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US20050214102A1 - Loading and unloading apparatus for a coating device - Google Patents

Loading and unloading apparatus for a coating device Download PDF

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Publication number
US20050214102A1
US20050214102A1 US11/038,305 US3830505A US2005214102A1 US 20050214102 A1 US20050214102 A1 US 20050214102A1 US 3830505 A US3830505 A US 3830505A US 2005214102 A1 US2005214102 A1 US 2005214102A1
Authority
US
United States
Prior art keywords
substrate
loading plate
gripper
particular according
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/038,305
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English (en)
Inventor
Holger Juergensen
Johannes Kaeppeler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aixtron SE
Original Assignee
Aixtron SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aixtron SE filed Critical Aixtron SE
Priority to US11/038,305 priority Critical patent/US20050214102A1/en
Assigned to AIXTRON AG reassignment AIXTRON AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUERGENSEN, HOLGER, KAEPPELER, JOHANNES
Publication of US20050214102A1 publication Critical patent/US20050214102A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • H10P72/7618—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H10P72/3311—
    • H10P72/7602—
    • H10P72/7621—
    • H10P95/00—

Definitions

  • the invention relates to an apparatus for loading and unloading a process chamber of a coating device with at least one substrate by means of a gripper and an automated handling unit.
  • the substrates which are to be coated can be introduced into the process chamber of a coating device and removed from it again by means of a gripper of an automated handling unit.
  • a CVD process can be carried out in the process chamber.
  • the gripper can act on the substrate directly.
  • the gripper may form a tongue which engages beneath the substrate. To unload the apparatus, this tongue has to be moved under the substrate.
  • a gripper of this type can in each case only grip one substrate.
  • the substrate has to be lifted off its supporting surface slightly.
  • the substrate holder has an apparatus, for example in the form of pins, which move out of the substrate surface in order to lift the substrate.
  • the invention is based on the object of improving the loading and unloading of a process chamber with at least one substrate.
  • the apparatus has a loading plate which can be gripped by the gripper and forms a supporting location, which is formed by an edge of an opening associated with each substrate, for each at least one substrate.
  • the substrate is therefore located above the opening during loading.
  • the edge of the opening supports the edge of the substrate.
  • the bottom of the opening is formed by a recess.
  • the substrate is therefore located in a recess. The result of this is that acceleration forces applied to the loading plate cannot displace the substrate out of the supporting location.
  • the opening associated with each substrate may be circular, so that only the edge of the substrate rests on the edge of the opening.
  • the contour of the opening is preferably similar to the peripheral contour of the substrate. If the substrate is substantially circular in form, the opening is likewise circular in form, but with a smaller diameter. If the substrate has a rectangular or polygonal peripheral contour, the opening preferably has the same peripheral contour, but with a smaller diameter.
  • the loading plate per se may have a multiplicity of supporting locations and may have a substantially circular circumferential contour.
  • the supporting plate may have an annular collar on the rear side.
  • the substrate holder may have one or more pedestal-like substrate carriers, on each of which a supporting plate can be placed in such a manner that surface portions of the substrate carrier are at a gap spacing from the substrate or that the substrate rests flat on a surface portion.
  • the annular collar surrounds a receiving cavity for receiving the substrate holder.
  • the substrate carrier may be an integral part of the substrate holder. However, it is preferable for the substrate carrier to be a plate driveable in rotation on a gas bearing.
  • the supporting plate can be fitted onto this plate in such a manner that it rotates with the substrate carrier.
  • the loading plate can be located in a depression in the substrate holder, in such a manner that its surface is flush with the surface of the substrate holder.
  • the material of the loading plate and the material of the substrate holder may be identical or similar.
  • the annular collar may have a conically running inner wall.
  • the substrate carrier onto which the loading plate can be placed, may form a circumferential formation of matching shape.
  • the outer wall of the annular collar may have a circumferential groove. This circumferential groove may in turn form an annular engagement groove for a hook of the gripper to enter.
  • the gripper may preferably have two gripper arms and a hook. The length of the two gripping arms may be shorter than the diameter of the loading plate, so that as a result of the eccentric engagement of the gripping arms in the circumferential groove of the loading plate a tilting moment is produced when the loading plate is lifted. This tilting moment causes the loading plate to tilt at the moment when it is lifted.
  • the substrate holder has at least three depressions which are open toward the edge. One of these depressions forms a centering opening. This opening may have trapezoidal opening walls. A centering projection of the gripper, with which the hook is also associated, moves into this centering opening. As the centering projection moves into the centering opening, the rotatable substrate holder can be rotated slightly until it has reached its optimum orientation. This is of benefit to positionally accurate placing of the loading plate on the substrate carrier.
  • the apparatus may also have an associated removal device.
  • This removal device has vertical supports associated with each opening in the loading plate. The plate can be fitted over these vertical supports. In the process, the vertical supports penetrate through the openings in the loading plates and thereby lift the substrates off the loading plate. The substrates are then located on the vertical supports and can be collected by the same or a different gripper in order to be fed to a cassette or other intermediate loader.
  • the vertical supports may be formed by at least three vertical pins.
  • the configuration described above provides an automatic loading and unloading system for one or more substrates for a coating device.
  • the loading and/or unloading may take place within a very short time.
  • the operation can take place at process temperatures (400° C. to 1200° C.). This minimizes the times between the actual coating operations.
  • the substrates are removed from cassettes, which can hold a plurality of substrates, and transported into the reactor. After coating has taken place, the substrates are put back in the cassettes.
  • the substrates are not gripped or clamped either on their surface or at their peripheral edges. In particular, there is no contact with the surface of the substrate at any time.
  • the entire operation can take place automatically.
  • a further advantage is that no particles are generated or transported to the substrate surface during loading and unloading.
  • these substrates are first of all, outside the chamber, automatically placed in recesses in a thin loading plate which consists of an identical or similar material to the substrate holder in the chamber.
  • This loading plate is formed in such a way that only the external periphery of the substrates is located in a cut-out in this plate. The bases of these cut-outs form openings, the diameters of which are only slightly smaller than the substrate diameters.
  • This loading plate can be loaded by means of the removal device.
  • the releasable loading plate is first of all fitted over the vertical supports. Then, at least one substrate is placed onto the vertical supports in an accurately positioned manner by means of a robot arm.
  • the loading plate is displaced vertically upward until the substrates are resting on the edge of the openings. Unloading is carried out in the reverse order.
  • the loading plate is then introduced into the process chamber by the gripper.
  • the centering projection described above moves into the centering opening in the substrate holder, the substrate holder is positioned by means of the centering projection, so that the loading plate can be fitted accurately over the substrate carrier.
  • the substrate carrier may be hotter than the loading plate. Then, however, heat transfer causes the loading plate to be heated up to the temperature of the substrate holder, with length expansion taking place in such a manner that the diameter of the loading plate is increased slightly.
  • the loading plate slips downward into its final position, in which the substrates either rest flat on portions of the substrate carrier or are at a defined gap spacing from the surface of the substrate holder.
  • the gap spacing is defined by the material thickness of the loading plate, which rests flat on the surface of the substrate carrier.
  • the rotationally driven substrate holder only has to be roughly pre-positioned for loading and unloading. Precision positioning is effected by the gripper itself.
  • the retaining of the loading plate on the gripper is effected when the plate is tilted as it is lifted, with a hook engaging in an annular engagement groove in the loading plate.
  • the substantially rotationally symmetrical circumferential contour of the loading plate makes it possible for the latter to be gripped by the gripper independently of its rotational position.
  • FIG. 1 shows a basic diagrammatic illustration of a substrate holder with a total of three substrate carriers, onto each of which a loading plate with a total of seven supporting locations has been fitted,
  • FIG. 2 shows a section on line II-II in FIG. 1 ,
  • FIG. 3 shows an enlarged illustration of the excerpt denoted by III in FIG. 2 .
  • FIG. 4 shows an enlarged illustration of the enlarged excerpt denoted by IV in FIG. 2 .
  • FIG. 5 shows a plan view of a loading plate held by a gripper
  • FIG. 6 shows a section on the line VI-VI in FIG. 5 .
  • FIG. 7 shows an illustration corresponding to FIG. 3 with the loading plate lifted off the gripper
  • FIG. 8 shows a perspective illustration of the loading plate held by a gripper
  • FIG. 9 shows a removal device with a loading plate fitted over vertical pins of the removal device
  • FIG. 10 shows a second exemplary embodiment of the invention in an illustration corresponding to FIG. 3 .
  • FIG. 11 shows the second exemplary embodiment of the invention in accordance with FIG. 4 .
  • the apparatus according to the invention is used in a CVD reactor.
  • a reactor of this type has a process chamber in which a defined gas phase composition is set, so that one or more layers are deposited on substrates resting on a substrate holder which forms the base of the process chamber, the layer material being supplied via the gases of the gas phase.
  • the process may be a VPE, MOCVD or, very generally, a CVD process.
  • the apparatus according to the invention is an auxiliary means for loading and unloading the process chamber with substrates in the form of a loading plate 3 which, having been equipped with substrates 1 before the process, is introduced into the process chamber, where it remains during the coating process, in order to be removed again from the process chamber, together with the substrates, after the coating process has been completed.
  • the loading plate 3 shown in the exemplary embodiments illustrated in the figures is circular in form.
  • a number of openings 5 are disposed uniformly on the surface of the loading plate 3 .
  • the openings 5 are in each case located in recesses, so that they form a recessed edge 4 on which the edge 1 ′ of in each case one substrate 1 can rest.
  • the recesses each form a supporting location 6 for a substrate 1 .
  • the circumferential contour of the recess is substantially matched to the circumferential contour of the substrate.
  • the circumferential contour of each supporting location 6 is accurately matched to the circumferential contour of the substrate 1 . Therefore, the recess, like the substrate, forms a portion which is not round.
  • the recess has a circular circumferential contour.
  • the opening 5 which forms the bottom of the recess likewise has a circular circumferential contour, the diameter of the opening 5 being smaller than the diameter of the substrate, in order to ensure that the edge of the substrate rests on the edge 4 .
  • annular collar 9 On the rear side of the loading plate 3 , which is thin in the inner region, the thickness being 1 to 3 mm, in the vicinity of the edge 3 ′′ of the loading plate 3 , there is an annular collar 9 .
  • the annular collar 9 On its side facing outward, the annular collar 9 forms an annular circumferential groove 18 which, moreover, forms an undercut annular engagement groove 12 .
  • the inwardly facing side of the annular collar 9 with a conically running flank, forms the boundary of a receiving cavity.
  • This conical flank 9 ′ can be brought into surface contact with a matching inclined flank of a substrate carrier 8 .
  • the substrate carrier 8 forms a pedestal-like elevation and during the process floats on a gas bearing which, moreover, drives the substrate carrier 8 in rotation, so that the loading plate 3 which has been fitted over the substrate carrier 8 rotates with it.
  • the substrate carrier 8 may also be an integral part of the substrate holder 7 .
  • the substrate carrier 8 is located in a depression 11 in the substrate holder 7 . It is surrounded by a circumferential groove, into which the annular collar 9 of the supporting plate 3 can move in such a manner that the surface 3 ′ is flush with the surface 7 ′ of the substrate holder 7 .
  • the surface 3 ′ if appropriate, for fluid dynamics reasons, to be raised with respect to the surface 7 .
  • the diameters of substrate carrier 8 and annular collar 9 are matched to one another in such a manner that at process temperature the underside of the loading plate 3 rests on the top side of the substrate carrier 8 .
  • the loading plate 3 is subject to thermal expansion and then slips down into its final position.
  • the material of the loading plate 3 corresponds to the material of the substrate holder 7 or of the substrate carrier 8 .
  • the substrate 1 is located at a gap spacing above the surface of the substrate carrier 8 , so that the substrate 1 is heated through thermal radiation.
  • the substrate carrier 8 has a central elevation, on which the substrate 1 rests areally.
  • the substrate 1 is lifted slightly above the edge 4 of the supporting location 6 . However, its edge can still be enclosed by the edge of the recess.
  • the loading and unloading are carried out using a gripper 2 .
  • This gripper has two fork-like gripping arms 14 which can engage, by means of gripping sections 14 ′, in the said annular circumferential groove 18 (cf. FIG. 6 ). Consequently, the gripping arm 14 can engage beneath the outer edge 3 ′′ of the loading plate 3 in order to lift the loading plate 3 out of its position in the depression 11 in the substrate holder 7 .
  • the gripping arms 14 project into passages 17 in the substrate holder 7 which are open toward the edge.
  • a centering opening 15 is located between the two passages 17 .
  • the centering opening 15 has a trapezoidal outline contour with inclined walls.
  • a hook 13 is formed integrally on this centering projection 16 . This hook 13 enters the annular circumferential groove 18 .
  • the substrate holder 7 To move the substrate holder 7 into the correct rotary orientation, it has ribs/grooves, which can be optically scanned, on its circumferential surface. This means that the centering is possible not only by mechanical means but also by optical means.
  • the length of the gripping arms 14 is shorter than the diameter of the loading plate 3 . Therefore, the axis A, which is defined by engagement of the gripping portions 14 ′ on the loading plate 3 , is located eccentrically with respect to the diagonal M, so that a tilting moment occurs when the loading plate 3 is lifted. The tilting of the loading plate 3 causes the hook 13 to engage in the annular engagement groove 12 . As a result of this engagement, the loading plate 3 cannot slip out of the gripper 2 when the gripper executes translational movements.
  • the substrates 1 are picked up and put down with the aid of a removal device 19 indicated outside the process chamber.
  • This removal device 19 is substantially a plate which is disposed in the horizontal plane and from which a multiplicity of vertical supports project.
  • Each vertical support comprises a total of three vertical pins 20 .
  • These three vertical pins 20 in each case penetrate through one opening 5 defining a supporting location 6 . If the loading plate 3 is fitted over the vertical pins 20 in this way, the substrates are lifted out of their supporting locations 6 and, in the position illustrated in FIG. 9 , can be gripped by other grippers in order to be fed to cassettes or the like.
  • the loading of the loading plate 3 with substrates takes place in the reverse order.
  • the substrates are placed onto the vertical pins 20 by means of a gripper (not shown) in such a manner that they are aligned above the supporting locations 6 . If the gripper 2 is then raised in the vertical direction, the substrates 1 move into the supporting locations 6 .
  • the substrate holder has only one substrate carrier 8 , which is in the form of a pedestal.
  • the material of this substrate carrier 8 may also be joined integrally with the substrate holder 7 . In this configuration too it is provided that the substrate holder 8 as a whole be driven in rotation.
  • the loading plate 3 has only a single opening 5 for a single substrate.
  • the substrate holder may include a planetary gear mechanism with a toothed ring, which has an internal toothing and extends close to the edge, and a central, externally toothed sun wheel which is driveable in rotation, the two toothings meshing with planet wheels, and a substrate carrier being associated with each planet wheel.
  • the apparatus according to the invention is suitable for the production of all compound semiconductors, in particular for processes for producing silicon semiconductors for high-k, ferroelectric and other silicon processes.
  • the apparatus is suitable in particular for the production of displays.
  • the apparatus can be used together with one or more robots for loading and unloading a reactor. It is possible to use both rectangular and round substrates.
  • the apparatus can be used with various automated handling units and their grippers. It is also possible for a metal, silicon oxide, graphite, molybdenum or other suitable material to be used as material for the loading plate.
  • the apparatus can be operated at high temperatures (over 1000°) and at low temperatures (below 600°) and at high and low process chamber pressures (0.1 to 1000 mbar).
  • the apparatus is distinguished by the fact that very short loading times are possible.
  • the process chamber does not need to be completely cooled during loading.
  • the automated handling unit can be docked to the substrate holder under mechanical or optical control.
  • the robot can interact with a plurality of process chambers.
  • the loading plate can be removed from one process chamber and fed to another process chamber. It is also provided that an empty loading plate can be cleaned in a special apparatus. However, the cleaning of the loading plate may also take place in a process chamber. The cleaning can be carried out, for example, by etching.
  • the substrates can be transported, together with the loading plate, from one process chamber into other process chambers or into an intermediate position.
  • the apparatus can also be used in combination with inspection devices, such as FTIR or ellipsometry.
  • the apparatus is in very general terms suitable for any CVD process and also for any condensation coating process. It can be used for the deposition of metals, insulators, semiconductor layers formed from the elements of groups IV,III-II-V and from organic materials. Suitable substrate materials are any type of solids, in particular silicon, III-V semiconductors, II-VI semiconductors or insulators, such as glass. In particular plastic for display production can be used as substrate. A condensation process is used especially for the production of displays.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
US11/038,305 2002-07-19 2005-01-19 Loading and unloading apparatus for a coating device Abandoned US20050214102A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/038,305 US20050214102A1 (en) 2002-07-19 2005-01-19 Loading and unloading apparatus for a coating device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10232731A DE10232731A1 (de) 2002-07-19 2002-07-19 Be- und Entladevorrichtung für eine Beschichtungseinrichtung
DE10232731.9 2002-07-19
PCT/EP2003/007244 WO2004009299A2 (de) 2002-07-19 2003-07-07 Be- und entladevorrichtung für eine beschichtungseinrichtung
US11/038,305 US20050214102A1 (en) 2002-07-19 2005-01-19 Loading and unloading apparatus for a coating device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/007244 Continuation WO2004009299A2 (de) 2002-07-19 2003-07-07 Be- und entladevorrichtung für eine beschichtungseinrichtung

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US11/781,779 Division US7762208B2 (en) 2002-07-19 2007-07-23 Loading and unloading apparatus for a coating device

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US11/038,305 Abandoned US20050214102A1 (en) 2002-07-19 2005-01-19 Loading and unloading apparatus for a coating device
US11/781,779 Expired - Fee Related US7762208B2 (en) 2002-07-19 2007-07-23 Loading and unloading apparatus for a coating device

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US (2) US20050214102A1 (de)
EP (1) EP1523585B1 (de)
JP (1) JP4358108B2 (de)
KR (1) KR101125431B1 (de)
AU (1) AU2003246389A1 (de)
DE (2) DE10232731A1 (de)
TW (1) TWI314503B (de)
WO (1) WO2004009299A2 (de)

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US20040182310A1 (en) * 2001-07-04 2004-09-23 Johannes Kaeppeler CVD device with substrate holder with differential temperature control
US20080149590A1 (en) * 2006-12-20 2008-06-26 Kenji Maeda Substrate-Holder, Etching Method of the Substrate, and the Fabrication Method of a Magnetic Recording Media
WO2009047597A1 (en) * 2007-10-10 2009-04-16 Lpe S.P.A. Tool for handling a susceptor, and machine for treating substrates and/or wafers using it
US20100037827A1 (en) * 2001-07-04 2010-02-18 Johannes Kaeppeler CVD Device with Substrate Holder with Differential Temperature Control
CN102569153A (zh) * 2010-12-28 2012-07-11 夏普株式会社 工件夹具
US20120231158A1 (en) * 2009-11-19 2012-09-13 Showa Denko K.K. In-line type film forming apparatus and method for manufacturing magnetic recording medium
US20130305992A1 (en) * 2011-02-04 2013-11-21 Micro System Co., Ltd. Rotating and holding apparatus for semiconductor substrate and conveying apparatus of rotating and holding apparatus for semiconductor substrate
US20140048527A1 (en) * 2005-10-12 2014-02-20 Panasonic Corporation Plasma processing apparatus and plasma processing method

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JP4878109B2 (ja) * 2004-08-24 2012-02-15 株式会社アルバック 基板移載システムおよび基板移載方法
DE102004058521A1 (de) 2004-12-04 2006-06-14 Aixtron Ag Verfahren und Vorrichtung zum Abscheiden von dicken Gallium-Nitrit-Schichten auf einem Saphirsubstrat und zugehörigen Substrathalter
KR101132633B1 (ko) * 2005-05-19 2012-04-02 주성엔지니어링(주) 반도체 제조 장치
US20070240631A1 (en) * 2006-04-14 2007-10-18 Applied Materials, Inc. Epitaxial growth of compound nitride semiconductor structures
US20070256635A1 (en) * 2006-05-02 2007-11-08 Applied Materials, Inc. A Delaware Corporation UV activation of NH3 for III-N deposition
US8778079B2 (en) 2007-10-11 2014-07-15 Valence Process Equipment, Inc. Chemical vapor deposition reactor
US20100111650A1 (en) * 2008-01-31 2010-05-06 Applied Materials, Inc. Automatic substrate loading station
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US20080014057A1 (en) 2008-01-17
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US7762208B2 (en) 2010-07-27
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