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US20100000720A1 - Liquid cooling heat dissipating device with heat tubes gathering heat sources - Google Patents

Liquid cooling heat dissipating device with heat tubes gathering heat sources Download PDF

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Publication number
US20100000720A1
US20100000720A1 US12/492,146 US49214609A US2010000720A1 US 20100000720 A1 US20100000720 A1 US 20100000720A1 US 49214609 A US49214609 A US 49214609A US 2010000720 A1 US2010000720 A1 US 2010000720A1
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US
United States
Prior art keywords
heat
cold plate
liquid cooling
dissipating device
tubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/492,146
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English (en)
Inventor
Ji Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing AVC Technology Research Center Co Ltd
Original Assignee
Beijing AVC Technology Research Center Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing AVC Technology Research Center Co Ltd filed Critical Beijing AVC Technology Research Center Co Ltd
Publication of US20100000720A1 publication Critical patent/US20100000720A1/en
Assigned to Beijing AVC Technology Research Center Co., Ltd. reassignment Beijing AVC Technology Research Center Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, JI
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
    • A61P7/00—Drugs for disorders of the blood or the extracellular fluid
    • H10W40/73—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention is related to a heat dissipation device for an electronic product and particularly to a liquid cooling heat dissipation device.
  • the liquid cooling type heat dissipation device is widely used in the electronic products.
  • the heat generating from the CPU in the high speed electronic product is not the only heat needed to remove for an electronic product.
  • the video graphics array (VGA) chip, the internal storage chip and the north bridge chip in the high resolution graphics card also generate a lot of heat to be removed.
  • the conventional technique of liquid cooling device usually provides copper tubes and multiple cold plates.
  • the so-called cold plate is a chamber body with an inlet and an outlet for admitting the liquid flowing through, and a facial side thereof is touched to the heat source tightly such that the heat generated by the heat source is carried outward with the liquid flow.
  • the conventional cooling device has the following disadvantages:
  • the main object of the present invention is to provide a liquid cooling heat dissipating device with heat tubes gathering heat sources with which the heat sources at different spots can be gathered to a single cold plate and the cooling liquid can flow to the entire device with simple assembly and less risk of leakage.
  • the liquid cooling heat dissipating device with heat tubes gathering heat sources includes a cold plate being disposed on the heat sources and a or a plurality of heat pipes disposed between the heat sources, wherein the cold plate contacts with the heat sources completely, an end of the respective heat pipe is fixedly attached to the cold plate.
  • the respective heat pipe is sealed with a capillary material and a vapor-liquid working median contained inside.
  • the heat tubes which provide a high heat conductivity respectively, contact with the heat sources at different spots to gather the heat generated by the heat sources to the single cold plate.
  • the working media in the heat tubes are vaporized.
  • the vapor moves to the low temperature end of the respective heat tube and is condensed.
  • the cooling liquid carries all the heat at the cold plate outward the electronic product to perform the heat dissipation effectively.
  • the condensed liquid at the low temperature end passes through the capillary material in the respective heat tube to the high temperature end with the capillary attraction of the capillary material to complete the internal cooling cycle. Due to the latent heat being created at the time of the phase change of the working medium, the respective heat tube is capable of having very high heat transfer capability and the equivalent heat conductivity.
  • liquid cooling heat dissipating device with heat tubes gathering heat sources according to the prior art, has the following advantages:
  • the cooling device is easily fabricated with suitable fixtures during welding process.
  • the cooling device has less connecting joints with less risk of leakage to enhance the safety.
  • FIG. 1 is a disassembled perspective view of a liquid cooling heat dissipating device with heat tubes gathering heat sources according to the present invention
  • FIG. 2 is a perspective view of the liquid cooling heat dissipating device with heat tubes gathering heat sources according to the present invention
  • FIG. 3 is a perspective view illustrating the first type structure of the cold plate shown in FIG. 1 ;
  • FIG. 4 is a perspective view illustrating the second type structure of the cold plate shown in FIG. 1 ;
  • FIG. 5 is a plan view of the “L” shaped heat pipe
  • FIG. 6 is a plan view of the “N” shaped heat pipe
  • FIG. 7 is a plan view of the “S” shaped heat pipe.
  • FIG. 8 is an exploded perspective view illustrating an implement of the heat dissipating device according to the present invention.
  • FIGS. 1 and 2 a preferred embodiment of a heat dissipating device with heat tubes gathering heat sources according to the present invention is illustrated.
  • the heat dissipating device shown in FIGS. 1 and 2 is a liquid cooling heat dissipating device for an electronic product.
  • the heat dissipating device has a cold plate 1 and two heat tubes 3 , 4 .
  • the cold plate 1 is disposed on electronic heat sources.
  • the cold plate 1 can be implemented with the needle type cold plate as shown in FIG. 4 or the like in addition to the micro passage type cold plate shown in FIG. 3 .
  • the cold plate is made of metal, alloy or other composites with high heat conductivity and certain strength such as copper, aluminum, or graphite.
  • the heat pipes 3 , 4 are placed between the heat source and the cold plate 1 to contact with the electronic heat source completely. An end of the respective heat pipe 3 , 4 is fixedly connected to the cold plate.
  • the heat tubes 3 , 4 are sealed with a capillary material and a liquid-vapor working median.
  • the respective heat tube wall and the capillary material are made of copper and the working medium is water in the embodiment. It is noted that copper and water here only for exemplification and not for restriction.
  • a metal plate can be disposed at the bottom of the heat tubes 3 , 4 respectively under a certain constant pressure for securing the connection.
  • the metal plate is high heat conductivity with certain strength such as copper or silver. It can be seen in FIG. 1 that a metal plate 6 is fixed at the bottom of the heat tube 3 , and two metal plates 5 , 7 are fixed at the bottom of the heat tube 4 .
  • the heat tubes 3 , 4 are fabricated with powder sintering or groove type tube.
  • the respective heat tube can be “L” shaped as shown in FIG. 5 , “N” shaped as shown in FIG. 6 , and “S” shaped as shown in FIG. 7 .
  • the cross section of the respective heat tube 3 , 4 can be round, square, or triangle. It is noted that other suitable cross section for the heat tubes can be used instead of the preceding cross sections. Further, the heat tubes can be attached to the cold plate and the metal plates with welding, gluing or screw fastening, but it is not restricted the preceding joining ways.
  • the heat source can be gathered at an area, two areas or multiple areas with the corresponding amount of the cold plates to transmit the heat outward.
  • FIG. 8 shows a typical example of application of the heat dissipating device with heat tubes gathering heat sources according to the present invention.
  • the heat from the heat source 10 is transmitted to the cold plate 1 via the metal plates 5 , 7 and the heat pipe 4 .
  • the heat sources 8 , 9 are cooled with the cold plate directly, and the cooling liquid passes through the cold plate 1 to carry all the heat outward to perform the function of heat dissipation.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Hematology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Medicinal Chemistry (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Organic Chemistry (AREA)
  • Diabetes (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Coloring Foods And Improving Nutritive Qualities (AREA)
US12/492,146 2008-07-04 2009-06-26 Liquid cooling heat dissipating device with heat tubes gathering heat sources Abandoned US20100000720A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200820109045.2 2008-07-04
CNU2008201090452U CN201226635Y (zh) 2008-07-04 2008-07-04 一种利用热管集中热源式液冷散热装置

Publications (1)

Publication Number Publication Date
US20100000720A1 true US20100000720A1 (en) 2010-01-07

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Application Number Title Priority Date Filing Date
US12/492,146 Abandoned US20100000720A1 (en) 2008-07-04 2009-06-26 Liquid cooling heat dissipating device with heat tubes gathering heat sources
US12/533,981 Abandoned US20100021569A1 (en) 2008-07-04 2009-07-31 Use of Extracts from AMTHS plants in Lowering Blood Glucose

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/533,981 Abandoned US20100021569A1 (en) 2008-07-04 2009-07-31 Use of Extracts from AMTHS plants in Lowering Blood Glucose

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US (2) US20100000720A1 (zh)
CN (1) CN201226635Y (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9930807B2 (en) * 2011-05-06 2018-03-27 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US10433458B1 (en) * 2018-05-08 2019-10-01 Hewlett Packard Enterprise Development Lp Conducting plastic cold plates
US11355420B2 (en) * 2018-06-27 2022-06-07 Fuji Electric Co., Ltd. Cooling apparatus, semiconductor module, and vehicle
US12242121B2 (en) * 2022-08-31 2025-03-04 Ruijie Networks Co., Ltd. Heat dissipation structure for optoelectronic module and electronic device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103066038B (zh) * 2012-12-20 2015-04-22 华南理工大学 基于环路热管的igbt模块散热器及其制造方法
CN104945950A (zh) * 2015-06-11 2015-09-30 孙新新 一种苋菜中食用红色素的提取方法
CN106643242B (zh) * 2016-12-02 2018-10-12 廖忠民 液冷式竖直导热面热管散热器
KR102223310B1 (ko) * 2019-05-20 2021-03-04 동의대학교 산학협력단 깻묵을 포함하는 애완동물 기능성 사료용 조성물
CN110591571A (zh) * 2019-09-12 2019-12-20 无锡江南计算技术研究所 一种多质液冷冷板胶粘工艺方法
GB202105464D0 (en) * 2021-04-16 2021-06-02 Bionexus Llc Amaranthus extracts
CN113873828A (zh) * 2021-09-06 2021-12-31 华东计算技术研究所（中国电子科技集团公司第三十二研究所） 补偿型嵌入式散热装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US20050174735A1 (en) * 2003-08-26 2005-08-11 Nagui Mankaruse High performance cooling systems
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US20060278372A1 (en) * 2005-06-08 2006-12-14 Cheng-Tien Lai Heat dissipation device
US20070034355A1 (en) * 2005-08-10 2007-02-15 Cooler Master Co.,Ltd. Heat-dissipation structure and method thereof
US20080173431A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7440278B2 (en) * 2005-05-19 2008-10-21 Cooler Master Co., Ltd. Water-cooling heat dissipator
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US7551443B2 (en) * 2007-06-27 2009-06-23 Wistron Corporation Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
US20090166000A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20090301689A1 (en) * 2008-06-04 2009-12-10 Quanta Computer Inc. Fastening device and heat-dissipating module having the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4063822B2 (ja) * 2003-04-11 2008-03-19 コリアナ・コズメティック・カンパニー・リミテッド 皮膚しわ改善及び皮膚美白の二重機能性化粧料組成物。

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US20050174735A1 (en) * 2003-08-26 2005-08-11 Nagui Mankaruse High performance cooling systems
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US7440278B2 (en) * 2005-05-19 2008-10-21 Cooler Master Co., Ltd. Water-cooling heat dissipator
US20060278372A1 (en) * 2005-06-08 2006-12-14 Cheng-Tien Lai Heat dissipation device
US20070034355A1 (en) * 2005-08-10 2007-02-15 Cooler Master Co.,Ltd. Heat-dissipation structure and method thereof
US20080173431A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US7551443B2 (en) * 2007-06-27 2009-06-23 Wistron Corporation Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
US20090166000A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20090301689A1 (en) * 2008-06-04 2009-12-10 Quanta Computer Inc. Fastening device and heat-dissipating module having the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9930807B2 (en) * 2011-05-06 2018-03-27 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US9930806B2 (en) 2011-05-06 2018-03-27 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9936607B2 (en) * 2011-05-06 2018-04-03 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US10045463B2 (en) 2011-05-06 2018-08-07 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US10433458B1 (en) * 2018-05-08 2019-10-01 Hewlett Packard Enterprise Development Lp Conducting plastic cold plates
US11355420B2 (en) * 2018-06-27 2022-06-07 Fuji Electric Co., Ltd. Cooling apparatus, semiconductor module, and vehicle
US12242121B2 (en) * 2022-08-31 2025-03-04 Ruijie Networks Co., Ltd. Heat dissipation structure for optoelectronic module and electronic device

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CN201226635Y (zh) 2009-04-22
US20100021569A1 (en) 2010-01-28

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AS Assignment

Owner name: BEIJING AVC TECHNOLOGY RESEARCH CENTER CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LI, JI;REEL/FRAME:027281/0715

Effective date: 20090625

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION