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US20080050611A1 - Tin-Based Plating Film and Method for Forming the Same - Google Patents

Tin-Based Plating Film and Method for Forming the Same Download PDF

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Publication number
US20080050611A1
US20080050611A1 US11/628,747 US62874705A US2008050611A1 US 20080050611 A1 US20080050611 A1 US 20080050611A1 US 62874705 A US62874705 A US 62874705A US 2008050611 A1 US2008050611 A1 US 2008050611A1
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Prior art keywords
tin
plating film
alloy
plating
layer
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Abandoned
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US11/628,747
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English (en)
Inventor
Chun Wah Jimmy Kwok
Yim Wah Rosaline Kwok
Yutaka Nakagishi
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RAMBO CHEMICALS H K Ltd
Okuno Chemical Industries Co Ltd
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RAMBO CHEMICALS H K Ltd
Okuno Chemical Industries Co Ltd
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Assigned to OKUNO CHEMICAL INDUSTRIES CO., LTD., RAMBO CHEMICALS (H.K.) LTD. reassignment OKUNO CHEMICAL INDUSTRIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KWOK, CHUN WAH JIMMY, KWOK, YIM WAH ROSALINE, NAKAGISHI, YUTAKA
Publication of US20080050611A1 publication Critical patent/US20080050611A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1841—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H05K3/346—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component

Definitions

  • the present invention relates to a tin-based plating film with suppressed whisker growth, and a method for forming the same.
  • Sn—Pb plating provides plating films with good appearance, outstanding solderbility, and allows relatively easy plating bath management, because of which it has been called solder plating and widely used for plating electrical and electronic components.
  • solder plating has been leaching from electronic component wastes by acid rain, etc., becoming a contamination source for groundwater. Since lead, which is particularly harmful to the human body, causes problems in the work environment and waste water treatment, development of lead-free tin alloys has been urgently demanded.
  • Examples of known lead-free Sn alloy platings having good solderbility and low melting points are those containing Ag, Cu, In, Tl, Zn, and the like (see Patent document 1 below).
  • whiskers grown on plating films formed on electrical and electronic components cause shorting of circuits and terminals, resulting in significantly degraded performance and reliability of electrical and electronic components. For this reason, with plating films for electrical and electronic components, the prevention of such whisker formation has been an important object.
  • electroplating with tin alone is advantageous; however since such plating cannot prevent short-circuiting on the plating surface caused by the whisker formation, it is not usually employed for plating electrical and electronic components as it is.
  • a known method of preventing tin and tin alloy whisker growth is to perform a melting treatment after plating.
  • a melting treatment poses drawbacks in that it is expensive and unsuitable for use with complicated shapes, restricting the shapes of applicable items.
  • Another known method is to perform chemical posttreatment using a phosphoric acid solution after plating.
  • a phosphoric acid solution after plating.
  • the present invention has been accomplished in view of the above state of the art, and its primary object is to provide a tin-based plating film such as a lead-free tin plating film or tin alloy plating film which can suppress whisker growth for an extended period, and can be relatively easily formed without complicated steps.
  • a tin-based plating film such as a lead-free tin plating film or tin alloy plating film which can suppress whisker growth for an extended period, and can be relatively easily formed without complicated steps.
  • the present inventors have conducted extended research to accomplish the above object. As a result, the inventors have found that a two-layered tin-based plating film comprising a lower layer of a tin plating film or tin alloy plating film and an upper layer of relatively thin tin plating film or tin alloy plating film formed on the lower layer is capable of preventing the formation of whiskers for an extended period of time. The inventors have further found that when the alloy composition constituting the upper plating film layer is appropriately selected, reflow temperatures can be arbitrarily determined without affecting the properties of the plating film as a whole. The present invention has been accomplished based on these findings.
  • the present invention provides the following tin-based plating films exhibiting suppressed whisker growth, and methods for forming them.
  • the tin-based plating film of the present invention has a two-layer structure consisting of a lower layer: a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and 95% by weight or more of tin; and an upper layer: a tin plating film or tin alloy plating film comprising 5% by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and 95% by weight or more of tin.
  • a tin-based film having such a two-layer structure With a tin-based film having such a two-layer structure, the formation of a very thin tin plating film or tin alloy plating film as an upper layer can prevent whisker growth for an extended period, regardless of whether the lower layer is a tin plating film or tin alloy plating film.
  • the upper plating layer and the lower plating layer may be of bright, semi-bright or matt (matted) finish, and suitable selections can be made in accordance with the purpose of use.
  • the lower layer is preferably a tin plating film.
  • the lower layer is preferably of semi-bright or matt, with matt being more preferable. Due to their large crystal grain sizes and great stress relief effects, semi-bright and matt tin plating films can effectively retard whisker growth. Even when the lower layer is a tin alloy plating film, whiskers are less likely to grow by the above-mentioned two-layer structure, and problems such as variation of reflow temperature, degradation of solderbility, occurrence of crackings, etc. hardly occur. Given this, compared with a single layer tin alloy plating film, such a two-layer structure can dispense with strict control of the alloy composition and makes the plating process easier.
  • the upper layer is preferably a bright or semi-bright finish tin plating film or tin alloy plating film, with a bright plating film being particularly preferable. Due to their small crystal grain sizes, bright and semi-bright plating films can block pores. Further, since such films are relatively hard, the film surface is scarcely scratched. With these characteristics, they can very effectively prevent the formation of whiskers.
  • the lower layer is a semi-bright or matt tin or tin alloy plating film and the upper layer is a bright or semi-bright tin or tin alloy plating film
  • internal stress and crack occurrence can be suppressed without increasing the overall hardness.
  • the lower layer be a matt tin plating film and the upper layer be a bright tin alloy plating film.
  • the reflow temperature can be arbitrarily set by selecting the composition of the tin alloy, thereby easily providing a film having a reflow temperature meeting the purpose of use. Comparing such a structure with a film formed only by a tin alloy plating layer, since the tin alloy plating layer forming the upper layer is a thin film, the alloy composition is relatively stable and reflow temperatures can be easily controlled. Further, since such a structure requires an upper layer of tin alloy layer having an extremely thin film, only a reflow temperature can be freely controlled without adversely affecting the properties of the lower layer of tin plating film or tin alloy plating.
  • the upper layer of bright or semi-bright tin plating film or tin alloy plating film can be formed using a known tin plating bath or tin alloy plating bath containing, for example, a grain refiner and/or like additives.
  • the thickness of the lower layer of tin plating film or tin alloy plating film is not limited, but typically is preferably about 0.1 to about 20 ⁇ m.
  • the lower layer preferably has a thickness of about 1.5 to about 5 ⁇ m, and more preferably about 2.5 to about 5 ⁇ m.
  • the lower layer preferably has a thickness of about 8 to about 20 ⁇ m, and more preferably about 10 to about 15 ⁇ m.
  • the thickness of the upper layer of tin plating film or tin alloy plating film is not limited, but it is preferable that it be thinner than the lower layer, with about 0.025 to 5 ⁇ m typically being preferable.
  • the film thickness of the upper layer should preferably be within the above range, and at the same time be about 50% or less, and more preferably about 25% or less, of the film thickness of the lower layer.
  • the method(s) for forming tin plating and tin alloy plating films of the above-mentioned two-layered tin-based plating film is not limited, and desired tin and/or tin alloy plating films may be formed in a typical manner using conventionally known tin and/or tin alloy plating baths. Both electro- and electroless plating baths can be used.
  • electroplating baths are various known tin and tin alloy plating baths such as organic sulfonic acid bath, sulfuric acid bath, pyrophosphoric acid bath, tartaric acid bath, and the like. Specific compositions of these plating baths are not limited, and any compositions can be employed as long as they are able to form desired tin and tin alloy plating films.
  • organic sulfonic acid baths examples include those containing methanesulfonic acid, ethanesulfonic acid, methanolsulfonic acid, ethanolsulfonic acid, phenolsulfonic acid, naphtholsulfonic acid, or the like.
  • a composition for a methanesulfonic acid bath is given below as an example of a bath composition for a tin electroplating solution.
  • Methanesulfonic acid 100 to 250 ml/l Tin methanesulfonate (as a 300 g/l aqueous solution) 100 to 350 ml/l Brightener 0.1 to 2 g/l Wetting agent 30 to 1000 g/l Additive (grain refiner) 0.1 to 5 g/l
  • metal salts of methanesulfonic acid or the like containing metal components alloying with tin may further be added to the tin plating solution.
  • metal salts of methanesulfonic acid or the like containing metal components alloying with tin may further be added to the tin plating solution.
  • cobalt methanesulfonate, and/or the like may be added in a range of about 20 mg/l to about 1500 mg/l on a metal concentration basis.
  • the amount of metal salts to be added may be selected within such a range in accordance with the desired alloy composition.
  • Plating conditions are not limited; the bath temperature may be about 5 to about 65° C., and the cathode current density may be about 1 to about 50 A/dm 2 .
  • high speed plating such as hoop plating and jet plating, or pulse plating may be employed.
  • Pretreatment for forming tin or tin alloy plating films is not limited, and may be performed according to a typical manner.
  • degreasing may be carried out in a typical manner, and as necessary, chemical polishing, etching, and like treatments may follow.
  • a lower layer of tin or tin alloy plating film is subsequently formed, and an upper layer of tin or tin alloy plating film may be formed subsequently.
  • an undercoat plating layer of Ni or Cu or an undercoat plating layer of Sn, Sn—Co alloy, Sn—Cu alloy, Sn—Bi alloy, Sn—Ag alloy or Sn—In alloy, functioning as a barrier layer may be formed as necessary.
  • another undercoat plating layer of Sn, Sn—Co alloy, Sn—Cu alloy, Sn—Bi alloy, Sn—Ag alloy, or Sn—In alloy may be formed.
  • an undercoat plating layer of Ni or Cu preferably has a semi-bright or matt finish, which have larger crystal grain sizes.
  • the formation of such an undercoat plating layer enhances the effect of stress relief.
  • such an undercoat plating layer, together with a substrate forms metallic interlayer which can suppress whisker growth caused by internal stress from the substrate and migration stress from the substrate and the like.
  • Such a Ni or Cu undercoat plating layer preferably has a film thickness of about 0.1 to about 10 ⁇ m, and more preferably about 0.1 to about 2 ⁇ m.
  • an undercoat plating layer of Sn, Sn—Co alloy, Sn—Cu alloy, Sn—Bi alloy, Sn—Ag alloy or Sn—In alloy be a bright or semi-bright plating film, which has smaller crystal grain sizes.
  • the formation of such an undercoat plating layer is able to block micropores, thereby suppressing whisker growth. If the formation of a Ni plating layer as a barrier layer is not feasible due to the circumstances of the manufacturing equipment, assembly steps, and the like, a metallic interlayer is formed from such an undercoat plating layer and the substrate, and whisker growth caused by internal stress from the substrate and migration stress from the substrate and the like can be retarded.
  • An undercoat plating layer of Sn, Sn—Co alloy, Sn—Cu alloy, Sn—Bi alloy, Sn—Ag alloy or Sn—In alloy preferably has a film thickness of about 0.01 to about 3 ⁇ m, and more preferably about 0.01 to about 1 ⁇ m. Further, it is preferable that tin be contained about 60% by weight or more in an Sn—Co alloy, Sn—Cu alloy, Sn—Bi alloy, Sn—Ag alloy or Sn—In alloy.
  • the method for forming the undercoat plating layer as a barrier layer is not limited, and desired plating films may be formed using conventionally known plating baths in a typical manner. Both electro- and electroless plating baths can be used for this purpose.
  • Materials of an article to be plated are not limited as long as the aforementioned plating film can be formed thereon. Examples can include copper, copper alloy, iron, iron alloy, and the like.
  • electroplating non-conducting materials the surface of the material is coated with a metal by electroless plating or the like to impart electric conductivity before electroplating is performed.
  • Kinds and shapes of the articles to be plated are not limited, and typical examples are electronic components which require soldering such as lead frames, semiconductor packages, chip components, and the like.
  • chemical posttreatment may further be applied as necessary.
  • Such chemical posttreatment may be performed following conventional methods, and examples include a method in which the plating film is immersed for about 5 to about 60 seconds in a solution containing about 30 to 70 g/l of trisodium phosphate at a temperature of about 30 to about 50° C.
  • the two-layered tin-based plating film of the present invention can greatly suppress whisker formation, and thereby provide highly reliable electrical and electronic components.
  • the upper layer is a tin alloy plating film
  • its thin film thickness stabilizes the alloy composition, contributing to easier control of reflow temperature.
  • the film thickness of the tin alloy plating film is thin, the reflow temperature can be controlled without substantially affecting the characteristic properties of the lower layer plating film.
  • the lower layer is a semi-bright or matt (non-bright) tin or tin alloy plating film, and a semi-bright or bright tin or tin alloy plating film is formed thereon
  • the presence of the thick semi-bright or matt lower layer contributes to overall stress relief, and further, the presence of the very hard surface layer can suppress the scratching formation, providing outstanding effects in preventing whisker growth.
  • FIG. 1 A figure printed from the electronic data of an SEM image taken after a sample consisting of a tin-cobalt plating layer and a pure tin plating layer formed on a brass plate was allowed to stand at room temperature.
  • FIG. 2 A figure printed from the electronic data of an SEM image taken after a sample consisting of a pure tin plating layer formed on a brass plate was allowed to stand at room temperature.
  • FIG. 3 A figure printed from the electronic data of an SEM image of a plating film surface taken after a sample consisting of a tin-cobalt alloy plating layer and a matt tin plating layer formed on a phosphore bronze plate was allowed to stand at a high humidity and high temperature.
  • electrolytic degreasing treatment was performed, and the plate was immersed in an aqueous acidic solution for one minute at ambient temperature as an activation treatment, followed by immersion in an aqueous solution containing a 70% methanesulfonic acid solution in a concentration of 10% by weight.
  • a bright tin plating film of about 3 ⁇ m thickness was formed.
  • Te plating bath composition Methanesulfonic acid 175 ml/l Tin methanesulfonate 45 g/l (as tin metal amount) Wetting agent 100 g/l Brightener 0.3 g/l Additive 0.5 g/l (grain refiner) (Plating conditions) Bath temperature: room temperature Cathode current density: 10 A/dm 2 Plating time: 1 minute
  • a tin-cobalt plating film of about 1.25 ⁇ m thickness was then formed.
  • the composition of the alloy plating film was 99.5% by weight of tin and 0.5% by weight of cobalt.
  • a two-layered tin-based plating film consisting of a pure tin plating layer of about 3 ⁇ m thickness and a tin-cobalt plating layer of 1.25 ⁇ m thickness was formed on a brass plate.
  • FIG. 1 shows an SEM image (500 ⁇ ) of the plating film surface of the thus obtained sample which was allowed to stand at room temperature for 5 months.
  • FIG. 2 shows an SEM image (500 ⁇ ) of the plating film surface of a sample comprising a pure tin plating film of 3 ⁇ m thickness formed on a brass plate in the same manner as the above which was allowed to stand at room temperature for 5 months.
  • a matt (non-bright) tin plating film of about 11 ⁇ m thickness was formed using a tin electroplating bath having the following composition.
  • Methanesulfonic acid 175 ml/l Tin methanesulfonate 45 g/l (by tin metal amount)
  • Additive 0.5 g/l (grain refiner)
  • Bath temperature room temperature
  • Cathode current density 10 A/dm 2
  • Plating time 2.4 minutes
  • a tin-cobalt alloy plating layer of 1.25 ⁇ m thickness was then formed as the upper layer in the same manner as in Example 1.
  • FIG. 3 shows an SEM image (300 ⁇ ) of the plating film surface of this sample taken after it was allowed to stand for 500 hours under high humidity and high temperature conditions at a humidity 85% and a temperature of 85° C.
  • the sample comprising the upper tin-cobalt alloy layer formed on the matt tin plating layer was confirmed to have an excellent whisker growth suppressing effect.

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US11/628,747 2004-06-21 2005-05-27 Tin-Based Plating Film and Method for Forming the Same Abandoned US20080050611A1 (en)

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JP2004-183078 2004-06-21
JP2004183078A JP2006009039A (ja) 2004-06-21 2004-06-21 ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
PCT/JP2005/009784 WO2005123987A1 (ja) 2004-06-21 2005-05-27 スズ系めっき皮膜及びその形成方法

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Cited By (7)

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US20080217916A1 (en) * 2005-09-02 2008-09-11 Shigeo Nagasaku Threaded joint for steel pipes
US20100206133A1 (en) * 2002-10-08 2010-08-19 Honeywell International Inc. Method of refining solder materials
US20140017410A1 (en) * 2010-12-27 2014-01-16 Council Of Scientific And Industrial Research Electroless plating process
US10072347B2 (en) 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating
US10260159B2 (en) 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
US10633754B2 (en) 2013-07-05 2020-04-28 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US20230002924A1 (en) * 2021-06-30 2023-01-05 Stmicroelectronics S.R.L. Method for inhibiting tin whisker growth

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WO2007142352A1 (ja) * 2006-06-09 2007-12-13 National University Corporation Kumamoto University めっき膜の形成方法および材料
KR100854505B1 (ko) 2007-02-23 2008-08-26 (주)해빛정보 텅스텐 코발트와 주석 코발트를 이용한 도금층 및도금방법
JP5401714B2 (ja) * 2007-12-27 2014-01-29 石原ケミカル株式会社 無電解メッキによるスズホイスカーの防止方法
EP2298960A1 (en) * 2009-08-24 2011-03-23 ATOTECH Deutschland GmbH Method for electroless plating of tin and tin alloys
DE102011101602A1 (de) 2011-05-13 2012-11-15 Enayati GmbH & Co. KG Oberflächen- und Anlagentechnik Einpresspin und Verfahren zu seiner Herstellung
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
CN102681218B (zh) * 2012-05-31 2014-05-28 中国电子科技集团公司第二十六研究所 使用合金材料的声光器件
CN103352240B (zh) * 2013-07-29 2015-12-09 厦门旺朋电子元件有限公司 Smd汽车电子元件的电镀锡工艺
CN103938191B (zh) * 2014-05-13 2016-06-01 山西宇达集团有限公司 青铜雕塑表面的富锡方法
KR20180066268A (ko) * 2014-12-15 2018-06-18 센주긴조쿠고교 가부시키가이샤 도금용 땜납 합금 및 전자부품
CN106676598B (zh) * 2016-12-13 2019-08-23 上海交通大学 一种基于微纳米针锥结构抑制锡晶须生长的方法
JP7121390B2 (ja) 2018-08-21 2022-08-18 ディップソール株式会社 すず合金電気めっき浴及びそれを用いためっき方法
WO2022158896A1 (ko) * 2021-01-21 2022-07-28 김미연 도금액용 첨가제 조성물

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JPH06196349A (ja) * 1992-12-24 1994-07-15 Kobe Steel Ltd タンタルコンデンサ用銅系リードフレーム材及びその製造方法
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
JP2003147580A (ja) * 2001-11-13 2003-05-21 Murata Mfg Co Ltd 金属端子、金属端子の製造方法および電子部品

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100206133A1 (en) * 2002-10-08 2010-08-19 Honeywell International Inc. Method of refining solder materials
US9666547B2 (en) 2002-10-08 2017-05-30 Honeywell International Inc. Method of refining solder materials
US20080217916A1 (en) * 2005-09-02 2008-09-11 Shigeo Nagasaku Threaded joint for steel pipes
US7740285B2 (en) * 2005-09-02 2010-06-22 Sumitomo Metal Industries, Ltd. Threaded joint for steel pipes
US20140017410A1 (en) * 2010-12-27 2014-01-16 Council Of Scientific And Industrial Research Electroless plating process
US10072347B2 (en) 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating
US10815581B2 (en) 2012-07-31 2020-10-27 The Boeing Company Systems and methods for tin antimony plating
US10260159B2 (en) 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
US10633754B2 (en) 2013-07-05 2020-04-28 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US11505874B2 (en) 2013-07-05 2022-11-22 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US20230002924A1 (en) * 2021-06-30 2023-01-05 Stmicroelectronics S.R.L. Method for inhibiting tin whisker growth

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EP1767672A1 (en) 2007-03-28
CN1969064A (zh) 2007-05-23
EP1767672A4 (en) 2007-10-03
JP2006009039A (ja) 2006-01-12
KR20070026832A (ko) 2007-03-08
TW200604387A (en) 2006-02-01

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