[go: up one dir, main page]

US20080245511A1 - Flat heat pipe - Google Patents

Flat heat pipe Download PDF

Info

Publication number
US20080245511A1
US20080245511A1 US11/790,518 US79051807A US2008245511A1 US 20080245511 A1 US20080245511 A1 US 20080245511A1 US 79051807 A US79051807 A US 79051807A US 2008245511 A1 US2008245511 A1 US 2008245511A1
Authority
US
United States
Prior art keywords
section
tubular member
heat pipe
flat
capillary wick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/790,518
Inventor
Yaw-Huey Lai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, YAW-HUEY
Publication of US20080245511A1 publication Critical patent/US20080245511A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to a heat-dissipating device and more particular to a flat heat pipe.
  • a conventional heat pipe is usually composed of a sealed tubular member, a capillary wick mounted on the internal wall of the sealed tubular member, and adequate liquid, employing the liquid-vapor transformation and the flowage of the liquid for thermal conduction.
  • water located at a heated section of the sealed tubular member is heated to be transformed into vapor, the vapor is then diffused to a condensed section of the sealed tubular member to be transformed into water, and then the water is returned to the heated section through the capillary action generated by the capillary wick, thus completing heat exchange.
  • Such endless cycles of endothermic and exothermic reactions can effect rapid thermal conduction.
  • the water in the condensed section C will store up since the water can't return to the heated section H all.
  • the vapor can't do the liquid-vapor transformation in the condensed section C. That is to say, the heat can't transmit to this section.
  • This status of accumulated water causes the temperature of the accumulated water portion dropping and breaks the status of a uniform temperature of the whole, and the effect of heat transmission drops too. This situation needs to improve.
  • the primary object of the present invention is to provide a flat heat pipe, which is able to solve the problem of accumulated water and provides a good character of uniform temperature.
  • the flat heat pipe including: a tubular member having two sealed ends, a capillary wick being disposed at the internal sidewall of said tubular member and a liquid being disposed in said tubular member.
  • Said tubular member defines a flat section and a thicker section at least.
  • FIG. 1 is a sectional view of the present invention
  • FIG. 2 is an enlarged view of a portion of the FIG. 1 ;
  • FIG. 3 is a sectional view of the present invention in practice
  • FIG. 4 is another sectional view of the present invention in practice
  • FIG. 5 is a sectional view of a heat pipe of prior art, which shows a side sectional view
  • FIG. 6 is a sectional view of a heat pipe of prior art, which shows a vertical sectional view
  • FIG. 7 is a sectional view of a heat pipe of prior art, which shows a top sectional view
  • the flat heat pipe 10 of present invention including: a tubular member 11 , a capillary wick 21 and liquid 31 .
  • Said tubular member 11 makes of copper and both ends are sealed.
  • Said capillary wick 21 is disposed at the internal sidewall of said tubular member 11 .
  • Said capillary wick 21 can be a metal mesh or copper powder or grooves that is provided at the internal sidewall of said tubular member 11 .
  • present invention takes the sintering by copper powder as an illustration.
  • the metal mesh and the grooves type are all prior art skills and the capillary wick is not the technique key point of present invention, so there are no more redundancy words.
  • Said liquid 31 is disposed into said tubular member 11 .
  • said tubular member 11 defines a flat section 12 and a thicker section 14 .
  • Said flat section 12 is placed at one end of said tubular member 11 and said thicker section 14 is placed at the other end, namely the rearward end.
  • the caliber that surrounds by the capillary wick 21 in said thicker section 14 is bigger than the caliber that surrounds by the capillary wick 21 in said flat section 12 .
  • Said tubular member 111 defines a heated section H and a condensed section C more over.
  • Said heated section H overlaps a portion of said flat section C and connects with a heat-dispersing device (not shown).
  • Said condensed section C includes said thicker section 14 and a portion of said flat section 12 . In other words, said condensed section C is combined with said thicker section 14 and a portion of said flat section 12 .
  • said liquid 31 located in the heated section H is heated to be transformed into vapor, the vapor is then diffused to said condensed section C through the space that surrounds by said capillary wick 21 . Said vapor is transformed into water in said condensed section C again and goes into said capillary wick 21 .
  • the caliber that surrounds by the capillary wick 21 in said thicker section 14 is bigger than the caliber that surrounds by the capillary wick 21 in said flat section 12 .
  • the quantity of said liquid 31 condensed in said capillary wick 21 is not enough to block the space surrounds by the capillary wick 21 .
  • Said flat heat pipe 10 provides a plurality of dissipating fins 41 further more.
  • Said dissipating fins 41 are disposed on the surface of said condensed section C of said tubular member 11 . That is to say, said dissipating fins 41 are near said thicker section 14 .
  • FIG. 4 and FIG. 5 show the other disposals of said dissipating fins 41 .
  • the main object of adding said dissipating fins 41 is for increasing the radiation efficiency of said heated section C.
  • tubular member 11 of present invention there is an addition remark.
  • the definitions of the location and the quantity of said flat section 12 and thicker section 14 can be different.
  • said tubular member could provide two thicker sections at both ends separately and a flat section in the middle.
  • the liquid can stay in the capillary wick of the condensed section without blocking the space that surrounds by the capillary wick. So, the problem of the accumulated water in the flat heat pipe of prior art can be solved and keeps a good efficiency of uniform temperature.
  • the inside space is bigger than the heat pipe that is pressed flat in prior art.
  • the quantity of the heat transmission and radiation efficiency is better than prior art as a whole.
  • the quantity of the heat transmission is larger than the heat pipe as a whole because that the present invention solves the problem of the accumulated water in the flat heat pipe in prior art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A flat heat pipe including: a tubular member having two sealed ends, a capillary wick being disposed at the internal sidewall of said tubular member and a liquid contained in said tubular member. Said tubular member defines a flat section and a thicker section at least. By the way, the present invention can solve the problem of the accumulated water inside the heat pipe of prior art and keeps a good efficiency of uniform temperature, and the radiation efficiency is better then the heat pipe of prior art.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat-dissipating device and more particular to a flat heat pipe.
  • 2. Description of the Related Art
  • A conventional heat pipe is usually composed of a sealed tubular member, a capillary wick mounted on the internal wall of the sealed tubular member, and adequate liquid, employing the liquid-vapor transformation and the flowage of the liquid for thermal conduction. In practical operation, water located at a heated section of the sealed tubular member is heated to be transformed into vapor, the vapor is then diffused to a condensed section of the sealed tubular member to be transformed into water, and then the water is returned to the heated section through the capillary action generated by the capillary wick, thus completing heat exchange. Such endless cycles of endothermic and exothermic reactions can effect rapid thermal conduction.
  • However, in some device with limited space such as notebooks, display cards or the other devices that will dissipate heat. At the time of assembling the heat pipe, said heat pipe need to press flat before it is assembled some time. The inside status of the heat pipe that is flattened and show in FIG. 6 and FIG. 7. The space inside the heat pipe 70 shrinks and causes the space for the vapor to move around small and thinness owing to the heat pipe is pressed flat. After the vapor is transformed into water 79 in the condensed section C, some of the water returns to the heated section H. But, most of the water 79 will stay in the condensed section C. This is owing to the space that is surrounded by capillary wick 73 shrinks and makes the structures similar to a capillary. Because of the capillarity, the water 79 will stay in the condensed section C and stores up.
  • The water in the condensed section C will store up since the water can't return to the heated section H all. The vapor can't do the liquid-vapor transformation in the condensed section C. That is to say, the heat can't transmit to this section. This status of accumulated water causes the temperature of the accumulated water portion dropping and breaks the status of a uniform temperature of the whole, and the effect of heat transmission drops too. This situation needs to improve.
    • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a flat heat pipe, which is able to solve the problem of accumulated water and provides a good character of uniform temperature.
  • To achieve this object of the present invention, the flat heat pipe including: a tubular member having two sealed ends, a capillary wick being disposed at the internal sidewall of said tubular member and a liquid being disposed in said tubular member. Said tubular member defines a flat section and a thicker section at least. Whereby the present invention can solve the problem of the accumulated water inside the heat pipe of the prior art and keeps a good efficiency of uniform temperature, and the radiation efficiency is better then the heat pipe of prior art.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a sectional view of the present invention;
  • FIG. 2 is an enlarged view of a portion of the FIG. 1;
  • FIG. 3 is a sectional view of the present invention in practice;
  • FIG. 4 is another sectional view of the present invention in practice;
  • FIG. 5 is a sectional view of a heat pipe of prior art, which shows a side sectional view;
  • FIG. 6 is a sectional view of a heat pipe of prior art, which shows a vertical sectional view;
  • FIG. 7 is a sectional view of a heat pipe of prior art, which shows a top sectional view;
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1 and FIG. 2, the flat heat pipe 10 of present invention including: a tubular member 11, a capillary wick 21 and liquid 31. Wherein:
  • Said tubular member 11 makes of copper and both ends are sealed.
  • Said capillary wick 21 is disposed at the internal sidewall of said tubular member 11. Said capillary wick 21 can be a metal mesh or copper powder or grooves that is provided at the internal sidewall of said tubular member 11. In this embodiment, present invention takes the sintering by copper powder as an illustration. The metal mesh and the grooves type are all prior art skills and the capillary wick is not the technique key point of present invention, so there are no more redundancy words.
  • Said liquid 31 is disposed into said tubular member 11. Wherein said tubular member 11 defines a flat section 12 and a thicker section 14. Said flat section 12 is placed at one end of said tubular member 11 and said thicker section 14 is placed at the other end, namely the rearward end. The caliber that surrounds by the capillary wick 21 in said thicker section 14 is bigger than the caliber that surrounds by the capillary wick 21 in said flat section 12. Said tubular member 111 defines a heated section H and a condensed section C more over. Said heated section H overlaps a portion of said flat section C and connects with a heat-dispersing device (not shown). Said condensed section C includes said thicker section 14 and a portion of said flat section 12. In other words, said condensed section C is combined with said thicker section 14 and a portion of said flat section 12.
  • According to the structures as aforesaid in practical operation, said liquid 31 located in the heated section H is heated to be transformed into vapor, the vapor is then diffused to said condensed section C through the space that surrounds by said capillary wick 21. Said vapor is transformed into water in said condensed section C again and goes into said capillary wick 21. By the disposal of said thicker section of present invention, the caliber that surrounds by the capillary wick 21 in said thicker section 14 is bigger than the caliber that surrounds by the capillary wick 21 in said flat section 12. The quantity of said liquid 31 condensed in said capillary wick 21 is not enough to block the space surrounds by the capillary wick 21. FIG. 2 shows the status of said liquid 31 condensed in said capillary wick 31. So, said liquid 31 can return to said heated section H by said capillary wick 21 and keeps a good circulating efficiency, and then the efficiency of uniform temperature and the transmission effect will be good.
  • Referring to FIG. 3, Said flat heat pipe 10 provides a plurality of dissipating fins 41 further more. Said dissipating fins 41 are disposed on the surface of said condensed section C of said tubular member 11. That is to say, said dissipating fins 41 are near said thicker section 14. FIG. 4 and FIG. 5 show the other disposals of said dissipating fins 41. The main object of adding said dissipating fins 41 is for increasing the radiation efficiency of said heated section C.
  • There is an addition remark. On the tubular member 11 of present invention, the definitions of the location and the quantity of said flat section 12 and thicker section 14 can be different. For example, said tubular member could provide two thicker sections at both ends separately and a flat section in the middle. This is a change shape practice as aforesaid embodiment. This change shape practice is an equivalent change of the claims of present invention and it should be included in the scope of the claims.
  • In conclusion, the efficiencies of present invention are:
  • 1. Solving the problems about the accumulated water and the poor efficiency of uniform temperature in the flat heat pipe of prior art.
  • By the design of the thicker section in present invention, the liquid can stay in the capillary wick of the condensed section without blocking the space that surrounds by the capillary wick. So, the problem of the accumulated water in the flat heat pipe of prior art can be solved and keeps a good efficiency of uniform temperature.
  • 2. The radiation efficiency is better then prior art.
  • Due to the flat section and the thicker section are provided in present invention, the inside space is bigger than the heat pipe that is pressed flat in prior art. The quantity of the heat transmission and radiation efficiency is better than prior art as a whole. Besides, the quantity of the heat transmission is larger than the heat pipe as a whole because that the present invention solves the problem of the accumulated water in the flat heat pipe in prior art.

Claims (8)

1. A flat heat pipe including:
a tubular member having two sealed ends;
a capillary wick being disposed at the internal sidewall of said tubular member;
a liquid contained in said tubular member;
said tubular member defining a heated section and a condensed section, and
said tubular member defining a flat section and a thicker section at least;
said heated section including a portion of said flat section at least, and
said condensed section including a portion of said thicker section at least.
2. The pipe as claimed in claim 1, wherein said capillary wick can be a mesh or copper powder or grooves that is provided at the internal sidewall of said tubular member.
3. The pipe as claimed in claim 1, wherein said tubular member makes of copper.
4. The pipe as claimed in claim 1, wherein said thicker section disposes at one end of said tubular member.
5. The pipe as claimed in claim 1, wherein said flat section disposes at one end of said tubular member.
6. The pipe as claimed in claim 1, wherein the caliber that surrounds by the capillary wick in said thicker section is bigger than the caliber that surrounds by the capillary wick in said flat section.
7. The pipe as claimed in claim 1, wherein said flat heat pipe provides a plurality of dissipating fins further more and said dissipating fins disposes on the surface of said tubular member near said thicker section.
8. The pipe as claimed in claim 1, wherein said thicker section locates at the rear end of said tubular member.
US11/790,518 2007-04-09 2007-04-26 Flat heat pipe Abandoned US20080245511A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096205624U TWM318115U (en) 2007-04-09 2007-04-09 Flat heat pipe
TW96205624 2007-04-09

Publications (1)

Publication Number Publication Date
US20080245511A1 true US20080245511A1 (en) 2008-10-09

Family

ID=39458377

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/790,518 Abandoned US20080245511A1 (en) 2007-04-09 2007-04-26 Flat heat pipe

Country Status (2)

Country Link
US (1) US20080245511A1 (en)
TW (1) TWM318115U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100033933A1 (en) * 2008-08-11 2010-02-11 Sony Corporation Heat spreader, electronic apparatus, and heat spreader manufacturing method
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
US20130168053A1 (en) * 2012-01-04 2013-07-04 Asia Vital Components Co., Ltd. Thin heat pipe structure and method of forming same
US20140055954A1 (en) * 2012-08-23 2014-02-27 Asia Vital Components Co., Ltd. Heat pipe structure, and thermal module and electronic device using same
US20140290914A1 (en) * 2013-03-26 2014-10-02 Asustek Computer Inc. Heat pipe structure
CN105783550A (en) * 2016-04-07 2016-07-20 江苏巨鼎新能源科技有限公司 Hammer-shaped radiating tube and radiator

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3811496A (en) * 1971-11-06 1974-05-21 Philips Corp Heat transfer device
US3962869A (en) * 1972-09-04 1976-06-15 Robert Bosch G.M.B.H. Equipment for exhaust gas detoxification in internal combustion engines
US4550774A (en) * 1982-02-02 1985-11-05 Daimler-Benz Aktiengesellschaft Surface heating body for vehicles
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US20020179284A1 (en) * 2001-04-06 2002-12-05 Yogendra Joshi Orientation-independent thermosyphon heat spreader
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US20050217826A1 (en) * 1999-05-12 2005-10-06 Dussinger Peter M Integrated circuit heat pipe heat spreader with through mounting holes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3811496A (en) * 1971-11-06 1974-05-21 Philips Corp Heat transfer device
US3962869A (en) * 1972-09-04 1976-06-15 Robert Bosch G.M.B.H. Equipment for exhaust gas detoxification in internal combustion engines
US4550774A (en) * 1982-02-02 1985-11-05 Daimler-Benz Aktiengesellschaft Surface heating body for vehicles
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US20050217826A1 (en) * 1999-05-12 2005-10-06 Dussinger Peter M Integrated circuit heat pipe heat spreader with through mounting holes
US20020179284A1 (en) * 2001-04-06 2002-12-05 Yogendra Joshi Orientation-independent thermosyphon heat spreader
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8391007B2 (en) * 2008-08-11 2013-03-05 Sony Corporation Heat spreader, electronic apparatus, and heat spreader manufacturing method
US20100033933A1 (en) * 2008-08-11 2010-02-11 Sony Corporation Heat spreader, electronic apparatus, and heat spreader manufacturing method
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US8243449B2 (en) * 2008-12-24 2012-08-14 Sony Corporation Heat-transporting device and electronic apparatus
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
US9032624B2 (en) 2010-10-04 2015-05-19 Asia Vital Components Co., Ltd. Plate-type heat pipe sealing structure and manufacturing method thereof
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
US20130168053A1 (en) * 2012-01-04 2013-07-04 Asia Vital Components Co., Ltd. Thin heat pipe structure and method of forming same
US9476652B2 (en) * 2012-01-04 2016-10-25 Asia Vital Components Co., Ltd. Thin heat pipe structure having enlarged condensing section
US20140055954A1 (en) * 2012-08-23 2014-02-27 Asia Vital Components Co., Ltd. Heat pipe structure, and thermal module and electronic device using same
US9273909B2 (en) * 2012-08-23 2016-03-01 Asia Vital Components Co., Ltd. Heat pipe structure, and thermal module and electronic device using same
US20140290914A1 (en) * 2013-03-26 2014-10-02 Asustek Computer Inc. Heat pipe structure
CN105783550A (en) * 2016-04-07 2016-07-20 江苏巨鼎新能源科技有限公司 Hammer-shaped radiating tube and radiator

Also Published As

Publication number Publication date
TWM318115U (en) 2007-09-01

Similar Documents

Publication Publication Date Title
US20080245511A1 (en) Flat heat pipe
US7484553B2 (en) Heat pipe incorporating outer and inner pipes
US8016024B2 (en) Loop heat pipe with flat evaportor having a wick with an internal chamber
US9273909B2 (en) Heat pipe structure, and thermal module and electronic device using same
US8316921B2 (en) Plate type heat pipe and heat sink using the same
US8622118B2 (en) Loop heat pipe
US7296617B2 (en) Heat sink
US10077945B2 (en) Heat dissipation device
TWI722736B (en) Heat sink
US6938680B2 (en) Tower heat sink with sintered grooved wick
US7331379B2 (en) Heat dissipation device with heat pipe
US10514211B2 (en) Vapor chamber
US20120111541A1 (en) Plate type heat pipe and heat sink using the same
US20020021556A1 (en) Vapor chamber with integrated pin array
US20060283577A1 (en) Loop-type heat exchange device
KR100917599B1 (en) Flat Plate Heat Dissipation Unit
US20060283576A1 (en) Heat pipe
US9074824B2 (en) Low-profile heat transfer device
US20080210404A1 (en) Cooling device with ringed fins
US7926553B2 (en) Cooling system for electronic devices, in particular, computers
TW201947180A (en) Loop vapor chamber conducive to separation of liquid and gas
US7665509B2 (en) Heat exchange module for electronic components
US20080093052A1 (en) Heat dissipation device with heat pipes
US20100139888A1 (en) Heat spreader and heat dissipation device using same
US7451806B2 (en) Heat dissipation device with heat pipes

Legal Events

Date Code Title Description
AS Assignment

Owner name: TAI-SOL ELECTRONICS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LAI, YAW-HUEY;REEL/FRAME:019291/0081

Effective date: 20070416

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION