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US20100019625A1 - Multilayer Element and a Method for Producing a Multilayer Element - Google Patents

Multilayer Element and a Method for Producing a Multilayer Element Download PDF

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Publication number
US20100019625A1
US20100019625A1 US12/534,610 US53461009A US2010019625A1 US 20100019625 A1 US20100019625 A1 US 20100019625A1 US 53461009 A US53461009 A US 53461009A US 2010019625 A1 US2010019625 A1 US 2010019625A1
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Prior art keywords
multilayer
segments
ceramic
multilayer element
pressing
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Abandoned
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US12/534,610
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English (en)
Inventor
Georg Kuegerl
Wolfgang Bauer
Manfred Reinisch
Franz Aldrian
Marion Ottlinger
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TDK Electronics AG
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Epcos AG
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Assigned to EPCOS AG reassignment EPCOS AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OTTLINGER, MARION, REINISCH, MANFRED, KUEGERL, GEORG, ALDRIAN, FRANZ, BAUER, WOLFGANG
Publication of US20100019625A1 publication Critical patent/US20100019625A1/en
Priority to US13/194,830 priority Critical patent/US9728706B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
    • H10W99/00—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/604—Pressing at temperatures other than sintering temperatures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Definitions

  • a method for producing a multilayer element is described, for example, a method in which the multilayer segments are pressed together. Also described is a multilayer element with predetermined breakage regions.
  • a method for making a multilayer actuator is known from the German publication DE 102 34 787 C1. Microdistortions are intentionally made in the actuator framework, which grow inwardly upon polarization of the actuator.
  • An electrical multilayer element with ceramic layers arranged along a lengthwise axis, where at least one predetermined breakage layer is arranged at a point on the lengthwise axis between ceramic layers is known from International publication WO 2004/077583. It is less stable to tensile stresses in the lengthwise direction than are the ceramic layers.
  • the present invention provides an electrical multilayer element that remains functional under repeated mechanical stresses and a method for producing such a multilayer element.
  • the invention specifies a method for producing a ceramic multilayer element in which a number of ceramic multilayer segments are pressed together.
  • the ceramic multilayer segments each have a plurality of ceramic layers pressed together.
  • a multilayer segment is understood to mean a stack of at least two ceramic layers with any outer contour.
  • a multilayer element results from a stack of multilayer segments arranged one on top of another and pressed together.
  • Thin multilayer segments are made available, the external shaping of which can take place, for example, by means of a cutting tool, without damaging the multilayer segments, and optionally using a less energetically or less powerfully driven cutting tool can be enabled by the choice of a certain small number of pressed ceramic layers. Since a plurality of the multilayer segments formed in this way are pressed together, a complete multilayer element, for example, a piezoelectric multilayer element, can be created with the desired outer contour and thickness.
  • the outer contour is at least in part rounded, circular or oval.
  • handling of multilayer segments is easier than with individual ceramic layers.
  • the probability of process errors, which can accumulate with each separation of a ceramic layer, can be minimized.
  • the production time for a multilayer element is advantageously significantly reduced, since each individual ceramic layer does not have to be placed on another ceramic layer.
  • the production process offers the advantage that multilayer elements can be created in any height. This makes it possible to design elements that satisfy certain criteria that apply in the case of tight placement conditions when inserted into a device that uses the multilayer element.
  • Another advantage is that multilayer elements can already be created in an unsintered, i.e., green, state with a desired outer contour. This eliminates the need, for example, to give a sintered element the desired external geometry by means of a cost- and time-intensive grinding operation. Where this step is omitted, it is possible, for example, to apply external contacts flush or directly onto the sintered element. Thus, this produces an additional beneficial effect.
  • a plurality of ceramic films are pressed together into a film stack as a precursor product, where the ceramic films preferably contain an organic binder, so that the pressing, or handling, of the films, for example, in transport, is made easier.
  • the ceramic film stack or the stacked ceramic films have a large surface in relationship to the cross-sectional area of a ceramic multilayer segment that is to be separated out later, i.e., the ceramic film stack, as a precursor product, preferably comprises a multiple of the area of the multilayer segments to be separated out later, which are called the afterproduct.
  • the temperature at which the ceramic films are pressed together is lower than the temperature at which the multilayer segments are pressed together. This will achieve bonding of the multilayer segments to each other such that, at least in the ultimately sintered element, the boundary region between the multilayer segments has lower resistance to tensile stresses. In comparison, the ceramic layers of an individual multilayer segment are firmly bonded together.
  • the binding effect of the organic binder while pressing the multilayer segments is set to be different than the binding effect during the pressing of the ceramic films.
  • a binder is selected whose activity is dependent on a number of process parameters, for example, temperature, force with which the multilayer segments are pressed together, duration of the pressing force, and the atmosphere or composition of the atmosphere in which the films and/or the multilayer segments are pressed together.
  • Controlled change of the activity of the binder has the advantage that the binding or adhesion of the multilayer segments to each other can be controlled.
  • the ceramic layers contained in the multilayer segments are in the green state during the pressing operation. This means that the multilayer segments do not first have to be separately sintered.
  • the temperature at which the ceramic films are pressed together preferably varies from room temperature by a maximum of 25%.
  • the temperature at which the multilayer segments are pressed together preferably lies between 75° C. and 95° C.
  • the tensile strengths of the boundary region between the multilayer segments be determined by adjusting the temperature at which the multilayer segments are pressed together.
  • the tensile strength of the boundary region between the multilayer segments can also be determined by adjusting the pressure applied in pressing the multilayer segments.
  • the tensile strength of the boundary region between the multilayer segments can be determined by adjusting the duration of the pressing of the multilayer segments.
  • a tensile strength is determined for the boundary region between two multilayer segments that gives these segments the function of a predetermined breakage region.
  • a predetermined breakage region that responds or forms a crack at certain mechanical stresses.
  • the predetermined breakage region thus forms a tailored mechanical weak point in the multilayer element.
  • a predetermined breakage region that arises between two multilayer segments of a multilayer element by means of a production process described in this document allows, under certain tensile stresses, a controlled cracking into the interior of the multilayer element.
  • the cracking thus runs essentially parallel to the plane of the ceramic layers.
  • the multilayer segments are preferably cut from the precursor foil stack by means of a cutting tool. They can be cut out with any desired outer contour. Thus, multilayer segments are cut with, in particular, circular or oval contours or at least nearly circular or oval contours, so that multilayer elements with such contours can be created for high quality or stability demands.
  • the cutting tool directly transports the separated multilayer segments further on, for example, to another manufacturing unit for further processing.
  • the multilayer segments are transported into a cavity for pressing.
  • a conveyor means that is used only for transport, for example, a conveyor belt or gripper, is omitted.
  • the multilayer segments can be cut from the foil stack with particular speed. Since the foil stack is, relatively speaking, not very thick, the stamping tool can stamp out the likewise relatively thin multilayer segments with any cross-sectional shape without damaging them.
  • two adjacent multilayer segments are pressed together in a repeated operation.
  • 49 pressing operations are carried out, one for each pair of adjacent multilayer segments.
  • the number of pressing operations is thus one less than the number of multilayer segments in the end multilayer element.
  • the multilayer segments are pressed together by pressing a stamping tool onto a face surface of a multilayer segment which has been inserted into the cavity.
  • the multilayer segment on which the stamping tool presses is always in the uppermost position in the cavity.
  • the multilayer segments are pressed together with the additional use of a press pin, which presses against the undermost multilayer segment in the cavity, toward the stamping tool.
  • Ceramic films with imprinted metallizations can be used to produce the multilayer segments. These metallizations can later serve as electrodes or electrode layers of the ultimately produced multilayer element.
  • Warpage during pressing which might lead to bending of internal electrodes that may be present, at least at the ends of the multilayer element, is highly minimized by means of the production process, since individual multilayer segments are pressed together rather than an entire multilayer element of greater thickness. This minimizes convex or concave bending of the internal electrodes (with respect to the axis running through the multilayer element in the vertical direction). All in all, a multilayer element with high symmetry is created.
  • a piezoelectric multilayer element can be created by means of the production process.
  • the ceramic layers preferably contain a PZT (lead zirconate titanate) ceramic.
  • These ceramic films can contain a binder, which is burned out during a debinding before the multilayer element is subjected to a sintering operation.
  • a multilayer element with a stack of ceramic layers and electrode layers arranged on top of one another is specified, where a predetermined breakage region with reduced tensile strength running parallel to the ceramic layers is localized between adjacent ceramic layers and partially merges into them. Adjacent ceramic layers thus have a portion of the predetermined breakage region.
  • the multilayer element has a plurality of multilayer segments that are pressed together and that have individual ceramic layers, and these segments are sintered together. With that, the predetermined breakage region runs between adjacent ceramic layers and partially penetrates into them or is partially contained in the ceramic layers. Adjacent ceramic layers belonging to different multilayer segments form parts of the predetermined breakage region.
  • the multilayer element or the multilayer segments which it comprises are preferably a product of the production process described in this document in all of its possible embodiments.
  • the predetermined breakage region has a porosity that is higher than the average porosity of the ceramic layers in the overall multilayer element.
  • Edge- or face-side ceramic layers of adjacent multilayer segments can have regions that abut one another or merge into one another and that have less tensile strength or are more porous than the ceramic layers that are turned away from the boundary between the multilayer segments.
  • the elevated porosity can also be understood as lower packing density of the ceramic grains in the corresponding region.
  • the predetermined breakage region between the multilayer segments forms a crack running into the interior of the multilayer element when the multilayer element is subjected to certain mechanical stresses. If an electrode layer or a flat metallization is arranged between the multilayer segments, the crack will run along or parallel to the electrode or through the electrode layer, and thus does not connect two electrodes that are arranged one above the other. An electric short circuit that would lead to failure of the multilayer element can thus be avoided.
  • the multilayer element preferably has a plurality of predetermined breakage regions distributed over the thickness of the multilayer element at regular intervals.
  • the intervals i.e., the space between two adjacent predetermined breakage regions, comprise a plurality of ceramic layers and electrode layers, between which no predetermined breakage region is made available.
  • FIG. 1 which includes FIGS. 1 a and 1 b , shows a multilayer element with a predetermined breakage site in a first arrangement
  • FIG. 2 which includes FIGS. 2 a and 2 b , shows a multilayer element with a predetermined breakage site in a second arrangement
  • FIG. 3 shows a cross-sectional view of a multilayer element
  • FIG. 4 shows a perspective view of a part of an essentially massive block comprising a cavity, with a partially inserted punching tool
  • FIG. 5 shows a top view of an essentially massive block comprising a cavity
  • FIG. 6 shows a side view of an essentially massive block comprising a cavity, with a partially inserted punching tool.
  • FIG. 1 a shows a multilayer element 1 with ceramic layers 2 and electrode layers 3 arranged alternately one above the other.
  • FIG. 1 b shows a magnified section from FIG. 1 a .
  • the multilayer element has a plurality of multilayer segments 4 , each of which has a plurality of ceramic layers and electrode layers. Between each two adjacent multilayer segments 4 is a predetermined breakage region 5 , which is designed as a region with reduced strength compared to the surface areas between other ceramic layers deeper into the interior of each multilayer segment 4 .
  • the predetermined breakage region 5 is contained in the boundary region between two adjacent multilayer segments and merges with its reduced mechanical strength into an undermost and uppermost ceramic layer of adjacent multilayer segments.
  • the predetermined breakage region 5 is realized, by means of the method of producing the multilayer element, as a region of reduced porosity by comparison with the porosity of other ceramic layers within each multilayer segment 4 .
  • the elevated porosity in the boundary region between two multilayer segments 4 can be determined by adjusting the combination of the following parameters:
  • FIG. 1 shows in particular how the boundary region between two multilayer segments 4 can be designed.
  • the boundary region with reduced tensile strength runs, according to one embodiment, between two edge- or face-side ceramic layers 2 of adjacent multilayer segments 4 , where one of the ceramic layers is provided with an imprinted internal electrode layer 3 .
  • FIG. 2 a shows a multilayer element 1 with ceramic layers 2 and electrode layers 3 arranged alternately one above the other.
  • FIG. 2 b shows an enlarged section from FIG. 1 a .
  • this embodiment of the multilayer element corresponds to that of FIG. 1 .
  • the predetermined breakage region 5 on two adjacent multilayer segments is designed differently here. It merges into two edge- or face-side and adjacent ceramic layers 2 of adjacent multilayer segments 4 , and there is no electrode layer 3 between these ceramic layers 2 .
  • a construction of this kind can be achieved, for example, by stacking the multilayer segments stamped out of a film stack with different orientations for pressing. This means that, for example, two multilayer segments 4 that are adjacent and pressed together can have face surfaces turned toward each other, with these face surfaces free of internal electrode layers 3 .
  • FIG. 3 shows a multilayer element 1 with a preferred contour in a top view.
  • the multilayer element or each multilayer segment 4 of the multilayer element in this case is circular in cross section, with flat sides.
  • external electrodes 6 can be applied to or arranged on the flattened side, where the electrodes are each in contact with a set of internal electrode layers 3 arranged one above the other and having the same electric polarity.
  • the multilayer element or its multilayer segments preferably have a diameter of 8-10 mm; the flattened sides each have a length of 2-4 mm.
  • the following operation is chosen to produce the multilayer element.
  • a ceramic powder with piezoelectric properties is processed into films.
  • the films are imprinted according to the desired design with an electrode paste, in particular, screen-printed, so that an isolation zone on the flattened segments of the multilayer element is made available.
  • the isolation zone comprises a nearly field-free region, where adjacent internal electrodes do not overlap.
  • Each film is again imprinted, where the printing of adjacent films of a film stack takes place with an offset.
  • Multilayer segments with the desired cross-sectional shape are stamped out of the pressed film stack with a stamp.
  • the stamp or stamping tool comprises a sharp projecting edge for stamping out multilayer sequences; further inward, it has a flat area that presses on the multilayer segment surface and separates it from the film stack.
  • the stamped-out multilayer segments in contrast to individual ceramic layers (which each come from a single ceramic film) are much easier to handle in the process of manufacturing the multilayer element. For example, they can be grabbed and transported better. In this case, the risk of damage to these multilayer segments is also reduced. The effectiveness of these advantages is especially apparent when the cross-sectional area of the stamped out multilayer segment is 20 mm 2 or smaller.
  • the multilayer segments with low height that are stamped from the film stack or stacks are preferably stacked in a cavity by means of the stamping tool.
  • a multilayer segment is pressed onto a multilayer segment or partial multilayer element that is already in the cavity, at a force of 1500 N at about 85° C.
  • the operation is repeated until a piezoelectric multilayer element with any desired height, preferably between 70 and 100 mm, is made.
  • Preferably used criteria for establishing the absolute breaking force at the seam between the multilayer segments are the applied pressure, temperature or hold time in a pressing operation.
  • a still-green multilayer element produced by pressing multilayer segments can then be debinded and sintered. External contacts can then be applied to the side surfaces of the multilayer element.
  • Measurement of multilayer elements made by pressing multilayer segments show a seam region between two adjacent multilayer segments with lower strength than the bonds between individual ceramic layers lying in the multilayer segments.
  • An advantage of this effect was seen to be that the multilayer element, because of the weaker seam regions, contains one or more predetermined breakage sites that favor a stable failure or controlled failure of the multilayer element. Additional process or manufacturing steps to introduce predetermined breakage sites into the element can thus be omitted. From the standpoint of manufacturing technology, the number of predetermined breakage sites alone is already determined by the height of the multilayer element, since a certain height of the multilayer element implies a number of multilayer segment boundaries and thus predetermined breakage regions.
  • the predetermined breakage region responds at certain tensile stresses, where it forms a crack running parallel to the ceramic layers or electrode layers. Since the dielectric cannot be entirely broken through in the direction between two internal electrodes by the crack, a short circuit between two electric poles of the multilayer element supported by internal electrodes situated one above the other caused by certain tensile stresses can be avoided.
  • FIGS. 4-6 show different perspective views of a preferably massive metallic block 7 , in which multilayer segments are pressed together to form a multilayer element 1 in a cavity 8 by means of a stamping tool 9 .
  • FIG. 4 shows a section of a preferably massive and metallic block 7 in a perspective view.
  • a cavity 8 which is realized as a drilling, runs centrally and vertically through block 7 .
  • the cavity 8 has an opening 10 at the bottom that allows the insertion of a press pin, not shown, which pushes against a stamping tool 9 , which is shown inserted into the cavity.
  • the cavity 8 has an internal clear diameter that is dimensioned so that a multilayer segment can be inserted into the cavity 8 together with the transport means or stamping tool 9 that surrounds and transports the multilayer segment.
  • Multilayer segments arranged between the press pin, which pushes from below, and the stamping tool 9 , inserted from above, are pressed together.
  • the press block 7 has a number of parts that are positioned on locating pin(s) and secured with screws.
  • the press block can also be made in one piece, i.e., from a casting.
  • the press block is made of steel, and other materials such as ceramic, sintered materials or other hard metals can be used.
  • the press block 7 has a plurality of vertically running drillings 11 , which according to one embodiment serve to secure the block 7 by means of screws or other fastening means to another object, for example, another housing.
  • Horizontal fastener drillings 12 are also shown. By means of suitable fasteners such as screws, the horizontal fastener drillings 12 serve for assembly of the possibly several parts of the block 7 (of which only one part is shown by this figure) into a block unit.
  • heating elements are inserted into the vertically running drillings 11 to heat the press block.
  • the heating elements can be realized as heating resistance wires.
  • the heating elements can be contained in drillings 11 together with a fastening element if the drillings 11 are also used to fasten the press block.
  • FIG. 5 shows a top view of block 7 that is shown only partially in perspective view in FIG. 4 .
  • An opening of cavity 8 is shown on the top side and centrally arranged in the block.
  • the section line A-A is also shown; a section of the entire block through this section line was shown in the previous figure.
  • the lateral course of the horizontal fastener drillings 12 and the openings of the vertical drillings 11 are shown.
  • FIG. 6 is a side view of block 7 .
  • the partially inserted stamping tool 9 is shown at the top.
  • the lateral course of a fastener drilling 12 is shown at the bottom.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
US12/534,610 2007-02-02 2009-08-03 Multilayer Element and a Method for Producing a Multilayer Element Abandoned US20100019625A1 (en)

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US13/194,830 US9728706B2 (en) 2007-02-02 2011-07-29 Method for producing a multilayer element

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DE102007005341A DE102007005341A1 (de) 2007-02-02 2007-02-02 Vielschichtbauelement sowie Verfahren zur Herstellung eines Vielschichtbauelements
DE102007005341.1 2007-02-02
PCT/EP2008/051220 WO2008092932A1 (fr) 2007-02-02 2008-01-31 Élément multicouche et procédé de fabrication associé

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PCT/EP2008/051220 Continuation WO2008092932A1 (fr) 2007-02-02 2008-01-31 Élément multicouche et procédé de fabrication associé

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US20100019625A1 true US20100019625A1 (en) 2010-01-28

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US12/534,610 Abandoned US20100019625A1 (en) 2007-02-02 2009-08-03 Multilayer Element and a Method for Producing a Multilayer Element
US13/194,830 Expired - Fee Related US9728706B2 (en) 2007-02-02 2011-07-29 Method for producing a multilayer element

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US (2) US20100019625A1 (fr)
EP (1) EP2122701B1 (fr)
JP (2) JP5507261B2 (fr)
DE (1) DE102007005341A1 (fr)
WO (1) WO2008092932A1 (fr)

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DE102011079658A1 (de) * 2011-07-22 2013-01-24 Robert Bosch Gmbh Verfahren zur Herstellung eines keramischen Mehrlagenbauelements und keramisches Mehrlagenbauelement
DE102016101248A1 (de) 2015-11-02 2017-05-04 Epcos Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements

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DE102007005341A1 (de) 2008-08-07
JP5507261B2 (ja) 2014-05-28
JP2010518596A (ja) 2010-05-27
US9728706B2 (en) 2017-08-08
JP2014112701A (ja) 2014-06-19
EP2122701A1 (fr) 2009-11-25
JP5797286B2 (ja) 2015-10-21
WO2008092932A1 (fr) 2008-08-07
US20110277913A1 (en) 2011-11-17
EP2122701B1 (fr) 2012-10-10

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