[go: up one dir, main page]

US20070256813A1 - Direction-adjustable diffusive device - Google Patents

Direction-adjustable diffusive device Download PDF

Info

Publication number
US20070256813A1
US20070256813A1 US11/730,811 US73081107A US2007256813A1 US 20070256813 A1 US20070256813 A1 US 20070256813A1 US 73081107 A US73081107 A US 73081107A US 2007256813 A1 US2007256813 A1 US 2007256813A1
Authority
US
United States
Prior art keywords
wind
heat sink
cowling
rotating mechanism
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/730,811
Other languages
English (en)
Inventor
Ching Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMA Precision Inc
Original Assignee
AMA Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMA Precision Inc filed Critical AMA Precision Inc
Assigned to AMA PRECISION INC. reassignment AMA PRECISION INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HO, CHING
Publication of US20070256813A1 publication Critical patent/US20070256813A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H10W40/43—

Definitions

  • the present invention relates to a diffusive device applicable to adjust direction and more particularly, to a direction-adjustable diffusive device, which allows adjustment of the heat dissipation direction through 360° to fit the heat-emitting source.
  • the internal electronic devices of regular electronic products emit heat, either in a big or small amount, during their operation. These electronic devices may fail or even be damaged if emitted heat is not effectively dissipated.
  • the main heat source (heat-emitting source) is the central processing unit (CPU) mounted on the motherboard. Therefore, heat dissipation devices are commonly used in a computer to dissipate heat from its CPU.
  • a computer is equipped with a cooling fan and/or a heat-emitting fan for dissipating heat from the CPU.
  • the installation position is fixed subject to the design of the motherboard, i.e., the heat dissipation direction of the cooling fan and the heat sink is determined subject to the location of the CPU on the motherboard. Therefore, when a conventional cooling fan and a heat sink are installed in a computer motherboard, they provide a heat dissipation effect only in one particular direction. This design of fixed heat dissipation direction provides no flexibility in application.
  • the direction-adjustable diffusive device comprises a heat sink, and a cowling.
  • the heat sink has at least one rotating mechanism positioned outside of the heat sink.
  • the cowling has at least one another rotating mechanism correspondingly coupled to the rotating mechanism of the heat sink, and comprising a wind-guiding channel comprising a first wind-guiding hole facing the heat sink. Further, the cowling adjusts a heat dissipation direction of the heat sink by that the another rotating mechanism and the rotating mechanism relatively rotated to the heat sink.
  • the cowling can be turned about the heat sink through 360° to adjust the angular position with the other rotating mechanism, enabling the heat sink to dissipate heat.
  • the aforesaid heat sink may comprise a plurality of radiation fins that are parallel to each other.
  • the wind-guiding channel may have an inner space.
  • the wind-guiding channel may provide an inner space, and part of the radiation fins of the heat sink may locate in the inner space.
  • the wind-guiding channel may have a second wind-guiding hole, and the wind-guiding channel connects to the first wind-guiding hole and the second wind-guiding hole.
  • An electric fan may be mounted on the second wind-guiding hole of the cowling.
  • the electric fan may have an air input side and an air output side. The air output side of the electric fan may correspond to the second wind-guiding hole of the cowling.
  • the radiation fins of the heat sink can be plurality of circular radiation fins, or radiation fins of a variety of polygonal shapes.
  • the diffusive device may be mounted on a substrate that comprises a heat-emitting electronic device.
  • the heat-emitting electronic device may be mounted with an electric fan, which may have an air input side corresponding to the heat-emitting electronic device and an air output side corresponding to the second wind-guiding hole of the cowling.
  • the cowling may further comprise an extending pipe on the second wind-guiding hole, and the front end of the extending pipe is guided to the electric fan.
  • FIG. 1 is a schematic drawing showing the basic architecture of a direction-adjustable diffusive device according to the present invention.
  • FIG. 2 is an exploded view of a direction-adjustable diffusive device in accordance with a first embodiment of the present invention.
  • FIG. 3 is an elevational view showing an application example of the direction-adjustable diffusive device in accordance with the first embodiment of the present invention.
  • FIG. 4 is an elevational view showing another application example of the direction-adjustable diffusive device in accordance with the first embodiment of the present invention.
  • FIG. 5 is a perspective view of a direction-adjustable diffusive device in accordance with a second embodiment of the present invention.
  • FIG. 6 is an exploded view of a direction-adjustable diffusive device in accordance with a third embodiment of the present invention.
  • FIG. 1 illustrates the basic architecture of a direction-adjustable diffusive device according to the present invention.
  • the direction-adjustable diffusive device comprises a heat sink 10 , and a cowling 3 .
  • the heat sink 10 comprises at least one rotating mechanism 12 positioned on the outside of the heat sink 10 .
  • the cowling 3 comprises at least one rotating mechanism 331 pivotally coupled to the at least one rotating mechanism 12 of the heat sink 10 correspondingly.
  • the cowling 3 comprises a wind-guiding channel 33 .
  • the wind-guiding channel 33 has a first wind-guiding hole 32 facing the heat sink 10 .
  • the cowling 3 is turnable about the heat sink 10 by means of the rotating mechanism 331 , i.e., the cowling 3 can be turned through 360° to adjust the direction of the first wind-guiding hole 32 , thereby adjusting the heat dissipation direction of the heat sink 10 . Examples described below will illustrate more detail.
  • FIG. 2 is an exploded view of a direction-adjustable diffusive device in accordance with a first embodiment of the present invention
  • FIG. 3 is an applied view of the direction-adjustable diffusive device according to the first embodiment of the present invention.
  • This embodiment is based on the aforesaid basic architecture.
  • the reference sign 5 indicates a substrate.
  • the substrate 5 comprises two fixing devices 51 , and a heat-emitting electronic device 52 .
  • the substrate 5 is a motherboard; the heat-emitting electronic device 52 is a CPU (Central Processing Unit).
  • CPU Central Processing Unit
  • the direction-adjustable diffusive device in accordance with the first embodiment of the present invention is mounted on the substrate 5 , comprising a heat sink 10 and a cowling 3 .
  • the heat sink 10 comprises a plurality of radiation fins 2 and a rotating mechanism 12 positioned on the outside of the radiation fins 2 .
  • the radiation fins 2 are parallel to each other, and axially fixed on the rotating mechanism 12 respectively, and spaced from one another along the axial direction of the rotating mechanism 12 at a pitch t.
  • the radiation fins 2 each have a center through hole 21 .
  • the radiation fin 2 are configured a center through hole 21 respectively, and the rotating mechanism 12 is inserted through the center through hole 21 of each radiation fin 2 and fixedly fastened to each radiation fin 2 .
  • the rotating mechanism 12 is a cylindrical copper pivot shaft.
  • the radiation fins 2 of the heat sink 10 are circular radiation fins.
  • the heat sink 10 has a base frame 1 fixedly provided at the bottom side of the rotating mechanism 12 .
  • the base frame 1 comprises two fixing elements 11 corresponding to the fixing elements 51 of the substrate 5 respectively.
  • the fixing elements 11 of the heat sink 10 are through holes, and two screws 6 are respectively inserted through the through holes 11 respectively and threaded into the screw holes 51 of the substrate 5 to affix the heat sink 10 to the substrate 5 .
  • the cowling 3 comprises a second wind-guiding hole 31 , a first wind-guiding hole 32 , and a wind-guiding channel 33 connecting to the second wind-guiding hole 31 and the first wind-guiding hole 32 .
  • the first wind-guiding hole 32 faces the heat sink 10 .
  • the cowling 3 comprises another rotating mechanism 331 and an inner space 332 .
  • the rotating mechanism 331 of the cowling 3 is correspondingly coupled to the rotating mechanism 12 of the heat sink 10 , and part of the radiation fins 2 located in the inner space 332 of the cowling 3 .
  • the rotating mechanism 331 of the cowling 3 is a pivot bolt; an electric fan 4 is mounted on the second wind-guiding hole 31 of the cowling 3 with screws 61 .
  • the electric fan 4 has an air input side 41 and an air output side 42 .
  • the air output side 42 corresponds to the second wind-guiding hole 31 of the cowling 3 .
  • the first wind-guiding hole 32 of the cowling 3 faces the radiation fins 2 of the heat sink 10 correspondingly, and the cowling 3 can be rotated relatively to the heat sink 10 with the rotating mechanism 331 and the rotating mechanism 12 to adjust the heat dissipation direction of the heat sink 10 and to have the air input side 41 of the electric fan 4 correspond the heat-emitting electronic device 52 at the substrate 5 for heat dissipation.
  • FIG. 4 shows another application example of the direction-adjustable diffusive device according to the second embodiment of the present invention.
  • the cowling 3 can be turned relatively to the heat sink 10 with the rotating mechanism 12 to have the air input side 41 of the electric fan 4 correspond the heat-emitting electronic device 53 at the substrate 5 similarly.
  • the cowling 3 can be turned about the heat sink 10 according to the requirements, i.e., through 360° to adjust the direction of the cowling 3 , and dissipate the heat with the heat sink 10 . Therefore, no matter which location of the heat-emitting electronic device 52 or 53 at the substrate 5 is, the desired heat dissipation effect is achieved. Further, because the heat-emitting electronic devices 52 or 53 may be installed at any location, the heat sink 10 and the cowling 3 of the direction-adjustable diffusive device of the present invention can be arranged to fit different requirements.
  • FIG. 5 is an installed view of a direction-adjustable diffusive device in accordance with a third embodiment of the present invention.
  • the main structure shown in FIG. 5 is the similar to that of the aforesaid first and second embodiments, but the electric fan 72 is mounted on the heat-emitting electronic device 71 .
  • the electric fan 72 has an air input side 721 and an air output side 722 .
  • an extension pipe 74 is installed on the second wind-guiding hole 731 of the cowling 73 and the front end of the extension pipe 74 is guided to the electric fan 72 . Therefore, after adjustment of the angular position of the cowling 73 , the air output side 722 of the electric fan 72 corresponds the second wind-guiding hole 731 of the cowling 73 , and the air input side 721 of the electric fan 72 corresponds the heat-emitting electronic device 71 .
  • the aforesaid cowling 73 has the function of adjusting the angle about the heat sink of the direction-adjustable diffusive device. Therefore, even the electric fan 72 is mounted on the heat-emitting electronic device 71 , the goal of heat dissipation is achieved similarly, i.e., this second embodiment can still achieve the same effects as the aforesaid first embodiment of the present invention.
  • FIG. 6 is an exploded view of a direction-adjustable diffusive device in accordance with a third embodiment of the present invention.
  • This embodiment is substantially similar to the aforesaid embodiments with the exception of the polygonal shape design of the radiation fins 76 .
  • the radiation fins 76 have a hexagonal profile.
  • the radiation fins 76 can be made with a rectangular, pentagonal or heptagonal shape, or any of a variety of polygonal shapes.
  • each radiation fin 76 has two retaining holes 761 correspondingly to each other, and the base frame 752 of the heat sink 75 has two upright retaining rods 751 . Therefore, each radiation fin 76 can use the retaining holes 761 to mount on the upright retaining rods 751 of the base frame 752 of the heat sink 75 respectively.

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US11/730,811 2006-04-19 2007-04-04 Direction-adjustable diffusive device Abandoned US20070256813A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW095113949 2006-04-19
TW095113949A TWI304531B (en) 2006-04-19 2006-04-19 Adjustable direction heat diffusive structure

Publications (1)

Publication Number Publication Date
US20070256813A1 true US20070256813A1 (en) 2007-11-08

Family

ID=38660180

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/730,811 Abandoned US20070256813A1 (en) 2006-04-19 2007-04-04 Direction-adjustable diffusive device

Country Status (2)

Country Link
US (1) US20070256813A1 (zh)
TW (1) TWI304531B (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080041561A1 (en) * 2006-08-18 2008-02-21 Foxconn Technology Co., Ltd. Heat dissipation device
US20080316705A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fan mounted thereon
US20090159254A1 (en) * 2007-12-19 2009-06-25 Tyco Electronics Corporation Heat sink assembly and method of fabricating
US20100101757A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100172089A1 (en) * 2009-01-08 2010-07-08 Asustek Computer Inc. Heat dissipation module and electronic device having the same
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US20110100600A1 (en) * 2009-11-05 2011-05-05 Hon Fu Jin Precision Industry(Shenzhen) Co., Ltd. Heat dissipation device
US20130138262A1 (en) * 2011-11-28 2013-05-30 International Business Machines Corporation Heat sink with orientable fins
US20130251392A1 (en) * 2012-03-21 2013-09-26 Ricoh Company, Ltd. Cooling device and image forming apparatus including same
US20140104770A1 (en) * 2012-10-11 2014-04-17 Asustek Computer Inc. Heat dissipating structure
US8873236B1 (en) * 2011-10-07 2014-10-28 Qlogic, Corporation Electronic devices having cooling module with direction-configurable airflow

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7753107B2 (en) * 2006-08-18 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080041561A1 (en) * 2006-08-18 2008-02-21 Foxconn Technology Co., Ltd. Heat dissipation device
US20080316705A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fan mounted thereon
US7646604B2 (en) * 2007-06-22 2010-01-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan mounted thereon
US20090159254A1 (en) * 2007-12-19 2009-06-25 Tyco Electronics Corporation Heat sink assembly and method of fabricating
US20100101757A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8061411B2 (en) * 2008-10-24 2011-11-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8254127B2 (en) * 2009-01-08 2012-08-28 Asustek Computer Inc. Heat dissipation module and electronic device having the same
US20100172089A1 (en) * 2009-01-08 2010-07-08 Asustek Computer Inc. Heat dissipation module and electronic device having the same
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
US20110100600A1 (en) * 2009-11-05 2011-05-05 Hon Fu Jin Precision Industry(Shenzhen) Co., Ltd. Heat dissipation device
US8322405B2 (en) * 2009-11-05 2012-12-04 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with pivotable fan
US8873236B1 (en) * 2011-10-07 2014-10-28 Qlogic, Corporation Electronic devices having cooling module with direction-configurable airflow
US20130138262A1 (en) * 2011-11-28 2013-05-30 International Business Machines Corporation Heat sink with orientable fins
US9507391B2 (en) * 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
US20130251392A1 (en) * 2012-03-21 2013-09-26 Ricoh Company, Ltd. Cooling device and image forming apparatus including same
US9042766B2 (en) * 2012-03-21 2015-05-26 Ricoh Company, Ltd. Cooling device and image forming apparatus including same
US20140104770A1 (en) * 2012-10-11 2014-04-17 Asustek Computer Inc. Heat dissipating structure

Also Published As

Publication number Publication date
TW200741425A (en) 2007-11-01
TWI304531B (en) 2008-12-21

Similar Documents

Publication Publication Date Title
US20070256813A1 (en) Direction-adjustable diffusive device
US8322405B2 (en) Heat dissipation device with pivotable fan
US7885072B2 (en) Fixing device for heat sink
US7990700B2 (en) Electronic device enclosure
US7136286B2 (en) Industrial computer with aluminum case having fins as radiating device
US20030189815A1 (en) Chipset cooling device of video graphic adapter card
US8184434B2 (en) Video/audio computer display processor
US7729119B2 (en) Heat dissipation device
CN201601122U (zh) 散热装置
CN102022356B (zh) 风扇装置
US7447027B2 (en) Hybrid heat dissipation device
CN2756880Y (zh) 风扇固定装置
US20070009356A1 (en) Fan holder assembly
US7944688B2 (en) Heat dissipating structure including a position-adjusting unit
US20070121080A1 (en) Adjusting device for an integration rod in a projection apparatus
CN101616573B (zh) 散热装置
US7101149B2 (en) Axial fan for computer
US8978739B2 (en) Heat dissipating device
US20140177167A1 (en) Heat dissipation device
US7423873B2 (en) Heat dissipation device having fan holder for attachment of a fan
CN101820736A (zh) 散热装置及其支架
TWI362584B (en) Heat dissipating device
US20220299176A1 (en) Adjustable recessed lighting apparatus
CN101059713A (zh) 可调整方向的散热装置
JP2021190388A (ja) 照明装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: AMA PRECISION INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HO, CHING;REEL/FRAME:019200/0224

Effective date: 20070313

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION