US20060088437A1 - Copper based precipitation hardening alloy - Google Patents
Copper based precipitation hardening alloy Download PDFInfo
- Publication number
- US20060088437A1 US20060088437A1 US10/971,931 US97193104A US2006088437A1 US 20060088437 A1 US20060088437 A1 US 20060088437A1 US 97193104 A US97193104 A US 97193104A US 2006088437 A1 US2006088437 A1 US 2006088437A1
- Authority
- US
- United States
- Prior art keywords
- copper
- alloy
- precipitation hardenable
- based precipitation
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000010949 copper Substances 0.000 title claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 68
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 56
- 239000000956 alloy Substances 0.000 title claims abstract description 56
- 238000004881 precipitation hardening Methods 0.000 title 1
- 238000001556 precipitation Methods 0.000 claims abstract description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011574 phosphorus Substances 0.000 claims abstract description 25
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 25
- 239000011651 chromium Substances 0.000 claims abstract description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 20
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010936 titanium Substances 0.000 claims abstract description 13
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 13
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 12
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 claims description 8
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 claims description 7
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 claims description 6
- QZLJNVMRJXHARQ-UHFFFAOYSA-N [Zr].[Cr].[Cu] Chemical compound [Zr].[Cr].[Cu] QZLJNVMRJXHARQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 4
- 239000000788 chromium alloy Substances 0.000 claims description 3
- 229910001093 Zr alloy Inorganic materials 0.000 claims 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims 2
- 238000005275 alloying Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 238000007792 addition Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- ZTPQLYJGPLYBPS-UHFFFAOYSA-N phosphanylidynechromium Chemical compound [Cr]#P ZTPQLYJGPLYBPS-UHFFFAOYSA-N 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- VQYKQHDWCVUGBB-UHFFFAOYSA-N phosphanylidynezirconium Chemical compound [Zr]#P VQYKQHDWCVUGBB-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- IDDKUWZJZGIPGE-UHFFFAOYSA-N [Cu].[P].[Zr] Chemical class [Cu].[P].[Zr] IDDKUWZJZGIPGE-UHFFFAOYSA-N 0.000 description 1
- QYNKMDUDPAXRPR-UHFFFAOYSA-N [P].[Cr].[Cu] Chemical compound [P].[Cr].[Cu] QYNKMDUDPAXRPR-UHFFFAOYSA-N 0.000 description 1
- BYBLBYLTFKFCPU-UHFFFAOYSA-N [P].[Zr].[Cr].[Cu] Chemical compound [P].[Zr].[Cr].[Cu] BYBLBYLTFKFCPU-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Definitions
- This invention relates to at least one copper based precipitation hardenable alloy in which high strength mechanical properties and an anneal resistance are improved.
- the JP patent publication 06-212,374 describes a method for manufacturing a copper based precipitation hardenable alloy to be used as material of small electric and electronic components.
- the alloy contains by weight 2 to 4% nickel, 0.5 to 1.0% silicon, 0.1 to 1.0% zinc, 0.001 to 0.15% aluminium, 0.01 to 0.1% manganese and 0.001 to 0.1% chromium. Because of many alloying elements the manufacture of the alloy is more expensive than an alloy having less alloying elements.
- the copper based precipitation hardenable alloy in the GB patent 609,900 contains by weight 0.25 to 1.5% chromium with deoxidants of zinc, boron, sodium, lithium and phosphorus in amounts not exceeding 0.2% as well as strengthening elements of nickel, iron or cobalt in amounts between 0.1 and 5.0%.
- the value for the electrical conductivity is between 69 and 74% IASC (International Annealed Copper Standard).
- the electrical conductivity and strength of copper is dependent upon the purity of copper. Moreover high purity copper is too soft for many applications where high strength mechanical properties and an anneal resistance are required.
- Direct alloying of copper has considerable disadvantages since the direct alloying has an inverse relationship on the conductivity of copper.
- a beneficial way of producing a high strength copper alloy with good electrical properties is to select an alloying element that forms a precipitate within the copper.
- the advantage with precipitation hardenable copper alloys is the amount of alloying required which is low and once aged the electrical conductivities greater than 85% IASC can be achieved.
- the requirements in the properties of the precipitation hardenable copper based alloys are today increased especially in the electrical conductivity with new solutions for instance in electric, electronic or welding industry where these alloys are planned to be used.
- the object of the present invention is to eliminate some drawbacks of the prior art and to achieve improved precipitation hardenable copper alloys, which include improvements in the properties of the alloys having at least a decreased resistance to sticking, and increased conductivity when comparing with the prior art.
- the essential features of the present invention are enlisted in the appended claims.
- copper-chromium (CuCr), copper-chromium-zirconium (CuCrZr), copper-zirconium (CuZr) or copper-titanium (CuTi) precipitation hardenable alloys contain phosphorus as an alloying element in the range of 100 to 500 parts per million (ppm).
- ppm parts per million
- the copper-chromium (CuCr), copper-chromium-zirconium (CuCrZr), copper-zirconium (CuZr) or copper titanium (CuTi) precipitation hardenable alloys in accordance with the invention contain 0.1-1.5% by weight chromium and/or 0.01-0.25% by weight zirconium or 0.05-3.4% by weight titanium, the remainder being copper and the usual impurities.
- the copper content in the alloys containing chromium and/or zirconium is at least 98.5% by weight copper and in the alloy containing titanium at least 96.5% by weight copper.
- the alloying element, phosphorus, in the copper alloys forms phosphides and this formation of phosphides has been found an impact on the electrical conductivity and mechanical strength for the precipitation hardenable copper alloys.
- phosphides can form during heat treatment or even during casting. It has been discovered with the invention that phosphorus additions of up to 550 parts per million (ppm) have an advantageous effect on the electrical and mechanical properties of the alloys.
- the formation of phosphides causes coarsening within the lattice structure and thus increasing the dislocation energy and decreases the solubility of the alloying elements, chromium, zirconium and titanium in the case of the invention.
- the copper based precipitation hardenable alloy of the invention is advantageously used because of the improvements in properties such as electrical conductivity and mechanical strength in many solutions in electric, electronic and welding industries.
- FIG. 1 illustrates an additive ternary copper-chromium-phosphorus (CuCrP) phase diagram close to the copper corner (100% copper) at the temperature of 600° C.
- FIG. 2 shows the test results for the value of stress in percents (%) remaining after the 100 hour-test at the temperature of 175° C. for a copper chromium zirconium phosphorus (CuCrZrP) alloy.
- Phosphorus addition of up to 500 ppm to a chromium, zirconium and titanium bearing copper based precipitation hardenable alloy has a direct impact on the electrical conductivity.
- the phosphorus addition reduces the solubility of the alloying element, chromium, zirconium or titanium in the terminal crystal structure of face centered cubic copper (fcc-Cu).
- chromium forms thermally stable phosphides, such as Cr 3 P and CrP 4 , but no double phosphide with copper.
- chromium has the terminal crystal structure of base centered cubic (bcc), instead of face centered cubic (fcc) for copper.
- FIG. 1 shows an additive ternary Cu—Cr—P in the copper corner (100% copper) at the temperature of 600° C.
- additive means that no ternary interactions are taken into account, which approximation would not bring large differences in the fcc-solid solution due to the very small solubilities, in particular in the case of chromium in copper.
- solubility of chromium in solid copper is less than 0.01% by weight the effect on the solubility of phosphorus is very small.
- solubility of phosphorus in copper chromium alloys is limited by the Cr 2 P phosphide to a fraction of the solubility of phosphorus in the copper phosphorus binary alloy.
- Zirconium forms a ternary compound and is stable with a stoichiometry of copper-zirconium phosphide of Cu 2 ZrP. Further, a binary compound of zirconium phosphide (Zr 5 P 4 ) precipitates from the super saturated zirconium-phosphorus-copper alloy during casting or aging. This binary compound has no effect on conductivity and in effect reduces the solubility of zirconium within copper.
- Titanium forms with phosphorus for instance phosphides of Ti 3 P and TiP. Titanium also forms a ternary compound with copper and phosphorus (Cu 2 TiP), which is stable. Also in the case of having titanium as an alloying element in the precipitation hardenable copper based alloy the formation of the binary and ternary compounds help to increase the electrical conductivity and tensile strength of copper.
- phosphides The influence of phosphorus to the copper chromium, copper zirconium and copper titanium system increases the yield strength, tensile strength and hardness with no effect on ductility. Another advantage of the formation of phosphides is the effect on the recrystallization temperature. The influence of the phosphides enables strain hardened or cold worked material to be exposed to the temperature range of 800-1200° C. where most other high conductivity alloys would lose most of their properties achieved by strain hardening.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Materials For Medical Uses (AREA)
- Chemically Coating (AREA)
- Secondary Cells (AREA)
Abstract
The invention relates to a copper based precipitation hardenable alloy containing at least one of the elements chromium, zirconium or titanium, wherein the copper based precipitation hardenable alloy is alloyed by phosphorus.
Description
- This invention relates to at least one copper based precipitation hardenable alloy in which high strength mechanical properties and an anneal resistance are improved.
- The JP patent publication 06-212,374 describes a method for manufacturing a copper based precipitation hardenable alloy to be used as material of small electric and electronic components. The alloy contains by weight 2 to 4% nickel, 0.5 to 1.0% silicon, 0.1 to 1.0% zinc, 0.001 to 0.15% aluminium, 0.01 to 0.1% manganese and 0.001 to 0.1% chromium. Because of many alloying elements the manufacture of the alloy is more expensive than an alloy having less alloying elements.
- The copper based precipitation hardenable alloy in the GB patent 609,900 contains by weight 0.25 to 1.5% chromium with deoxidants of zinc, boron, sodium, lithium and phosphorus in amounts not exceeding 0.2% as well as strengthening elements of nickel, iron or cobalt in amounts between 0.1 and 5.0%. In this alloy of the GB patent 609,900 the value for the electrical conductivity is between 69 and 74% IASC (International Annealed Copper Standard).
- The electrical conductivity and strength of copper is dependent upon the purity of copper. Moreover high purity copper is too soft for many applications where high strength mechanical properties and an anneal resistance are required. Direct alloying of copper has considerable disadvantages since the direct alloying has an inverse relationship on the conductivity of copper. A beneficial way of producing a high strength copper alloy with good electrical properties is to select an alloying element that forms a precipitate within the copper. The advantage with precipitation hardenable copper alloys is the amount of alloying required which is low and once aged the electrical conductivities greater than 85% IASC can be achieved. However, the requirements in the properties of the precipitation hardenable copper based alloys are today increased especially in the electrical conductivity with new solutions for instance in electric, electronic or welding industry where these alloys are planned to be used.
- The object of the present invention is to eliminate some drawbacks of the prior art and to achieve improved precipitation hardenable copper alloys, which include improvements in the properties of the alloys having at least a decreased resistance to sticking, and increased conductivity when comparing with the prior art. The essential features of the present invention are enlisted in the appended claims.
- In accordance with the invention copper-chromium (CuCr), copper-chromium-zirconium (CuCrZr), copper-zirconium (CuZr) or copper-titanium (CuTi) precipitation hardenable alloys contain phosphorus as an alloying element in the range of 100 to 500 parts per million (ppm). The addition of phosphorus to the chromium, zirconium or titanium bearing copper has a significant effect on the hardness and on electrical properties.
- The copper-chromium (CuCr), copper-chromium-zirconium (CuCrZr), copper-zirconium (CuZr) or copper titanium (CuTi) precipitation hardenable alloys in accordance with the invention contain 0.1-1.5% by weight chromium and/or 0.01-0.25% by weight zirconium or 0.05-3.4% by weight titanium, the remainder being copper and the usual impurities. The copper content in the alloys containing chromium and/or zirconium is at least 98.5% by weight copper and in the alloy containing titanium at least 96.5% by weight copper.
- The alloying element, phosphorus, in the copper alloys forms phosphides and this formation of phosphides has been found an impact on the electrical conductivity and mechanical strength for the precipitation hardenable copper alloys. When phosphorus is added as an alloying element to these copper chromium (CuCr), copper chromium zirconium (CuCrZr), copper zirconium (CuZr) or copper titanium (CuTi) precipitation hardenable alloys in accordance with the invention, phosphides can form during heat treatment or even during casting. It has been discovered with the invention that phosphorus additions of up to 550 parts per million (ppm) have an advantageous effect on the electrical and mechanical properties of the alloys. The formation of phosphides causes coarsening within the lattice structure and thus increasing the dislocation energy and decreases the solubility of the alloying elements, chromium, zirconium and titanium in the case of the invention.
- The copper based precipitation hardenable alloy of the invention is advantageously used because of the improvements in properties such as electrical conductivity and mechanical strength in many solutions in electric, electronic and welding industries.
- The invention is described in more details referring to the appended drawings wherein
-
FIG. 1 illustrates an additive ternary copper-chromium-phosphorus (CuCrP) phase diagram close to the copper corner (100% copper) at the temperature of 600° C., and -
FIG. 2 shows the test results for the value of stress in percents (%) remaining after the 100 hour-test at the temperature of 175° C. for a copper chromium zirconium phosphorus (CuCrZrP) alloy. - Phosphorus addition of up to 500 ppm to a chromium, zirconium and titanium bearing copper based precipitation hardenable alloy has a direct impact on the electrical conductivity. The phosphorus addition reduces the solubility of the alloying element, chromium, zirconium or titanium in the terminal crystal structure of face centered cubic copper (fcc-Cu). For instance chromium forms thermally stable phosphides, such as Cr3P and CrP4, but no double phosphide with copper. One reason is, that chromium has the terminal crystal structure of base centered cubic (bcc), instead of face centered cubic (fcc) for copper.
- The solubility of chromium into copper at the presence of phosphorus is illustrated in
FIG. 1 referred from Villars P., Prince A., Okamoto H., Handbook of Ternary Alloy Phase Diagrams, Vol 7 & 8, ASM International, Metals Park (Ohio), 1998.FIG. 1 shows an additive ternary Cu—Cr—P in the copper corner (100% copper) at the temperature of 600° C. The term “additive” means that no ternary interactions are taken into account, which approximation would not bring large differences in the fcc-solid solution due to the very small solubilities, in particular in the case of chromium in copper. As the solubility of chromium in solid copper is less than 0.01% by weight the effect on the solubility of phosphorus is very small. On the other hand, the solubility of phosphorus in copper chromium alloys is limited by the Cr2P phosphide to a fraction of the solubility of phosphorus in the copper phosphorus binary alloy. - Additional isotherms at higher temperatures have been evaluated and indicate that the chromium phosphide (Cr2P) extending from the chromium phosphorus edge of the ternary system limits the solubility of phosphorus in typical copper chromium compositions with about 0.1% by weight chromium. The maximum solubility of phosphorus in binary fcc-Cu and bcc-Cr alloys at the temperature of 600° C. is about 100 ppm. Beyond that concentration, CrP phosphide precipitates from two-phase system of the fcc-Cu and bcc-Cr. It is also recognized from
FIG. 1 that phosphorus additions at high concentrations systematically lower the solubility of chromium in the fcc-Cu alloy. - Zirconium forms a ternary compound and is stable with a stoichiometry of copper-zirconium phosphide of Cu2ZrP. Further, a binary compound of zirconium phosphide (Zr5P4) precipitates from the super saturated zirconium-phosphorus-copper alloy during casting or aging. This binary compound has no effect on conductivity and in effect reduces the solubility of zirconium within copper.
- Titanium forms with phosphorus for instance phosphides of Ti3P and TiP. Titanium also forms a ternary compound with copper and phosphorus (Cu2TiP), which is stable. Also in the case of having titanium as an alloying element in the precipitation hardenable copper based alloy the formation of the binary and ternary compounds help to increase the electrical conductivity and tensile strength of copper.
- The influence of phosphorus to the copper chromium, copper zirconium and copper titanium system increases the yield strength, tensile strength and hardness with no effect on ductility. Another advantage of the formation of phosphides is the effect on the recrystallization temperature. The influence of the phosphides enables strain hardened or cold worked material to be exposed to the temperature range of 800-1200° C. where most other high conductivity alloys would lose most of their properties achieved by strain hardening.
- To determine the effects of phosphides on strain harden material at elevated temperatures a stress relaxation test was performed on the alloy (CuCrZrP) containing copper, 0.75% by weigth chromium, 0.06% by weight zirconium and varying contents of phosphorus. The value of stress in percents (%) remaining after the 100 hour-test at the temperature of 175° C. is shown in
FIG. 2 . As theFIG. 2 shows the amount of stress remaining in the CuCrZrP alloy with the higher phosphorus content is almost 100%. However, it has to be pointed out that the alloy processing is critical in achieving the superior properties. Based onFIG. 2 , phosphorus contents above 550 ppm have been found to have a negative impact on the electrical conductivity and mechanical properties of the chromium, zirconium or titanium containing copper based precipitation hardenable alloys alloyed by phosphorus.
Claims (14)
1. A copper based precipitation hardenable alloy containing at least one of the elements chromium, zirconium or titanium, wherein the copper based precipitation hardenable alloy is alloyed by phosphorus.
2. The copper based precipitation hardenable alloy according to claim 1 , wherein the alloy contains 100 to 500 ppm phosphorus.
3. The copper based precipitation hardenable alloy according to claim 1 , wherein the copper based precipitation hardenable alloy is a copper chromium alloy containing at least 98.5% by weight copper.
4. The copper based precipitation hardenable alloy according to claim 3 , wherein the alloy contains 0.1 to 1.5% by weight chromium.
5. The copper based precipitation hardenable alloy according to claim 1 , wherein the copper based precipitation hardenable alloy is a copper zirconium alloy containing at least 98.5% by weight copper.
6. The copper based precipitation hardenable alloy according to claim 5 , wherein the alloy contains 0.01 to 0.25% by weight zirconium.
7. The copper based precipitation hardenable alloy according to claim 1 , wherein the copper based precipitation hardenable alloy is a copper chromium zirconium alloy containing at least 98.5% by weight copper.
8. The copper based precipitation hardenable alloy according to claim 7 , wherein the alloy contains 0.1 to 1.5% by weight chromium and 0.01 to 0.25% by weight zirconium.
9. The copper based precipitation hardenable alloy according to claim 1 , wherein the copper based precipitation hardenable alloy is a copper titanium alloy containing at least 96.5% by weight copper.
10. The copper based precipitation hardenable alloy according to claim 9 , wherein the alloy contains 0.05 to 3.4% by weight titanium.
11. The copper based precipitation hardenable alloy according to claim 2 , wherein the copper based precipitation hardenable alloy is a copper chromium alloy containing at least 98.5 % by weight copper.
12. The copper based precipitation hardenable alloy according to claim 2 , wherein the copper based precipitation hardenable alloy is a copper zirconium alloy containing at least 98.5% by weight copper.
13. The copper based precipitation hardenable alloy according to claim 2 , wherein the copper based precipitation hardenable alloy is a copper chromium zirconium alloy containing at least 98.5% by weight copper.
14. The copper based precipitation hardenable alloy according to claim 2 , wherein the copper based precipitation hardenable alloy is a copper titanium alloy containing at least 96.5% by weight copper.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/971,931 US20060088437A1 (en) | 2004-10-22 | 2004-10-22 | Copper based precipitation hardening alloy |
| EP05022512A EP1650317A3 (en) | 2004-10-22 | 2005-10-14 | Copper based precipitation hardening alloy |
| CN200510121572.6A CN1804071A (en) | 2004-10-22 | 2005-10-21 | Copper based precipitation hardening alloy |
| JP2005308126A JP2006124835A (en) | 2004-10-22 | 2005-10-24 | Precipitation hardening type copper based alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/971,931 US20060088437A1 (en) | 2004-10-22 | 2004-10-22 | Copper based precipitation hardening alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20060088437A1 true US20060088437A1 (en) | 2006-04-27 |
Family
ID=35457198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/971,931 Abandoned US20060088437A1 (en) | 2004-10-22 | 2004-10-22 | Copper based precipitation hardening alloy |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060088437A1 (en) |
| EP (1) | EP1650317A3 (en) |
| JP (1) | JP2006124835A (en) |
| CN (1) | CN1804071A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106086493A (en) * | 2016-08-18 | 2016-11-09 | 江西理工大学 | A kind of fast low temperature sinters the method preparing CuCr alloy material |
| US20170292181A1 (en) * | 2014-09-25 | 2017-10-12 | Mitsubishi Materials Corporation | CASTING MOLD MATERIAL AND Cu-Cr-Zr ALLOY MATERIAL |
| EP3375897A4 (en) * | 2015-11-09 | 2019-04-03 | Mitsubishi Materials Corporation | COPPER ALLOY MATERIAL |
| CN116904782A (en) * | 2023-06-26 | 2023-10-20 | 北京科技大学 | A preparation method of high-strength and high-conductivity powder metallurgy copper-chromium-zirconium alloy |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5157278B2 (en) * | 2007-06-20 | 2013-03-06 | 日立電線株式会社 | Copper alloy material |
| US20110056591A1 (en) | 2008-05-07 | 2011-03-10 | Japan Science And Technology Agency | Brass alloy powder, brass alloy extruded material, and method for producing the brass alloy extruded material |
| CN103502485B (en) * | 2011-03-31 | 2015-11-25 | 国立大学法人东北大学 | Copper alloy and preparation method of copper alloy |
| CN103131886B (en) * | 2013-03-18 | 2015-12-02 | 湖南银联湘北铜业有限公司 | A kind of chromium ferrozirconium copper alloy electrode material and methods for making and using same thereof |
| JP2016180169A (en) * | 2015-03-25 | 2016-10-13 | 株式会社Uacj | Copper alloy tube |
| CN106381414B (en) * | 2016-09-30 | 2018-02-13 | 陕西科技大学 | A kind of copper-based in-situ composite alloy and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127840A (en) * | 1984-11-27 | 1986-06-16 | Nippon Mining Co Ltd | Copper alloy having high strength and electric conductivity |
| JP4251672B2 (en) * | 1997-03-26 | 2009-04-08 | 株式会社神戸製鋼所 | Copper alloy for electrical and electronic parts |
| KR100329153B1 (en) * | 1998-07-08 | 2002-03-21 | 구마모토 마사히로 | Copper alloy for terminals and connectors and method for making same |
| JP4132451B2 (en) * | 1999-08-09 | 2008-08-13 | 株式会社神戸製鋼所 | High strength and high conductivity copper alloy with excellent heat resistance |
| JP2004353011A (en) * | 2003-05-27 | 2004-12-16 | Ykk Corp | Electrode material and its manufacturing method |
-
2004
- 2004-10-22 US US10/971,931 patent/US20060088437A1/en not_active Abandoned
-
2005
- 2005-10-14 EP EP05022512A patent/EP1650317A3/en not_active Withdrawn
- 2005-10-21 CN CN200510121572.6A patent/CN1804071A/en active Pending
- 2005-10-24 JP JP2005308126A patent/JP2006124835A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170292181A1 (en) * | 2014-09-25 | 2017-10-12 | Mitsubishi Materials Corporation | CASTING MOLD MATERIAL AND Cu-Cr-Zr ALLOY MATERIAL |
| US10544495B2 (en) * | 2014-09-25 | 2020-01-28 | Mitsubishi Materials Corporation | Casting mold material and Cu—Cr—Zr alloy material |
| EP3375897A4 (en) * | 2015-11-09 | 2019-04-03 | Mitsubishi Materials Corporation | COPPER ALLOY MATERIAL |
| CN106086493A (en) * | 2016-08-18 | 2016-11-09 | 江西理工大学 | A kind of fast low temperature sinters the method preparing CuCr alloy material |
| CN116904782A (en) * | 2023-06-26 | 2023-10-20 | 北京科技大学 | A preparation method of high-strength and high-conductivity powder metallurgy copper-chromium-zirconium alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006124835A (en) | 2006-05-18 |
| CN1804071A (en) | 2006-07-19 |
| EP1650317A2 (en) | 2006-04-26 |
| EP1650317A3 (en) | 2006-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100360131B1 (en) | Method for improving the bendability of copper alloy and copper alloy manufactured therefrom | |
| US5370840A (en) | Copper alloy having high strength and high electrical conductivity | |
| JP5847987B2 (en) | Copper alloy containing silver | |
| KR100929276B1 (en) | Copper alloy | |
| EP0175183A1 (en) | Copper alloys having an improved combination of strength and conductivity | |
| US3923558A (en) | Copper base alloy | |
| JP2010059543A (en) | Copper alloy material | |
| US20060088437A1 (en) | Copper based precipitation hardening alloy | |
| US4305762A (en) | Copper base alloy and method for obtaining same | |
| JPH036341A (en) | High strength and high conductivity copper-base alloy | |
| JPS63109130A (en) | Copper alloy for electronic equipment | |
| US5306465A (en) | Copper alloy having high strength and high electrical conductivity | |
| CN106460097B (en) | The manufacture method of copper alloy plate and copper alloy plate | |
| JP5261691B2 (en) | Copper-base alloy with excellent press punchability and method for producing the same | |
| US4492602A (en) | Copper base alloys for automotive radiator fins, electrical connectors and commutators | |
| JPS6345336A (en) | Copper alloy for electronic and electrical equipment and its manufacturing method | |
| JP2007126739A (en) | Copper alloy for electronic material | |
| JPS62182240A (en) | Conductive high-tensile copper alloy | |
| JPH10152737A (en) | Copper alloy material and method of manufacturing the same | |
| KR950014423B1 (en) | A copper-based metal alloy of improved type particularly for the contruction of electronic components | |
| JP4459067B2 (en) | High strength and high conductivity copper alloy | |
| JP2008075174A (en) | Copper-titanium-hydrogen alloy and method for producing the same | |
| JP6749122B2 (en) | Copper alloy plate with excellent strength and conductivity | |
| JPH09143597A (en) | Copper alloy for lead frame and manufacturing method thereof | |
| JP5070772B2 (en) | Cu-Ni-Si based copper alloy with excellent hot workability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: OUTOKUMPU OYJ, FINLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NIPPERT, RUSSELL;SWANK, BRIAN;GHITA, MIHNEA;REEL/FRAME:016578/0883;SIGNING DATES FROM 20050228 TO 20050630 |
|
| AS | Assignment |
Owner name: LUVATA OY, FINLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OUTOKUMPU OYJ;REEL/FRAME:020121/0406 Effective date: 20071108 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |