US20100085711A1

US20100085711A1 - Heat dissipation module and fan thereof

Info

Publication number: US20100085711A1
Application number: US12/634,049
Authority: US
Inventors: Hao-Wen Ko; Tsung-Yu Lei; Wen-Shi Huang
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2006-10-04
Filing date: 2009-12-09
Publication date: 2010-04-08
Also published as: US20080084663A1; TWI306384B; DE102007046874B4; JP2008091885A; TW200819027A; DE102007046874A1; US7688588B2

Abstract

A heat dissipation module assembled with a circuit board is disclosed. The heat dissipation module assembled comprises a fan and at least a heat sink. The fan comprises a frame and an impeller. The frame comprises a body and at least an extension, wherein the extension protrudes from at least a side of the body. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of co-pending Application No. 11/902,902, filed on Sep. 26, 2007, the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. §120. This nonprovisional application also claims priority under 35 U.S.C. §119(a) on Patent Application No. 95136868 filed in Taiwan R.O.C. on Oct. 4, 2006, the entirety of which is herein incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention relates to a heat dissipation module and a fan thereof and more particularly, to a heat dissipation module and fan engaged with a circuit board by a fan frame.
2. Description of the Related Art
Electronic systems typically include heat dissipation modules for dissipating heat produced by electronic elements disposed on the circuit board of the electronic system. A conventional heat dissipation module can be separated into a heat sink and a fan, wherein the fan is fixed to the heat sink and the heat sink is fixed to the circuit board.
Because the heat sink and a base thereof for fixing the heat dissipation module to the circuit board are metal materials. Thus, the materials cost are high.
Another conventional heat dissipation module can be provided at less cost. This conventional heat dissipation module includes a support with a base, a fan, and a heat sink, each of which is an independent structure. The fan and the heat sink are respectively locked on the support. The heat dissipation module is fixed on the circuit board by the base of the support. The material of the support can be plastic rather than metal and thus, cost can be reduced because the support is an independent structure.
The adjustment and fabrications steps for the support and the fan, the support and the heat sink, and the fan and the heat sink are increased. Thus, the number of steps required to fabricate the entire heat dissipation module is increased and precision adjustment is required. The cost is additionally increased and the reliability and quality are decreased.

BRIEF SUMMARY OF THE INVENTION

Thus, to solve the described problems, the invention provides a heat dissipation module and a fan thereof with fewer elements and fabrication procedures, and reduced fabrication time and cost.
Accordingly, a heat dissipation module and a fan thereof are provided. The fan includes a frame and an impeller. The frame includes a body and at least an extension protruding from at least a side of the body. The extension or the body is connected to the circuit board. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from the electronic element disposed on the circuit board.
Furthermore, a fan is provided. The fan includes a frame and an impeller. The frame includes a body and at least an extension protruding from at least a side of the body. The extension is connected to the circuit board. The impeller is disposed in the body.
The frame can be plastics, rubber, or polymer materials.
The heat sink includes at least a dissipating portion and at least a contact portion. The contact portion serves as a contact with the electronic element disposed on the circuit board. The extension includes at least an opening so that the contact portion can pass through the extension to be contacted with the electronic element. The dissipating portion can be a plurality of fins. The extension is coupled to the heat sink by clipping, engaging, locking, or receiving.
The body of the heat dissipation module or the fan is annular. The cross-sectional shape by the axial direction of the body is pillar, board-shape, L-shape, U-shape, O-shape or D-shape.
The extension and the body of the heat dissipation module or the fan respectively include at least a base for receiving at least a fastener. The fastener is utilized to fix the fan on the circuit board. The fastener is a screw, spring screw, bolt, or fastening structure.
The extension and the body of the heat dissipation module or the fan respectively include at least a connecting structure for connecting the fan with the circuit board. The connecting structure is a bolt, a fastening structure, a sliding structure, or a guiding structure.
The heat dissipation module or the fan further includes at least a fastener for fixing the fan on the circuit board.
The electronic element is a central processing unit or an integrated chip. The impeller includes at least a blade, and the shape thereof is flat, curved, or arced. The fan can also be a blower. The circuit board is a printed circuit board or laminated circuit board.
The heat dissipation module or the fan of the present invention, due to being directly connected to the fan frame with the circuit board, an additional support is not required. Thus, the number of elements, fabrication procedures, and required adjustment precision and cost are all decreased while improving reliability and quality. Additionally, the fan frame can be plastic material, and formed by injection-molding and thus, increasing production time, decreasing cost and increasing reliability and quality.
A detailed description is given in the following embodiments with reference to the accompanying drawings:

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the subsequent detailed description and the accompanying drawings, which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1 is a schematic view of a first embodiment of a fan;

FIG. 2 is a schematic view of a first embodiment of a heat dissipation module;

FIG. 3 is a schematic view of a second embodiment of a fan;

FIG. 4 is a schematic view of a second embodiment of a heat dissipation module;

FIG. 5 is a schematic view of a first embodiment of a system;

FIG. 6 is a schematic view of a second embodiment of a system; and

FIG. 7 is a schematic view of a third embodiment of a system.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
FIG. 1 is a schematic view of a first embodiment of a fan 100. Referring to FIG. 1, the fan 100 includes a frame 112 and an impeller 102. The frame 112 includes a body 108 and at least an extension 110 protruding from at least a side of the body 108. Particularly, the extension 110 protrudes in the axial direction from at least a side of the body 108.
The extension 110 or the body 108 is connected to a circuit board 208. The body 108 and the extension 110 are formed as a monolithic piece. Additionally, the frame 112 can be non-metal materials such as plastic, rubber, or polymer materials.
The body 108 can be annular. The sectional shape of the extension 110 extending in the axial direction of the body 108 is pillar, board-shape, L-shape, U-shape, O-shape or D-shape. In this embodiment, the sectional shape of the extension 110 extending in the axial direction of the body 108 is board shape.
The extension 110 includes at least an opening 116 so that a contact portion 122 of a heat sink 124 can pass through the extension 110 via the opening 116 and the contact portion 112 can contact with an electronic element 206 similar to the heat dissipation module 300 shown in FIG. 2. The extension 110 or the body 108 further includes a base 114 for receiving at least a fastener 202 as shown in FIG. 5. The fastener 202 serves to fix the fan 100 on a circuit board 208. The fastener 202 is a screw, a spring screw, a bolt, or a fastening structure.
The impeller 102 is disposed in the body 108. The impeller 102 includes a hub 104 and a plurality of blades 106 disposed around the hub 104. The fan 100 can be a blower. The shape of the blade 106 is flat, curved, or arced.
FIG. 2 is a schematic view of a first embodiment of a heat dissipation module 300. Referring to FIG. 2, the heat dissipation module 300 includes a fan and at least a heat sink 124. Different from FIG. 1, the extension 110 a shown in FIG. 2 includes a connecting structure 118 substituting the base 114. A connecting structure 118, similar to the base 114 shown in FIG. 1, is a bolt, a fastening structure, a sliding structure, or a guiding structure. In this embodiment, the connecting structure 118 is a fastening bolt.
The heat sink 124 includes at least a dissipating portion 120 and at least a contact portion 122. The contact portion 122 contacts the electronic element 206. The heat sink 124 can be fins.
The heat sink 124 is coupled to the extension 110 a for guiding heat produced from the electronic element 206 of the circuit board 208. The extension 110 a is coupled to the heat sink 124 by clipping, engaging, locking, or receiving.
FIG. 3 is a schematic view of a second embodiment of a fan 100 a. Referring to FIG. 3, the difference between the fan 100 a and the preceding embodiments is the cross-sectional shape of the extension 110 a of the frame 112 b, wherein the sectional shape of the extension 110 a toward an axial direction of the body 108 is U-shaped. Thus, the heat sink 124 is received in the extension 110 a. The extension 110 a is connected to the circuit board 208 by a base 126, which receives screws or spring screws therein.
FIG. 4 is a schematic view of a second embodiment of a heat dissipation module 300 a. Referring to FIG. 4, a U-shaped extension 110 b of a frame 112 c conforms to the body 108 a for aesthetic considerations. Additionally, the heat sink 124 a is coupled to the extension 110 b by side screwing. Thus, the extension 110 b is a guiding-type connecting structure 128 for rapidly and securely connecting the heat dissipation module 300 a and the circuit board 208.
For further describing the heat dissipation module or the fan, a general system is described. Referring to FIG. 5, a system 200 includes a circuit board 208 therein. The circuit board 208 includes at least an electronic element 206 and at least a fixed portion 210. The electronic element 206 can be a central processing unit or an integrated chip. The circuit board 208 can be a printed circuit board or a laminated circuit board.
Due to the excessive heat produced from the electronic element 206, the system 200 requires a heat dissipation module. At first, the heat sink 124 b is disposed in the frame 112 b and then, a base 126 is roughly aligned corresponding to the fixed portion 210. The fastener 202 passes through the base 126 and is screwed on the base 126. Thus, the heat sink 124 b of the fan 100 a is securely disposed on the electronic element 206. Thus, while the system is operating, the heat dissipation module 124 b dissipates heat produced from the electronic element 206.
Because the frame 112 b is not required to be in direct contact with the electronic element 206 in the system 200. Thus, the frame 112 b does not require materials with high conductive coefficient, and can include non-metal materials such as plastic. Thus, the cost is decreased when compared with the conventional technology.
Moreover, referring to FIG. 6, when a system 200 a uses the fan 100 instead of the fan 100 a, the fan 100 and the heat sink 124 are coupled to the extension 110 by screwing. The heat sink 124 is attached to the electronic element 206 via the contact portion of heat sink 124 passing through the opening of the extension 110. The spring screw 212 received in the base 114 fastens the fan 100 on the circuit board 208. A gap is formed between the extension 110 and the electronic element 206. Thus, the frame 112 can include non-metal materials, such as plastic, to reduce the cost to lower than that of the conventional. Furthermore, the extension 110 is board-shaped and the material of the extension 110 is less than that of the extension 110 a so that the cost of the system 200 a is less than that of the system 200.
Referring to FIG. 7, the frame 112 c is fixed on the circuit board 208 by a fastener 214. Thus, in system 200 b, the frame 112 c and the heat sink 124 can be attached to the circuit board 208 more rapidly, reducing production time.
As mentioned above, since the fan frame is directly connected to the circuit board, additional support is not required. Thus, the number of elements, fabrication, and adjustment procedures and cost are decreased while reliability and quality are improved.
Additionally, the fan frame can include a plastic material. Thus, the fan frame can be formed by injection-molding, decreasing production time and increasing reliability and quality.
While the invention has been described by way of example and in terms of the preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

1. A heat dissipation module assembled with a circuit board, comprising:

a fan comprising:

a frame comprising a body and at least an extension, wherein the extension protrudes from at least a side of the body; and

an impeller disposed in the body; and

at least a heat sink coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element.

2. The heat dissipation module as claimed in claim 1, wherein a cross-sectional shape of the extension toward an axial direction of the body is U-shaped, and the extension protrudes from at least a side of the body along the axial direction.

3. The heat dissipation module as claimed in claim 1, wherein the extension is connected to the circuit board by a base, and the base receives screws or spring screws therein.

4. The heat dissipation module as claimed in claim 1, wherein the extension or the body comprises at least a connecting structure for connecting the fan to the circuit board, wherein the connecting structure is a bolt, a fastening structure, a sliding structure or a guiding structure.

5. The heat dissipation module as claimed in claim 1, further comprising at least a fastener for fixing the fan on the circuit board.

6. The heat dissipation module as claimed in claim 1, wherein the electronic element is a central processing unit or an integrated chip, and the circuit board is a printed circuit board or laminated circuit board.

7. The heat dissipation module as claimed in claim 1, wherein the impeller comprises at least a blade with a flat, curved, or arced shape.

8. The heat dissipation module as claimed in claim 1, wherein the frame is made of non-metal materials, plastics, rubber, or polymer materials.

9. The heat dissipation module as claimed in claim 1, wherein the extension and the body are formed as a monolithic unit.

10. A system comprising:

a circuit board;

an electronic element disposed on the circuit board; and

a heat dissipation module assembled with a circuit board, comprising:

a fan comprising:

an impeller disposed in the body; and

at least a heat sink coupled to the extension for dissipating heat produced from the electronic element, wherein the heat sink is received in the extension and disposed on the electronic element.

11. The system as claimed in claim 10, wherein the frame is fixed on the circuit board by a fastener surrounding the frame.

12. The system as claimed in claim 11, wherein the fastener is a metal sheet.

13. The system as claimed in claim 12, wherein a cross-sectional shape of the fastener toward an axial direction of the body is U-shaped.

14. The system as claimed in claim 11, wherein a cross-sectional shape of the extension toward an axial direction of the body is U-shaped, and the extension protrudes from at least a side of the body along the axial direction.

15. The system as claimed in claim 11, wherein the extension is connected to the circuit board by a base, and the base receives screws or spring screws therein.

16. The system as claimed in claim 11, wherein the extension or the body comprises at least a connecting structure for connecting the fan to the circuit board, wherein the connecting structure is a bolt, a fastening structure, a sliding structure, or a guiding structure.

17. The system as claimed in claim 11, further comprising at least a fastener for fixing the fan on the circuit board.

18. The system as claimed in claim 11, wherein the electronic element is a central processing unit or an integrated chip, and the circuit board is a printed circuit board or laminated circuit board.

19. The system as claimed in claim 11, wherein the impeller comprises at least a blade with a flat, curved, or arced shape, and the frame is made of non-metal materials, plastics, rubber, or polymer materials.

20. The system as claimed in claim 11, wherein the extension and the body are formed as a monolithic unit.