US20060093511A1 - Reflective alloy film - Google Patents
Reflective alloy film Download PDFInfo
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- US20060093511A1 US20060093511A1 US10/980,680 US98068004A US2006093511A1 US 20060093511 A1 US20060093511 A1 US 20060093511A1 US 98068004 A US98068004 A US 98068004A US 2006093511 A1 US2006093511 A1 US 2006093511A1
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- reflective
- alloy film
- silver
- film
- reflectivity
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 47
- 239000000956 alloy Substances 0.000 title claims abstract description 47
- 229910052709 silver Inorganic materials 0.000 claims abstract description 26
- 239000004332 silver Substances 0.000 claims abstract description 26
- 238000005728 strengthening Methods 0.000 claims abstract description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 13
- 229910052697 platinum Inorganic materials 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052706 scandium Inorganic materials 0.000 claims description 6
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 abstract description 31
- 230000007797 corrosion Effects 0.000 abstract description 20
- 238000005260 corrosion Methods 0.000 abstract description 20
- 238000003860 storage Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 24
- 229910001316 Ag alloy Inorganic materials 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 230000009467 reduction Effects 0.000 description 7
- 229910052779 Neodymium Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002524 electron diffraction data Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0808—Mirrors having a single reflecting layer
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/258—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers
- G11B7/259—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers based on silver
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/258—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers
Definitions
- the invention relates to a reflective alloy film, more particularly to a reflective alloy film having high strength, high corrosion resistance, and high reflectivity.
- a metal film has been widely applied in various electronic products to enhance or improve original properties of a substrate and to meet specific requirements of the products. Since silver has high reflectivity, a film made of pure silver can meet the general requirement of mirror-like reflection for a metal film. Therefore, silver is a primary material used in the manufacture of a reflective film.
- the film is usually formed on a substrate by vapor depositing silver on the substrate so as to reduce the thickness of the silver film and thus the amount of silver.
- the reduction in the thickness of the silver film formed by vapor deposition decreases the strength and the corrosion resistance of the film, which causes the film to oxidize and to deform in an atmospheric environment, especially at an elevated temperature or in a humid condition.
- the reflective film with high strength, high corrosion resistance, and high reflectivity.
- the object of the present invention is to provide a reflective alloy film having high strength, high corrosion resistance, and high reflectivity.
- the reflective alloy film according to this invention includes 0.01-2.0 at % of at least one strengthening element, 0.01-2.0 at % of at least one anti-corrosive element, 0.01-3.0 at % of at least one reflective element, and a balance amount of silver.
- the total atomic percentage of the strengthening element, the anti-corrosive element, and the reflective element is less than 5.0.
- the strengthening element decreases the grain size of the alloy film so as to increase the mechanical strength of the film.
- the anti-corrosive element can form a dense oxide film on the alloy film so as to protect the alloy film from corrosion.
- the reflective element enlarges area of a solid solution of the alloy film so as to prevent formation of precipitates and to result in high reflectivity.
- FIG. 1 is a transmission electron microscopic photograph of a preferred embodiment of the reflective alloy film according to this invention illustrating a microscopic structure of the alloy film containing 0.5 at % titanium, 0.05 at % indium and 0.5 at % copper;
- FIG. 2 is a transmission electron microscopic photograph of a comparative film illustrating a microscopic structure of the film made of pure silver.
- the preferred embodiment of the reflective alloy film according to this invention contains at least one strengthening element, at least one anti-corrosive element, at least one reflective element, and silver.
- the reflectivity of the silver alloy is influenced by the existence of a second phase element.
- at least one of the highly reflective elements which is selected from the group consisting of palladium, copper and platinum, is added to silver under the condition that reflectivity of the silver alloy does not decrease significantly.
- the reflective element such as palladium, copper, or platinum
- the reflective element has a face-centered cubic structure, like silver, it is compatible with silver, and thus can enlarge the single phase area of the silver alloy phase diagram. As a result, precipitation can be avoided, and the scattering phenomenon and the reduction of reflectivity due to the precipitates can be minimized.
- Table 1 although the addition of the reflective element reduces the reflectivity of silver, the reflectivity reduction is not significant.
- the amount of the reflective element ranges from 0.01 at % to 3.0 at %. If the amount of the reflective element is above 3.0 at %, the reflectivity of the alloy film will decrease significantly as the amount of the reflective element is increased. TABLE 1 Reflectivity 200 nm thickness, reflectivity(%) Composition of film at 650 nm wavelength Ag 98 Ag—2.0at % Pd 98 Ag—2.0at % Cu 97 Ag—2.0at % Pt 96
- the anti-corrosive element can form a dense oxide film on the alloy film so as to enhance the corrosion resistance of the alloy film.
- the anti-corrosive element is preferably scandium, beryllium, aluminum, titanium, chromium, zinc, nickel, or mixtures thereof. Since the anti-corrosive element has a high reactivity with oxygen, the anti-corrosive element added to the alloy film will migrate to the surface of the alloy film so as to form a dense anti-corrosive oxide film thereon.
- the amount of the anti-corrosive element ranges from 0.01 at % to 2.0 at %. If the amount of the anti-corrosive element is above 2.0 at %, the reflectivity of the alloy film may be adversely affected thereby.
- the principle of solid solution strengthening mechanism is applied in the present invention.
- the strengthening element is selected from barium, scandium, silicon, titanium, indium, germanium, zinc, bismuth, and mixtures thereof.
- the atomic radiuses of these strengthening elements all have 5% or higher difference from the atomic radius of pure silver.
- the dislocation migration in the atomic lattice of these alloys is reduced by elastic strain of the atomic lattice. Therefore, the grain size is reduced, and the strength of the alloy film is increased.
- the amount of the strengthening element is controlled to be in a range from 0.01 at % to 2.0 at %.
- examples of this invention and comparative examples are compared in terms of reflectivity, relative mechanical strength, and relative corrosion resistance.
- the comparative examples include a film of pure silver, a silver alloy film containing 2 at % copper, a silver alloy film containing 2 at % platinum, and a silver alloy film containing 1 at % neodymium.
- the examples of this invention include a silver alloy film containing 0.5 at % germanium, 0.5 at % nickel, and 1.0 at % platinum (referred as Example 1 hereinafter), and a silver alloy film containing 0.5 at % titanium, 0.05 at % indium, and 0.5 at % copper (referred as Example 2 hereinafter).
- the relative mechanical strength is determined on a basis of grain size of a sputtered film. Since the mechanical strength is inversely proportional to the square root of the grain size, the smaller the grain size, the higher will be the relative mechanical strength. Four numbers from 1 to 4 are used to evaluate the mechanical strength. The smaller the number, the lower is the relative mechanical strength.
- the relative corrosion resistance is determined on a basis of the duration of delaying an abrupt reduction of the reflectivity at constant temperature under constant relative humidity. The longer the duration, the better is the corrosion resistance.
- the relative corrosion resistance is evaluated using numbers from 1 to 4. The smaller the number, the worse is the corrosion resistance.
- Examples 1 and 2 have significantly improved properties in connection with mechanical strength and corrosion resistance while attaining a reflectivity above 95%.
- the alloy film of Example 1 has a reflectivity of 96%, which is comparable to that of the comparative alloy film containing 2 at % platinum.
- germanium used as the strengthening element
- nickel used as the anti-corrosive element
- the alloy film of Example 1 has a reflectivity superior to that of the comparative example containing 2 at % neodymium.
- the alloy film of Example 2 has a reflectivity of 97%, and has the mechanical strength and the corrosion resistance superior to those of the comparative alloy film containing 2 at % copper, which has a reflectivity identical to that of Example 2.
- the alloy film of this invention possesses high strength, high corrosion resistance, and high reflectivity. Therefore, the alloy film of this invention is useful as a reflective film for various electronic products, such as flat panel displays and optical storage media.
- FIGS. 1 and 2 show transmission electron microscopic photographs of the alloy film of Example 2 and the comparative film made of pure silver.
- the alloy film of Example 2 has a grain size less than 10 nm, and the grains thereof are distributed densely. Therefore, as compared to the silver film shown in FIG. 2 , which has a grain size of about 100 nm, the grain size of the alloy film of Example 2 is reduced significantly, which in turn demonstrates that the mechanical strength of the alloy film of Example 2 is superior to that of the comparative silver film. It was further confirmed by electron diffraction pattern that the atomic structure of the alloy film of Example 2 is a single phase face-centered cubic structure.
- the alloy film of this invention when the alloy film of this invention is made in a thickness of 100 nm, it not only has a reflectivity of 97% at a wavelength of 650 nm, which is comparable to that of silver film (98%), but also passed a corrosion resistance test at a temperature of 80° C. in a relative humidity of 85% (The duration till the reduction in the reflectivity is over 100 hrs). Therefore, the alloy film can be used as a full-reflective layer of a high-speed write-once DVD disk.
- the alloy film of this invention When the alloy film of this invention is made in a thickness less than 20 nm, it still has a reflectivity above 25%, while passing the corrosion resistance test at a temperature of 80° C. in a relative humidity of 85% (The duration till the reduction in the reflectivity is longer than 96 hrs). Therefore, the alloy film can be used as a semi-reflective layer of a double-layer read-only recording medium or a double-layer write-once recording medium, or as a reflective layer of a reflective/semi-reflective flat panel display.
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optical Elements Other Than Lenses (AREA)
- Physical Vapour Deposition (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
A reflective alloy film having high strength, high corrosion resistance, and high reflectivity includes 0.01-2.0 at % of at least one strengthening element, 0.01-2.0 at % of at least one anti-corrosive element, 0.01-3.0 at % of at least one reflective element, and a balance amount of silver. The total atomic percentage of the strengthening element, the anti-corrosive element, and the reflective element is less than 5.0. The reflective alloy film is useful as a reflective layer or a semi-reflective layer for various electronic devices, such as flat panel displays and optical storage media.
Description
- 1. Field of the Invention
- The invention relates to a reflective alloy film, more particularly to a reflective alloy film having high strength, high corrosion resistance, and high reflectivity.
- 2. Description of the Related Art
- A metal film has been widely applied in various electronic products to enhance or improve original properties of a substrate and to meet specific requirements of the products. Since silver has high reflectivity, a film made of pure silver can meet the general requirement of mirror-like reflection for a metal film. Therefore, silver is a primary material used in the manufacture of a reflective film.
- In order to reduce the manufacturing cost by minimizing the amount of silver used in the film or to provide the film with desirable transmittance or reflectivity, the film is usually formed on a substrate by vapor depositing silver on the substrate so as to reduce the thickness of the silver film and thus the amount of silver. However, the reduction in the thickness of the silver film formed by vapor deposition decreases the strength and the corrosion resistance of the film, which causes the film to oxidize and to deform in an atmospheric environment, especially at an elevated temperature or in a humid condition.
- Therefore, various silver alloys, each of which contains selective additives, have been developed to improve the properties of the silver film.
- Various silver alloys containing palladium, copper, tin, indium, gallium, or zinc therein can enhance strength and hardness while having a high compatibility with ceramic substrate (see, for example, the “Noble Metal” section in “Metals Handbook” published by American Society for Metals).
- Various silver alloys with selectively added copper, neodymium, tin, platinum, palladium, or zinc therein can achieve corrosion resistance, and retard the undesirable oxidation. (see, for example, Japanese Patent Nos. 2000-395894, 2002-15464 and 2003-160827, and Taiwanese Patent Nos. 514,909 and 531,562).
- Various silver alloys with selectively added platinum, palladium, copper or gold therein can minimize the reduction of reflectivity. Since such silver alloys have a reflectivity substantially identical to that of pure silver, they can be used in applications such as CD-R, writable DVD disk, and the like (see, for example, U.S. Pat. Nos. 5,948,497 and 6,007,889).
- Nevertheless, in view of the development of high storage capacity and high reading and/or writing speeds for electronic products, it is desirable to provide the reflective film with high strength, high corrosion resistance, and high reflectivity.
- The object of the present invention is to provide a reflective alloy film having high strength, high corrosion resistance, and high reflectivity.
- The reflective alloy film according to this invention includes 0.01-2.0 at % of at least one strengthening element, 0.01-2.0 at % of at least one anti-corrosive element, 0.01-3.0 at % of at least one reflective element, and a balance amount of silver. The total atomic percentage of the strengthening element, the anti-corrosive element, and the reflective element is less than 5.0.
- The strengthening element decreases the grain size of the alloy film so as to increase the mechanical strength of the film. The anti-corrosive element can form a dense oxide film on the alloy film so as to protect the alloy film from corrosion. The reflective element enlarges area of a solid solution of the alloy film so as to prevent formation of precipitates and to result in high reflectivity.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
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FIG. 1 is a transmission electron microscopic photograph of a preferred embodiment of the reflective alloy film according to this invention illustrating a microscopic structure of the alloy film containing 0.5 at % titanium, 0.05 at % indium and 0.5 at % copper; and -
FIG. 2 is a transmission electron microscopic photograph of a comparative film illustrating a microscopic structure of the film made of pure silver. - The preferred embodiment of the reflective alloy film according to this invention contains at least one strengthening element, at least one anti-corrosive element, at least one reflective element, and silver.
- The reflectivity of the silver alloy is influenced by the existence of a second phase element. In the present invention, at least one of the highly reflective elements, which is selected from the group consisting of palladium, copper and platinum, is added to silver under the condition that reflectivity of the silver alloy does not decrease significantly. Since the reflective element, such as palladium, copper, or platinum, has a face-centered cubic structure, like silver, it is compatible with silver, and thus can enlarge the single phase area of the silver alloy phase diagram. As a result, precipitation can be avoided, and the scattering phenomenon and the reduction of reflectivity due to the precipitates can be minimized. As shown in Table 1, although the addition of the reflective element reduces the reflectivity of silver, the reflectivity reduction is not significant. Preferably, the amount of the reflective element ranges from 0.01 at % to 3.0 at %. If the amount of the reflective element is above 3.0 at %, the reflectivity of the alloy film will decrease significantly as the amount of the reflective element is increased.
TABLE 1 Reflectivity 200 nm thickness, reflectivity(%) Composition of film at 650 nm wavelength Ag 98 Ag—2.0at % Pd 98 Ag—2.0at % Cu 97 Ag—2.0at % Pt 96 - The anti-corrosive element can form a dense oxide film on the alloy film so as to enhance the corrosion resistance of the alloy film. As shown in Table 2, the anti-corrosive element is preferably scandium, beryllium, aluminum, titanium, chromium, zinc, nickel, or mixtures thereof. Since the anti-corrosive element has a high reactivity with oxygen, the anti-corrosive element added to the alloy film will migrate to the surface of the alloy film so as to form a dense anti-corrosive oxide film thereon. Preferably, the amount of the anti-corrosive element ranges from 0.01 at % to 2.0 at %. If the amount of the anti-corrosive element is above 2.0 at %, the reflectivity of the alloy film may be adversely affected thereby.
TABLE 2 Anti-corrosive element Anti-corrosive Oxidation free energy (kJ/mole element oxygen) at 127° C. Scandium(Sc) −596 Beryllium(Be) −570 Aluminum(Al) −511 Titanium(Ti) −468 Chromium(Cr) −342 Zinc(Zn) −310 Nickel(Ni) −202 - In order to strengthen the film and to maintain a single phase microstructure of the silver alloy, the principle of solid solution strengthening mechanism is applied in the present invention. As shown in Table 3, the strengthening element is selected from barium, scandium, silicon, titanium, indium, germanium, zinc, bismuth, and mixtures thereof. The atomic radiuses of these strengthening elements all have 5% or higher difference from the atomic radius of pure silver. The dislocation migration in the atomic lattice of these alloys is reduced by elastic strain of the atomic lattice. Therefore, the grain size is reduced, and the strength of the alloy film is increased. Preferably, the amount of the strengthening element is controlled to be in a range from 0.01 at % to 2.0 at %.
TABLE 3 Strengthening element Radius difference as compared to silver Barium(Ba) 59% Scandium(Sc) 19% Silicon(Si) 17% Titanium(Ti) 14% Indium(In) 14% Germanium(Ge) 13% Zinc(Zn) 13% Bismuth(Bi) 7% - In Table 4, examples of this invention and comparative examples are compared in terms of reflectivity, relative mechanical strength, and relative corrosion resistance. The comparative examples include a film of pure silver, a silver alloy film containing 2 at % copper, a silver alloy film containing 2 at % platinum, and a silver alloy film containing 1 at % neodymium. The examples of this invention include a silver alloy film containing 0.5 at % germanium, 0.5 at % nickel, and 1.0 at % platinum (referred as Example 1 hereinafter), and a silver alloy film containing 0.5 at % titanium, 0.05 at % indium, and 0.5 at % copper (referred as Example 2 hereinafter).
- The relative mechanical strength is determined on a basis of grain size of a sputtered film. Since the mechanical strength is inversely proportional to the square root of the grain size, the smaller the grain size, the higher will be the relative mechanical strength. Four numbers from 1 to 4 are used to evaluate the mechanical strength. The smaller the number, the lower is the relative mechanical strength.
- The relative corrosion resistance is determined on a basis of the duration of delaying an abrupt reduction of the reflectivity at constant temperature under constant relative humidity. The longer the duration, the better is the corrosion resistance. The relative corrosion resistance is evaluated using numbers from 1 to 4. The smaller the number, the worse is the corrosion resistance.
TABLE 4 comparison of properties between the examples of this invention and the comparative examples Relative Relative Reflectivity mechanical corrosion Composition at 650 nm strength resistance Comparative Ag 98% 1 1 Ag—2at%Cu 97% 2 2 Ag—2at%Pt 96% 3 4 Ag—1at%Nd 90% 4 3 Examples Example 1 96% 3.5 4 (Ag—0.5at% Ge—0.5at%Ni— 1.0at%Pt) Example 2 97% 3 3.5 (Ag—0.5at% Ti—0.05at%In— 0.5at%Cu) - As shown in Table 4, generally, Examples 1 and 2 have significantly improved properties in connection with mechanical strength and corrosion resistance while attaining a reflectivity above 95%.
- The alloy film of Example 1 has a reflectivity of 96%, which is comparable to that of the comparative alloy film containing 2 at % platinum. However, the addition of germanium (used as the strengthening element) and nickel (used as the anti-corrosive element) improves the mechanical strength and the corrosion resistance of the alloy film of Example 1 over the comparative example. Furthermore, the alloy film of Example 1 has a reflectivity superior to that of the comparative example containing 2 at % neodymium.
- The alloy film of Example 2 has a reflectivity of 97%, and has the mechanical strength and the corrosion resistance superior to those of the comparative alloy film containing 2 at % copper, which has a reflectivity identical to that of Example 2.
- In view of the results shown in Table 4, the alloy film of this invention possesses high strength, high corrosion resistance, and high reflectivity. Therefore, the alloy film of this invention is useful as a reflective film for various electronic products, such as flat panel displays and optical storage media.
-
FIGS. 1 and 2 show transmission electron microscopic photographs of the alloy film of Example 2 and the comparative film made of pure silver. The alloy film of Example 2 has a grain size less than 10 nm, and the grains thereof are distributed densely. Therefore, as compared to the silver film shown inFIG. 2 , which has a grain size of about 100 nm, the grain size of the alloy film of Example 2 is reduced significantly, which in turn demonstrates that the mechanical strength of the alloy film of Example 2 is superior to that of the comparative silver film. It was further confirmed by electron diffraction pattern that the atomic structure of the alloy film of Example 2 is a single phase face-centered cubic structure. - In fact, when the alloy film of this invention is made in a thickness of 100 nm, it not only has a reflectivity of 97% at a wavelength of 650 nm, which is comparable to that of silver film (98%), but also passed a corrosion resistance test at a temperature of 80° C. in a relative humidity of 85% (The duration till the reduction in the reflectivity is over 100 hrs). Therefore, the alloy film can be used as a full-reflective layer of a high-speed write-once DVD disk.
- When the alloy film of this invention is made in a thickness less than 20 nm, it still has a reflectivity above 25%, while passing the corrosion resistance test at a temperature of 80° C. in a relative humidity of 85% (The duration till the reduction in the reflectivity is longer than 96 hrs). Therefore, the alloy film can be used as a semi-reflective layer of a double-layer read-only recording medium or a double-layer write-once recording medium, or as a reflective layer of a reflective/semi-reflective flat panel display.
- While the present invention has been described in connection with what is considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (8)
1. A reflective alloy film comprising:
0.01-2.0 at % of at least one strengthening element;
0.01-2.0 at % of at least one anti-corrosive element;
0.01-3.0 at % of at least one reflective element; and
a balance amount of silver,
the total atomic percentage of said strengthening element, said anti-corrosive element, and said reflective element being less than 5.0.
2. The reflective alloy film as claimed in claim 1 , wherein said strengthening element is selected from the group consisting of barium, scandium, silicon, titanium, indium, germanium, zinc, and bismuth.
3. The reflective alloy film as claimed in claim 1 , wherein said anti-corrosive element is selected from the group consisting of scandium, beryllium, aluminum, titanium, chromium, zinc, and nickel.
4. The reflective alloy film as claimed in claim 1 , wherein said reflective element is selected from the group consisting of palladium, copper, and platinum.
5. The reflective alloy film as claimed in claim 1 , wherein said strengthening element is germanium, said anti-corrosive element is nickel, and said reflective element is platinum.
6. The reflective alloy film as claimed in claim 5 , comprising 0.5 at % of said germanium, 0.5 at % of said nickel, and 1.0 at % of said platinum.
7. The reflective alloy film as claimed in claim 1 , wherein said strengthening element is indium, said anti-corrosive element is titanium, and said reflective element is copper.
8. The reflective alloy film as claimed in claim 7 , comprising 0.05 at % of said indium, 0.5 at % of said titanium, and 0.5 at % of said copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/980,680 US20060093511A1 (en) | 2004-11-03 | 2004-11-03 | Reflective alloy film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/980,680 US20060093511A1 (en) | 2004-11-03 | 2004-11-03 | Reflective alloy film |
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| Publication Number | Publication Date |
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| US20060093511A1 true US20060093511A1 (en) | 2006-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/980,680 Abandoned US20060093511A1 (en) | 2004-11-03 | 2004-11-03 | Reflective alloy film |
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| US (1) | US20060093511A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060223004A1 (en) * | 2005-03-31 | 2006-10-05 | Tsukasa Nakai | Storage medium, reproducing method, and recording method |
| EP2618187A3 (en) * | 2012-01-18 | 2014-08-13 | Seiko Epson Corporation | Interference filter, optical module, and electronic apparatus |
| JP2015028211A (en) * | 2013-06-26 | 2015-02-12 | 株式会社神戸製鋼所 | Ag ALLOY FILM FOR REFLECTION COATING OR WIRING ELECTRODE, REFLECTION COATING OR WIRING ELECTRODE AND Ag ALLOY SPUTTERING TARGET FOR REFLECTION COATING OR WIRING ELECTRODE |
| IT201900000773A1 (en) * | 2019-01-18 | 2020-07-18 | Aurum S R L | PERFECTED SILVER ALLOY |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948497A (en) * | 1992-10-19 | 1999-09-07 | Eastman Kodak Company | High stability silver based alloy reflectors for use in a writable compact disk |
| US6007889A (en) * | 1998-06-22 | 1999-12-28 | Target Technology, Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US6544616B2 (en) * | 2000-07-21 | 2003-04-08 | Target Technology Company, Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US20040005432A1 (en) * | 2002-07-08 | 2004-01-08 | Ridout James W. | Reflective or semi-reflective metal alloy coatings |
| US7018696B2 (en) * | 2003-04-18 | 2006-03-28 | Target Technology Company Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US20070110968A1 (en) * | 2003-09-26 | 2007-05-17 | Furuya Metal Co., Ltd. | Silver alloy, sputtering target material thereof, and thin film thereof |
-
2004
- 2004-11-03 US US10/980,680 patent/US20060093511A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948497A (en) * | 1992-10-19 | 1999-09-07 | Eastman Kodak Company | High stability silver based alloy reflectors for use in a writable compact disk |
| US6007889A (en) * | 1998-06-22 | 1999-12-28 | Target Technology, Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US6544616B2 (en) * | 2000-07-21 | 2003-04-08 | Target Technology Company, Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US20040005432A1 (en) * | 2002-07-08 | 2004-01-08 | Ridout James W. | Reflective or semi-reflective metal alloy coatings |
| US7018696B2 (en) * | 2003-04-18 | 2006-03-28 | Target Technology Company Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| US20070110968A1 (en) * | 2003-09-26 | 2007-05-17 | Furuya Metal Co., Ltd. | Silver alloy, sputtering target material thereof, and thin film thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060223004A1 (en) * | 2005-03-31 | 2006-10-05 | Tsukasa Nakai | Storage medium, reproducing method, and recording method |
| US8232042B2 (en) * | 2005-03-31 | 2012-07-31 | Kabushiki Kaisha Toshiba | Storage medium, reproducing method, and recording method |
| EP2618187A3 (en) * | 2012-01-18 | 2014-08-13 | Seiko Epson Corporation | Interference filter, optical module, and electronic apparatus |
| US9322966B2 (en) | 2012-01-18 | 2016-04-26 | Seiko Epson Corporation | Interference filter having Ag—Bi—Nd alloy film |
| JP2015028211A (en) * | 2013-06-26 | 2015-02-12 | 株式会社神戸製鋼所 | Ag ALLOY FILM FOR REFLECTION COATING OR WIRING ELECTRODE, REFLECTION COATING OR WIRING ELECTRODE AND Ag ALLOY SPUTTERING TARGET FOR REFLECTION COATING OR WIRING ELECTRODE |
| IT201900000773A1 (en) * | 2019-01-18 | 2020-07-18 | Aurum S R L | PERFECTED SILVER ALLOY |
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