[go: up one dir, main page]

US20090123740A1 - Surface Protection Sheet for Laser Material Processing - Google Patents

Surface Protection Sheet for Laser Material Processing Download PDF

Info

Publication number
US20090123740A1
US20090123740A1 US11/922,845 US92284506A US2009123740A1 US 20090123740 A1 US20090123740 A1 US 20090123740A1 US 92284506 A US92284506 A US 92284506A US 2009123740 A1 US2009123740 A1 US 2009123740A1
Authority
US
United States
Prior art keywords
protection sheet
surface protection
substrate layer
workpiece
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/922,845
Other languages
English (en)
Inventor
Ikkou Hanaki
Keiji Hayashi
Kazuhito Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANAKI, IKKOU, HAYASHI, KEIJI, OKUMURA, KAZUHITO
Publication of US20090123740A1 publication Critical patent/US20090123740A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/06—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for positioning the molten material, e.g. confining it to a desired area
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Definitions

  • the present invention relates to a surface protection sheet for laser processing, which is applied to a workpiece subjected to a cutting process by irradiation of a laser beam.
  • the property necessary for a surface protection sheet includes absence of detachment and delamination of a protection sheet after application to an application object and absence of a residual adhesive layer on the application object after release or removal. Furthermore, it includes absence of the development of detachment and delamination of a surface protection sheet, damage, and adhesive residue on an application object and the like, after processing of the application object with the surface protection sheet applied thereto.
  • JP-A-2000-328022 and JP-A-2002-302657 disclose a surface protection sheet for a metal plate.
  • laser cutting processing has superior merits.
  • the merits are, unlike punching processing, it does not require various dies but merely requires an input of the design data for practicing, it requires a shorter time than punching processing when a processing target (hereinafter to be also referred to as a workpiece) is particularly a metal plate, it is applicable even when the workpiece is thick, and it does not require a lubricant. Accordingly, the market of the laser cutting processing tends to expand.
  • laser cutting processing requires a high-pressure (about 0.5-1.5 MPa) assist gas supply.
  • a workpiece is desirably subjected to laser cutting processing with a surface protection sheet applied thereon for appearance reasons and the like.
  • a surface protection sheet applied thereon for appearance reasons and the like.
  • JP-A-2-295688, JP-A-7-241688 and JP-A-2001-212690 propose laser cutting processing methods capable of suppressing delamination during laser cutting processing. These processing methods can suppress delamination of a protection sheet.
  • FIG. 2 is an explanation figure of the dross.
  • FIG. 2 (A) is a plane view wherein a cylindrical through-hole 300 is formed by laser cutting processing.
  • FIG. 2 (B) is a sectional view along I-I of FIG. 2 (A), wherein a dross 210 with a height t is developed on the surface on the opposite side of surface 200 a on which a laser beam was irradiated.
  • dross 210 is developed, unpreferably, a further step to remove the dross becomes necessary.
  • the surface to be in contact with surface protection sheet 100 during laser cutting processing of workpiece 200 is mostly a sharp-surfaced table, and without the surface protection sheet 100 , a workpiece itself may be damaged during setting thereon.
  • the present invention aims at provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, which is the original role of a protection sheet, and does not allow easy development of a dross during laser cutting processing.
  • the present inventors have found that a surface protection sheet applied to the surface on the opposite side of the laser beam irradiation surface prevents the melt of a workpiece from being easily blown off by an assist gas during laser cutting processing, which consequently facilitates development of a dross. Based thereon, they have found a surface protection sheet for laser processing, which does not suffer easily from such a problem.
  • the characteristics of the present invention are as follows.
  • a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face of a workpiece during a cutting process by irradiation of a laser beam on the workpiece which comprises a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the substrate layer is made of a resin material having a melt viscosity measured based on JIS K7199 (1999) at 290° C. of not more than 200 Pa ⁇ s, and has a thickness of 0.01-0.12 mm.
  • the polyester-based resin is a poly(ethylene terephthalate) resin.
  • the surface protection sheet of (1) wherein the resin material comprises a polyolefin-based resin.
  • the surface protection sheet for laser processing of the present invention With the surface protection sheet for laser processing of the present invention, a dross is not developed easily during a laser cutting processing. Therefore, it is possible to subject a workpiece, particularly a metal plate and the like, to a laser cutting processing with a damage protection on the surface on the opposite side of a laser irradiation face.
  • a surface protection sheet associated with less delamination due to an assist gas by setting, on a surface ( 200 a side in FIG. 2 (B)), on which a laser beam is irradiated, a surface protection sheet associated with less delamination due to an assist gas, conventionally unavailable laser cutting processing of a workpiece having the sheet on both surfaces thereof can be enabled.
  • FIG. 1 schematically shows use of the surface protection sheet for laser processing of the present invention.
  • FIG. 2 is an explanation figure of a dross developed by a laser cutting processing.
  • the surface protection sheet for laser processing of the present invention comprises a substrate layer and an adhesive layer.
  • the substrate layer is made of a resin material having a particular melt viscosity, and has a thickness within a particular range.
  • the adhesive layer can be formed on one surface of the substrate layer.
  • the melt viscosity of the resin material constituting the substrate layer is measured based on JIS K7199 (1999). More specifically, a measurement sample is obtained as shown in the following, and the melt viscosity is obtained using a capillary die at 290° C., and via the measurement of test pressure and volume flow rate.
  • a specific method for obtaining the measurement sample is as follows.
  • the resin material constituting the substrate layer is clear, the resin material is palletized to give a measurement sample.
  • the adhesive layer and the substrate layer can be separated, the adhesive layer is removed using an organic solvent and the like, and only the substrate layer is finely cut to give a measurement sample.
  • the whole surface protection sheet is finely cut to give a measurement sample, and the melt viscosity obtained by measuring the measurement sample is taken as the melt viscosity of the resin material constituting the substrate layer.
  • the whole substrate layer is finely cut to give a measurement sample.
  • a resin material having a melt viscosity measured as mentioned above of not more than 200 Pa ⁇ s, preferably not more than 150 Pa ⁇ s, more preferably 20-100 Pa ⁇ s is used as a material of the substrate layer.
  • the melt viscosity exceeds 200 Pa ⁇ s, the substrate layer is not easily blown off in a laser-cut part and, as a result, a dross is easily developed.
  • the melt viscosity is within the above-mentioned preferable range, a dross is more easily blown off with an assist gas, and the film forming becomes more easy.
  • a resin material having a melt viscosity measured at 290° C. of not more than 200 Pa ⁇ s typically comprises a polyester-based resin.
  • poly(ethylene terephthalate), poly(butylene terephthalate), poly(ethylene naphthalate), poly(trimethylene terephthalate), poly(lactic acid), polycarbonate and the like can be mentioned.
  • amide-based polymers such as 6-nylon, 6,6-nylon, 12-nylon and the like
  • styrene-based polymers such as HIPS, GPPS and the like
  • acrylic-based polymers such as poly(methyl methacrylate) and the like
  • polyolefin-based resins such as propylene-based polymer, ethylene-based polymer, ethylene-based copolymerized polymer and the like; and the like
  • propylene-based polymers homopolymer series, block polymer series, random polymer series and the like can be mentioned.
  • the ethylene-based polymer low density, high density, linear low density polymers and the like can be mentioned.
  • the ethylene-based copolymerized polymer copolymers of ethylene and a polar polymer such as vinyl acetate, methyl methacrylate, acrylic acid and the like, and the like can be mentioned.
  • a polar polymer such as vinyl acetate, methyl methacrylate, acrylic acid and the like, and the like
  • the melt viscosity of the resins recited above is not necessarily within the above-mentioned range, and a resin usable in the present invention can be found easily from these resins by the measurement defined in the JIS.
  • the substrate layer may be made to have a multi-layer structure and the like.
  • the substrate layer may contain, within the range that does not impair the effect of the present invention, appropriate additives such as a filler (e.g., calcium carbonate, talc, calcium oxide and the like), an antiblocking agent, a lubricant, titanium oxide, an organic and inorganic pigment aiming at coloring, an antioxidant aiming at prevention of degradation and the like, a UV absorber, a light stabilizer, an antistatic agent and the like.
  • a plasticizer and the like for improving the flexibility of a substrate layer can also be added.
  • a surface treatment such as a corona treatment and the like may be applied to a substrate surface for the purpose of improving the adhesion with a back treating agent, an adhesive and an undercoating agent.
  • the lower limit of the thickness of the substrate layer is 0.01 mm, preferably 0.02 mm.
  • the upper limit of the thickness of the substrate layer is 0.12 mm, preferably 0.10 mm, more preferably 0.05 mm.
  • An adhesive layer is formed on one surface of the substrate layer.
  • the adhesive layer only needs to have adhesiveness to a stainless plate, which is a typical workpiece.
  • an adhesive as a material of the adhesive layer known rubber-based adhesives, acrylic-based adhesives, polyester-based adhesives and polyurethane-based adhesives can be used. Of these, from the aspects of adhesiveness to a metal plate, release property and cost, rubber-based adhesives and acrylic adhesives are preferable.
  • An adhesive layer using such adhesive is preferable because it also has adhesiveness to a metal plate and a glass plate other than a stainless plate.
  • rubber-based adhesive for example, natural rubber-based adhesives, synthetic rubber-based adhesives and the like can be mentioned.
  • synthetic rubber-based adhesive styrene-based elastomers such as polybutadiene, polyisoprene, butyl rubber, polyisobutylene, styrene-butadiene-styrene block copolymer and the like, styrene-based elastomers such as styrene-ethylene-butylene-styrene block copolymer, styrene-ethylene-butylene random copolymer and the like, ethylene-propylene rubber, propylene-butene rubber, ethylene-propylene-butene rubber and the like are used as a main component.
  • an acrylic-based adhesive for example, a copolymer of a monomer mixture of alkyl (meth)acrylate such as butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate and the like as a main component and, where necessary, as a copolymerizable monomer for modification, other monomers such as hydroxyl group containing monomer (e.g., 2-hydroxyethyl (meth)acrylate and the like), carboxyl group containing monomer (e.g., (meth)acrylic acid and the like), styrene-based monomer (e.g., styrene and the like), vinyl esters (e.g., vinyl acetate and the like), and the like is used.
  • the acrylic-based adhesive can be obtained by a conventionally used polymerization method such as solution polymerization method, emulsion polymerization method, UV polymerization method and the like.
  • a crosslinking agent for example, a crosslinking agent, a tackifier, a softening agent, an olefin-based resin, a silicone-based polymer, a liquid acrylic-based copolymer, a phosphoric acid ester series compound, an anti-aging agent, a light stabilizer such as a hindered amine series light stabilizer and the like, a UV absorber and others such as appropriate additives, for example, a filler, a pigment and the like such as calcium oxide, magnesium oxide, calcium carbonate, silica, zinc oxide and titanium oxide may be added.
  • a crosslinking agent for example, a crosslinking agent, a tackifier, a softening agent, an olefin-based resin, a silicone-based polymer, a liquid acrylic-based copolymer, a phosphoric acid ester series compound, an anti-aging agent, a light stabilizer such as a hindered amine series light stabilizer and the like, a UV absorb
  • Addition of a tackifier is effective for improving adhesiveness, and the amount of addition thereof is preferably 0-50 parts by weight, especially 0-30 parts by weight, particularly 0-10 parts by weight, per 100 parts by weight of the aforementioned adhesive, to improve adhesion to avoid development of a problem of an adhesive residue due to decreased cohesion and the like.
  • 0 part by weight means no addition of a tackifier.
  • tackifier for example, one or more kinds of known appropriate adhesives such as petroleum-based resins (e.g., aliphatic series, aromatic series, aliphatic-aromatic copolymer series, alicyclic series and the like), coumarone-indene-based resin, terpene-based resin, terpene-phenol-based resin, polymerized rosin-based resin, (alkyl) phenol-based resin, xylene-based resin, hydrogenated series resins thereof and the like can be used.
  • petroleum-based resins e.g., aliphatic series, aromatic series, aliphatic-aromatic copolymer series, alicyclic series and the like
  • coumarone-indene-based resin e.g., aliphatic series, aromatic series, aliphatic-aromatic copolymer series, alicyclic series and the like
  • coumarone-indene-based resin e.g., aliphatic series, aromatic series
  • Addition of a softening agent is generally effective for improving adhesiveness.
  • the softening agent for example, one or more kinds of low molecular weight diene-based polymer, polyisobutylene, hydrogenated polyisoprene, hydrogenated polybutadiene and derivatives thereof can be used, and the amount of addition thereof can be appropriately determined.
  • 0-40 parts by weight, especially 0-20 parts by weight, particularly 0-10 parts by weight, per 100 parts by weight of the above-described adhesive is preferable.
  • 0 part by weight means no addition of a softening agent.
  • the amount to be added is not more than 40 parts by weight, adhesive residue is less even at a high temperature or under outdoor exposure and the like.
  • the thickness of an adhesive layer can be appropriately determined according to adhesiveness and the like. Generally, it is set to 0.001-0.050 mm, especially 0.002-0.020 mm, particularly 0.003-0.015 mm. Where necessary, the adhesive layer can also be protected by temporarily setting a separator and the like until practical use.
  • a surface protection sheet for laser processing can be formed, for example, according to a known adhesion sheet formation method such as a method including applying a solution obtained by dissolving an adhesive composition in a solvent or a liquid melt resulting from heating the composition to a substrate layer, a method including forming an adhesive layer on a separator and shifting and adhering the adhesive layer to a substrate layer, a method including extruding and forming a material for forming an adhesive layer on a substrate layer to coat the substrate layer, a method including coextruding a substrate layer and an adhesive layer in two layers or multiple layers, a method including laminating a single layer of an adhesive layer or two layers of a laminate layer and an adhesive layer on a substrate layer, a method including laminating two layers or multiple layers of an adhesive layer, and a substrate layer, or a laminate layer and the like, and the like.
  • a known adhesion sheet formation method such as a method including applying a solution obtained by dissolving an adhesive composition in a solvent or a liquid melt
  • the surface protection sheet for laser processing of the present invention may have a release layer.
  • a back treating agent for forming a release layer one made of a solvent type or non-solvent type silicone-based polymer or a long chain alkyl-based polymer is generally used. Specifically, Peeloil (manufactured by Ipposha Yushi Kogyo Co., Ltd.), Shin-Etsu Silicones (manufactured by Shin-Etsu Chemical Co., Ltd.) and the like are available.
  • a known coating method such as a coating method using a roll coater (e.g., a gravure roll and the like), an atomizing method by a spray and the like, and the like can be used.
  • FIG. 1 schematically shows the use of the surface protection sheet for laser processing of the present invention.
  • the surface protection sheet 1 for laser processing of the present invention is adhered to a workpiece 2 to be subjected to a cutting process, by irradiation of laser beam 6 .
  • a laser beam 6 is focused by a collective lens 31 of a processing head 3 and then irradiated on the workpiece 2 from a nozzle 4 .
  • a laser beam generation apparatus is not limited to the one shown in the Figure.
  • An assist gas 7 is blown against the workpiece 2 at a high pressure of about 0.5-1.5 MPa from the nozzle 4 together with the laser beam 6 .
  • the assist gas 7 is supplied via an inlet tube 51 and a gas inlet 41 from a gas supply means 5 such as a gas cylinder and the like.
  • a gas supply means 5 such as a gas cylinder and the like.
  • various gases can be used as appropriate according to the material of workpiece 2 and the required quality of cut surface. Typically, nitrogen gas, air and the like are used.
  • the workpiece 2 is a target to be cut, which is exemplified by a metal plate, a coated metal plate, an aluminum sash, a resin board, a decorative copper plate, a vinyl chloride-laminated steel plate, a glass plate and the like.
  • the effect of the present invention becomes particularly remarkable in the case of a metal plate on which a dross is easily developed and which is required to have excellent appearance, particularly, a stainless plate and an aluminum plate.
  • the cutting process by irradiation of a laser beam 6 includes irradiation of a laser beam 6 from one side of a workpiece 2 to form a cut section penetrating through to the opposite side of the irradiation side, thereby to release at least one part of the workpiece. As shown in FIG. 2 , it may be a processing to remove a cylindrical part, or a processing to divide a large workpiece into plural small pieces.
  • the surface protection sheet 1 for laser processing of the present invention is to be adhered to the surface on the opposite side of a laser beam irradiation face 2 a of a workpiece 2 (processing target) in the cutting process.
  • the cutting process is performed by irradiating laser beam 6 to the surface 2 a on the opposite side of the applied surface of workpiece 2 with the surface protection sheet 1 for laser processing of the present invention applied to the workpiece 2 .
  • the surface protection sheet 1 for laser processing of the present invention is applied to the surface on the opposite side of the laser beam irradiation face 2 a of the workpiece 2 , at least to the part to be cut by the cutting process.
  • the surface, on which the surface protection sheet for laser processing of the present invention is applied can avoid damage caused by mounting on a laser processing apparatus and the like, and moreover, does not develop a dross easily.
  • An isocyanate series crosslinking agent (3 parts by weight, CORONATE L manufactured by NIPPON POLYURETHANE INDUSTRY CO., LTD.) was added to an ethyl acetate solution containing an acrylic-based adhesive (100 parts by weight, weight average molecular weight based on polystyrene 600,000) containing 2-ethylhexyl acrylate (2EHA, 30 wt %), ethyl acrylate (EA, 60%), methyl methacrylate (MMA, 6 wt %) and 2-hydroxyethyl acrylate (HEA, 4 wt %) to give an acrylic-based adhesive solution.
  • an acrylic-based adhesive 100 parts by weight, weight average molecular weight based on polystyrene 600,000
  • a 0.038 mm-thick poly(ethylene terephthalate) film (Tetoron Film G2 manufactured by Teijin DuPont Films Japan Limited) was directly used as a substrate layer.
  • a resin material sampled from the substrate layer had a melt viscosity at 290° C. of 74 Pa ⁇ s.
  • the acrylic-based adhesive solution was applied to the aforementioned substrate layer and dried to form a 0.010 mm-thick adhesive layer, whereby a surface protection sheet for laser processing was obtained.
  • Poly(butylene terephthalate) (DURANEX 200FP manufactured by WinTech Polymer Ltd.) was formed into a film at a die temperature of 250° C. by a T-die method to give a 0.04 mm-thick substrate layer.
  • a resin material sampled from the substrate layer had a melt viscosity at 290° C. of 26 Pa ⁇ s.
  • Example 1 The acrylic-based adhesive solution used in Example 1 was applied to this substrate layer and dried to form a 0.005 mm-thick adhesive layer, whereby a surface protection sheet for laser processing was obtained.
  • Example 2 In the same manner as in Example 1 except that a 0.05-mm thick poly(ethylene terephthalate) film (Tetoron Film G2 manufactured by Teijin DuPont Films Japan Limited) was used as a substrate layer, a surface protection sheet for laser processing was obtained.
  • a 0.05-mm thick poly(ethylene terephthalate) film Tetoron Film G2 manufactured by Teijin DuPont Films Japan Limited
  • Low density polyethylene (MIRASON 68P manufactured by Mitsui Chemicals, Inc.) was used as a material of a substrate layer and a mixture of a styrene-ethylene-butylene-styrene block copolymer (Tuftec H1062 manufactured by Asahi Kasei Corporation, 100 parts by weight) and a hydrogenated petroleum resin (ARKON P-100 manufactured by Arakawa Chemical Industries, Ltd., 50 parts by weight) was used as a material of an adhesive layer. These were coextruded by a T-die method at a die temperature of 170° C. to give a surface protection sheet for laser processing having a 0.01 mm-thick adhesive layer formed on a 0.05 mm-thick substrate layer. A resin material sampled from the above-mentioned substrate layer had a melt viscosity at 290° C. of 47 Pa ⁇ s.
  • Example 2 In the same manner as in Example 1 except that the thickness of an adhesive layer was set to 5 ⁇ m, a surface protection sheet for laser processing was obtained.
  • Low density polyethylene (SUMIKATHENE F208 manufactured by Mitsui Chemicals, Inc.) was formed into a film at a die temperature of 160° C. by an inflation method to give a 0.11 mm-thick substrate layer.
  • a resin material sampled from the substrate layer had a melt viscosity at 290° C. of 285 Pa ⁇ s.
  • One surface of the substrate layer was subjected to a corona discharge treatment and the acrylic-based adhesive solution used in Example 1 was applied to the treated surface and dried to form a 0.010 mm-thick adhesive layer, whereby a surface protection sheet for laser processing was obtained.
  • Example 2 In the same manner as in Example 1 except that a 0.125-mm thick poly(ethylene terephthalate) film (Tetoron Film G2 manufactured by Teijin DuPont Films Japan Limited) was used as a substrate layer, a surface protection sheet for laser processing was obtained. A resin material sampled from the substrate layer had a melt viscosity at 290° C. of 74 Pa ⁇ s as in Example 1.
  • a 0.125-mm thick poly(ethylene terephthalate) film Tetoron Film G2 manufactured by Teijin DuPont Films Japan Limited
  • Polypropylene (Novatech PP FL6H manufactured by Japan Polypropylene Corporation) was formed into a film at a die temperature of 230° C. by a T-die method to give a 0.04 mm-thick substrate layer.
  • a resin material sampled from the substrate layer had a melt viscosity at 290° C. of 422 Pa ⁇ s.
  • One surface of the substrate layer was subjected to a corona discharge treatment and the acrylic-based adhesive solution used in Example 1 was applied to the treated surface and dried to form a 0.010 mm-thick adhesive layer, whereby a surface protection sheet for laser processing was obtained.
  • Poly(butylene terephthalate) (DURANEX 800FP manufactured by WinTech Polymer Ltd.) was formed into a film at a die temperature of 270° C. by a T-die method to give a 0.04 mm-thick substrate layer.
  • a resin material sampled from the substrate layer had a melt viscosity at 290° C. of 295 Pa ⁇ s.
  • the acrylic-based adhesive solution used in Example 1 was applied to one surface of the substrate layer and dried to form a 0.005 mm-thick adhesive layer, whereby a surface protection sheet for laser processing was obtained.
  • the melt viscosity was measured by the aforementioned method. Specifically, a capillary rheometer (Capirograph 1B manufactured by Toyo Seiki Seisaku-sho, Ltd.) described in JIS K7199 was used and the measurement was performed at a nozzle diameter D of 1.0 mm, a land length L of 30 mm, and a shear rate of 10 sec ⁇ 1 .
  • a carbon dioxide gas laser processing machine (LC-3015 ⁇ II manufactured by AMADA CO., LTD.) and an oscillator (OLC-420HII manufactured by AMADA CO., LTD.) were used and a linear cutting process was performed at cutting rate 2200 mm/min, output 3000 W, frequency 0 Hz, duty 100 , nitrogen gas pressure 0.85 MPa, nozzle diameter 2.0 mm, nozzle gap 0.3 mm, and laser beam focus at 1.0 mm below the upper surface side of a workpiece (metal plate).
  • a surface protection sheet for laser processing obtained in each Example or Comparative Example was applied to one surface thereof.
  • a cutting process test was performed by irradiating a laser beam to a surface on the opposite side of the surface applied with the aforementioned sheet, under the aforementioned conditions.
  • the height of the dross developed on the surface applied with the aforementioned sheet was measured.
  • the difference obtained by subtracting the thickness (2.0 mm) of the metal plate from the height of the cut edge face was taken as the height of the dross.
  • the dial gauge with a minimum scale of 0.01 mm which is described in JIS B7503 (1997), was used. The measurement was performed at 10 points at 10 mm intervals and the average was obtained. The results are shown in Table 1.
  • Example 6 the surface protection sheet for laser processing obtained in Example 5 was applied to one surface of a workpiece, and SPV-M-4002E (manufactured by NITTO DENKO CORPORATION) was applied to the other surface of the workpiece, and the obtained sample was used as Example 6.
  • a cutting process test was performed by irradiating a laser beam to the surface applied with M-4002E, under the aforementioned conditions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
US11/922,845 2005-06-27 2006-06-27 Surface Protection Sheet for Laser Material Processing Abandoned US20090123740A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005187216 2005-06-27
JP2005-187216 2005-06-27
PCT/JP2006/313192 WO2007001078A1 (ja) 2005-06-27 2006-06-27 レーザ加工用表面保護シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/313192 A-371-Of-International WO2007001078A1 (ja) 2005-06-27 2006-06-27 レーザ加工用表面保護シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/888,024 Division US9089930B2 (en) 2005-06-27 2010-09-22 Surface protection sheet for laser material processing

Publications (1)

Publication Number Publication Date
US20090123740A1 true US20090123740A1 (en) 2009-05-14

Family

ID=37595311

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/922,845 Abandoned US20090123740A1 (en) 2005-06-27 2006-06-27 Surface Protection Sheet for Laser Material Processing
US12/888,024 Expired - Fee Related US9089930B2 (en) 2005-06-27 2010-09-22 Surface protection sheet for laser material processing

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/888,024 Expired - Fee Related US9089930B2 (en) 2005-06-27 2010-09-22 Surface protection sheet for laser material processing

Country Status (6)

Country Link
US (2) US20090123740A1 (ja)
EP (1) EP1900470B1 (ja)
KR (1) KR20080023263A (ja)
CN (2) CN101208172A (ja)
TW (1) TWI408203B (ja)
WO (1) WO2007001078A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080254249A1 (en) * 2004-08-06 2008-10-16 Nitto Denko Corporation Work Subject Material, Surface Protection Sheet and Method of Working
US20110003114A1 (en) * 2008-02-28 2011-01-06 Susumu Nakamura Method for forming through hole and product with the formed through hole
US10286489B2 (en) 2010-12-30 2019-05-14 3M Innovative Properties Company Apparatus and method for laser cutting using a support member having a gold facing layer
US11786993B2 (en) * 2017-10-20 2023-10-17 Arcelormittal Method for producing a precoated steel sheet and associated sheet

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080190995A1 (en) * 2007-02-13 2008-08-14 Venture Tape Corp. Welding tape and method of use
DE102008040640A1 (de) * 2008-07-23 2010-01-28 Biotronik Vi Patent Ag Endoprothese und Verfahren zur Herstellung derselben
US8217303B2 (en) * 2009-03-16 2012-07-10 Abbott Cardiovascular Systems Inc. Dual gas laser cutting of medical devices
CN102741038B (zh) * 2009-10-15 2014-11-05 株式会社爱世克私 激光粘接用层叠体、鞋和鞋的制造方法
US20120160818A1 (en) * 2010-06-14 2012-06-28 Mitsubishi Electric Corporation Laser machining apparatus and laser machining method
JP5153917B2 (ja) * 2011-05-30 2013-02-27 アルプス電気株式会社 レンズ駆動装置及びレンズ駆動装置の製造方法
EP2712699A1 (de) * 2012-10-01 2014-04-02 Siemens Aktiengesellschaft Verfahren zum Schutz eines Bauteils, Verfahren zum Laserbohren und Bauteil
WO2017116941A1 (en) * 2015-12-30 2017-07-06 3M Innovative Properties Company Infrared absorbing adhesive films and related methods
JP7089347B2 (ja) * 2016-07-20 2022-06-22 日東電工株式会社 粘着シート
KR102769664B1 (ko) * 2018-08-20 2025-02-17 니폰 제온 가부시키가이샤 커트 필름의 제조 방법, 커트 필름, 및 커트 필름용 필름
CN112122797A (zh) * 2020-09-24 2020-12-25 松山湖材料实验室 激光加工熔渣去除方法、系统、计算机设备及可读存储介质
CN113547210A (zh) * 2021-07-15 2021-10-26 Tcl华星光电技术有限公司 颗粒物粘附装置与激光处理工艺
DE102021123617A1 (de) 2021-09-13 2023-03-16 Precitec Gmbh & Co. Kg Laserbearbeitungskopf mit Klebefalle

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020114948A1 (en) * 1999-12-15 2002-08-22 Uwe Schumann Adhesive tape with thermally curable backing for masking a cathodic electrocoat primer
US20040028919A1 (en) * 2002-08-09 2004-02-12 Mitsushi Yamamoto Surface protective film for transparent conductive substrate, and transparent conductive substrate with surface protective film
US20040151903A1 (en) * 2003-01-27 2004-08-05 Takuya Niino Protective tape used for optical member
US6899949B2 (en) * 2002-04-25 2005-05-31 Nitto Denko Corporation Protective tape used for optical member, treated layer forming agent used for protective tape used for optical member, optical film with protective tape and image viewing display with protective tape
US20060246279A1 (en) * 2003-04-25 2006-11-02 Masakatsu Urairi Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
US20080254249A1 (en) * 2004-08-06 2008-10-16 Nitto Denko Corporation Work Subject Material, Surface Protection Sheet and Method of Working

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213384A (ja) * 1984-04-06 1985-10-25 Mitsubishi Electric Corp レ−ザ切断方法
JPS63160781A (ja) * 1986-12-24 1988-07-04 Mitsubishi Electric Corp レ−ザ切断・穿孔方法
US5059256A (en) * 1988-09-01 1991-10-22 Kanapenas Rimantas Mikolas V Method of manufacturing filters by laser treatment and device therefor
JPH02295688A (ja) 1989-05-01 1990-12-06 Amada Co Ltd フィルムコーティング材のレーザ加工方法およびその方法に用いるレーザ加工ヘッド
JP3405799B2 (ja) 1994-03-04 2003-05-12 ファナック株式会社 レーザ加工方法
JPH08108289A (ja) * 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd レーザ加工用光学装置
JPH08162583A (ja) * 1994-11-30 1996-06-21 Toshiba Corp リードフレームの製造方法
JP3237441B2 (ja) * 1995-02-28 2001-12-10 三菱電機株式会社 レーザ加工装置
TW311927B (ja) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
IT1277080B1 (it) * 1995-12-14 1997-11-04 Salvagnini Italia Spa Testa di focalizzazione di un fascio laser dotata di una lente di focalizzazione per una macchina di lavorazione di pezzi metallici
DE19649865C1 (de) * 1996-12-02 1998-02-12 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Formkörpers
JP2000328022A (ja) 1999-05-21 2000-11-28 Hitachi Chem Co Ltd 金属板加工用表面保護フィルム
AU4706601A (en) * 1999-11-18 2001-06-18 Main Tape Company, Inc. Process for forming film covered sheet metal material and sheet metal material so covered
JP4366534B2 (ja) 2000-02-01 2009-11-18 澁谷工業株式会社 レーザ加工方法
JP3615691B2 (ja) * 2000-06-20 2005-02-02 新日鐵化学株式会社 樹脂フィルムのレーザ加工方法
JP4277429B2 (ja) * 2000-07-27 2009-06-10 株式会社デンソー 高密度エネルギビーム加工方法およびその装置
JP4780828B2 (ja) * 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2002302657A (ja) 2001-04-05 2002-10-18 Sekisui Chem Co Ltd 金属板の曲げ加工用表面保護フィルム
JP2002331377A (ja) * 2001-05-08 2002-11-19 Koike Sanso Kogyo Co Ltd レーザピアシング方法
JP4886937B2 (ja) * 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
JP2004096483A (ja) 2002-08-30 2004-03-25 Sharp Corp 通信装置および通信方法
JP2004223542A (ja) * 2003-01-21 2004-08-12 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
JP2004322157A (ja) * 2003-04-25 2004-11-18 Nitto Denko Corp 被加工物の加工方法、及びこれに用いる粘着シート
FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
ATE553638T1 (de) * 2003-12-25 2012-04-15 Nitto Denko Corp Verfahren zur herstellung durch laser werkstücke
JP2005236082A (ja) * 2004-02-20 2005-09-02 Nitto Denko Corp レーザーダイシング用粘着シート及びその製造方法
JP4439990B2 (ja) * 2004-04-28 2010-03-24 株式会社ディスコ レーザー加工方法
JP2006095563A (ja) * 2004-09-29 2006-04-13 Denso Corp 高密度エネルギービームによるバリ除去方法およびバリ除去装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020114948A1 (en) * 1999-12-15 2002-08-22 Uwe Schumann Adhesive tape with thermally curable backing for masking a cathodic electrocoat primer
US6899949B2 (en) * 2002-04-25 2005-05-31 Nitto Denko Corporation Protective tape used for optical member, treated layer forming agent used for protective tape used for optical member, optical film with protective tape and image viewing display with protective tape
US20050185570A1 (en) * 2002-04-25 2005-08-25 Shozo Imono Protective tape used for optical member, optical film with protective tape, and image viewing display with protective tape
US20040028919A1 (en) * 2002-08-09 2004-02-12 Mitsushi Yamamoto Surface protective film for transparent conductive substrate, and transparent conductive substrate with surface protective film
US20060029798A1 (en) * 2002-08-09 2006-02-09 Mitsushi Yamamoto Surface protective film for transparent conductive substrate, and transparent conductive substrate with surface protective film
US20040151903A1 (en) * 2003-01-27 2004-08-05 Takuya Niino Protective tape used for optical member
US7270877B2 (en) * 2003-01-27 2007-09-18 Nitto Denko Corporation Protective tape used for optical member
US20060246279A1 (en) * 2003-04-25 2006-11-02 Masakatsu Urairi Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
US20080254249A1 (en) * 2004-08-06 2008-10-16 Nitto Denko Corporation Work Subject Material, Surface Protection Sheet and Method of Working

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080254249A1 (en) * 2004-08-06 2008-10-16 Nitto Denko Corporation Work Subject Material, Surface Protection Sheet and Method of Working
US8263220B2 (en) * 2004-08-06 2012-09-11 Nitto Denko Corporation Work subject material, surface protection sheet and method of working
US20110003114A1 (en) * 2008-02-28 2011-01-06 Susumu Nakamura Method for forming through hole and product with the formed through hole
US8704127B2 (en) * 2008-02-28 2014-04-22 Wavelock Advanced Technology Co., Ltd. Method of forming a through hole by laser drilling
US10286489B2 (en) 2010-12-30 2019-05-14 3M Innovative Properties Company Apparatus and method for laser cutting using a support member having a gold facing layer
US11786993B2 (en) * 2017-10-20 2023-10-17 Arcelormittal Method for producing a precoated steel sheet and associated sheet

Also Published As

Publication number Publication date
US20110011841A1 (en) 2011-01-20
US9089930B2 (en) 2015-07-28
WO2007001078A1 (ja) 2007-01-04
KR20080023263A (ko) 2008-03-12
TW200706629A (en) 2007-02-16
CN102009270B (zh) 2013-03-06
EP1900470A4 (en) 2009-05-13
EP1900470B1 (en) 2012-06-13
CN101208172A (zh) 2008-06-25
CN102009270A (zh) 2011-04-13
TWI408203B (zh) 2013-09-11
EP1900470A1 (en) 2008-03-19

Similar Documents

Publication Publication Date Title
US9089930B2 (en) Surface protection sheet for laser material processing
US20140193611A1 (en) Surface protection film and optical film with surface protection film
US8455083B2 (en) Pressure-sensitive adhesive sheet
US11866613B2 (en) Pressure-sensitive adhesive sheet
WO2004061032A1 (ja) 粘着シートおよびその製造方法
US20110033699A1 (en) Pressure-sensitive adhesive tape
US20110244227A1 (en) Pressure-sensitive adhesive tape
US20070224416A1 (en) Easily Applicable Pressure-Sensitive Adhesive Sheet and Process for Production Thereof
US20130017363A1 (en) Pressure-sensitive adhesive sheet
US20110287253A1 (en) Pressure-sensitive adhesive tape
EP2388304A1 (en) Multi-layer pressure-sensitive adhesive tape
EP2371918A1 (en) Multi-layer pressure-sensitive adhesive tape
CN1973013A (zh) 粘合片材的制造方法
KR20080040724A (ko) 점착 시트
JP5221012B2 (ja) レーザ加工用表面保護シート
JP2006035914A (ja) 自動車ホイール用表面保護フィルム
WO2013141178A1 (ja) 表面保護シート
US20230081331A1 (en) Pressure-sensitive adhesive sheet
KR20070036129A (ko) 점착 시트
JP7778618B2 (ja) レーザ加工用粘着シート

Legal Events

Date Code Title Description
AS Assignment

Owner name: NITTO DENKO CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HANAKI, IKKOU;HAYASHI, KEIJI;OKUMURA, KAZUHITO;REEL/FRAME:020322/0925

Effective date: 20071213

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION