US20080305277A1 - Method and apparatus for making diamond-like carbon films - Google Patents
Method and apparatus for making diamond-like carbon films Download PDFInfo
- Publication number
- US20080305277A1 US20080305277A1 US12/188,104 US18810408A US2008305277A1 US 20080305277 A1 US20080305277 A1 US 20080305277A1 US 18810408 A US18810408 A US 18810408A US 2008305277 A1 US2008305277 A1 US 2008305277A1
- Authority
- US
- United States
- Prior art keywords
- dlc
- plasma
- ions
- ion
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
- H01J37/3233—Discharge generated by other radiation using charged particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
- C23C16/4588—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically the substrate being rotated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3178—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S427/00—Coating processes
- Y10S427/103—Diamond-like carbon coating, i.e. DLC
- Y10S427/106—Utilizing plasma, e.g. corona, glow discharge, cold plasma
Definitions
- the present invention relates to deposition of diamond-like carbon films, and more specifically to ion-assisted plasma-enhanced deposition of diamond-like carbon films for uses including protection of materials against exposure to harmful agents, for example, encapsulation of surface of films, such as photovoltaic solar cells for protection against chemical, mechanical, and radiation damage.
- a method of this type is described in Armenian patent (AM N851, HO1L31/02).
- DLC diamond-like carbon
- the deposition of diamond-like carbon (DLC) film on the front surface of a silicon photovoltaic cell with p-n junction and two contacts is performed using plasma flow produced by an ion source comprising a cylindrical hollow cathode, anode and a magnet (solenoid).
- the method is simple and reliable. Its disadvantage is in a considerable degree of non-uniformity of density of plasma flow and ion energy which limits the area of uniformly of DLC encapsulated substrates by 20 cm 2 .
- a method is known of deposition of antireflecting and passivating diamond-like or composite diamond film on the surface of optoelectronic devices (solar cells or photodetectors) using high-frequency plasma (Patent CN N1188160, C23C16/26, G02B1/11, 1998).
- the closest to the claimed invention is a method of coating of substrates with various films including DLC using the separation of the substrate voltage from the production of the plasma (Patent H5 N6372303, C23C016/26, 2002).
- the substrate biased by a combination of a direct voltage and a pulsed voltage with a frequency of 0.1 kHz-10 MHz, is rotated about several axes of rotation in a vacuum chamber with various plasma sources.
- the method produces a multilayer structure that is wear-resistant and that reduces friction. Optical characteristics of the coating are not controlled. It is not possible to produce by this method of DLC coating on plain substrates of large area.
- An object of the present invention is to provide a method scaled upwards, which facilitates deposition of uniform (with degree of non-uniformity of optical parameters less than 5%) DLC film on large area surface (e.g., more than 110 cm 2 ) photovoltaic solar cells to produces a DLC film that has optical parameters varied within the given range and that possesses stability against harmful effects of the environment.
- the object is achieved by the control of ion energy, plasma discharge current and spatial distribution of ion current density by an electric field produced by a system of annular electrodes, comprising diaphragm, neutralizer, and accelerating electrodes.
- the uniformity of plasma is monitored by measurement of ion current density at the surface of the substrate (photovoltaic solar cell).
- DLC films with refractive index in the range of 1.48-2.60 are obtained by varying ion energy in the range of 20-140 eV, plasma current density in the range of 0.2-0.8 mA ⁇ cm ⁇ 2 , and hydrocarbon content in the feed gas mixture in the range of 2-40%. Rotation of the substrates about three axes is used to improve the uniformity of DLC films, which allows the substrate temperature not to exceed 80° C.
- DLC films can be manufactured in the form of monolayer or multilayer (with discrete changes of refractive index) structures, or in the form of a layer with the refractive index continuously varying along the depth of film thickness.
- encapsulants used as encapsulants for photovoltaic solar cells, they allow light transmission of at least 95% and reflectivity of 5% within the range of photosensitivity of silicon.
- These encapsulants possess stability against UV, proton, and electron irradiation, chemical stability against attacks by strong acids, thermal and weathering stability against high temperature and humidity, and mechanical stability against scratching and environmental elements.
- FIG. 1 shows a cross-sectional view of an ion source and a system of electrodes to control plasma.
- FIG. 2 shows spatial distribution of ion current density without (curve 1 ) and with (curve 2 ) a system of electrodes.
- FIG. 3 shows a side view of a device for rotation of substrates.
- FIG. 4 shows a top view of the device shown in FIG. 3 .
- FIG. 5 shows a side view of the device shown in FIG. 3 in combination with the system of electrodes shown in FIG. 1 .
- FIG. 6 shows a Raman spectra of three DLC films.
- FIG. 7 shows reflection spectra from indicated spots of a DLC film deposited on a Si substrate.
- FIG. 8 shows transmission spectra of three DLC films deposited on sapphire substrates under various conditions.
- FIG. 9 shows a cross section of a photovoltaic cell with contact grid and bi-layer DLC film encapsulant.
- FIG. 11 shows a spectral response of a silicon photovoltaic cell (excited from the back).
- FIG. 12 shows the effect of proton irradiation on spectral efficiency of DLC coated photovoltaic cells.
- FIG. 1 shows an apparatus that can be used for carrying out the method of depositing diamond-like carbon (DLC) films according to this invention. It includes a vacuum chamber 4 , in which a radial direct current ion source is provided by an anode 1 , a cylindrical cathode 2 and a magnet (solenoid) 3 . A direct voltage potential in a range of 1-4 kV is applied between cathode 2 and anode 1 . The magnet 3 forms magnetic field perpendicular to the electric field.
- Plasma 16 is formed in a gap between anode 1 and cathode 2 and is shaped in the form of a truncated cone as it projects into the chamber 4 .
- Grounded diaphragm 5 slows down electrons and cuts off ions which move at angles more than 40° relative to the plasma axis to condition and collimate a flow of the ions toward the substrate 9 .
- a neutralizer electrode 6 is placed outside the magnetic field.
- An alternating (AC) voltage in a range of 30-50 V is applied to the neutralizer electrode 6 in order to create the alternating current (AC) for providing the electron flow due to a thermo emission phenomenon. Since the anode voltage is about +2.5 kV, the potential of the neutralizer is negative relative to the anode. Therefore, the flow of emitted electrons in the plasma region is provided to neutralize slow ions and non-dissociated radicals (C X H y ).
- the accelerating electrode 7 provided with a grid 8 enables one to control or correct the energy of ions reaching the surface of a substrate (photovoltaic cell) 9 mounted on a support device 10 .
- a voltage supply biases accelerating electrode 7 and the support device 10 in a voltage range of ⁇ 50 to ⁇ 400 V, which provides average ion energy within the range 20 to 150 eV.
- the apparatus and method of this invention can also be scaled up to larger deposition areas than the 12-13 cm diameter of this example and still achieve this uniformity in ion energy over such layer.
- Proportion of concentration of these ions is controlled by feed gas mixture composition (C 7 H 8 , Ar, N 2 ) brought into chamber 4 via a gas inlet conduit through the anode 1 .
- the effluent gases leave through an exhaust system 11 .
- a plurality of support devices 10 are configured and motivated to move a plurality of substrates 9 (see FIG. 1 ; not shown in FIGS. 3-5 ) sequentially into and out of alignment with the ion flow 17 .
- the individual support devices 10 and substrates 9 are also rotated to expose the substrates 9 to different portions of the ion flow 17 to attain uniform deposition of material on the substrates 9 .
- the support devices 10 of the apparatus 100 are ganged or grouped into a plurality of gangs 102 , 104 , 106 , 108 .
- Each gang 102 , 104 , 106 , 108 has at least one support device 10 (four support devices 10 in the example of FIGS. 3-5 ).
- the support devices 10 are motivated to rotate about their respective axes 110 , as indicated by arrows 111 in FIG. 3 .
- the gangs 102 , 104 , 106 , 108 are mounted on respective struts 13 , which extend radially outward from a main shaft 12 .
- the main shaft 12 rotates, as indicated by arrow 120 , to move the respective gangs 102 , 104 , 106 , 108 into and out of alignment with the ion flow 17 so that the substrates 9 in the respective gangs 102 , 104 , 106 , 108 are exposed to the ion flow 17 .
- This rotation of the gangs about the axis of shaft 12 into and out of alignment with the ion flow 17 not only enables the individual substrates 9 to get exposed to more portions of the ion flow 17 and thereby avoid uneven deposition, but also so that they are exposed to the ion flow 17 for limited times and then rotated out of such alignment for a time to avoid unnecessary heat build-up and temperature rise in the substrate 9 .
- the support devices 10 rotate the substrates 9 about their respective axes 110 , as indicated by arrows 111 , to also help achieve uniform deposition on the substrates 9 .
- each gang 102 , 104 , 106 , 108 can be rotated about the axis of its respective strut 13 , as indicated by arrow 130 in FIGS. 3 and 5 .
- the four support devices 10 on each gang 102 , 104 , 106 , 108 are mounted on the distal ends of four arms 131 extending radially outward from a hub 132 of a wheel 14 .
- the hub 132 is rotatable with respect to the axis of the strut 13 on which it is mounted so that the wheel 14 rotates the support devices 10 and substrates 9 about the respective axes of struts 13 , as indicated by arrow 130 .
- the shaft 12 is vertical in the example of FIGS. 3-5 , so the axis of struts 13 and mountings 110 are horizontal. Therefore, in this example, rotation about a main vertical axis 12 is combined with rotation of four wheels 14 about the four horizontal axes of struts 13 . Support devices 10 mounted on the wheels 14 rotate about their respective horizontal axes 110 . As a consequence, substrates 9 perform complex movement about the base 15 . Rotation in the range 10-30 rpm provides optimal trajectory which drives the substrates to traverse all the zones or areas across the plasma flow 17 and spend some time outside it, which facilitates their cooling.
- the complex movement of substrates 9 provides for better uniformity of the DLC coating (with less than 5% variation in mechanical and optical parameters—sometimes called “spread”—within an area of ⁇ 110 cm 2 ) and relatively low (30-80° C.) temperature of deposition.
- the circular area of about 125 cm 2 (diameter of about 12.6 cm) in the example of the FIG. 2 analysis exceeds the area of the silicon plate and correspondingly provides the uniformity or homogeneity of the deposited coating.
- the method and apparatus of this invention can be scaled up to larger deposition areas than the examples described herein and still achieve this uniformity in mechanical and optical parameters for such larger deposition areas. Therefore, this invention is not limited to the example areas of the examples provided herein.
- a film manufactured according to the present invention is high quality diamond-like material.
- FIG. 6 shows a Raman spectra of the DLC films of various thickness (240, 540, and 840 nm, for curves 61 , 62 and 63 respectively) deposited under various technological conditions. The position of maximum of the curves indicates predominance of sp 3 bonds in these films.
- FIG. 7 shows the nearly identical reflectance spectra for the different areas (as indicated) of a 12-cm diameter DLC film.
- DLC films in particular their optical parameters can be tuned by exact control of plasma parameters (ion beam current and energy; feed gas mixture composition).
- Table 1 shows parameters of 60-900 nm thick DLC films manufactured under various technological conditions where U ac is anode 1 to cathode 2 voltage, I ac is plasma discharge current in the ion source, U b is the bias applied to the diaphragm 7 and the support device 10 , ⁇ E k > is the average kinetic energy of ions reaching the surface of the substrate (photovoltaic cell) 9 , I p is the plasma current density at the surface of the substrate 9 , n is the refractive index of a DLC film, H V is its microhardness.
- the feed gas mixture (C 7 H 8 , Ar, N 2 ) was 55% Ar, with 45% left for C 7 H 8 and N 2 .
- This method and apparatus also works with other carrier gases besides N 2 and Ar, as will be understood by persons skilled in the art.
- Table 1 the percentage of C 7 H 8 is given.
- the DLC films are manufactured with various microhardness (2500-3100 kg ⁇ mm ⁇ 2 ) and refractive indexes (1.48-2.60).
- the films show a density varying in the range of 1.8-2.35 g ⁇ cm ⁇ 3 and are characterized by small amount of microdefects, low internal stresses, good adhesion and reduced friction. These properties grant high mechanical stability of the DLC encapsulants.
- a feed gas mixture with higher ratio C 7 H 8 :N 2 produces DLC films with unacceptable high optical absorption. Ions with energies higher than 140 eV cause degradation of the properties of photovoltaic cells. Films manufactured at ion energies of less than 20 eV possess too high refractive index to be useful for antireflective coating.
- Plasma current less than 0.20 mA ⁇ cm ⁇ 2 does not grant proper efficiency of the DLC deposition. Plasma current more then 0 . 80 mA ⁇ cm ⁇ 2 causes increase an amount of defects in the films.
- Curve 83 of FIG. 8 corresponds to a 240 nm film sample deposited under technological conditions different from those for the other two samples.
- FIG. 10 shows the reflection spectrum of the bi-layer DLC structure; the low reflectance (R ⁇ 5%) grants good antireflection effects of this PV cell encapsulation.
- FIG. 11 shows a spectral response of a Si PV cell (excited from the back): curve 91 —before DLC coating, curve 92 after DLC coating.
- the cell efficiency enhancement is stronger than that can be explained by the antireflecting effect.
- Significant performance improvement is attributed to reduced (surface) boundary recombination losses.
- Proton irradiation is an important factor causing degradation of PV cells used in space.
- the proton energy interval which is of interest as far as the effects on the DLC films with technologically realistic thickness ( ⁇ 2 ⁇ m) are concerned, ranges from 10 keV to 500 keV.
- data on the proton spectrum given by the accepted models (such as NASA AP-8 and JPL-91) were used.
- the range of 10-500 keV was divided into two intervals: 10-50 keV and 50-500 keV.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
- This application claims priority as a divisional of U.S. patent application Ser. No. 11/002,611, filed on Dec. 2, 2004 and entitled “Methods and Apparatus for Making Diamond-Like Carbon Films” by Fu-Jann Pem et al., hereby incorporated by reference as if fully set forth herein.
- The United States Government has rights in this invention pursuant to Contract No. DEAC36-99GO10337 between the U.S. Department of Energy and the National Renewable Energy Laboratory, a Division of Midwest Research Institute.
- The present invention relates to deposition of diamond-like carbon films, and more specifically to ion-assisted plasma-enhanced deposition of diamond-like carbon films for uses including protection of materials against exposure to harmful agents, for example, encapsulation of surface of films, such as photovoltaic solar cells for protection against chemical, mechanical, and radiation damage.
- A method of this type is described in Armenian patent (AM N851, HO1L31/02). According to this patent the deposition of diamond-like carbon (DLC) film on the front surface of a silicon photovoltaic cell with p-n junction and two contacts is performed using plasma flow produced by an ion source comprising a cylindrical hollow cathode, anode and a magnet (solenoid). The method is simple and reliable. Its disadvantage is in a considerable degree of non-uniformity of density of plasma flow and ion energy which limits the area of uniformly of DLC encapsulated substrates by 20 cm2.
- A method is known of deposition of antireflecting and passivating diamond-like or composite diamond film on the surface of optoelectronic devices (solar cells or photodetectors) using high-frequency plasma (Patent CN N1188160, C23C16/26, G02B1/11, 1998).
- The closest to the claimed invention is a method of coating of substrates with various films including DLC using the separation of the substrate voltage from the production of the plasma (Patent H5 N6372303, C23C016/26, 2002). The substrate, biased by a combination of a direct voltage and a pulsed voltage with a frequency of 0.1 kHz-10 MHz, is rotated about several axes of rotation in a vacuum chamber with various plasma sources. The method produces a multilayer structure that is wear-resistant and that reduces friction. Optical characteristics of the coating are not controlled. It is not possible to produce by this method of DLC coating on plain substrates of large area.
- An object of the present invention is to provide a method scaled upwards, which facilitates deposition of uniform (with degree of non-uniformity of optical parameters less than 5%) DLC film on large area surface (e.g., more than 110 cm2) photovoltaic solar cells to produces a DLC film that has optical parameters varied within the given range and that possesses stability against harmful effects of the environment.
- The object is achieved by the control of ion energy, plasma discharge current and spatial distribution of ion current density by an electric field produced by a system of annular electrodes, comprising diaphragm, neutralizer, and accelerating electrodes. The uniformity of plasma is monitored by measurement of ion current density at the surface of the substrate (photovoltaic solar cell).
- According to the present invention, DLC films with refractive index in the range of 1.48-2.60 are obtained by varying ion energy in the range of 20-140 eV, plasma current density in the range of 0.2-0.8 mA·cm−2, and hydrocarbon content in the feed gas mixture in the range of 2-40%. Rotation of the substrates about three axes is used to improve the uniformity of DLC films, which allows the substrate temperature not to exceed 80° C.
- According to the present invention, DLC films can be manufactured in the form of monolayer or multilayer (with discrete changes of refractive index) structures, or in the form of a layer with the refractive index continuously varying along the depth of film thickness. Used as encapsulants for photovoltaic solar cells, they allow light transmission of at least 95% and reflectivity of 5% within the range of photosensitivity of silicon. These encapsulants possess stability against UV, proton, and electron irradiation, chemical stability against attacks by strong acids, thermal and weathering stability against high temperature and humidity, and mechanical stability against scratching and environmental elements.
-
FIG. 1 shows a cross-sectional view of an ion source and a system of electrodes to control plasma. -
FIG. 2 shows spatial distribution of ion current density without (curve 1) and with (curve 2) a system of electrodes. -
FIG. 3 shows a side view of a device for rotation of substrates. -
FIG. 4 shows a top view of the device shown inFIG. 3 . -
FIG. 5 shows a side view of the device shown inFIG. 3 in combination with the system of electrodes shown inFIG. 1 . -
FIG. 6 shows a Raman spectra of three DLC films. -
FIG. 7 shows reflection spectra from indicated spots of a DLC film deposited on a Si substrate. -
FIG. 8 shows transmission spectra of three DLC films deposited on sapphire substrates under various conditions. -
FIG. 9 shows a cross section of a photovoltaic cell with contact grid and bi-layer DLC film encapsulant. -
FIG. 10 shows reflectance spectrum of a bi-layer DLC film sample on c-Si substrate with film parameters of n1=2.4, d1=60 nm, and n2=1.6, and d2=80 nm. -
FIG. 11 shows a spectral response of a silicon photovoltaic cell (excited from the back). -
FIG. 12 shows the effect of proton irradiation on spectral efficiency of DLC coated photovoltaic cells. -
FIG. 1 shows an apparatus that can be used for carrying out the method of depositing diamond-like carbon (DLC) films according to this invention. It includes avacuum chamber 4, in which a radial direct current ion source is provided by ananode 1, acylindrical cathode 2 and a magnet (solenoid) 3. A direct voltage potential in a range of 1-4 kV is applied betweencathode 2 andanode 1. Themagnet 3 forms magnetic field perpendicular to the electric field.Plasma 16 is formed in a gap betweenanode 1 andcathode 2 and is shaped in the form of a truncated cone as it projects into thechamber 4. Groundeddiaphragm 5 slows down electrons and cuts off ions which move at angles more than 40° relative to the plasma axis to condition and collimate a flow of the ions toward thesubstrate 9. Aneutralizer electrode 6, is placed outside the magnetic field. An alternating (AC) voltage in a range of 30-50 V is applied to theneutralizer electrode 6 in order to create the alternating current (AC) for providing the electron flow due to a thermo emission phenomenon. Since the anode voltage is about +2.5 kV, the potential of the neutralizer is negative relative to the anode. Therefore, the flow of emitted electrons in the plasma region is provided to neutralize slow ions and non-dissociated radicals (CXHy). As a consequence the ion flow reaching an acceleratingelectrode 7 possesses a low degree of non-uniformity of energies, i.e., fairly uniform ion energy. The acceleratingelectrode 7 provided with agrid 8 enables one to control or correct the energy of ions reaching the surface of a substrate (photovoltaic cell) 9 mounted on asupport device 10. A voltage supply (not shown)biases accelerating electrode 7 and thesupport device 10 in a voltage range of −50 to −400 V, which provides average ion energy within therange 20 to 150 eV. - Initial (that is without the use of the
5, 6, 7) spatial distribution of ion current density I is approximated by the Boltzman function (electrodes FIG. 2 , curve 21) with a 10% degree of non-uniformity only within a limited area of about 20 cm2. Introduction of the 5, 6 and 7 produces much better plasma uniformity. Plasma is now shaped in the form of a cylinder, so that a 10% degree of non-uniformity of ion current density is measured within a diameter of about 12.6 cm (electrodes FIG. 2 , curve 22). The degree of non-uniformity of energy of ions C+, H+, N+and Ar+does not exceed 10%. The apparatus and method of this invention can also be scaled up to larger deposition areas than the 12-13 cm diameter of this example and still achieve this uniformity in ion energy over such layer. Proportion of concentration of these ions is controlled by feed gas mixture composition (C7H8, Ar, N2) brought intochamber 4 via a gas inlet conduit through theanode 1. The effluent gases leave through anexhaust system 11. - In a preferred
deposition apparatus embodiment 100 illustrated inFIGS. 3-5 , a plurality ofsupport devices 10 are configured and motivated to move a plurality of substrates 9 (seeFIG. 1 ; not shown inFIGS. 3-5 ) sequentially into and out of alignment with theion flow 17. In theapparatus 100, theindividual support devices 10 andsubstrates 9 are also rotated to expose thesubstrates 9 to different portions of theion flow 17 to attain uniform deposition of material on thesubstrates 9. - As illustrated in
FIGS. 3-5 , thesupport devices 10 of theapparatus 100 are ganged or grouped into a plurality of 102, 104, 106, 108. Eachgangs 102, 104, 106, 108 has at least one support device 10 (fourgang support devices 10 in the example ofFIGS. 3-5 ). Thesupport devices 10 are motivated to rotate about theirrespective axes 110, as indicated byarrows 111 inFIG. 3 . The 102, 104, 106, 108 are mounted ongangs respective struts 13, which extend radially outward from amain shaft 12. Themain shaft 12 rotates, as indicated byarrow 120, to move the 102, 104, 106, 108 into and out of alignment with therespective gangs ion flow 17 so that thesubstrates 9 in the 102, 104, 106, 108 are exposed to therespective gangs ion flow 17. This rotation of the gangs about the axis ofshaft 12 into and out of alignment with theion flow 17 not only enables theindividual substrates 9 to get exposed to more portions of theion flow 17 and thereby avoid uneven deposition, but also so that they are exposed to theion flow 17 for limited times and then rotated out of such alignment for a time to avoid unnecessary heat build-up and temperature rise in thesubstrate 9. As thesubstrates 9 on one gang rotate out alignment with theion flow 17, they can cool whileother substrates 9 are rotated into alignment to receive theion flow 17 and the resulting deposition. At the same time, thesupport devices 10 rotate thesubstrates 9 about theirrespective axes 110, as indicated byarrows 111, to also help achieve uniform deposition on thesubstrates 9. - To further enhance uniform deposition, each
102, 104, 106, 108 can be rotated about the axis of itsgang respective strut 13, as indicated byarrow 130 inFIGS. 3 and 5 . For example, as shown inFIGS. 3-5 , the foursupport devices 10 on each 102, 104, 106, 108 are mounted on the distal ends of fourgang arms 131 extending radially outward from ahub 132 of awheel 14. Thehub 132 is rotatable with respect to the axis of thestrut 13 on which it is mounted so that thewheel 14 rotates thesupport devices 10 andsubstrates 9 about the respective axes ofstruts 13, as indicated byarrow 130. - While no particular orientation is essential, the
shaft 12 is vertical in the example ofFIGS. 3-5 , so the axis ofstruts 13 andmountings 110 are horizontal. Therefore, in this example, rotation about a mainvertical axis 12 is combined with rotation of fourwheels 14 about the four horizontal axes ofstruts 13.Support devices 10 mounted on thewheels 14 rotate about their respectivehorizontal axes 110. As a consequence,substrates 9 perform complex movement about thebase 15. Rotation in the range 10-30 rpm provides optimal trajectory which drives the substrates to traverse all the zones or areas across theplasma flow 17 and spend some time outside it, which facilitates their cooling. The complex movement ofsubstrates 9 provides for better uniformity of the DLC coating (with less than 5% variation in mechanical and optical parameters—sometimes called “spread”—within an area of ˜110 cm2) and relatively low (30-80° C.) temperature of deposition. The circular area of about 125 cm2 (diameter of about 12.6 cm) in the example of theFIG. 2 analysis exceeds the area of the silicon plate and correspondingly provides the uniformity or homogeneity of the deposited coating. As mentioned above, the method and apparatus of this invention can be scaled up to larger deposition areas than the examples described herein and still achieve this uniformity in mechanical and optical parameters for such larger deposition areas. Therefore, this invention is not limited to the example areas of the examples provided herein. - A film manufactured according to the present invention is high quality diamond-like material.
FIG. 6 shows a Raman spectra of the DLC films of various thickness (240, 540, and 840 nm, for 61, 62 and 63 respectively) deposited under various technological conditions. The position of maximum of the curves indicates predominance of sp3 bonds in these films.curves - Improved film uniformity obtained according to the present invention is illustrated in
FIG. 7 , which shows the nearly identical reflectance spectra for the different areas (as indicated) of a 12-cm diameter DLC film. - Properties of DLC films, in particular their optical parameters can be tuned by exact control of plasma parameters (ion beam current and energy; feed gas mixture composition). Table 1 shows parameters of 60-900 nm thick DLC films manufactured under various technological conditions where Uac is
anode 1 tocathode 2 voltage, Iac is plasma discharge current in the ion source, Ub is the bias applied to thediaphragm 7 and thesupport device 10, <Ek> is the average kinetic energy of ions reaching the surface of the substrate (photovoltaic cell) 9, Ip is the plasma current density at the surface of thesubstrate 9, n is the refractive index of a DLC film, H V is its microhardness. The feed gas mixture (C7H8, Ar, N2) was 55% Ar, with 45% left for C7H8 and N2. This method and apparatus also works with other carrier gases besides N2 and Ar, as will be understood by persons skilled in the art. In Table 1, the percentage of C7H8 is given. -
TABLE 1 C7H8/ Uac, Iac/ Ub/ <Ek/ Ip/ HV % KV mA V eV mA/cm2 n kg/mm2 35 2.5 30 −300 90 0.20 1.48 2500 28 2.6 35 −350 100 0.25 2.00 2750 24 2.8 40 −400 140 0.30 2.10 2700 18 2.2 80 −250 60 0.60 2.40 3000 12 2.3 100 −300 65 0.65 2.45 2950 15 2.4 120 −350 80 0.80 2.35 3100 10 1.5 45 −20 20 0.35 2.55 2900 8 1.8 50 −50 25 0.40 2.60 2850 4 2.0 60 −100 50 0.45 2.57 2800 - It is seen that with proper choice of deposition condition, the DLC films are manufactured with various microhardness (2500-3100 kg·mm−2) and refractive indexes (1.48-2.60). The films show a density varying in the range of 1.8-2.35 g·cm−3 and are characterized by small amount of microdefects, low internal stresses, good adhesion and reduced friction. These properties grant high mechanical stability of the DLC encapsulants.
- DLC films with low refractive indexes are manufactured at the ratio C7H8:N2=40:5 and at the average ion energy less than 140 eV. A feed gas mixture with higher ratio C7H8:N2 produces DLC films with unacceptable high optical absorption. Ions with energies higher than 140 eV cause degradation of the properties of photovoltaic cells. Films manufactured at ion energies of less than 20 eV possess too high refractive index to be useful for antireflective coating. Plasma current less than 0.20 mA·cm−2 does not grant proper efficiency of the DLC deposition. Plasma current more then 0.80 mA·cm−2 causes increase an amount of defects in the films.
- Optical transmission of DLC coating and, consequently, efficiency improvement of photovoltaic solar cells can be tuned by exact control of deposition conditions.
FIG. 8 shows the transmittance spectra of two DLC film samples of the same thickness (curves 81 and 82), but deposited on sapphire substrates under different conditions. Transmittance is determined as T=I/I0(1−R), where I0 and I are the incident and transmitted light intensities, respectively, and R is the reflectance of a film. It is seen that the transmission of the two films differ by 17% at λ=260 nm. In the range of 300-620 nm, transmittance of one of the 185 nm thick films is ˜98% with a band gap of ˜4 eV; this grants very low absorption losses which is a prerequisite of effective use of such films as encapsulants for photovoltaic solar cells.Curve 83 ofFIG. 8 corresponds to a 240 nm film sample deposited under technological conditions different from those for the other two samples. - Based upon the relationship between the technological parameters and value of refractive index, it is possible to manufacture DLC films with the preset variation of refractive index within the DLC layer that is either multilayer structures or a monolayer with continuous variation of refractive index through the depth of the DLC film thickness.
- As an example,
FIG. 9 shows a cross section of a PV cell with a contact grid and bilayer DLC film encapsulant (DLC(1):n1=2.4, d1=60 nm; DLC(2):n2=1.6, d2=80 nm).FIG. 10 shows the reflection spectrum of the bi-layer DLC structure; the low reflectance (R≦5%) grants good antireflection effects of this PV cell encapsulation. -
FIG. 11 shows a spectral response of a Si PV cell (excited from the back): curve 91—before DLC coating,curve 92 after DLC coating. The cell efficiency enhancement is stronger than that can be explained by the antireflecting effect. Significant performance improvement is attributed to reduced (surface) boundary recombination losses. - Weathering and chemical stability tests were performed on DLC encapsulated PV cells. In the course of weathering stability tests, silicon PV cells were kept in a special enclosure (or chamber) at 80-90° C. and relative humidity 90% for 20 hours. Optical and mechanical parameters of DLC films as well as efficiency of DLC coated PV cells were measured before and after the exposure to humid atmosphere. Practically no changes of these parameters were found (the data for PV cells efficiency are presented in Table 2).
- In the course of chemical stability tests the DLC coated silicon PV cells were exposed to one of the following agents:
- concentrated HNO3 acid, 30 minutes, 25° C.
- diluted (1%) HNO3 acid, 1 hour, 25° C.
- concentrated H2SO4 acid, 30 minutes, 25° C.
- diluted (1%) H2SO4 acid, 1 hour, 25° C.
- saturated solution of NaCl (sea fog simulation), 40 hours, 25-30° C.
- Similar to weathering stability tests, measurements of reflectivity of DLC coating and PV cell efficiency as well as microscopic inspection of DLC coating surface were performed before and after the exposures. Again no effects of these exposures on the mentioned parameters were found (Table 2). These results demonstrate good chemical stability of DLC coating and are in striking contrast to the data of similar tests performed on ZnS coated silicon PV cells. In the latter case, the ZnS coating was damaged or destroyed and PV cells efficiency decreased by 30%.
- A longer-term stability study was conducted for the DLC-coated Si samples in a stringent damp heat test (85° C./85% RH), which is being used to qualify thin film modules by the PV industry, for 762 hours. Results from the reflectance measurements indicate that the DLC-on-Si thin films show negligible or no change. Additionally, both microhardness and reflectivity did not change after heating at 350° C. for 2 hours, a slight change in reflectivity but not in microhardness was observed if heated at 380° C. for 2 hours. Intense oxidative degradation of the films was observed however, when heated to 410° C. or higher for less than 1 hour.
-
TABLE 2 Efficiency, % Weathering Chemical test stability test <Ek>/, C7H8/ Si + DLC Si + DLC Si + DLC eV % d, nm PV cell PV cell PV cell 55 22 80 9.87 9.85 9.78 70 16 80 9.71 9.75 9.58 65 13 75 8.90 8.93 8.78 60 12 85 9.27 9.23 9.28 75 10 85 9.11 9.18 9.14 65 14 80 8.82 8.90 8.80 - It was found that UV, proton and electron irradiation do not affect the properties of DLC films and DLC encapsulated PV cells. For UV irradiation tests, a high-pressure xenon lamp was used with the spectra similar to that of the sun but with higher intensity of UV. Silicon PV cells with various coatings (DLC, ZnS, SiO2) were exposed to the light of the Xe lamp with a UV power density of ˜0.5 W·cm−2 for ˜400 hours. No effects on the DLC coated PV cell efficiency were found. On the other hand, for a ZnS coated cell a ˜15% decrease of efficiency was observed, possibly due to UV induced degradation of the film transparency and enhancement of the surface recombination rate at the Si-ZnS boundary.
- Proton irradiation is an important factor causing degradation of PV cells used in space. The proton energy interval, which is of interest as far as the effects on the DLC films with technologically realistic thickness (˜2 μm) are concerned, ranges from 10 keV to 500 keV. To choose the conditions of a proton irradiation test, data on the proton spectrum given by the accepted models (such as NASA AP-8 and JPL-91) were used. To simulate the effects of solar proton irradiation, the range of 10-500 keV was divided into two intervals: 10-50 keV and 50-500 keV. Integration of the proton spectrum given by AP-8 model within these intervals for 11 years period gives the
fluences 2×1012 and 5×1011 cm−2 respectively. To simulate the effect of proton irradiation with the energy in these intervals proton implantation withenergies 20 and 150 keV andfluences 1014 cm−2 and 1013 cm−2 respectively was used, which allows for all possible errors in proton flux estimates and may correspond to at least 100 years exposure. The implantation was performed into a 1.5 μm DLC film deposited on a quartz substrate and into DLC coatings on two silicon PV cells. No effect of the implantation on the optical properties of DLC film was found. Similarly, the spectral efficiency of the cells was not affected by the implantation (FIG. 12 ). This means that DLC coating with the thickness ˜2 μm is stable and can serve as a radiation shield against solar protons. Similar results were obtained with 1 MeV electron irradiation. - The foregoing description of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or structure disclosed, and other modifications and variations may be possible in light of the above teachings and within the scope of the claims appended hereto. The embodiments described above were chosen and described in order to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best utilize the invention in various embodiments and various modifications as are suited to the particular use contemplated. It is intended that the appended claims be construed to include other alternative embodiments of the invention except insofar as limited by the prior art. The words “comprise,” “comprising,” “include,” “including,” and “includes” when used in this specification and in the following claims are intended to specify the presence of stated features, integers, components, or steps, but they do not preclude the presence or addition of one or more other features, integers, components, steps or groups thereof.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/188,104 US20080305277A1 (en) | 2004-12-02 | 2008-08-07 | Method and apparatus for making diamond-like carbon films |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/002,611 US7459188B2 (en) | 2004-12-02 | 2004-12-02 | Method and apparatus for making diamond-like carbon films |
| US12/188,104 US20080305277A1 (en) | 2004-12-02 | 2008-08-07 | Method and apparatus for making diamond-like carbon films |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/002,611 Division US7459188B2 (en) | 2004-12-02 | 2004-12-02 | Method and apparatus for making diamond-like carbon films |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20080305277A1 true US20080305277A1 (en) | 2008-12-11 |
Family
ID=39887318
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/002,611 Expired - Fee Related US7459188B2 (en) | 2004-12-02 | 2004-12-02 | Method and apparatus for making diamond-like carbon films |
| US12/188,104 Abandoned US20080305277A1 (en) | 2004-12-02 | 2008-08-07 | Method and apparatus for making diamond-like carbon films |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/002,611 Expired - Fee Related US7459188B2 (en) | 2004-12-02 | 2004-12-02 | Method and apparatus for making diamond-like carbon films |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | US7459188B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120263936A1 (en) * | 2009-10-23 | 2012-10-18 | Marta Krzyak | Device having reduced friction properties |
| IT202200007826A1 (en) * | 2022-04-20 | 2023-10-20 | Kolzer Srl | Improved equipment and process for coating articles with Physical Vapor Deposition technique |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5858477A (en) * | 1996-12-10 | 1999-01-12 | Akashic Memories Corporation | Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon |
| US20180274100A1 (en) | 2017-03-24 | 2018-09-27 | Applied Materials, Inc. | Alternating between deposition and treatment of diamond-like carbon |
| CN107385418A (en) * | 2017-07-24 | 2017-11-24 | 江苏实为半导体科技有限公司 | It is a kind of can on substrate all standing deposit CVD equipment |
| JP7125749B2 (en) * | 2018-10-29 | 2022-08-25 | 株式会社日立ハイテクサイエンス | Charged particle beam device |
| US20220119954A1 (en) * | 2019-02-07 | 2022-04-21 | Lam Research Corporation | Substrate processing tool capable of modulating one or more plasma temporally and/or spatially |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566829A (en) * | 1969-03-06 | 1971-03-02 | Bryan H Hill | Ion implantation means including a variable ration ion source |
| US3749058A (en) * | 1971-07-26 | 1973-07-31 | Ion Equipment Corp | Rotary substrate holder assembly |
| US4277304A (en) * | 1978-11-01 | 1981-07-07 | Tokyo Shibaura Denki Kabushiki Kaisha | Ion source and ion etching process |
| US4481062A (en) * | 1982-09-02 | 1984-11-06 | Kaufman Harold R | Electron bombardment ion sources |
| US4486286A (en) * | 1982-09-28 | 1984-12-04 | Nerken Research Corp. | Method of depositing a carbon film on a substrate and products obtained thereby |
| US5279669A (en) * | 1991-12-13 | 1994-01-18 | International Business Machines Corporation | Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions |
| US5288543A (en) * | 1990-09-17 | 1994-02-22 | Tdk Corporation | Protective film on sliding members and method of forming same |
| US5458754A (en) * | 1991-04-22 | 1995-10-17 | Multi-Arc Scientific Coatings | Plasma enhancement apparatus and method for physical vapor deposition |
| US5662877A (en) * | 1989-08-23 | 1997-09-02 | Tdk Corporation | Process for forming diamond-like thin film |
| US6265068B1 (en) * | 1997-11-26 | 2001-07-24 | 3M Innovative Properties Company | Diamond-like carbon coatings on inorganic phosphors |
| US6372303B1 (en) * | 1997-06-16 | 2002-04-16 | Robert Bosch Gmbh | Method and device for vacuum-coating a substrate |
| US6749764B1 (en) * | 2000-11-14 | 2004-06-15 | Tru-Si Technologies, Inc. | Plasma processing comprising three rotational motions of an article being processed |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188160A (en) | 1997-11-24 | 1998-07-22 | 上海大学 | Making of optical anti-reflection film by diamond-like and diamond compound film |
-
2004
- 2004-12-02 US US11/002,611 patent/US7459188B2/en not_active Expired - Fee Related
-
2008
- 2008-08-07 US US12/188,104 patent/US20080305277A1/en not_active Abandoned
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566829A (en) * | 1969-03-06 | 1971-03-02 | Bryan H Hill | Ion implantation means including a variable ration ion source |
| US3749058A (en) * | 1971-07-26 | 1973-07-31 | Ion Equipment Corp | Rotary substrate holder assembly |
| US4277304A (en) * | 1978-11-01 | 1981-07-07 | Tokyo Shibaura Denki Kabushiki Kaisha | Ion source and ion etching process |
| US4481062A (en) * | 1982-09-02 | 1984-11-06 | Kaufman Harold R | Electron bombardment ion sources |
| US4486286A (en) * | 1982-09-28 | 1984-12-04 | Nerken Research Corp. | Method of depositing a carbon film on a substrate and products obtained thereby |
| US5662877A (en) * | 1989-08-23 | 1997-09-02 | Tdk Corporation | Process for forming diamond-like thin film |
| US5288543A (en) * | 1990-09-17 | 1994-02-22 | Tdk Corporation | Protective film on sliding members and method of forming same |
| US5458754A (en) * | 1991-04-22 | 1995-10-17 | Multi-Arc Scientific Coatings | Plasma enhancement apparatus and method for physical vapor deposition |
| US5279669A (en) * | 1991-12-13 | 1994-01-18 | International Business Machines Corporation | Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions |
| US6372303B1 (en) * | 1997-06-16 | 2002-04-16 | Robert Bosch Gmbh | Method and device for vacuum-coating a substrate |
| US6265068B1 (en) * | 1997-11-26 | 2001-07-24 | 3M Innovative Properties Company | Diamond-like carbon coatings on inorganic phosphors |
| US6749764B1 (en) * | 2000-11-14 | 2004-06-15 | Tru-Si Technologies, Inc. | Plasma processing comprising three rotational motions of an article being processed |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120263936A1 (en) * | 2009-10-23 | 2012-10-18 | Marta Krzyak | Device having reduced friction properties |
| IT202200007826A1 (en) * | 2022-04-20 | 2023-10-20 | Kolzer Srl | Improved equipment and process for coating articles with Physical Vapor Deposition technique |
| EP4265819A1 (en) * | 2022-04-20 | 2023-10-25 | Kolzer S.r.l. | Improved apparatus and method for coating articles by physical vapor deposition technique |
Also Published As
| Publication number | Publication date |
|---|---|
| US7459188B2 (en) | 2008-12-02 |
| US20080268170A1 (en) | 2008-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080305277A1 (en) | Method and apparatus for making diamond-like carbon films | |
| JP3073327B2 (en) | Deposition film formation method | |
| US9548404B2 (en) | Method for fabricating anti-reflection film with anti-PID effect | |
| WO2021004525A1 (en) | Heterojunction battery layerwise hydrogen passivation method and passivation device, battery, battery assembly, and solar power station | |
| KR20140056169A (en) | Thin-film photovoltaic device and fabrication method | |
| TW201110200A (en) | Solar cell defect passivation method | |
| US4547621A (en) | Stable photovoltaic devices and method of producing same | |
| Kolodzey et al. | Properties of a‐Si, Ge: H, F alloys prepared by rf glow discharge in an ultrahigh vacuum reactor | |
| US5506426A (en) | Compound semiconductor, a method for producing a thin film thereof, and a semiconductor device having the thin film | |
| Linss et al. | Comparison of low damage sputter deposition techniques to enable the application of very thin a-Si passivation films | |
| Zhao et al. | Radiation hardness of Cu2ZnSn (S, Se) 4 thin film solar cells under 10 MeV proton irradiation | |
| WO2023132259A1 (en) | Method for treating surface of metal oxide, method for manufacturing perovskite solar cell, and metal oxide surface treatment device | |
| RU2244983C1 (en) | Method for producing diamond-like films for encapsulating solar photocells | |
| CN102102172B (en) | Heterojunction thin film material with white light photovoltaic effect and preparation method thereof | |
| Zimmermann et al. | Deposition of intrinsic hydrogenated amorphous silicon for thin‐film solar cells–a comparative study for layers grown statically by RF‐PECVD and dynamically by VHF‐PECVD | |
| JP6551185B2 (en) | LIGHT CONVERSION MEMBER AND ITS MANUFACTURING METHOD, SOLAR CELL MODULE AND SOLAR CELL | |
| Soppe et al. | On combining surface and bulk passivation of SiN/sub x: H layers for mc-Si solar cells | |
| US9952360B2 (en) | Method for producing a textured reflector for a thin-film photovoltaic cell, and resulting textured reflector | |
| Tishin et al. | Investigation of degradation characteristics of photosensitive structures with porous silicon | |
| JP2003524705A (en) | Electron beam / microwave gas injection PECVD method and apparatus for thin film material deposition and / or surface modification | |
| JPS6314420A (en) | Method of manufacturing thin film | |
| DE19919742A1 (en) | Doped silicon substrates are coated with an anti-reflection layer, especially of silicon nitride for solar cells, by sputter deposition using silicon electrodes alternately connected as cathode and anode | |
| Saito et al. | Vacuum-ultraviolet-light-induced defects in hydrogenated amorphous silicon films | |
| KR100940357B1 (en) | Device producing colored gemstone including the device for producing ions and method for coloring gemstone | |
| Preidel et al. | A novel light trapping concept for liquid phase crystallized poly-Si thin-film solar cells on periodically nanoimprinted glass substrates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: MIDWEST RESEARCH INSTITUTE, MISSOURI Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PERN, FU-JANN;TOURYAN, KENNELL J.;REEL/FRAME:021361/0311;SIGNING DATES FROM 20041130 TO 20041201 |
|
| AS | Assignment |
Owner name: ENERGY, UNITED STATES DEPARTMENT OF, DISTRICT OF C Free format text: CONFIRMATORY LICENSE;ASSIGNOR:MIDWEST RESEARCH INSTITUTE;REEL/FRAME:021495/0900 Effective date: 20080811 |
|
| AS | Assignment |
Owner name: ALLIANCE FOR SUSTAINABLE ENERGY, LLC, COLORADO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MIDWEST RESEARCH INSTITUTE;REEL/FRAME:021603/0337 Effective date: 20080912 Owner name: ALLIANCE FOR SUSTAINABLE ENERGY, LLC,COLORADO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MIDWEST RESEARCH INSTITUTE;REEL/FRAME:021603/0337 Effective date: 20080912 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |