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US20100044417A1 - Deconstructable assembly and method - Google Patents

Deconstructable assembly and method Download PDF

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Publication number
US20100044417A1
US20100044417A1 US12/194,900 US19490008A US2010044417A1 US 20100044417 A1 US20100044417 A1 US 20100044417A1 US 19490008 A US19490008 A US 19490008A US 2010044417 A1 US2010044417 A1 US 2010044417A1
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Prior art keywords
parting
temperature
joining
assembly
force
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Granted
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US12/194,900
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US8132710B2 (en
Inventor
Gerald J. Bruck
Douglas A. Arrell
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Siemens Energy Inc
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Siemens Energy Inc
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Priority to US12/194,900 priority Critical patent/US8132710B2/en
Assigned to SIEMENS POWER GENERATION, INC. reassignment SIEMENS POWER GENERATION, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARRELL, DOUGLAS J., BRUCK, GERALD J.
Assigned to SIEMENS ENERGY, INC. reassignment SIEMENS ENERGY, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SIEMENS POWER GENERATION, INC.
Publication of US20100044417A1 publication Critical patent/US20100044417A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/018Unsoldering; Removal of melted solder or other residues
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49815Disassembling
    • Y10T29/49822Disassembling by applying force
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12986Adjacent functionally defined components

Definitions

  • This invention relates generally to the field of metals joining, and more specifically to a deconstructable assembly and method for assembly and disassembly via high temperature processing.
  • Vacuum brazed or soldered assemblies offer superior advantages to conventional brazing or soldering, such as: flux-free joints, high strength and integrity of the joint, and the ability to heat-treat or age-harden the assemblies while simultaneously performing the joining process. Excess flux may cause corrosion over time, so a process that offers flux-free joining has an advantage in that there is no flux to remove after joining.
  • vacuum brazing or soldering may be expensive due to the process being performed inside of a vacuum chamber vessel.
  • vacuum brazed or soldered assemblies face a unique challenge of disassembly when retrofitting or repair is necessary.
  • brazing as a joining process wherein a non-ferrous joining material or alloy is heated to a melting temperature above 842° F. (450° C.) and distributed between two or more close-fitting parts by capillary action.
  • the joining material and a flux interact with a thin layer of the base material.
  • soldering as a process whereby two or more metal components are joined together by melting and flowing a filler metal into the joint, the filler material having a melting point lower than a brazing material.
  • High temperature assemblies that are joined through vacuum brazing are especially difficult to disassemble for repair or retrofit.
  • a vacuum brazed assembly is difficult to disassemble because introducing mechanical loading through the vacuum chamber walls to pull the pieces apart is problematic.
  • such assemblies might be loaded by weights within the chamber and rely on gravity to disengage elements.
  • the design of the assembly may require lateral loading to disengage. Loading by lateral cables and pulleys in a high temperature vacuum environment is extremely complex and difficult.
  • FIG. 1 is a schematic illustration of a deconstructable assembly in accordance with a first embodiment of the invention.
  • FIGS. 2 a - 2 e are schematic illustrations of the steps of a method of joining and parting an assembly in accordance with an embodiment of the invention.
  • FIG. 3 is a schematic illustration of a deconstructable assembly in accordance with a second embodiment of the invention.
  • FIG. 4 is a schematic illustration of a deconstructable apparatus in accordance with a third embodiment of the invention.
  • the present invention provides an improved assembly, and a method of joining such an assembly, whereby two component parts or members may be joined together at a joining temperature with a meltable joining material, such as a braze or solder material, and whereby the joined component parts may be subsequently separated by exposing the assembly to a parting temperature that is higher than the joining temperature.
  • a meltable joining material such as a braze or solder material
  • This is accomplished by disposing a parting member between opposed surfaces of the respective component parts when the assembly is formed, with the parting member being formed of a material that exhibits a state change at the parting temperature.
  • the state change causes the parting member to exert a parting force between the opposed surfaces sufficient effective to separate the two component parts at the parting temperature.
  • FIG. 1 illustrates a first embodiment of the invention wherein an assembly 10 is formed by joining a first component 12 to a second component 14 at an interface 16 with a meltable joining material 18 , for example a braze material. At least one parting member is captured within the assembly upon joining of the first and second components 12 , 14 together.
  • FIG. 1 illustrates two parting members as pins 20 , with each pin 20 being disposed in a respective cavity 22 formed in the first member 12 .
  • Each pin 20 extends axially between opposed surfaces 24 , 26 of the first and second members 12 , 14 respectively.
  • a braze stop material 26 may be used on the pins 20 to prevent the joining material 18 from attaching to the pins 20 .
  • the assembly 10 of FIG. 1 may be joined by a method such as vacuum brazing, whereby the assembly 10 is heated to a joining temperature sufficiently high to melt the joining material 18 , such that subsequent cooling of the assembly results in solidification of the joining material 18 and physical attachment of the first component 12 to the second component 14 along the interface 16 . Subsequently, the assembly 10 may be used at an operating temperature that is below the melting temperature of the joining material 18 .
  • pins 20 exhibit adequate thermal growth in the axial direction such that they contact the opposed surface 26 of the second member 14 , thereby exerting a parting force between the first and second components 12 , 14 .
  • the pins may exert the parting force into the first component 12 via surface 24 and/or by friction along the pin length, depending upon the tolerance of the fit of the pin 20 within the cavity 22 .
  • the joining material 18 is melted at the parting temperature, and the parting force is sufficient to cause separation of the components 12 , 14 without the need for any mechanical force otherwise to be applied to the components 12 , 14 .
  • the assembly 10 can be parted inside a vacuum furnace without the need for the complex and expensive mechanisms that would otherwise have to be used with prior art assemblies.
  • FIGS. 2 a - 2 e Steps of a method in accordance with the present invention are more clearly illustrated by viewing FIGS. 2 a - 2 e.
  • the components 12 , 14 are in position at room temperature in preparation for being joined by joining material 18 .
  • Pin 20 has an axial length at this temperature such that it does not contact surface 26 of component 14 .
  • FIG. 2 b illustrates a condition of the assembly 10 at the joining temperature, where the joining material 18 is melted and flows to create the interface 16 .
  • the pin 20 exhibits differential thermal growth relative to the first component 12 at this temperature whereby it still does not contact the second component 14 , although it may have grown to become very close to the surface 26 , whereby the braze stop material 28 prevents any attachment there between.
  • FIG. 2 c illustrates a condition of the assembly 10 at room or operating temperature after the components 12 , 14 are joined to form assembly 10 .
  • pin 20 remains short of surface 26 .
  • FIG. 2 e illustrates a condition of the disassembled assembly 10 at room temperature.
  • FIG. 3 illustrates another embodiment of the present invention where the assembly 10 ′ includes parting members (pins 20 ) that extend across the interface 16 at room and operating temperatures and into respective cavities formed in the second component 14 .
  • This embodiment allows for the parting members to support the interface 16 in the shear direction, i.e. parallel to the interface 16 .
  • the pins 20 function in this embodiment in a manner similar to that of FIG. 1 by growing axially to make contact with surface 26 at the parting temperature.
  • Cavity 30 may be somewhat oversized relative to the pin 20 such that no force is exerted into the second component 14 due to friction along the axial length of the pin 20 , but rather, the force may be applied only upon contact between the pin 20 and the surface 26 .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)

Abstract

An assembly (10) that can be both joined and parted by temperature processing. A parting member (20) captured between two members of the assembly exhibits a state change as a function of temperature such that the two members can be joined with a meltable joining material (18) at a joining temperature, operated at an operating temperature lower than the joining temperature, and then separated at a parting temperature higher or lower than the operating and joining temperatures as a result of a parting force caused by the state change of the parting member. In one embodiment, the parting member has a coefficient of thermal expansion higher than a coefficient of thermal expansion of the assembly members such that differential thermal expansion causes the parting member to expand across the interface (16) between the members to generate the parting force.

Description

    FIELD OF THE INVENTION
  • This invention relates generally to the field of metals joining, and more specifically to a deconstructable assembly and method for assembly and disassembly via high temperature processing.
  • BACKGROUND OF THE INVENTION
  • Vacuum brazed or soldered assemblies offer superior advantages to conventional brazing or soldering, such as: flux-free joints, high strength and integrity of the joint, and the ability to heat-treat or age-harden the assemblies while simultaneously performing the joining process. Excess flux may cause corrosion over time, so a process that offers flux-free joining has an advantage in that there is no flux to remove after joining. However, vacuum brazing or soldering may be expensive due to the process being performed inside of a vacuum chamber vessel. In addition, vacuum brazed or soldered assemblies face a unique challenge of disassembly when retrofitting or repair is necessary.
  • The American Welding Society defines brazing as a joining process wherein a non-ferrous joining material or alloy is heated to a melting temperature above 842° F. (450° C.) and distributed between two or more close-fitting parts by capillary action. The joining material and a flux interact with a thin layer of the base material. When cooled, the joint is especially strong due to grain structure interaction. The American Welding Society defines soldering as a process whereby two or more metal components are joined together by melting and flowing a filler metal into the joint, the filler material having a melting point lower than a brazing material.
  • High temperature assemblies that are joined through vacuum brazing are especially difficult to disassemble for repair or retrofit. A vacuum brazed assembly is difficult to disassemble because introducing mechanical loading through the vacuum chamber walls to pull the pieces apart is problematic. Alternatively, such assemblies might be loaded by weights within the chamber and rely on gravity to disengage elements. The design of the assembly may require lateral loading to disengage. Loading by lateral cables and pulleys in a high temperature vacuum environment is extremely complex and difficult.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention is explained in the following description in view of the drawings that show:
  • FIG. 1 is a schematic illustration of a deconstructable assembly in accordance with a first embodiment of the invention.
  • FIGS. 2 a-2 e are schematic illustrations of the steps of a method of joining and parting an assembly in accordance with an embodiment of the invention.
  • FIG. 3 is a schematic illustration of a deconstructable assembly in accordance with a second embodiment of the invention.
  • FIG. 4 is a schematic illustration of a deconstructable apparatus in accordance with a third embodiment of the invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention provides an improved assembly, and a method of joining such an assembly, whereby two component parts or members may be joined together at a joining temperature with a meltable joining material, such as a braze or solder material, and whereby the joined component parts may be subsequently separated by exposing the assembly to a parting temperature that is higher than the joining temperature. This is accomplished by disposing a parting member between opposed surfaces of the respective component parts when the assembly is formed, with the parting member being formed of a material that exhibits a state change at the parting temperature. The state change causes the parting member to exert a parting force between the opposed surfaces sufficient effective to separate the two component parts at the parting temperature.
  • FIG. 1 illustrates a first embodiment of the invention wherein an assembly 10 is formed by joining a first component 12 to a second component 14 at an interface 16 with a meltable joining material 18, for example a braze material. At least one parting member is captured within the assembly upon joining of the first and second components 12, 14 together. FIG. 1 illustrates two parting members as pins 20, with each pin 20 being disposed in a respective cavity 22 formed in the first member 12. Each pin 20 extends axially between opposed surfaces 24, 26 of the first and second members 12, 14 respectively. Optionally, a braze stop material 26 may be used on the pins 20 to prevent the joining material 18 from attaching to the pins 20.
  • The assembly 10 of FIG. 1 may be joined by a method such as vacuum brazing, whereby the assembly 10 is heated to a joining temperature sufficiently high to melt the joining material 18, such that subsequent cooling of the assembly results in solidification of the joining material 18 and physical attachment of the first component 12 to the second component 14 along the interface 16. Subsequently, the assembly 10 may be used at an operating temperature that is below the melting temperature of the joining material 18.
  • The assembly 10 of FIG. 1 may be parted simply by exposing the assembly 10 to a parting temperature that is higher than the joining temperature. This is accomplished by forming the parting members 20 of a material that will exhibit a state change at the parting temperature, whereby the state change causes the parting members 20 to exert a parting force between the opposed surfaces 24, 26 to break the interface 16 and to separate the two components 12, 14. In the embodiment of FIG. 1, pins 20 are selected to have a coefficient of thermal expansion that is higher than a coefficient of thermal expansion of the first component 12, and the state change is differential thermal expansion between there between. At and below the joining temperature, the pins 20 do not contact the second member 14. However, at the parting temperature, pins 20 exhibit adequate thermal growth in the axial direction such that they contact the opposed surface 26 of the second member 14, thereby exerting a parting force between the first and second components 12, 14. The pins may exert the parting force into the first component 12 via surface 24 and/or by friction along the pin length, depending upon the tolerance of the fit of the pin 20 within the cavity 22. The joining material 18 is melted at the parting temperature, and the parting force is sufficient to cause separation of the components 12, 14 without the need for any mechanical force otherwise to be applied to the components 12, 14. Thus, the assembly 10 can be parted inside a vacuum furnace without the need for the complex and expensive mechanisms that would otherwise have to be used with prior art assemblies.
  • Steps of a method in accordance with the present invention are more clearly illustrated by viewing FIGS. 2 a-2 e. In FIG. 2 a the components 12, 14 are in position at room temperature in preparation for being joined by joining material 18. Pin 20 has an axial length at this temperature such that it does not contact surface 26 of component 14.
  • FIG. 2 b illustrates a condition of the assembly 10 at the joining temperature, where the joining material 18 is melted and flows to create the interface 16. The pin 20 exhibits differential thermal growth relative to the first component 12 at this temperature whereby it still does not contact the second component 14, although it may have grown to become very close to the surface 26, whereby the braze stop material 28 prevents any attachment there between.
  • FIG. 2 c illustrates a condition of the assembly 10 at room or operating temperature after the components 12, 14 are joined to form assembly 10. Here again, pin 20 remains short of surface 26.
  • FIG. 2 d illustrates a condition of the assembly 10 during a disassembly operation at a parting temperature that is higher than the joining temperature. At this temperature, the pin 20 has grown relative to the first component 12 such that it contacts and exerts a parting force against surface 26, thereby breaking the interface 16 and mechanically separating the first and second components 12, 14.
  • FIG. 2 e illustrates a condition of the disassembled assembly 10 at room temperature.
  • FIG. 3 illustrates another embodiment of the present invention where the assembly 10′ includes parting members (pins 20) that extend across the interface 16 at room and operating temperatures and into respective cavities formed in the second component 14. This embodiment allows for the parting members to support the interface 16 in the shear direction, i.e. parallel to the interface 16. The pins 20 function in this embodiment in a manner similar to that of FIG. 1 by growing axially to make contact with surface 26 at the parting temperature. Cavity 30 may be somewhat oversized relative to the pin 20 such that no force is exerted into the second component 14 due to friction along the axial length of the pin 20, but rather, the force may be applied only upon contact between the pin 20 and the surface 26.
  • The state change utilized to provide the parting force is not necessarily limited to differential thermal expansion, as described above. FIG. 4 illustrates an embodiment of the invention wherein an alternative form of parting member 32 is disposed within the assembly 10″, such as within cavity 22. Alternative forms of parting member 32 may exert a parting force between the first and second components 12, 14 at the parting temperature via any number of state change mechanisms. In one embodiment, parting member 32 may be formed of a bimetallic material such that it exhibits a change of shape (e.g. curvature) upon reaching the parting temperature that is adequate to create the desired parting force. In another embodiment, the parting member 32 may be formed of a material that converts to or expels a gas at the parting temperature in a quantity sufficient to raise the pressure in cavity 22 to a desired pressure to create the parting force. For example, solid red phosphorous may be disposed within a cavity within an assembly soldered at 400° C. Upon reheating the assembly above 417° C., the red phosphorous sublimes and creates a gaseous pressure to part the assembly. Alternately, solid magnesium may be disposed within an assembly brazed at 500° C. Upon reheating above 649° C., the magnesium melts or above 1090 ° C. vaporizes and exerts a force to part the assembly. Water may also be used as the parting member 32 by taking advantage of a state change to either steam or ice at the parting temperature, which may be either above or below an operating temperature of the assembly. For example, components 12 and 14 may be brazed or soldered together with cavity 22 being empty but retaining an access to the exterior of the assembly. Cavity 22 is then filled with water and sealed, such as with a threaded cap. Upon cooling the assembly to a parting temperature below 0° C., the water freezes and expands, causing the relatively weak interface to break and part the assembly. In this embodiment, the joining material is not melted but rather it fails due to the mechanical loads exerted by the expanding water/ice volume. Alternatively, the assembly could be heated to a parting temperature above 100° C. to boil the water to create a parting pressure in the cavity 22, with the parting temperature being either below or above the melting temperature of the joining material.
  • While various embodiments of the present invention have been shown and described herein, it will be obvious that such embodiments are provided by way of example only. Numerous variations, changes and substitutions may be made without departing from the invention herein. Accordingly, it is intended that the invention be limited only by the spirit and scope of the appended claims.

Claims (15)

1. An assembly comprising:
a first component comprising a cavity;
a second component joined to the first component at an interface;
a meltable joining compound applied at the interface and joining the components together; and
a parting member at least partially disposed within the cavity and extending toward the second component, wherein a coefficient of thermal expansion of the parting member is greater than a coefficient of thermal expansion of the first component such that differential thermal expansion there between causes the parting member to exert a parting force between the first and second components at a parting temperature above a melting temperature of the joining compound but does not cause the parting force between the first and second components at an operating temperature below the melting temperature of the joining compound.
2. An assembly according to claim 1, wherein the parting member extends beyond the interface at the operating temperature, thereby supporting the interface in shear.
3. An assembly according to claim 1, wherein the joining compound comprises a braze compound and the parting member comprises a pin.
4. An assembly comprising:
a first member joined by a joining material to a second member along an interface; and
a parting member disposed between respective portions of the first and second members, the parting member exhibiting a state change as a function of temperature, such that at a parting temperature, the parting member will exert a parting force between the first and second members effective to separate the interface and part the first and second members.
5. An assembly according to claim 4, further comprising:
the parting member comprising a first axial end disposed within a cavity formed in the first member and an opposed second axial end projecting toward the second member but not making contact with the second member at an operating temperature; and
a coefficient of thermal expansion of the parting member being greater than a coefficient of thermal expansion of the first member such that the state change comprises differential thermal expansion there between, wherein the parting member expands to make contact with the second member at the parting temperature above the operating temperature and above a melting temperature of the joining material to exert the parting force.
6. An assembly according to claim 5, further comprising:
the parting member extending axially across the interface and into a cavity formed in the second member but not making contact with an opposed surface of the second member at the operating temperature, thereby effective to provide shear support for the interface at the operating temperature; and
the parting member expanding axially to make contact with the opposed surface of the second member at the parting temperature, thereby providing the parting force at the parting temperature.
7. An assembly according to claim 4, wherein the parting member comprises a bimetallic member and the state change comprises a change in shape of the parting member effective to exert the parting force at the parting temperature above a melting temperature of the joining material.
8. An assembly according to claim 4, wherein the parting member comprises a material selected to convert to a gas or to release a gas at the parting temperature above a melting temperature of the joining material in a quantity effective to create a pressure resulting in the parting force at the parting temperature.
9. An assembly according to claim 4, wherein the parting member comprises a material selected to expand upon freezing at the parting temperature to create the parting force at the parting temperature.
10. An assembly according to claim 4, wherein the joining material comprises a braze material, and further comprising a braze stop material disposed on the parting member.
11. A method comprising:
selecting a parting member exhibiting a state change between an operating temperature and a parting temperature;
disposing the parting member in a cavity within an assembly formed by joining a first member to a second member;
wherein a state of the parting member at the operating temperature allows the assembly to operate at the operating temperature with the first and second members joined, but wherein a changed state of the parting member at the parting temperature causes a parting force to be exerted between the first and second members.
12. A method according to claim 11, further comprising selecting the parting member to have a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of at least one of the first and second members such that the state change comprises differential thermal expansion.
13. A method according to claim 11, further comprising selecting the parting member to comprise a bimetallic member such that the state change comprises a change in shape of the parting member.
14. A method according to claim 11, further comprising selecting the parting member to comprise a material that converts to or releases a gas at the parting temperature such that a pressure is created within the cavity at the parting temperature resulting in the parting force.
15. A method according to claim 11, further comprising selecting the parting member to comprise water which exists as a liquid at the operating temperature such that the state change comprises freezing of the water to form ice at the parting temperature.
US12/194,900 2008-08-20 2008-08-20 Deconstructable assembly and method Expired - Fee Related US8132710B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109604592A (en) * 2017-04-28 2019-04-12 戴弗根特技术有限公司 Device and method for the removable support construction in increasing material manufacturing
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
WO2020012533A1 (en) * 2018-07-09 2020-01-16 オリンパス株式会社 Remanufacturing method of medical device

Citations (2)

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Publication number Priority date Publication date Assignee Title
US3600144A (en) * 1969-06-05 1971-08-17 Westinghouse Electric Corp Low melting point brazing alloy
US7308999B2 (en) * 2001-08-01 2007-12-18 Fujitsu Ten Limited Die bonding apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3600144A (en) * 1969-06-05 1971-08-17 Westinghouse Electric Corp Low melting point brazing alloy
US7308999B2 (en) * 2001-08-01 2007-12-18 Fujitsu Ten Limited Die bonding apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US11343950B2 (en) 2014-08-06 2022-05-24 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN109604592A (en) * 2017-04-28 2019-04-12 戴弗根特技术有限公司 Device and method for the removable support construction in increasing material manufacturing
US12251884B2 (en) 2017-04-28 2025-03-18 Divergent Technologies, Inc. Support structures in additive manufacturing
US12296539B2 (en) * 2017-04-28 2025-05-13 Divergent Technologies, Inc. Apparatus and methods for removable support structures in additive manufacturing
WO2020012533A1 (en) * 2018-07-09 2020-01-16 オリンパス株式会社 Remanufacturing method of medical device
JPWO2020012533A1 (en) * 2018-07-09 2021-05-13 オリンパス株式会社 How to remanufacture medical devices
US11858074B2 (en) 2018-07-09 2024-01-02 Olympus Corporation Medical apparatus remanufacturing method

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