US20080149885A1 - Etchant for etching workpieces made of aluminum and aluminum alloys - Google Patents
Etchant for etching workpieces made of aluminum and aluminum alloys Download PDFInfo
- Publication number
- US20080149885A1 US20080149885A1 US11/777,118 US77711807A US2008149885A1 US 20080149885 A1 US20080149885 A1 US 20080149885A1 US 77711807 A US77711807 A US 77711807A US 2008149885 A1 US2008149885 A1 US 2008149885A1
- Authority
- US
- United States
- Prior art keywords
- etchant
- ferric
- approximate range
- aluminum
- percentage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005530 etching Methods 0.000 title claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 12
- 229910000838 Al alloy Inorganic materials 0.000 title claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 14
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910001447 ferric ion Inorganic materials 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 239000007800 oxidant agent Substances 0.000 claims abstract description 5
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims abstract 3
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 4
- HEJPGFRXUXOTGM-UHFFFAOYSA-K iron(3+);triiodide Chemical compound [Fe+3].[I-].[I-].[I-] HEJPGFRXUXOTGM-UHFFFAOYSA-K 0.000 claims description 4
- FEONEKOZSGPOFN-UHFFFAOYSA-K tribromoiron Chemical compound Br[Fe](Br)Br FEONEKOZSGPOFN-UHFFFAOYSA-K 0.000 claims description 4
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
Definitions
- the present invention relates to an etchant, and, particularly, to a kind of etchant used for etching workpieces made of aluminum or an aluminum alloy.
- a typical etchant includes an acetic acid solution, a hydrochloric acid solution, and a nitric acid solution.
- Such an etchant is usually expensive and cannot be recycled.
- the etchant of this sort is used to etch workpieces made of aluminium or an alloy thereof, it usually requires a long time to etch the workpieces, and it is prone to leave a residue that stains the workpieces.
- An etchant includes nitric acid having a percentage by mass in an approximate range from 4% to 6%, hydrochloric acid having a percentage by mass in an approximate range from 1% to 3%; and ferric ions (Fe 3+ ) having a concentration in an approximate range of 30-70 grams/liter.
- the resultant etchant is suitable for etching aluminum and its alloys.
- An etchant in accordance with a present embodiment is provided.
- the etchant can be applied to workpieces made of aluminum or an aluminum alloy, such as housings of mobile phones, computers, digital cameras, etc., in order to form apertures, marks, and/or designs therein and/or thereon, as the case may be.
- the etchant is a solution including nitric acid (HNO 3 ), hydrochloric acid (HCl), and a ferric compound.
- the percentage by mass of HNO 3 contained in the resulting etchant is in an approximate range from 4% to 6%, and the percentage by mass of HCl contained in the resulting etchant is in an approximate range from 1% to 3%.
- the ferric (Fe 3+ ) compound is a soluble ferric compound.
- the ferric compound can be a ferric halide chosen from the group consisting of ferric chloride (FeCl 3 ), ferric bromide (FeBr 3 ), ferric iodide (FeI 3 ), and mixtures thereof.
- the concentration of ferric ions (Fe3 + ) contained in the etchant is in the approximate range of 30 to 70 grams/liter (g/l).
- HNO 3 , HCl, and the aforementioned ferric compound are mixed in water to form the etchant, wherein an original percentage by mass concentration of HNO 3 is about 68%-70%, and an original percentage by mass concentration of HCl is about 30%-32%.
- an optimal percentage by mass of HNO 3 can be approximately 5%
- an optimal percentage by mass of HCl can be approximately 2%
- an optimal concentration of Fe 3+ can be approximately 50 grams/liter (g/l).
- the workpieces made of aluminium or aluminium alloy are immersed in the etchant at a temperature in an approximate range of 38° C.-48° C. to be etched.
- the optimal etching temperature of the etchant is approximately 43° C.
- an etching depth in the workpieces is about 0.1 millimeters (mm). It is to be understood that, for depths greater than 0.1 mm, etching times in excess of 1.8 min would be needed, and for depths of less than 0.1 mm, shorter etching times would suffice.
- the workpieces are taken out from the etchant and cleaned by means of a typical cleaning method, in order to neutralize and/or remove any etchant remaining thereon upon removal from the etchant.
- An oxidizer such as sodium chlorate (NaClO 3 ) or potassium chlorate (KClO 3 ), can advantageously be added into the etchant for resuming/renewing the oxidizing capability of the used etchant.
- an oxidation-reduction potential (ORP) of the used etchant is measured to be less than 550 millivolt (mV)
- ORP oxidation-reduction potential
- the etchant in accordance with the present embodiment requires less etching time and forms less residue. Additionally, the etchant is less expensive since it can be recycled.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
An etchant includes nitric acid (HNO3) having a percentage by mass in the approximate range of 4%-6%, hydrochloric acid (HCl) having a percentage by mass in the approximate range of 1%-3%; and ferric ions (Fe3+) having a concentration in the approximate range of 30-70 grams/liter (g/l). The resultant etchant is suitable for etching aluminum and its alloys. In fact, the etchant is capable of etching such a material to a depth of about 0.1 mm in about 1.8 min, when employed at a temperature in the approximate range of 38° C.-48° C. The etchant further may be recycled, for which an added oxidizer may further be employed.
Description
- 1. Field of the Invention
- The present invention relates to an etchant, and, particularly, to a kind of etchant used for etching workpieces made of aluminum or an aluminum alloy.
- 2. Description of Related Art
- Workpieces, made of aluminum or an aluminum alloy, are widely used in modern industry. In use, workpieces made of aluminum or an aluminum alloy are oftentimes etched to form apertures, marks, and/or designs on and/or in surfaces thereof. Generally, a typical etchant includes an acetic acid solution, a hydrochloric acid solution, and a nitric acid solution. Such an etchant is usually expensive and cannot be recycled. Additionally, when the etchant of this sort is used to etch workpieces made of aluminium or an alloy thereof, it usually requires a long time to etch the workpieces, and it is prone to leave a residue that stains the workpieces.
- Therefore, a kind of new etchant for etching workpieces made of aluminum or an alloy thereof, is desired in order to overcome the above-described shortcomings.
- An etchant includes nitric acid having a percentage by mass in an approximate range from 4% to 6%, hydrochloric acid having a percentage by mass in an approximate range from 1% to 3%; and ferric ions (Fe3+) having a concentration in an approximate range of 30-70 grams/liter. The resultant etchant is suitable for etching aluminum and its alloys.
- Other advantages and novel features will become more apparent from the following detailed description.
- An etchant in accordance with a present embodiment is provided. The etchant can be applied to workpieces made of aluminum or an aluminum alloy, such as housings of mobile phones, computers, digital cameras, etc., in order to form apertures, marks, and/or designs therein and/or thereon, as the case may be. The etchant is a solution including nitric acid (HNO3), hydrochloric acid (HCl), and a ferric compound.
- In the etchant, the percentage by mass of HNO3 contained in the resulting etchant is in an approximate range from 4% to 6%, and the percentage by mass of HCl contained in the resulting etchant is in an approximate range from 1% to 3%. The ferric (Fe3+) compound is a soluble ferric compound. Beneficially, the ferric compound can be a ferric halide chosen from the group consisting of ferric chloride (FeCl3), ferric bromide (FeBr3), ferric iodide (FeI3), and mixtures thereof. When the ferric compound is dissolved in the etchant solution, the concentration of ferric ions (Fe3+) contained in the etchant is in the approximate range of 30 to 70 grams/liter (g/l).
- In preparation of the etchant, HNO3, HCl, and the aforementioned ferric compound are mixed in water to form the etchant, wherein an original percentage by mass concentration of HNO3 is about 68%-70%, and an original percentage by mass concentration of HCl is about 30%-32%. Beneficially, in the etchant an optimal percentage by mass of HNO3 can be approximately 5%, an optimal percentage by mass of HCl can be approximately 2%, and an optimal concentration of Fe3+ can be approximately 50 grams/liter (g/l).
- In use, the workpieces made of aluminium or aluminium alloy are immersed in the etchant at a temperature in an approximate range of 38° C.-48° C. to be etched. Beneficially, the optimal etching temperature of the etchant is approximately 43° C. When the workpieces are etched by the etchant for about 1.8 minutes, an etching depth in the workpieces is about 0.1 millimeters (mm). It is to be understood that, for depths greater than 0.1 mm, etching times in excess of 1.8 min would be needed, and for depths of less than 0.1 mm, shorter etching times would suffice. After predetermined apertures, marks, and/or designs are formed in/on the workpieces, the workpieces are taken out from the etchant and cleaned by means of a typical cleaning method, in order to neutralize and/or remove any etchant remaining thereon upon removal from the etchant.
- After the etchant is used, it can be recycled for etching further workpieces. An oxidizer, such as sodium chlorate (NaClO3) or potassium chlorate (KClO3), can advantageously be added into the etchant for resuming/renewing the oxidizing capability of the used etchant. Beneficially, when an oxidation-reduction potential (ORP) of the used etchant is measured to be less than 550 millivolt (mV), the oxidizer should be added to the used etchant.
- Understandably, compared to most kinds of typical etchants, the etchant in accordance with the present embodiment requires less etching time and forms less residue. Additionally, the etchant is less expensive since it can be recycled.
- It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of structures and functions of various embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (10)
1. An etchant comprising:
a nitric acid (HNO3) having a percentage by mass in an approximate range of 4%-6%;
a hydrochloric acid (HCl) having a percentage by mass in an approximate range of 1%-3%; and
a source of ferric ions (Fe3+) having a concentration in an approximate range of 30-70 grams/liter (g/l).
2. The etchant as claimed in claim 1 , wherein the percentage by mass of the nitric acid (HNO3) is approximately 5%.
3. The etchant as claimed in claim 1 , wherein the percentage by mass of the hydrochloric acid (HCl) is approximately 2%.
4. The etchant as claimed in claim 1 , wherein the ferric ions (Fe3+) have a concentration of approximately 50 grams/liter (g/l).
5. The etchant as claimed in claim 1 , wherein the etchant is capable of effectively etching aluminum or an alloy thereof at a temperature in an approximate range of 38° C.-48° C.
6. The etchant as claimed in claim 1 , wherein the ferric (Fe3+) ions are provided by a soluble ferric compound dissolved in the etchant.
7. The etchant as claimed in claim 6 , wherein the ferric compound is chosen from the group consisting of ferric chloride (FeCl3), ferric bromide (FeBr3), ferric iodide (FeI3), and a mixture of at least two kinds of these kinds of ferric halide.
8. The etchant as claimed in claim 1 , wherein the etchant further includes an oxidizer.
9. The etchant as claimed in claim 8 , wherein the oxidizer is chosen from the group of sodium chlorate (NaClO3) and potassium chlorate (KClO3).
10. The etchant as claimed in claim 1 , wherein the etchant is capable of etching at least one of aluminum and an aluminum alloy to a depth of about 0.1 mm in about 1.8 min, when employed at a temperature in the approximate range of 38° C.-48° C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101578739A CN101205614B (en) | 2006-12-22 | 2006-12-22 | Chemical etching liquor for aluminium and aluminum alloy |
| CN200610157873.9 | 2006-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20080149885A1 true US20080149885A1 (en) | 2008-06-26 |
Family
ID=39541519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/777,118 Abandoned US20080149885A1 (en) | 2006-12-22 | 2007-07-12 | Etchant for etching workpieces made of aluminum and aluminum alloys |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080149885A1 (en) |
| CN (1) | CN101205614B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800575A (en) * | 2011-05-26 | 2012-11-28 | 中芯国际集成电路制造(上海)有限公司 | Method for removing crystal defects of aluminum liner |
| US8540826B2 (en) | 2009-10-02 | 2013-09-24 | University Of Windsor | Method of surface treatment of aluminum foil and its alloy and method of producing immobilized nanocatalyst of transition metal oxides and their alloys |
| US9039915B2 (en) | 2009-02-23 | 2015-05-26 | Kanto Kagaku Kabushiki Kaisha | Etching solution compositions for metal laminate films |
| TWI547546B (en) * | 2010-09-28 | 2016-09-01 | 林純藥工業股份有限公司 | Etching liquid composition and etching method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
| CN103774148B (en) * | 2011-12-31 | 2016-03-16 | 聚灿光电科技股份有限公司 | Semiconductor technology normal temperature aluminium etch process |
| CN105925981A (en) * | 2016-05-30 | 2016-09-07 | 苏州安洁科技股份有限公司 | Etching liquid for preparing double-face aluminum product circuit board |
| JP6332821B1 (en) * | 2017-05-30 | 2018-05-30 | Ａｐｓジャパン株式会社 | Method for producing catalyst or adsorbent carrier, and catalyst or adsorbent carrier |
| CN110512210A (en) * | 2019-09-28 | 2019-11-29 | 立邦涂料（重庆）化工有限公司 | A kind of free-floride low-temperature corrosion agent and preparation method |
| CN113755840A (en) * | 2021-08-16 | 2021-12-07 | 合肥本源量子计算科技有限责任公司 | Etching liquid and etching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3836473A (en) * | 1971-09-21 | 1974-09-17 | Rolls Royce 1971 Ltd | Etching solution |
| US4060097A (en) * | 1975-09-17 | 1977-11-29 | Oxford Keith E | Automatic etching system |
| US4089736A (en) * | 1976-04-27 | 1978-05-16 | Rolls-Royce Limited | Method of removing Al-Cr-Co coatings from nickel alloy substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7509341A (en) * | 1975-08-06 | 1977-02-08 | Philips Nv | PROCESS FOR THE MANUFACTURE OF ELECTRICALLY CONDUCTIVE INDIUM OXIDE CARTRIDGES ON AN INSULATING SUPPORT. |
| SU1425252A1 (en) * | 1985-09-30 | 1988-09-23 | Предприятие П/Я Г-4517 | Agent for detecting macroflaws |
| CN100383282C (en) * | 2005-09-23 | 2008-04-23 | 祁佰伟 | Comprehensive utilization method of corrosive liquid for producing breastplate |
-
2006
- 2006-12-22 CN CN2006101578739A patent/CN101205614B/en not_active Expired - Fee Related
-
2007
- 2007-07-12 US US11/777,118 patent/US20080149885A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3836473A (en) * | 1971-09-21 | 1974-09-17 | Rolls Royce 1971 Ltd | Etching solution |
| US4060097A (en) * | 1975-09-17 | 1977-11-29 | Oxford Keith E | Automatic etching system |
| US4089736A (en) * | 1976-04-27 | 1978-05-16 | Rolls-Royce Limited | Method of removing Al-Cr-Co coatings from nickel alloy substrates |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9039915B2 (en) | 2009-02-23 | 2015-05-26 | Kanto Kagaku Kabushiki Kaisha | Etching solution compositions for metal laminate films |
| US8540826B2 (en) | 2009-10-02 | 2013-09-24 | University Of Windsor | Method of surface treatment of aluminum foil and its alloy and method of producing immobilized nanocatalyst of transition metal oxides and their alloys |
| TWI547546B (en) * | 2010-09-28 | 2016-09-01 | 林純藥工業股份有限公司 | Etching liquid composition and etching method |
| CN102800575A (en) * | 2011-05-26 | 2012-11-28 | 中芯国际集成电路制造(上海)有限公司 | Method for removing crystal defects of aluminum liner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101205614B (en) | 2011-06-29 |
| CN101205614A (en) | 2008-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO.,LTD., CH Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, CHIH-PEN;CAO, QING-SONG;WU, NIAN-JIANG;AND OTHERS;REEL/FRAME:019551/0858 Effective date: 20070627 Owner name: SUTECH TRADING LIMITED, VIRGIN ISLANDS, BRITISH Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, CHIH-PEN;CAO, QING-SONG;WU, NIAN-JIANG;AND OTHERS;REEL/FRAME:019551/0858 Effective date: 20070627 |
|
| AS | Assignment |
Owner name: FIH (HONG KONG) LIMITED, HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SUTECH TRADING LIMITED;REEL/FRAME:022483/0051 Effective date: 20090324 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |