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US20080184851A1 - Contact Element, Contact Unit, Method For Producing A Contact Unit, And Method For Placing Into Operation For Fine-Pitch Parts - Google Patents

Contact Element, Contact Unit, Method For Producing A Contact Unit, And Method For Placing Into Operation For Fine-Pitch Parts Download PDF

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Publication number
US20080184851A1
US20080184851A1 US11/677,264 US67726407A US2008184851A1 US 20080184851 A1 US20080184851 A1 US 20080184851A1 US 67726407 A US67726407 A US 67726407A US 2008184851 A1 US2008184851 A1 US 2008184851A1
Authority
US
United States
Prior art keywords
contact
conducting plate
tips
contact element
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/677,264
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English (en)
Inventor
Horst Groninger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GROENINGER, HORST
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GRONINGER, HORST
Publication of US20080184851A1 publication Critical patent/US20080184851A1/en
Priority to US12/533,540 priority Critical patent/US8091217B2/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Definitions

  • Embodiments of the invention generally relate to the placing into operation and the testing of parts.
  • they relate to a contacting of parts with a short contact distance (fine-pitch parts), contacts for contacting parts, and a method for placing into operation and for testing a part.
  • they relate to a contact element, a contact unit, a method for producing a contact unit, and a method for placing into operation of a part.
  • ATE Automatic test equipment
  • DUT device under test
  • fine-pitch diodes i.e. diodes with a reduced distance of the contact areas for contacting
  • test and characterization methods increase production costs. Therefore, quick, cost-effective, and robust testing devices are desired.
  • a contact element is provided.
  • the contact element for producing an electric contact has a laser-cut conducting plate, with the contour of the laser-cut conducting plates including at least two tips, which are embodied as contacting tips for a contact pad of a part, and which are connected to each other by a separating area such that a one-piece semi-finished part is formed.
  • FIG. 1 shows a schematic view of a contact holder and a contact element mounted thereto, which form a contact unit according to the embodiment described here;
  • FIG. 2 shows a schematic top view of a contact element contacting a fine-pitch part according to the embodiment described here;
  • FIG. 3 shows a schematic top view of a contact holder and a contact element forming a contact unit, contacting a fine-pitch part according to the embodiment described here;
  • FIG. 4 shows a schematic top view of another contact unit contacting a fine-pitch parts according to an embodiment described here;
  • FIG. 5 shows a schematic view of an other contact holder according to embodiments described here.
  • FIG. 6 shows a flow chart for illustrating methods to contact fine-pitch parts according to the embodiments described here.
  • a contact unit for producing an electric contact including a contact element with a contour having at least two tips, which are embodied as contact tips for a contact pad of a part, includes an insulating contact holder, which is connected to the contact element, with the contact element including at least a separating area, which is provided via laser cutting, and with at least two tips being electrically isolated from each other by the separation area.
  • a method for producing a contact unit comprises: cutting a one-piece conducting plate, with the contour of the conducting plate having at least two tips embodied as contact tips for a contact pad of a part, connecting the conducting plate to a holder, bending an area of the conducting plate adjacent to the two tips, and laser cutting the conducting plate at least at a separating area, with the tips being electrically insulated, with the laser cutting of the conducting plate being performed at least at a separation area after the connection.
  • a method for placing into operation of a part comprises: cutting a one-piece conducting plate, with the contour of the conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connecting the conducting plate with a holder, bending an area of the conducting plate adjacent to at least two tips, laser cutting of the conducting plate at least at a separating area, with the tips being electrically insulated, with laser cutting the conducting plate being performed at least at a separating area after the connection was made, contacting a part, and placing into operation of said part.
  • FIG. 1 shows a schematic side view of a contact unit for contacting parts, such as e.g., a fine-pitch diode.
  • the contact unit comprises a contact holder 110 and a contact element 120 .
  • the contact holder 110 has a first window 112 according to one embodiment, which is suitable to detect the image of the contact element 120 from above or to view it. Furthermore, there is a window 114 , which allows access to a part of the contact element 120 from the top for processing. In the following this window is called processing window 114 .
  • the contact holder comprises for example a bore 116 , in order to mount the contact holder to components of test equipment protruding therefrom or another ATE.
  • the contact element 120 in FIG. 1 comprises a contacting area 122 which protrudes from the contact holder 110 (in FIG. 1 on the right side) and further a bent part 124 , which ends in a tip 126 , which is adjusted to create a contact to the contact pad of a fine-pitch diode.
  • a tip may be adjusted to contact an area ranging from e.g. 0.1 to 0.4 ⁇ m.
  • the longitudinal dimension may relate to the lateral length of a rectangular contact pad, a diameter of a circular contact pad, or the like.
  • a typical distance between adjacent contact pads may range from 0.1 ⁇ m to 0.6 ⁇ m. This is discernible in FIG. 2 , for example. In FIG. 2 two tips 126 each contact the contact pads 22 of the part 20 .
  • the contact element 120 comprises a conducting plate, such as sheet metal, for example. It may have a thickness ranging from 0.5 mm to 2 mm.
  • the contact element 120 in FIG. 2 is embodied in one piece and has a separating area 128 , which can electrically isolate the two tips 126 from each other. This way it is possible to provide cost-effective and production ready contacts. According to an embodiment, these contact may be provided for a HF-measurement, with e.g. two contact pads of a part are each contacted by a tip 126 .
  • a contact element 120 is provided.
  • a contact element may have several areas, each of which being determined by a tip and a contacting area, and which are electrically separated from each other for a test.
  • a contact element may have two, four, or more areas. Prior to the connection to the holder the areas are connected to each other by separating areas 128 , so that the semi-finished part is embodied in one piece.
  • a contact element is produced from sheet metal by way of laser cutting.
  • the sheet metals quickly and precisely they can be processed via laser micro-removal.
  • a micro structuring device may be used having a frequency-doubling (532 nm) or a frequency tripling (355 nm) Nd:YAG laser or a Nd:YAG laser having an original wavelength of 1064 nm.
  • individual lines of an argon ion laser or a diode laser may be used for laser cutting and/or the material removal.
  • the individual positions may be approached for processing by a laser beam. According to other embodiments the use of pulsed laser radiation is possible in order to optimize the removal behavior.
  • a laser device with VUV laser beams may be used for the production by way of precision removal.
  • the laser cut one-piece contact element 120 can be provided cost-effectively and is subsequently connected to a contact holder 110 . After the contact element 120 has been connected to the contact holder 110 the contact element 120 can be electrically separated from each other by laser cutting in the separation area 128 .
  • the processing window 114 in the contact holder 110 can serve for this purpose, for example.
  • the contact holder 110 it is also possible for the contact holder 110 to be laser cut and thus also provided cost-effectively, quickly, and individually.
  • the contact holder 110 as described in FIGS. 1-3 , is produced from an insulating material so that the contact tips 126 are electrically isolated from each other and the contact areas 122 are each provided individually for a contact element tip 136 .
  • the contact element 120 can be glued to the contact holder 110 , or it can be connected thereto by other means of connection, such as screws or welding, e.g., laser welding.
  • the contact element 120 typically comprises sheet metal, allowing a large variety of materials selected.
  • Spring steel or copper beryllium can be used, e.g. Examples for typical thicknesses that can be used for the embodiments, as described here, range from 0.5 to 2 mm.
  • the area 124 in which bending occurred, is pressed onto the contact pads of the part.
  • an elastic feature of the bent area 124 may be advantageous.
  • the part 20 contacts with the tips 126 the contact unit comprising a contact holder 110 and a contact element 120 .
  • the separation area 328 (see area 128 in FIG. 2 ) has been separated by laser cutting and/or laser ablation after the contact holder 110 has been connected to the contact element 120 .
  • the contact tips 126 each being arranged on a contact pad 22 for producing a contact are electrically isolated from each other.
  • the contact unit which now comprises individual contact tips and contact areas 122 for addressing and/or receiving measurement signals, a test or a characterization of a part can be performed.
  • FIG. 4 shows another embodiment of a contact element 420 .
  • the contact element 420 comprises four areas, which have been separated from each other by separation areas 328 by laser cutting. Therefore the four contact tips 126 are electrically separated from each other.
  • the four tips 126 form a Kelvin-test contact for characterizing or testing the part 20 using the contact pads 22 .
  • the contact holder 410 shown in FIG. 5 has been connected to the contact element 420 , so that the tips 126 are in a fixed position in reference to each other before an electric separation of the tips 126 in the separation areas 328 is performed. In FIG. 4 this is indicated by the contact holder 410 in dot-dash lines.
  • the contact element 120 comprises sheet metal allowing a large variety of materials selected.
  • spring steel or copper beryllium may be used.
  • a micro structuring device with a frequency doubled (532 nm) or frequency tripled (355 nm) Nd:YAG laser or a Nd:YAG laser can be used with its original wavelength amounting to 1064 nm.
  • Individual lines of an argon-ion laser or a diode laser can also be used for the laser cutting and the material removal.
  • the individual positions can be approached for processing by a laser beam.
  • the use of pulsed laser beams is possible in order to optimize the removal behavior.
  • a tip can be paired, contacting an area ranging from 0.1 to 0.4 ⁇ m, for example.
  • the length may relate, for example, to the lateral length of a rectangular contact pad, a diameter of a circular contact pad, or the like.
  • a typical distance between adjacent contact pads of a part may range from 0.1 ⁇ m to 0.6 ⁇ m.
  • a test contact When separating a test contact 420 , such as for example a Kelvin-test contact, for measuring four tips 126 , a test contact is separated into four areas, this is indicated in FIG. 5 by the four processing windows 514 .
  • the window 512 As shown in FIG. 5 , the window 512 to be considered similar to the window 112 in FIG. 1 , serves for example to align a contact unit to a part in an placing into operation process. A visual alignment of the contact unit in reference to the part can be performed through the window 512 .
  • FIG. 6 shows a method illustrating embodiments for performing the placing into operation or the testing of a part.
  • a one-piece contact element is provided by laser cutting.
  • the one-piece contact element is mounted to the contact holder in step 604 .
  • the contact holder can also be produced by laser cutting.
  • Typical embodiments for mounting the contact element to a contact holder include gluing, screwing, or welding, e.g., laser welding.
  • step 606 the areas of the contact element in FIG. 1 , marked with the reference character 124 , are bent such that subsequently they can be pressed onto a contact pad.
  • FIG. 6 the mounting of a contact element to a contact holder and the bending of the contact element and/or the contacting tips is shown parallel to each other. This serves to illustrate different embodiments, because bending the contact element can be performed prior to the mounting at a contact holder or after the mounting at the contact holder.
  • the individual areas of the contact element are separated from each other by laser cutting in step 608 .
  • the contact tips are electrically separated from each other by the respectively allocated contacting areas 122 for the respective contact element tip.
  • the contact unit which now comprises individual contact tips for addressing and/or receiving measurement signals, an placing into operation, a test, or a characterization can be performed in step 610 .
  • Exemplary embodiments also relate to parts tested with the described contact elements, contact units, and with the methods for testing parts.
  • these parts may also be identified by the impressions in the contact pads of the part left by the contact tips.

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
US11/677,264 2007-02-07 2007-02-21 Contact Element, Contact Unit, Method For Producing A Contact Unit, And Method For Placing Into Operation For Fine-Pitch Parts Abandoned US20080184851A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/533,540 US8091217B2 (en) 2007-02-07 2009-07-31 Contact element, contact unit, method for producing a contact unit, and method for placing into operation for fine-pitch parts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007006195.3 2007-02-07
DE102007006195A DE102007006195A1 (de) 2007-02-07 2007-02-07 Kontaktelement, Kontakteinheit, Verfahren zur Herstellung einer Kontakteinheit und Verfahren zur Inbetriebnahme für Fine-Pitch Bauteile

Related Child Applications (1)

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US12/533,540 Division US8091217B2 (en) 2007-02-07 2009-07-31 Contact element, contact unit, method for producing a contact unit, and method for placing into operation for fine-pitch parts

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Publication Number Publication Date
US20080184851A1 true US20080184851A1 (en) 2008-08-07

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US11/677,264 Abandoned US20080184851A1 (en) 2007-02-07 2007-02-21 Contact Element, Contact Unit, Method For Producing A Contact Unit, And Method For Placing Into Operation For Fine-Pitch Parts
US12/533,540 Active 2027-09-16 US8091217B2 (en) 2007-02-07 2009-07-31 Contact element, contact unit, method for producing a contact unit, and method for placing into operation for fine-pitch parts

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DE (1) DE102007006195A1 (de)

Citations (17)

* Cited by examiner, † Cited by third party
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US3210710A (en) * 1962-04-20 1965-10-05 Honeywell Inc Control apparatus and sensor
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
US3670409A (en) * 1970-11-19 1972-06-20 Gte Automatic Electric Lab Inc Planar receptacle
US3853382A (en) * 1972-04-28 1974-12-10 Burndy Corp High pressure electrical contacts
US5046954A (en) * 1991-01-31 1991-09-10 Amp Incorporated Planar electrical connector
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US6128181A (en) * 1998-10-19 2000-10-03 Hokuriku Electric Industry Co., Ltd. Electric component unit
US6276955B1 (en) * 2000-01-14 2001-08-21 Avaya Technology Corp. Multi contact socket connector
US6305993B1 (en) * 2000-01-31 2001-10-23 Tyco Electronics Amp Gmbh Contact socket
US20040035547A1 (en) * 2002-08-20 2004-02-26 3M Innovative Properties Company Metal matrix composites, and methods for making the same
US6860766B2 (en) * 2002-03-08 2005-03-01 Cinch Connectors, Inc. Electrical connector
US6911130B2 (en) * 2000-12-12 2005-06-28 Bayer Healthcare, Llc Electrochemical sensor
US6938338B2 (en) * 1994-06-07 2005-09-06 Tessera, Inc. Method of making an electronic contact
US7044755B2 (en) * 2003-04-18 2006-05-16 Kyoshin Kogyo Co., Ltd. Ground terminal and method for mounting a printed board mounted with a ground terminal to a chassis
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US20070142903A1 (en) * 2005-12-15 2007-06-21 Dave Vipul B Laser cut intraluminal medical devices
US20070197099A1 (en) * 2006-02-17 2007-08-23 Centipede Systems, Inc. High Performance Electrical Connector

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US5173055A (en) * 1991-08-08 1992-12-22 Amp Incorporated Area array connector
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
DE19945178C2 (de) * 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
US6179624B1 (en) * 1999-11-05 2001-01-30 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
US6965245B2 (en) * 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3210710A (en) * 1962-04-20 1965-10-05 Honeywell Inc Control apparatus and sensor
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
US3670409A (en) * 1970-11-19 1972-06-20 Gte Automatic Electric Lab Inc Planar receptacle
US3853382A (en) * 1972-04-28 1974-12-10 Burndy Corp High pressure electrical contacts
US5046954A (en) * 1991-01-31 1991-09-10 Amp Incorporated Planar electrical connector
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US6938338B2 (en) * 1994-06-07 2005-09-06 Tessera, Inc. Method of making an electronic contact
US6128181A (en) * 1998-10-19 2000-10-03 Hokuriku Electric Industry Co., Ltd. Electric component unit
US6276955B1 (en) * 2000-01-14 2001-08-21 Avaya Technology Corp. Multi contact socket connector
US6305993B1 (en) * 2000-01-31 2001-10-23 Tyco Electronics Amp Gmbh Contact socket
US6911130B2 (en) * 2000-12-12 2005-06-28 Bayer Healthcare, Llc Electrochemical sensor
US6860766B2 (en) * 2002-03-08 2005-03-01 Cinch Connectors, Inc. Electrical connector
US20040035547A1 (en) * 2002-08-20 2004-02-26 3M Innovative Properties Company Metal matrix composites, and methods for making the same
US7044755B2 (en) * 2003-04-18 2006-05-16 Kyoshin Kogyo Co., Ltd. Ground terminal and method for mounting a printed board mounted with a ground terminal to a chassis
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US20070142903A1 (en) * 2005-12-15 2007-06-21 Dave Vipul B Laser cut intraluminal medical devices
US20070197099A1 (en) * 2006-02-17 2007-08-23 Centipede Systems, Inc. High Performance Electrical Connector

Also Published As

Publication number Publication date
US20090307904A1 (en) 2009-12-17
DE102007006195A1 (de) 2008-08-14
US8091217B2 (en) 2012-01-10

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