US20050277731A1 - Curable perfluoropolyether compositions and rubber or gel articles comprising the same - Google Patents
Curable perfluoropolyether compositions and rubber or gel articles comprising the same Download PDFInfo
- Publication number
- US20050277731A1 US20050277731A1 US11/148,360 US14836005A US2005277731A1 US 20050277731 A1 US20050277731 A1 US 20050277731A1 US 14836005 A US14836005 A US 14836005A US 2005277731 A1 US2005277731 A1 US 2005277731A1
- Authority
- US
- United States
- Prior art keywords
- perfluoropolyether
- group
- integer
- composition
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000010702 perfluoropolyether Substances 0.000 title claims abstract description 99
- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 229920001971 elastomer Polymers 0.000 title claims abstract description 63
- 239000005060 rubber Substances 0.000 title claims abstract description 62
- 150000001875 compounds Chemical class 0.000 claims abstract description 58
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 239000012763 reinforcing filler Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 16
- -1 dimethylphenylsilylene group Chemical group 0.000 claims description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- 125000001424 substituent group Chemical group 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 8
- 230000004584 weight gain Effects 0.000 claims description 8
- 235000019786 weight gain Nutrition 0.000 claims description 8
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 239000000446 fuel Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 229910021485 fumed silica Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 abstract description 25
- 239000000499 gel Substances 0.000 description 60
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 10
- 238000007654 immersion Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000035515 penetration Effects 0.000 description 10
- 230000035699 permeability Effects 0.000 description 10
- 239000003921 oil Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- 0 C.C.[3*]C1([3*])([H])([4*]C)CCCC1 Chemical compound C.C.[3*]C1([3*])([H])([4*]C)CCCC1 0.000 description 7
- QNSOMXQDRYZJKS-UHFFFAOYSA-N CC.C[Si](C)(C)C1=CC=CC=C1 Chemical compound CC.C[Si](C)(C)C1=CC=CC=C1 QNSOMXQDRYZJKS-UHFFFAOYSA-N 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229910002012 Aerosil® Inorganic materials 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 125000002947 alkylene group Chemical group 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 239000000565 sealant Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 150000003058 platinum compounds Chemical class 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- 239000010705 motor oil Substances 0.000 description 2
- 150000001367 organochlorosilanes Chemical class 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 2
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- WGGNJZRNHUJNEM-UHFFFAOYSA-N 2,2,4,4,6,6-hexamethyl-1,3,5,2,4,6-triazatrisilinane Chemical compound C[Si]1(C)N[Si](C)(C)N[Si](C)(C)N1 WGGNJZRNHUJNEM-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 description 1
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical compound OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- FGWBBQQMKQEPMM-UHFFFAOYSA-N C.C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1.[H]C1(C)CCCCO[Si]1(C)CCCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F Chemical compound C.C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1.[H]C1(C)CCCCO[Si]1(C)CCCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F FGWBBQQMKQEPMM-UHFFFAOYSA-N 0.000 description 1
- FUHIUBZURNBTKE-UHFFFAOYSA-N C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1 Chemical compound C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1 FUHIUBZURNBTKE-UHFFFAOYSA-N 0.000 description 1
- BTQYIZQGKBCHEJ-UHFFFAOYSA-N C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1.[H][Si](C)(C)CC[SiH2]CCCC Chemical compound C=C[Si](C)(C)c1cccc(N(C)C(=O)C(C)(=O)(c2cccc([Si](C)(C)C=C)c2)(C(F)(F)F)(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c1.[H][Si](C)(C)CC[SiH2]CCCC BTQYIZQGKBCHEJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- AQLRJIZVHATRFY-UHFFFAOYSA-N O=[Si]=O.[H][Si](C)(O[SiH]=O)(O[Si](C)(C)CC(=C)C#CC#CC#CC(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F)([Si](=O)[SiH2]O)[SiH](C)(C)([SiH]=O)[Si](C)(CCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F)O[Si](C)(C)CCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F Chemical compound O=[Si]=O.[H][Si](C)(O[SiH]=O)(O[Si](C)(C)CC(=C)C#CC#CC#CC(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F)([Si](=O)[SiH2]O)[SiH](C)(C)([SiH]=O)[Si](C)(CCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F)O[Si](C)(C)CCC#CC#CC#CC#C(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)(F)F AQLRJIZVHATRFY-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N Pd(PPh3)4 Substances [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- NQZFAUXPNWSLBI-UHFFFAOYSA-N carbon monoxide;ruthenium Chemical compound [Ru].[Ru].[Ru].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] NQZFAUXPNWSLBI-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
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- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- 238000004898 kneading Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 239000012255 powdered metal Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5406—Silicon-containing compounds containing elements other than oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Definitions
- This invention relates to perfluoropolyether compositions which cure into rubber or gel products having heat resistance, oil resistance, chemical resistance, solvent resistance, low-temperature properties, moisture resistance, and low gas permeability and especially, improved acid resistance.
- the invention also relates to rubber or gel articles obtained by curing the compositions.
- JP-A 8-199070 discloses a curable composition
- a curable composition comprising a linear perfluoropolyether compound containing at least two alkenyl groups per molecule and having a perfluoropolyether structure in its backbone, an organosilicon compound having at least two H—SiOSiO structures per molecule, and a hydrosilylation catalyst, which cures into a product having a good profile of heat resistance, chemical resistance, solvent resistance, water repellency, oil repellency and weatherability.
- perfluoropolyether rubber compositions perform well in most applications. However, their acid resistance is short in those applications requiring chemical resistance such as sealants in semiconductor manufacturing units, sealants and potting materials for use with engine oil, and sealants and potting materials for use in engine exhaust parts. There is a need for perfluoropolyether rubber or gel compositions which are improved in oil resistance and chemical resistance, and especially acid resistance.
- JP-A 2000-248166 discloses a curable fluoropolyether base rubber composition
- a curable fluoropolyether base rubber composition comprising a linear fluoropolyether compound having at least two alkenyl groups, an organosilicon compound having at least two SiH groups, a hydrosilylation catalyst, and surface-hydrophobicized microparticulate silica having a specific surface area of at least 50 m 2 /g and a nitrogen atom content of 500-5,000 ppm.
- An object of the invention is to provide curable perfluoropolyether compositions which are cured into rubber or gel having exhibit good heat resistance, solvent resistance, chemical resistance, weatherability, water repellency and oil repellency and especially acid resistance. Another object is to provide rubber or gel articles comprising the same.
- perfluoropolyether compositions which cure into rubber or gel products having improved acid resistance are obtainable using a linear perfluoropolyether compound having a weight average molecular weight of 10,000 to 100,000.
- the present invention provides a curable perfluoropolyether composition
- a curable perfluoropolyether composition comprising (A) a linear perfluoropolyether compound containing at least two alkenyl groups per molecule, having a perfluoropolyether structure comprising recurring units —C a F 2a O— wherein a is an integer of 1 to 6 in its backbone, and having a weight average molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms per molecule, selected from the class consisting of (B-1) a cyclic organohydrogenpolysiloxane containing at least one perfluoroalkyl group or perfluoropolyether substituent group per molecule, and (B-2) an organosilicon compound containing at least one perfluoroalkyl group or perfluoropolyether substituent group per molecule wherein all silicon atom-bonded hydrogen atoms form H—Si
- the present invention provides a curable perfluoropolyether composition
- a curable perfluoropolyether composition comprising (A) a linear perfluoropolyether compound as defined above; (B) an organosilicon compound as defined above; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group per molecule and having a perfluoropolyether structure in its backbone, the composition being cured into a gel.
- a rubber-like cured product or rubber means a cured product which is able to measure hardness according to JIS K 6253 or ISO 1619 and especially has a hardness of 10 to 80 according to JIS A-type hardness tester or Type A Durometer.
- gel-like cured product or gel means that a cured product which is unable to measure hardness according to JIS A-type hardness tester or Type A Durometer and has a penetration of 1 to 200, especially 10 to 150 according to JIS K 2220 or ASTM D-1403.
- perfluoropolyether compositions of the invention when cured, impart rubber or gel products having good heat resistance, oil resistance, chemical resistance, solvent resistance, low-temperature properties, moisture resistance and low gas permeability, and especially improved acid resistance.
- FIGS. 1 and 2 are transverse cross-sectional views of electronic packages under test in Example 5.
- Component (A) of the curable perfluoropolyether compositions according to the invention is a linear perfluoropolyether compound containing at least two alkenyl groups per molecule, having a perfluoropolyether structure, preferably divalent perfluoroalkylether structure, in its backbone, and having a weight average molecular weight (Mw) of 10,000 to 100,000, as determined by gel permeation chromatography (GPC) relative to polystyrene standards.
- Mw weight average molecular weight
- the perfluoroalkyl ether structures include structures comprising a plurality of recurring units —C a F 2a O— wherein a is at each occurrence an integer of 1 to 6, for example, structures represented by the general formula (7): (C a F 2a O) q (7) wherein q is an integer of 50 to 600, preferably 50 to 400, more preferably 50 to 200.
- Examples of the recurring units —C a F 2a O— are: —CF 2 O—, —CF 2 CF 2 O—, —CF 2 CF 2 CF 2 O—, —CF(CF 3 )CF 2 O—, —CF 2 CF 2 CF 2 CF 2 O—, —CF 2 CF 2 CF 2 CF 2 O—, and —C(CF 3 ) 2 O—.
- —CF 2 O—, —CF 2 CF 2 O—, —CF 2 CF 2 CF 2 O—, and —CF(CF 3 )CF 2 O— are preferred.
- the perfluoroalkyl ether structure may consist of recurring units —C a F 2a O— of one type or recurring units of two or more types.
- the alkenyl groups in the linear perfluoropolyether compound (A) are preferably those groups having 2 to 8 carbon atoms, especially 2 to 6 carbon atoms, and terminated with a CH 2 ⁇ CH— structure, for example, vinyl, allyl, propenyl, isopropenyl, butenyl, and hexenyl. Of these, vinyl and allyl are preferred.
- the alkenyl groups may be attached to the backbone at both ends either directly or through divalent linkages such as —CH 2 —, —CH 2 O— or —Y—NR—CO—.
- Y is —CH 2 — or a dimethylphenylsilylene group of the formula (Z): (inclusive of o-, m- and p-positions), and R is hydrogen, methyl, phenyl or allyl. There should be included at least two alkenyl groups per molecule.
- Suitable perfluoropolyether compounds (A) include polyfluorodialkenyl compounds of the general formulae (8) and (9). CH 2 ⁇ CH—(X) p —Rf 1 -(X′) p —CH ⁇ CH 2 (8) CH 2 ⁇ CH—(X) p -Q-Rf 1 -Q-(X′) p —CH ⁇ CH 2 (9)
- X is independently —CH 2 —, —CH 2 O—, —CH 2 OCH 2 — or —Y—NR 1 —CO— wherein Y is —CH 2 — or a dimethylphenylsilylene group of the structural formula (Z) and R 1 is hydrogen, methyl, phenyl or allyl.
- X′ is —CH 2 —, —OCH 2 —, —CH 2 OCH 2 — or —CO—NR 2 —Y′— wherein Y′ is —CH 2 — or a dimethylphenylsilylene group of the structural formula (Z′) and R 2 is hydrogen, methyl, phenyl or allyl.
- Rf 1 is a divalent perfluoropolyether structure, and preferably one of above formula (7); that is, of the formula (C a F 2a O) q .
- Q is a divalent hydrocarbon group having 1 to 15 carbon atoms which may contain an ether bond, for example, an alkylene group or an alkylene group containing an ether bond.
- the letter p is independently 0 or 1. (inclusive of o-, m- and p-positions) (inclusive of o-, m- and p-positions)
- the linear perfluoropolyether compound serving as component (A) is most preferably a compound of the general formula (1).
- X, X′ and p are as defined above, r is an integer of 2 to 6, each of m and n is an integer of 0 to 600, and the sum of m+n is 50 to 600.
- the linear perfluoropolyether compound of formula (1) should desirably have a weight-average molecular weight (Mw) of 10,000 to 100,000, and most preferably 10,000 to 50,000.
- Mw weight-average molecular weight
- Compounds with Mw of less than 10,000 undergo substantial swell in gasoline and other solvents, as demonstrated by a swell factor of at least 6% in gasoline, failing to meet the requirements of parts that must be gasoline resistant.
- Compounds with Mw of more than 100,000 are too viscous to work, detracting from practical utility.
- linear perfluoropolyether compound of formula (1) is given below. Note that each of m and n is an integer of 0 to 200, and the sum of m+n is 50 to 200.
- the linear perfluoropolyether compound of formula (1) may be previously subjected to hydrosilylation with an organosilicon compound bearing two SiH groups in a molecule by means of an ordinary method and under ordinary conditions.
- the resulting chain-extended product can be used as component (A).
- Component (B) is an organosilicon compound having at least two silicon atom-bonded hydrogen atoms (i.e., SiH groups) in a molecule.
- the organosilicon compound (B) serves as a crosslinking agent and chain extender for component (A).
- the organosilicon compound should preferably have at least one monovalent perfluoroalkyl, monovalent perfluorooxyalkyl, divalent perfluoroalkylene or divalent perfluorooxyalkylene group in a molecule.
- Preferred component (B) is (B-1) a cyclic organohydrogenpolysiloxane containing at least one perfluoroalkyl group or perfluoropolyether substituent group per molecule.
- organohydrogenpolysiloxane compounds (B-1) those of the general formula (5) are preferred.
- Rf 3 is a monovalent perfluoroalkyl or perfluoropolyether group
- R 3 is a monovalent hydrocarbon group of 1 to 20 carbon atoms
- R 4 is a divalent hydrocarbon group of 2 to 20 carbon atoms which may contain an ether bond
- k is an integer of at least 2
- 1 is an integer of 1 to 6
- the sum of k+1 is 3 to 10.
- Examples of monovalent perfluoroalkyl or perfluoropolyether groups represented by Rf 3 include monovalent perfluoroalkyl groups: C b F 2b+1 — wherein b is an integer from 1 to 20, and preferably from 2 to 10 and monovalent perfluorooxyalkyl groups: wherein n is an integer from 2 to 200, preferably 2 to 100.
- R 3 is a monovalent hydrocarbon group of 1 to 20 carbon atoms, for example, alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, hexyl, octyl and decyl; cycloalkyl groups such as cyclopentyl, cyclohexyl and cycloheptyl; alkenyl groups such as vinyl, allyl, propenyl, isopropenyl, butenyl and hexenyl; aryl groups such as phenyl, tolyl, xylyl and naphthyl; and aralkyl groups such as benzyl, phenylethyl, phenylpropyl. Of these, those free of aliphatic unsaturation are preferred.
- R 4 is a divalent hydrocarbon group of 2 to 20 carbon atoms which may contain an ether bond.
- divalent linking groups include alkylene groups, arylene groups, and combinations thereof, in which may intervene an ether-bonding oxygen atom, an amide bond, a carbonyl bond or the like, with those of 2 to 12 carbon atoms being preferred.
- Suitable divalent linking groups are: —CH 2 CH 2 —, —CH 2 CH 2 CH 2 —, —CH 2 CH 2 CH 2 OCH 2 —, —CH 2 CH 2 CH 2 —NH—CO—, —CH 2 CH 2 CH 2 —N(Ph)-CO—, —CH 2 CH 2 CH 2 —N(CH 3 )—CO—, and —CH 2 CH 2 CH 2 —O—CO—.
- Ph is phenyl.
- suitable compounds having at least one perfluoroalkyl group or perfluoropolyether substituent group in a molecule as component (B-1) are given below. They may be used alone or in admixture of two or more, or in admixture with component (B-2) to be described later. Note that Me is methyl and Ph is phenyl.
- Component (B) also includes (B-2) an organosilicon compound containing at least one perfluoroalkyl group or perfluoropolyether substituent group per molecule wherein all silicon atom-bonded hydrogen atoms form H—Si(CH 2 ) g Si— structures wherein g is 1 to 3.
- organosilicon compounds of the general formula (6) are preferred.
- i and j are 0 or 1, and not both i and j are 0;
- R 5 is a monovalent hydrocarbon group of 1 to 20 carbon atoms;
- t is 1, 2 or 3, and
- u is 0, 1, 2 or 3.
- Z is hydrogen, -Q-M or -Q-Rf 3
- Q is a divalent hydrocarbon group of 1 to 15 carbon atoms, such as an alkylene, an arylene, and a group in which an alkylene group and an arylene group are combined, which may contain an ether bond
- Rf 3 is a monovalent perfluoroalkyl or perfluorooxyalkyl group as defined above
- M is a group of formula (i): wherein R 6 is a monovalent hydrocarbon group of 1 to 20 carbon atoms, and g is an integer of 1 to 3.
- Rf′ is a divalent perfluoroalkylene or perfluorooxyalkylene group
- M is a group of the formula (ii) and/or a group of the formula (iii): wherein Rf 4 is monovalent perfluoroalkyl or perfluoropolyether group as in Rf 3 and g is 1 to 3, with the proviso that there are present at least two groups of formula (ii) per molecule.
- Examples of the divalent perfluoroalkylene or perfluorooxyalkylene group represented by Rf′ include divalent perfluoroalkylene groups of the formula: —C c F 2c — wherein c is an integer from 1 to 20, and preferably from 2 to 10, and divalent perfluorooxyalkylene groups of the formulae: wherein m+n is an integer of 1 to 200 and r is an integer of 2 to 6 and —(CF 2 O) m —(CF 2 CF 2 O) n —CF 2 — wherein each of m and n is an integer from 1 to 50.
- suitable compounds having fluorinated groups (B-2) include the following compounds. They may be used alone or in admixture of two or more, or in admixture with component (B-1) described above. Note that Me is methyl and Ph is phenyl.
- Component (B) is generally included in an amount effective for curing components (A) and (E), specifically an amount of supplying preferably 0.2 to 2 moles, and more preferably 0.5 to 1.3 moles, of hydrosilyl (SiH) groups per mole of total alkenyl groups on components (A) and (E). Too little hydrosilyl (SiH) groups may lead to an inadequate degree of crosslinking or under-cure, whereas too much may cause foaming during curing.
- Component (C) is a reinforcing filler. It is added to the curable perfluoropolyether rubber composition for the purposes of improving mechanical strength, thermal stability, weatherability, chemical resistance or flame retardance, reducing heat shrinkage upon curing, or reducing a coefficient of thermal expansion or a gas permeability of an elastomer resulting from curing. The major purpose is to improve mechanical strength.
- Examples of the reinforcing filler (C) include fumed silica, wet silica, ground silica, calcium carbonate, diatomaceous earth, carbon black, and various powdered metal oxides excluding alumina. They may have been treated with surface treating agents. From the mechanical strength standpoint, fumed silica is preferred; and from the dispersion standpoint, fumed silica treated with silane surface treating agents is most preferred.
- Hydrophobic treating agents for dry silica also known as fumed silica
- silicon compounds having hydrolyzable groups for example, organochlorosilanes such as dimethyldichlorosilane and trimethylchlorosilane, silazane compounds such as hexamethyldisilazane, and cyclic silazane compounds such as hexamethylcyclotrisilazane.
- organochlorosilanes such as dimethyldichlorosilane and trimethylchlorosilane
- silazane compounds such as hexamethyldisilazane
- cyclic silazane compounds such as hexamethylcyclotrisilazane.
- dry silica surface treated with organochlorosilane is preferred for mechanical strength.
- Silica treated to be hydrophobic should preferably have a specific surface area of at least 50 m 2 /g in order to improve mechanical properties.
- the specific surface area should be up to 300 m 2 /g because otherwise silica-compounded compositions have too much a viscosity buildup.
- silica fine powder which has been surface treated with surface treating agents for hydrophobization
- direct treatment in the particulate state is preferred. Any commonly known techniques may be employed for the surface treatment.
- untreated silica powder is fed along with a treating agent to a closed mechanical mixing unit or a fluidized bed under atmospheric pressure where they are admixed together for treatment at room temperature or elevated temperature, optionally in the presence of an inert gas.
- a catalyst and water for promoting hydrolysis may be used. Kneading is followed by drying, leaving the treated silica fine powder.
- the amount of the treating agent used may be at least the amount computed from the coverage area for the treating agent.
- the silica filler should preferably have a bulk density of 30 to 80 g/l.
- a silica filler with a bulk density of less than 30 g/l may provide a composition with a viscosity buildup to interfere with compounding.
- a silica filler with a bulk density of more than 80 g/l may fail to achieve a sufficient reinforcement effect.
- the reinforcing filler is preferably added in an amount of 1 to 200 parts by weight per 100 parts by weight of component (A). An amount of 1 to 60 parts by weight is more preferred for consistent mechanical properties. Less than 1 pbw of the filler is too small to be uniformly dispersed in the composition whereas more than 200 pbw is difficult to compound because of a noticeable viscosity buildup.
- component (C) in curable perfluoropolyether gel compositions as an additive for the purposes of providing reinforcement and thixotropy thereto.
- An appropriate amount of component (C) added to curable perfluoropolyether gel compositions is preferably 0 to 20 parts by weight per 100 parts by weight of components (A), (B) and (E) combined. The preferred amount is 0 to 10 parts by weight when properties of gel cured products are considered. More than 20 parts by weight of the filler fails to provide elastic properties as gel.
- Component (D) is a hydrosilylation catalyst which promotes addition reaction between alkenyl groups in components (A) and (E) and hydrosilyl groups in component (B).
- the hydrosilylation catalysts are typically noble metal compounds which are expensive. Platinum and platinum compounds are thus used because they are readily available.
- platinum compounds include chloroplatinic acid, complexes of chloroplatinic acid with olefins such as ethylene, complexes of chloroplatinic acid with alcohols and vinylsiloxanes, and metallic platinum supported on silica, alumina or carbon though not limited thereto.
- Known platinum group metal compounds other than the platinum compounds include rhodium, ruthenium, iridium, and palladium compounds, for example, RhCl(PPh 3 ) 3 , RhCl(CO)(PPh 3 ) 2 , Ru 3 (CO) 12 , IrCl(CO)(PPh 3 ) 2 , and Pd(PPh 3 ) 4 wherein Ph denotes phenyl.
- the amount of the hydrosilylation catalyst used may be a catalytic amount, and preferably an amount to give 0.1 to 100 ppm of platinum group metal based on the total weight of components (A), (B), (C) and (E).
- Component (E) is a polyfluoromonoalkenyl compound containing one alkenyl group per molecule and having a perfluoropolyether structure in its backbone. It is preferably a polyfluoromonoalkenyl compound having the general formula (2): Rf 2 -(X—) p —CH ⁇ CH 2 (2) wherein X′ and p are as defined above, Rf 2 is a group of the general formula: F—[CF(CF 3 )CF 2 O] w —CF(CF 3 )— wherein w is an integer of 1 to 500.
- n is an integer of 1 to 500.
- an appropriate amount of the polyfluoromonoalkenyl compound having formula (2) compounded is 1 to 300 parts, preferably 50 to 250 parts by weight per 100 parts by weight of component (A) or linear perfluoropolyether dialkenyl compound.
- the perfluoropolyether composition of the invention may further comprise (F) a nonfunctional fluoropolymer having a perfluoropolyether structure comprising recurring units —C a F 2a O— wherein a is as defined above, but free of alkenyl groups.
- This nonfunctional fluoropolymer is most preferably linear.
- the linear perfluoropolyether compound when compounded as component (F), serves to improve chemical resistance, solvent resistance and low-temperature properties without detracting from physical properties. Particularly when it is compounded in perfluoropolyether rubber and gel compositions, it is effective for imparting improved low-temperature properties, typically lowering the glass transition temperature.
- Component (F) is preferably at least one linear perfluoropolyether compound selected from the class consisting of compounds having the general formula (3): A-O—(CF 2 CF 2 CF 2 O) d -A (3) wherein A is a group of C e F 2e+1 —wherein e is 1 to 3, and d is an integer of 1 to 500, and compounds having the general formula (4): A-O—(CF 2 O) f (CF 2 CF 2 O) h -A (4) wherein A is as defined above, and f and h each are an integer of 1 to 300.
- component (F) are: CF 3 O—(CF 2 CF 2 CF 2 O) n —CF 2 CF 3 and CF 3 —[(OCF 2 CF 2 ) n (OCF 2 ) m ]—O—CF 3 wherein m is an integer of 1 to 200, n is an integer of 1 to 200, and m+n is 1 to 200.
- component (F) compounded varies whether the perfluoropolyether composition is a rubber or gel composition.
- the preferred amount of component (F) is 20 to 100 parts by weight per 100 parts by weight of components (A) and (E) combined, i.e., polyfluorodialkenyl compound plus polyfluoromonoalkenyl compound.
- the preferred amount of component (F) is 10 to 50 parts by weight per 100 parts by weight of component (A).
- Component (F) may be one or more of suitable compounds.
- compositions of the invention may further comprise various additives.
- Suitable hydrosilylation catalyst regulators include acetylenic alcohols such as 1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-penten-3-ol and phenylbutynol; 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; polymethylvinylsiloxane cyclic compounds; and organophosphorus compounds.
- the addition of such regulators keeps appropriate cure reactivity and shelf stability.
- Suitable inorganic fillers include iron oxide, zinc oxide, titanium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, and carbon black. The addition of such inorganic fillers adjusts the hardness or mechanical strength of cured products of the compositions. Hollow inorganic fillers or spherical rubbery fillers are also useful.
- any of well-known tackifiers having epoxy, alkoxy or similar groups may be added. Such tackifiers may be used in any desired amounts as long as they do not interfere with properties of the compositions or properties of the cured products.
- perfluoropolyether rubber or gel compositions of the invention cure into satisfactory products having good heat resistance, chemical resistance, solvent resistance, water repellency, oil repellency and weatherability and especially improved acid resistance and thus finding a variety of applications.
- the cured perfluoropolyether rubber can be formed by combining 100 parts by weight of component (A) with an amount of component (B) to provide 0.2 to 2.0 moles of hydrosilyl groups per mole of total alkenyl groups in component (A), 5 to 200 parts by weight of component (C), and an amount of component (D) to provide 0.1 to 100 ppm of platinum relative to the total weight of components (A), (B) and (C).
- component (F) 10 to 50 parts by weight of component (F) may be added if desired for reducing the glass transition temperature.
- the cured rubber is formed by any of prior art well-known techniques, for example, by casting the composition into a suitable mold and causing the composition to cure therein, by coating the composition onto a suitable substrate and curing it thereto, or by lamination.
- the curing is readily achieved by heating at a temperature of about 60 to about 150° C. for about 30 to about 180 minutes.
- the cured rubber thus obtained is typically a rubber material having a hardness of 10 to 80 according to JIS K6253, a glass transition temperature of up to ⁇ 60° C., and a gasoline saturation swell factor of up to 6% at 23° C.
- the cured perfluoropolyether gel can be formed by combining 100 parts by weight of component (A) with 1 to 300 parts by weight of component (E), an amount of component (B) to provide 0.2 to 2.0 moles of hydrosilyl groups per mole of total alkenyl groups in components (A) and (E), and an amount of component (D) to provide 0.1 to 100 ppm of platinum relative to the total weight of components (A), (B) and (E). To the mix, 20 to 100 parts by weight of component (F) may be added if desired for reducing the glass transition temperature.
- the cured gel is formed by any of prior art well-known techniques, for example, by casting the composition into a suitable mold and causing the composition to cure therein, by coating the composition onto a suitable substrate and curing it thereto, or by lamination.
- the curing is readily achieved by heating at a temperature of about 60 to about 150° C. for about 30 to about 180 minutes.
- the cured gel thus obtained is typically a gel material having a penetration of 10 to 150 according to the consistency test (using a 1 ⁇ 4 cone) of JIS K2220 or ASTM D-1403, a glass transition temperature of up to ⁇ 60° C., and a gasoline saturation swell factor of up to 6% at 23° C.
- Rubber or gel articles comprising the cured perfluoropolyether rubber or gel compositions of the invention are suitable for use in a variety of applications, for example, automobiles, chemical plants, ink jet printers, semiconductor manufacturing lines, analytical or scientific instruments, medical equipment, aircraft, and fuel cells.
- rubber or gel articles comprising the cured perfluoropolyether rubber or gel compositions of the invention are suitable for use as rubber parts for automobiles, rubber parts for chemical plants, rubber parts for ink jet printers, rubber parts for semiconductor manufacturing lines, rubber parts for analytical and scientific instruments, rubber parts for medical equipment, rubber parts for aircraft, tent coating materials, sealants, molded parts, extruded parts, coats, copier roll materials, electrical and electronic moisture-proof coatings, sensor potting materials, fuel cell sealing materials, and laminate rubber fabrics.
- rubber or gel articles comprising the cured compositions of the invention include, but are not limited to,
- rubber parts for automobiles for example, diaphragms such as fuel regulator diaphragms, pulsation damper diaphragms, oil pressure switch diaphragms, and EGR diaphragms, valves such as canister valves and power control valves, O-rings such as quick connector O-rings and injector O-rings, and seals such as oil seals and cylinder head gaskets;
- diaphragms such as fuel regulator diaphragms, pulsation damper diaphragms, oil pressure switch diaphragms, and EGR diaphragms
- valves such as canister valves and power control valves
- O-rings such as quick connector O-rings and injector O-rings
- seals such as oil seals and cylinder head gaskets
- rubber parts for chemical plants for example, pump diaphragms, valves, O-rings, packings, oil seals, and gaskets;
- rubber parts for ink jet printers and semiconductor manufacturing lines for example, diaphragms, valves, O-rings, packings, and gaskets;
- rubber parts for analytical and scientific instruments and medical equipment for example, pump diaphragms, O-rings, packings, valves, and joints;
- rubber parts for aircraft for example, O-rings, face seals, packings, gaskets, diaphragms, and valves in fluid piping for engine oil, jet fuel, hydraulic oil and Skydrol®;
- rubber parts for fuel cells for example, sealants between electrodes, O-rings, face seals, packings, gaskets, diaphragms, and valves in hydrogen, air and coolant water feed pipes;
- electric and electronic moisture-proof coating materials and sensor potting materials for use in, for example, gas pressure sensors, hydraulic pressure sensors, temperature sensors, humidity sensors, rotation sensors, gravity sensors, timing sensors, air flow meters, electronic circuits, semiconductor modules, and various control units.
- inventive compositions When the inventive compositions are potted or coated onto substrates to form cured products thereon, it is advantageous to use conventional primers in order to improve the bond or adhesion of the inventive compositions to substrates.
- primers prevents penetration of chemicals and solvents from the substrate interface, and improves the acid resistance, chemical resistance and solvent resistance of entire parts.
- primers including a silane primer based on a silane coupling agent, an organohydrogenpolysiloxane-based primer, a synthetic rubber-based primer, an acrylic resin-based primer, a urethane resin-based primer, and an epoxy resin-based primer.
- the cured products of the inventive compositions preferably have a weight gain of up to 6% when saturated in gasoline at 23° C. If this weight gain is more than 6%, the cured products may fail to exert their own performance with a possibility that swelling cause malfunction of the associated electric or electronic part or allow leakage from the seal.
- the cured products of the inventive compositions also preferably have a weight gain of up to 8% when immersed in conc. sulfuric acid (98%) at 23° C. If this weight gain is more than 8%, the cured products may allow leakage from the seal or premature occurrence of corrosion in protected substrates or electric or electronic parts.
- a composition was prepared by combining 100 pbw of a polymer having formula (10) (viscosity 5,600 cSt) with 1.5 pbw of fumed silica Aerosil R972 (Aerosil Co., Ltd.). There were further added 0.3 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.2 pbw of a toluene solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 0.5 wt %), and 3.3 pbw of a compound having formula (11), followed by mixing.
- the composition was press molded at 150° C. for 10 minutes and post-cured at 150° C. for 50 minutes, forming a cured product, designated Rubber A. Physical properties of the cured product were measured according to JIS K6249. The results are shown in Table 1.
- a composition was prepared by combining 100 pbw of a polymer having formula (12) (viscosity 7,500 cSt) with 4 pbw of Aerosil R976 (Aerosil Co., Ltd.). There were further added 0.3 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.2 pbw of a toluene solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 0.5 wt %), and 2.7 pbw of a compound having formula (13), followed by mixing.
- a polymer having formula (12) viscosity 7,500 cSt
- Aerosil R976 Aerosil Co., Ltd.
- the composition was press molded at 150° C. for 10 minutes and post-cured at 150° C. for 50 minutes, forming a cured product, designated Rubber B. Physical properties of the cured product were measured according to JIS K6249. The results are shown in Table 1.
- a composition was prepared by combining 100 pbw of a polymer having formula (14) (viscosity 2,500 cSt) with 4 pbw of Aerosil R976 (Aerosil Co., Ltd.). There were further added 0.3 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.2 pbw of a toluene solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 0.5 wt %), and 9.0 pbw of the compound having formula (11) used in Example 1, followed by mixing.
- a polymer having formula (14) viscosity 2,500 cSt
- Aerosil R976 Aerosil Co., Ltd.
- the composition was press molded at 150° C. for 10 minutes and post-cured at 150° C. for 50 minutes, forming a cured product, designated Rubber C. Physical properties of the cured product were measured according to JIS K6249. The results are shown in Table 1.
- the cured products of Examples 1 and 2 and Comparative Example 1 were measured for permeability of various gases (CO 2 , NO 2 and SO 2 ) and water vapor.
- the test for gas permeability was conducted at a temperature of 30° C. using a gas permeability meter M-C3 by Toyo Seiki Mfg. Co., Ltd. and expressed in unit of x10 ⁇ 9 cm 3 (STP).cm/cm 2 .sec.cmHg.
- STP gas permeability meter M-C3 by Toyo Seiki Mfg. Co., Ltd. and expressed in unit of x10 ⁇ 9 cm 3 (STP).cm/cm 2 .sec.cmHg.
- the test for water vapor permeability was conducted at a temperature of 40° C. and a relative humidity of 90% according to JIS Z0208.
- a sample of the composition was weighed and cured in a glass container having a diameter of 30 mm and a height of 15 mm where it was immersed in gasoline at 23° C. A percent weight change was determined upon saturation swell at 23° C.
- a sample of the composition was poured in a test tube having a diameter of 8 mm and a length of 90 mm to a height of 30 mm from the bottom, cured therein, and immersed in an acidic solution having a predetermined concentration at 23° C. for 3 days. A percent weight change before and after the immersion was determined.
- a sample of the composition was poured in a test tube having a diameter of 8 mm and a length of 90 mm to a height of 30 mm from the bottom, cured therein, and immersed in conc. sulfuric acid at 23° C. for 3 days. Changes of rubber physical properties before and after the immersion were determined.
- Rubber D is a silicone rubber based on dimethylsilicone, available as KE951 from Shin-Etsu Chemical Co., Ltd.
- Rubber E is a fluorosilicone rubber based on a copolymer of dimethylsilicone and trifluoropropyl group-containing silicone, available as FE271 from Shin-Etsu Chemical Co., Ltd.
- a composition was prepared by combining 65 pbw of a polymer having formula (12) and 10 pbw of a polymer having formula (15) (viscosity 650 cSt) with 25 pbw of a polymer having formula (16), 0.15 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.015 pbw of an ethanol solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 3.0 wt %), and 14.2 pbw of a compound having formula (17), followed by mixing.
- the composition was heated at 150° C. for one hour, forming a gel product, designated Gel A.
- the penetration of this gel was measured according to ASTM D-1403 using a 1 ⁇ 4 cone. The results are shown in Table 2.
- a composition was prepared by combining 45 pbw of the polymer having formula (10) and 22 pbw of a polymer having formula (18) (viscosity 1000 cSt) with 33 pbw of a polymer having formula (19), 0.15 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.015 pbw of an ethanol solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 3.0 wt %), and 8.5 pbw of a compound having formula (20), followed by mixing.
- the composition was heated at 150° C. for one hour, forming a gel product, designated Gel B.
- the penetration of this gel was measured according to ASTM D-1403 using a 1 ⁇ 4 cone. The results are shown in Table 2.
- a composition was prepared by combining 35 pbw of the polymer having formula (14) and 40 pbw of the polymer having formula (15) (viscosity 1000 cSt) with 25 pbw of the polymer having formula (16), 0.15 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.015 pbw of an ethanol solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 3.0 wt %), and 13.5 pbw of a compound having formula (21), followed by mixing.
- the composition was heated at 150° C. for one hour, forming a gel product, designated Gel C.
- the penetration of this gel was measured according to ASTM D-1403 using a 1 ⁇ 4 cone. The results are shown in Table 2.
- a composition was prepared by combining 40 pbw of the polymer having formula (10) and 35 pbw of the polymer having formula (15) (viscosity 1000 cSt) with 25 pbw of the polymer having formula (16), 0.15 pbw of a 50% toluene solution of ethynyl cyclohexanol, 0.015 pbw of an ethanol solution of chloroplatinic acid-vinylsiloxane complex (platinum metal concentration 3.0 wt %), and 8.1 pbw of a compound having formula (22), followed by mixing.
- the composition was heated at 150° C. for one hour, forming a gel product, designated Gel D.
- the penetration of this gel was measured according to ASTM D-1403 using a 1 ⁇ 4 cone. The results are shown in Table 2.
- a sample of the composition was weighed and cured in a glass container having a diameter of 30 mm and a height of 15 mm where it was immersed in gasoline at 23° C. A percent weight change was determined upon saturation swell.
- a sample of the composition was poured in a test tube having a diameter of 8 mm and a length of 90 mm to a height of 30 mm from the bottom, cured therein, and immersed in an acidic solution having a predetermined concentration at 23° C. for 3 days. A percent weight change before and after the immersion was determined.
- a sample of the composition was poured in a test tube having a diameter of 8 mm and a length of 90 mm to a height of 30 mm from the bottom, cured therein, and immersed in conc. sulfuric acid at 23° C. for 3 days. A change of penetration before and after the immersion were determined.
- Gel E is a fluorosilicone gel based on trifluoropropyl group-containing silicone, available as FE57 from Shin-Etsu Chemical Co., Ltd.
- Gel F is a silicone gel based on dimethylsilicone, available as KE1052 from Shin-Etsu Chemical Co., Ltd.
- FIGS. 1 and 2 Illustrated in FIGS. 1 and 2 are a housing 1 , a comb-shaped electrode 2 , a cavity 3 , insert pins or leads 4 , a pedestal 5 , an adhesive 5 a , bonding wires 6 , and a protective material 7 .
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/468,721 US8119760B2 (en) | 2004-06-11 | 2009-05-19 | Curable perfluoropolyether compositions and rubber or gel articles comprising the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004174777 | 2004-06-11 | ||
| JP2004-174777 | 2004-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/468,721 Division US8119760B2 (en) | 2004-06-11 | 2009-05-19 | Curable perfluoropolyether compositions and rubber or gel articles comprising the same |
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| Publication Number | Publication Date |
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| US20050277731A1 true US20050277731A1 (en) | 2005-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/148,360 Abandoned US20050277731A1 (en) | 2004-06-11 | 2005-06-09 | Curable perfluoropolyether compositions and rubber or gel articles comprising the same |
| US12/468,721 Active 2026-02-23 US8119760B2 (en) | 2004-06-11 | 2009-05-19 | Curable perfluoropolyether compositions and rubber or gel articles comprising the same |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/468,721 Active 2026-02-23 US8119760B2 (en) | 2004-06-11 | 2009-05-19 | Curable perfluoropolyether compositions and rubber or gel articles comprising the same |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20050277731A1 (de) |
| EP (1) | EP1605018B1 (de) |
| JP (1) | JP5233952B2 (de) |
| DE (1) | DE602005008818D1 (de) |
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| US20060160934A1 (en) * | 2005-01-14 | 2006-07-20 | Shin-Etsu Chemical Co., Ltd. | Heat curable composition comprising fluoropolyether |
| US20060183859A1 (en) * | 2005-02-14 | 2006-08-17 | Shin-Etsu Chemical Co., Ltd. | Curable perfluoropolyether compositions and rubber or gel articles comprising the cured products of the compositions |
| US20070027236A1 (en) * | 2005-07-28 | 2007-02-01 | Bandyopadhyay Pradip K | Cold-shrink article and method of making cold-shrink article |
| US20070191554A1 (en) * | 2006-02-13 | 2007-08-16 | Shin-Etsu Chemical Co., Ltd. | Curable fluoropolyether compositions and integral molded resin/rubber articles |
| US20070218402A1 (en) * | 2006-03-14 | 2007-09-20 | Shin-Etsu Chemical Co., Ltd. | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process |
| US20080248225A1 (en) * | 2007-04-06 | 2008-10-09 | 3M Innovative Properties Company | Cold shrinkable article including a fluoroelastomer composition |
| US20080280080A1 (en) * | 2007-05-07 | 2008-11-13 | Bandyopadhyay Pradip K | Cold shrinkable article including an epichlorohydrin composition |
| US20080281032A1 (en) * | 2007-05-07 | 2008-11-13 | 3M Innovative Properties Company | Cold shrinkable article including an epichlorohydrin composition |
| US20090065236A1 (en) * | 2007-09-10 | 2009-03-12 | 3M Innovative Properties Company | Article and method for sealing fluid-containing cables |
| US20090258986A1 (en) * | 2008-04-09 | 2009-10-15 | Shin-Etsu Chemical Co., Ltd. | Room temperature curable fluoropolyether rubber composition and cured product |
| US7705085B2 (en) | 2007-04-06 | 2010-04-27 | 3M Innovative Properties Company | Fluoroelastomer composition for cold shrink articles |
| US7973241B2 (en) | 2007-09-10 | 2011-07-05 | 3M Innovative Properties Company | Pressure restraining enclosure for cables |
| US20110178263A1 (en) * | 2010-01-19 | 2011-07-21 | Shin-Etsu Chemical Co., Ltd. | Addition-cure fluoropolyether adhesive composition |
| US20130240778A1 (en) * | 2012-03-19 | 2013-09-19 | Nippon Valqua Industries, Ltd. | Thermally conductive resin composition and thermally conductive sheet including the same |
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| US20160222170A1 (en) * | 2015-02-04 | 2016-08-04 | Shin-Etsu Chemical Co., Ltd. | Photo-curable fluoropolyether-based rubber composition, curing method thereof and cured product obtained by the curing method |
| CN110772020A (zh) * | 2019-11-25 | 2020-02-11 | 西安和光明宸科技有限公司 | 一种防摔水杯 |
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| JP6160540B2 (ja) | 2014-03-31 | 2017-07-12 | 信越化学工業株式会社 | 硬化性パーフルオロポリエーテル系ゲル組成物及びその硬化物を用いたゲル製品 |
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| EP3889220B1 (de) * | 2018-11-28 | 2023-09-20 | Shin-Etsu Chemical Co., Ltd. | Kautschukzusammensetzung auf der basis von perfluorpolyether, daraus hergestelltes gehärtetes produkt und produkt damit |
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| US20020095009A1 (en) * | 2000-11-30 | 2002-07-18 | Makoto Sato | Curable fluoropolyether base rubber compositions |
| US6552152B2 (en) * | 2000-06-29 | 2003-04-22 | Shin-Etsu Chemical Co., Ltd. | Curable fluoropolyether rubber compositions |
| US20040014889A1 (en) * | 2002-07-10 | 2004-01-22 | Kenichi Fukuda | Curable compositions and electric/electronic parts |
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| JP3487744B2 (ja) * | 1997-10-09 | 2004-01-19 | 信越化学工業株式会社 | 硬化性組成物 |
| JP3646775B2 (ja) | 1999-03-02 | 2005-05-11 | 信越化学工業株式会社 | 硬化性フルオロポリエーテル系ゴム組成物 |
| JP3944684B2 (ja) | 2000-12-21 | 2007-07-11 | 信越化学工業株式会社 | フッ素ゴム組成物及びその製造方法 |
| JP3835536B2 (ja) * | 2001-02-20 | 2006-10-18 | 信越化学工業株式会社 | 含フッ素硬化性組成物 |
| US6815492B2 (en) * | 2001-08-29 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Rubber parts for aircraft |
| JP2003183493A (ja) * | 2001-08-29 | 2003-07-03 | Shin Etsu Chem Co Ltd | 航空機用ゴム部品 |
| JP3985133B2 (ja) * | 2001-12-21 | 2007-10-03 | 信越化学工業株式会社 | チキソ性含フッ素硬化性組成物及びこれを用いた封止物 |
| JP2003198084A (ja) | 2001-12-28 | 2003-07-11 | Nikko Materials Co Ltd | プリント配線基板用複合箔及びその製造方法 |
| JP3815778B2 (ja) * | 2002-01-10 | 2006-08-30 | 信越化学工業株式会社 | 低ブリード性ゲル状硬化物を与える硬化性組成物 |
| JP2003327820A (ja) * | 2002-05-14 | 2003-11-19 | Shin Etsu Chem Co Ltd | 硬化性フルオロポリエーテルゴム組成物及びゴム製品 |
| JP2004045142A (ja) * | 2002-07-10 | 2004-02-12 | Shin Etsu Chem Co Ltd | 半導体圧力センサ装置 |
-
2005
- 2005-06-09 US US11/148,360 patent/US20050277731A1/en not_active Abandoned
- 2005-06-10 DE DE602005008818T patent/DE602005008818D1/de not_active Expired - Lifetime
- 2005-06-10 EP EP05253598A patent/EP1605018B1/de not_active Ceased
-
2009
- 2009-05-19 US US12/468,721 patent/US8119760B2/en active Active
- 2009-10-23 JP JP2009244611A patent/JP5233952B2/ja not_active Expired - Fee Related
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|---|---|---|---|---|
| US6552152B2 (en) * | 2000-06-29 | 2003-04-22 | Shin-Etsu Chemical Co., Ltd. | Curable fluoropolyether rubber compositions |
| US20020095009A1 (en) * | 2000-11-30 | 2002-07-18 | Makoto Sato | Curable fluoropolyether base rubber compositions |
| US20040014889A1 (en) * | 2002-07-10 | 2004-01-22 | Kenichi Fukuda | Curable compositions and electric/electronic parts |
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060160934A1 (en) * | 2005-01-14 | 2006-07-20 | Shin-Etsu Chemical Co., Ltd. | Heat curable composition comprising fluoropolyether |
| US20060183859A1 (en) * | 2005-02-14 | 2006-08-17 | Shin-Etsu Chemical Co., Ltd. | Curable perfluoropolyether compositions and rubber or gel articles comprising the cured products of the compositions |
| US7671160B2 (en) | 2005-02-14 | 2010-03-02 | Shin-Etsu Chemical Co., Ltd. | Curable perfluoropolyether compositions and rubber or gel articles comprising the cured products of the compositions |
| US20070027236A1 (en) * | 2005-07-28 | 2007-02-01 | Bandyopadhyay Pradip K | Cold-shrink article and method of making cold-shrink article |
| US7553894B2 (en) | 2005-07-28 | 2009-06-30 | 3M Innovative Properties Company | Cold-shrink article and method of making cold-shrink article |
| US20070191554A1 (en) * | 2006-02-13 | 2007-08-16 | Shin-Etsu Chemical Co., Ltd. | Curable fluoropolyether compositions and integral molded resin/rubber articles |
| US20070218402A1 (en) * | 2006-03-14 | 2007-09-20 | Shin-Etsu Chemical Co., Ltd. | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process |
| US7485408B2 (en) | 2006-03-14 | 2009-02-03 | Shin-Etsu Chemical Co., Ltd. | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process |
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| US20110178263A1 (en) * | 2010-01-19 | 2011-07-21 | Shin-Etsu Chemical Co., Ltd. | Addition-cure fluoropolyether adhesive composition |
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| US20130240778A1 (en) * | 2012-03-19 | 2013-09-19 | Nippon Valqua Industries, Ltd. | Thermally conductive resin composition and thermally conductive sheet including the same |
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| US20160222170A1 (en) * | 2015-02-04 | 2016-08-04 | Shin-Etsu Chemical Co., Ltd. | Photo-curable fluoropolyether-based rubber composition, curing method thereof and cured product obtained by the curing method |
| US20170137583A1 (en) * | 2015-02-04 | 2017-05-18 | Shin-Etsu Chemical Co., Ltd. | Method for producing a cured product |
| US9840601B2 (en) * | 2015-02-04 | 2017-12-12 | Shin-Etsu Chemical Co., Ltd. | Method for producing a cured product |
| US20210146662A1 (en) * | 2017-05-31 | 2021-05-20 | Osaka University | Layered product and method for producing same |
| US11208529B2 (en) * | 2017-12-27 | 2021-12-28 | AGC Inc. | Fluorinated ether compound, fluorinated ether composition, coating liquid, article and its production method |
| CN110772020A (zh) * | 2019-11-25 | 2020-02-11 | 西安和光明宸科技有限公司 | 一种防摔水杯 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8119760B2 (en) | 2012-02-21 |
| EP1605018A1 (de) | 2005-12-14 |
| DE602005008818D1 (de) | 2008-09-25 |
| EP1605018B1 (de) | 2008-08-13 |
| JP5233952B2 (ja) | 2013-07-10 |
| US20090292096A1 (en) | 2009-11-26 |
| JP2010043281A (ja) | 2010-02-25 |
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Owner name: SHIN-ETSU CHEMICAL CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FUKUDA, KENICHI;SHIONO, MIKIO;KISHITA, HIROFUMI;REEL/FRAME:016679/0252 Effective date: 20050525 |
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| STCB | Information on status: application discontinuation |
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