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US20080047695A1 - Cooling structure for electronics and machines - Google Patents

Cooling structure for electronics and machines Download PDF

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Publication number
US20080047695A1
US20080047695A1 US11/889,495 US88949507A US2008047695A1 US 20080047695 A1 US20080047695 A1 US 20080047695A1 US 88949507 A US88949507 A US 88949507A US 2008047695 A1 US2008047695 A1 US 2008047695A1
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US
United States
Prior art keywords
machines
electronics
fins
cooling
nanocarbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/889,495
Inventor
Jen-Too Hsieh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW95214984U external-priority patent/TWM308619U/en
Priority claimed from TW96203069U external-priority patent/TWM320290U/en
Application filed by Individual filed Critical Individual
Publication of US20080047695A1 publication Critical patent/US20080047695A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H10W40/25—

Definitions

  • the working electronics and machines could be an air-conditioner, a car, a computer, a LED, a CPU, or any electric equipment.
  • the known cooling structure is to provide a lot of cooling fins or grid thereon. As shown in FIG. 1 , for example, it is a traditional air-conditioner, which includes many cooling fins ( 1 ) to exhaust heat outward and then the cooling air can be blown indoor. The theory is to use the cooling fins to transfer heat to outward air efficiently.
  • FIGS. 4 and 5 a LED assembly are shown, wherein the LED ( 3 ) mounted on an IC board ( 5 ) is combined within a radiator ( 4 ) having many fins ( 1 ) thereon. The cooling effect is still poor.
  • FIG. 1 is a perspective view showing a portion of an air-conditioner with traditional cooling fins.
  • FIG. 2 is a perspective view showing an air-conditioner with the improved cooling structure according to the present invention.
  • FIG. 3 is a cross-sectional plan view showing the improved cooling structure according to the present invention.
  • FIG. 4 is a perspective view showing a conventional LED assembly.
  • FIG. 5 is a cross-sectional plan of FIG. 4 .
  • FIG. 6 is a perspective view showing a LED assembly covered with the cooling structure according to the present invention.
  • FIG. 7 is a cross-sectional plan of FIG. 6 .
  • FIG. 8 is a perspective view showing a brief conventional CPU assembly.
  • FIG. 9 is an embodiment of FIG. 8 after connected with the cooling structure of the present invention.
  • the present invention relates to an improved cooling structure for being uses in a working machine, such as an air-conditioner illustrated in this description, which includes a lot of cooling fins ( 1 ) thereon.
  • the character of the present invention mainly is to provide a nanocarbon layer ( 2 ), which is composed of many nanocarbon particles ( 21 ).
  • the nanocarbon particles ( 21 ) are covered on the cooling fins ( 2 ) by suitable flux and adherence, wherein tiny gaps are existed between the particles ( 21 ).
  • nanocarbon layer ( 2 ) some nanocarbon particles ( 21 ) contact the fins ( 1 ) directly.
  • the upper surface of the layer ( 2 ) will be terrific rough that obviously increases large surface area, in which a gram of nanocarbon can be extended to have a bet surface area about 1000 to 2000 square meters as usual.
  • the nanocarbon has a well character of heat transferring and diffusing.
  • the cooling fins ( 1 ) covered by nanocarbon layer ( 2 ) can exhaust heat outward more efficiently. In an experiment, it increases 30% in cooling effect. It will be understood that more nanocarbon particles used will promote the cooling effect accordingly.
  • FIGS. 6 and 7 are the embodiment of the LED assembly in FIGS. 4 and 5 , wherein the nanocarbon layer ( 2 ) is provided to cover the IC board ( 5 ), the radiator ( 4 ), and all fins ( 1 ).
  • the nanocarbon layer ( 2 ) is provided to cover the IC board ( 5 ), the radiator ( 4 ), and all fins ( 1 ).
  • a CPU ( 6 ) with connected radiator and fins ( 61 ) in a computer or any electrical equipment is capable of being covered by the nanocarbon layer ( 2 ) for increasing its cooling effect to keep all working electrical components in a normal situation without damage from high temperature.
  • nanocarbon particles used in the present invention are only exemplary and is not to limit the scope of this application.
  • Other material having a similar character of heat transferring and diffusing can be applied to reach the primary object of the present invention and will be also claimed in this application.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to an improved cooling structure for electronics and machines, which produce heat during working and have been provided with cooling fins or grid. A nanocarbon layer is covered on IC boards, CPUs, and the cooling fins or grids, that facilitates the cooling effect obviously because of increased surface area. Hence, the working electronics and machines can be cooled more conveniently and effectively and input energy will be also saved.

Description

  • This application claims priority based both on ROC Taiwan application number 095214984 filed on Aug. 24, 2006 and number 096203069 filed on Feb. 15, 2007.
    • BACKGROUND OF THE INVENTION
  • In most working electronics and machines, there are usually found that a radiator or a cooling apparatus must be provided to remove the heat produced by them and to keep the electronics and machines working normally without damage. The working electronics and machines could be an air-conditioner, a car, a computer, a LED, a CPU, or any electric equipment. The known cooling structure is to provide a lot of cooling fins or grid thereon. As shown in FIG. 1, for example, it is a traditional air-conditioner, which includes many cooling fins (1) to exhaust heat outward and then the cooling air can be blown indoor. The theory is to use the cooling fins to transfer heat to outward air efficiently. If we want to increase the cooling effect, it is necessary to increase the number of the fins or to change the shape of the fins for increasing the total surface area. But in the space of the working machine, it is still limited. The efficiency of the working machines is poor and energy lost will be high. In FIGS. 4 and 5, a LED assembly are shown, wherein the LED (3) mounted on an IC board (5) is combined within a radiator (4) having many fins (1) thereon. The cooling effect is still poor.
    • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide an improved cooling structure of working electronics and machines, which includes cooling fins covered with a layer of nanocarbon that promotes the cooling effect rapidly. Now, accompanying with the following drawings, the character of the present invention will be described here and after.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing a portion of an air-conditioner with traditional cooling fins.
  • FIG. 2 is a perspective view showing an air-conditioner with the improved cooling structure according to the present invention.
  • FIG. 3 is a cross-sectional plan view showing the improved cooling structure according to the present invention.
  • FIG. 4 is a perspective view showing a conventional LED assembly.
  • FIG. 5 is a cross-sectional plan of FIG. 4.
  • FIG. 6 is a perspective view showing a LED assembly covered with the cooling structure according to the present invention.
  • FIG. 7 is a cross-sectional plan of FIG. 6.
  • FIG. 8 is a perspective view showing a brief conventional CPU assembly.
  • FIG. 9 is an embodiment of FIG. 8 after connected with the cooling structure of the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 2 and 3, the present invention relates to an improved cooling structure for being uses in a working machine, such as an air-conditioner illustrated in this description, which includes a lot of cooling fins (1) thereon. The character of the present invention mainly is to provide a nanocarbon layer (2), which is composed of many nanocarbon particles (21). The nanocarbon particles (21) are covered on the cooling fins (2) by suitable flux and adherence, wherein tiny gaps are existed between the particles (21).
  • In the nanocarbon layer (2), some nanocarbon particles (21) contact the fins (1) directly. The upper surface of the layer (2) will be terrific rough that obviously increases large surface area, in which a gram of nanocarbon can be extended to have a bet surface area about 1000 to 2000 square meters as usual. Further, it is known that the nanocarbon has a well character of heat transferring and diffusing. Hence, the cooling fins (1) covered by nanocarbon layer (2) can exhaust heat outward more efficiently. In an experiment, it increases 30% in cooling effect. It will be understood that more nanocarbon particles used will promote the cooling effect accordingly.
  • Above all, the present invention can increase effective cooling purpose without adding the number of fins or changing the shape of them. It obtains utilization in saving huge energy. Under the same invented merit, it can be also applied in any other working machines, such as a radiator of electric equipment, cooling fins of cars or computes, to obtain a best cooling effect. For example, FIGS. 6 and 7 are the embodiment of the LED assembly in FIGS. 4 and 5, wherein the nanocarbon layer (2) is provided to cover the IC board (5), the radiator (4), and all fins (1). In FIGS. 8 and 9, it is another embodiment of the present invention, wherein a CPU (6) with connected radiator and fins (61) in a computer or any electrical equipment is capable of being covered by the nanocarbon layer (2) for increasing its cooling effect to keep all working electrical components in a normal situation without damage from high temperature.
  • Moreover, the nanocarbon particles used in the present invention are only exemplary and is not to limit the scope of this application. Other material having a similar character of heat transferring and diffusing can be applied to reach the primary object of the present invention and will be also claimed in this application.

Claims (4)

1. An improved cooling structure for electronics and machines provided with cooling fins or grid thereon, and the character is to provide a nanocarbon layer on the cooling fins or grid, in which the nanocarbon layer is composed of a lot of nanocarbon particles.
2. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon particles are covered on the cooling fins or grid with tiny gaps by flux and adherence.
3. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon layer is covered on an IC board, a radiator, and fins of a LED assembly.
4. The improved cooling structure for electronics and machines as claimed in claim 1, wherein the nanocarbon layer is covered on a CPU, its connected radiator, and fins of a computer.
US11/889,495 2006-08-24 2007-08-14 Cooling structure for electronics and machines Abandoned US20080047695A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW95214984U TWM308619U (en) 2006-08-24 2006-08-24 Improved structure of heat dissipation device
TW095214984 2006-08-24
TW096203069 2007-02-15
TW96203069U TWM320290U (en) 2007-02-15 2007-02-15 Heat-dissipation structure of LED lamp

Publications (1)

Publication Number Publication Date
US20080047695A1 true US20080047695A1 (en) 2008-02-28

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Application Number Title Priority Date Filing Date
US11/889,495 Abandoned US20080047695A1 (en) 2006-08-24 2007-08-14 Cooling structure for electronics and machines

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US20050008560A1 (en) * 2003-05-20 2005-01-13 Futaba Corporation Ultra-dispersed nanocarbon and method for preparing the same
US20050248924A1 (en) * 2004-05-10 2005-11-10 International Business Machines Corporation Thermal interface for electronic equipment
US20050270744A1 (en) * 2004-06-03 2005-12-08 International Business Machines Corporation Compliant thermal interface for electronic equipment
US20060091415A1 (en) * 2004-10-29 2006-05-04 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
US20060151153A1 (en) * 2005-01-07 2006-07-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
US7093650B2 (en) * 2003-09-01 2006-08-22 Usui Kokusai Sangyo Kaisha, Ltd. Heat conduction pipe externally covered with fin member
US20070280973A1 (en) * 2006-06-02 2007-12-06 Arno Schmuck Composite material and method of producing a composite material of this type
US7516804B2 (en) * 2006-07-31 2009-04-14 Us Synthetic Corporation Polycrystalline diamond element comprising ultra-dispersed diamond grain structures and applications utilizing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US20050008560A1 (en) * 2003-05-20 2005-01-13 Futaba Corporation Ultra-dispersed nanocarbon and method for preparing the same
US7093650B2 (en) * 2003-09-01 2006-08-22 Usui Kokusai Sangyo Kaisha, Ltd. Heat conduction pipe externally covered with fin member
US20050248924A1 (en) * 2004-05-10 2005-11-10 International Business Machines Corporation Thermal interface for electronic equipment
US20050270744A1 (en) * 2004-06-03 2005-12-08 International Business Machines Corporation Compliant thermal interface for electronic equipment
US20060091415A1 (en) * 2004-10-29 2006-05-04 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
US20060151153A1 (en) * 2005-01-07 2006-07-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
US20070280973A1 (en) * 2006-06-02 2007-12-06 Arno Schmuck Composite material and method of producing a composite material of this type
US7516804B2 (en) * 2006-07-31 2009-04-14 Us Synthetic Corporation Polycrystalline diamond element comprising ultra-dispersed diamond grain structures and applications utilizing same

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