US20050068474A1 - Full-color organic light-emitting diode display and method of fabricating the same - Google Patents
Full-color organic light-emitting diode display and method of fabricating the same Download PDFInfo
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- US20050068474A1 US20050068474A1 US10/725,152 US72515203A US2005068474A1 US 20050068474 A1 US20050068474 A1 US 20050068474A1 US 72515203 A US72515203 A US 72515203A US 2005068474 A1 US2005068474 A1 US 2005068474A1
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- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000002161 passivation Methods 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000011368 organic material Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 238000004528 spin coating Methods 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
Definitions
- the present invention relates to an organic light-emitting diode display and in particular to a full-color organic light-emitting diode display using top emission.
- Organic light-emitting diode displays employed therein have advantages of light emission, high luminous efficiency, wide viewing angle, fast response speed, high reliability, full color, low-voltage drive, low power consumption, and simple fabrication, making them a frequent choice in device configuration.
- the structure and the manufacture of a conventional full color OLED display involve using a precision photomask to achieve a pixel array of red, green, and blue (RGB) colors in a small molecule system, and a color filter to achieve the pixel array on a white light OLED device, light converting layers to convert the original blue or purple light into other colors of light, employing medium stacking layers of various thickness to convert original wide-band light spectrum to RGB colors, and stacking devices of RGB colors on the same pixel element on a two-sided transparent OEL device.
- RGB red, green, and blue
- the open area of the OLED display for emission is usually not large enough for strong light intensity.
- an object of the invention is to provide a full-color organic light-emitting diode (OLED) display emitting light from the top of the display, providing enhanced light intensity and life of the display.
- OLED organic light-emitting diode
- Another object of the invention is to provide a full-color OLED display with reduced thickness.
- the present invention provides a full-color OLED display comprising a substrate, a white light-emitting OLED, a first passivation layer, stacked layers of a color-converting layer and color filter, and a second passivation layer.
- the white light-emitting OLED comprising anodes, cathodes, and at least one white light-emitting organic material layer is disposed on the substrate.
- the white light-emitting organic material layer is disposed between t h e anode and the cathode.
- the first passivation layer is disposed covering the surface and sidewalls of the white light-emitting OLED.
- the stacked layers of color-converting layer and color filter are disposed on the first passivation layer and separated at intervals.
- the second passivation layer is disposed covering the surface and sidewalls of the stacked layers.
- the material of the substrate comprises glass, the first passivation layer, silicon nitride (Si 3 N 4 ) and silicon oxide (SiO 2 ), and the second passivation layer, silicon nitride (Si 3 N 4 ) and silicon oxide (SiO 2 ).
- a reflective layer is further disposed between the substrate and the white light-emitting OLED, comprising chromium (Cr) and aluminum (Al).
- the display can be actively driven, such that a plurality of transistors are further disposed on the substrate to electrically connect with the cathodes.
- the display can, conversely, be passively driven, in which case the anodes, parallel with each other and separated at intervals, are perpendicular to the cathodes, also parallel with each other and separated at intervals.
- the stacked layers are separated by a plurality of ribs at intervals, the material of the rib comprising a resin.
- a polarized plate is further disposed on the second passivation layer.
- a buffer is further disposed between the white light-emitting OLED and the first passivation layer.
- the anodes and cathodes comprise transparent conductive material.
- the present invention further provides a method of fabricating a full-color OLED display.
- a substrate is provided.
- a white light-emitting OLED comprising anodes, cathodes, and at least one white light-emitting organic material layer is formed on the substrate, wherein the white light-emitting organic material layer is disposed between the anodes and the cathodes.
- a first passivation layer is formed to cover the surface and sidewalls of the white light-emitting OLED.
- a plurality of ribs are formed on the first passivation layer, separated at intervals. Stacked layers of a color-converting layer and a color filter are disposed in the intervals between the ribs.
- a second passivation layer is formed to cover the surface and sidewalls of the stacked layers.
- a reflective layer is further formed on the substrate, and a polarized plate is formed on the second passivation layer.
- a buffer is formed on the white light-emitting OLED.
- the color-converting layer and color filter are formed by spin-coating, while the first passivation layer and the second passivation layer are formed by sputtering.
- FIGS. 1 through 6 are cross-sections illustrating a method of fabricating a full-color OLED display according to the invention
- FIG. 7 is a top view of a white light-emitting OLED of the passively driven full-color OLED display according to the invention.
- FIG. 6 a full-color organic light-emitting diode (OLED) display using top emission according to the present invention is shown.
- the display comprises a substrate 100 , a white light-emitting OLED 104 , a first passivation layer 108 , stacked layers of a color-converting layer 112 and a color filter 114 , and a second passivation layer 116 .
- the substrate 100 preferably comprises glass.
- the white light-emitting OLED 104 comprising anodes, cathodes, and at least one white light-emitting organic material layer, is disposed over the substrate 100 .
- the anodes and the cathodes are made of transparent conductive materials, such as indium tin oxide (ITO), for example.
- a reflective layer 102 can be further disposed between the substrate 100 and the white light-emitting OLED 104 .
- the material of the reflective layer 102 preferably comprises chromium (Cr) and aluminum (Al) Most light from the white light-emitting OLED 104 is reflected toward the color-converting layers 112 and color filters 114 by the reflective layer 102 .
- the first passivation layer 108 is disposed covering the surface and sidewalls of the white light-emitting OLED 104 .
- the first passivation layer 108 comprising silicon nitride (Si 3 N 4 ) and silicon oxide (SiO 2 ) is preferably formed by sputtering.
- the white light-emitting OLED 104 overlying the first passivation layer 108 may be damaged during sputtering.
- a buffer 106 comprising a polymer material is preferably formed on the white light-emitting OLED 104 by spin-coating before formation of the first passivation layer 108 .
- the stacked layers of a color-converting layer 112 and a color filter 114 are disposed on the first passivation layer 108 and separated at intervals to change and filter light from the white light-emitting OLED 104 , such that blue light, green light, and red light all can be produced. Only light of specific wavelength can pass through the color filter 114 .
- the color-converting layer 112 preferably comprising an organic material can absorb light of specific wavelength and convert it to another wavelength. Thus, wavelength, primary color of the full-color light, blue light, red light, and green light can be controlled.
- the stacked layers of the color-converting layer 112 and the color filter 114 are separated by a plurality of ribs 110 at intervals.
- the ribs 110 comprising a resin, can be set in arrays.
- the second passivation layer 116 is disposed on the entire display to cover the surface and sidewalls of the stacked layers, preventing machine and moisture damage.
- the second passivation layer 116 comprises silicon nitride (Si 3 N 4 ) and silicon oxide (SiO 2 ) or other transparent materials.
- a polarized plate 118 is further disposed on the second passivation layer 116 to enhance contrast.
- the display can be actively or passively driven.
- a plurality of transistors respectively corresponding to each of the stacked layers of color-converting layer 112 and the color filter 114 are disposed on the substrate 100 in advance to electrically connect with the cathodes to act as a switch in the circuit layout to determine if light is emitting from each of the stacked layers.
- the anodes 1042 parallel with each other and separated at intervals, are perpendicular to the cathodes 1043 , also parallel with each other and separated at intervals.
- each of the intersection points of the anodes 1042 and cathode 1043 is a pixel respectively corresponding to each of the stacked layers of color-converting layer 112 and the color filter 114 .
- the anodes 1042 and cathodes 1043 can be made of transparent conductive material.
- Each of the stacked layers of color-converting layer 112 and the color filter 114 corresponds to a pixel.
- the substrate 100 is provided, and the reflective layer 102 comprising chromium (Cr) and aluminum (Al) is formed thereon by sputtering.
- the reflective layer 102 comprising chromium (Cr) and aluminum (Al) is formed thereon by sputtering.
- the white light-emitting OLED 104 is formed on the reflective layer 102 , comprising the cathodes, the anodes, and at least one white light-emitting organic electroluminescent material.
- the anodes and the cathodes can be arranged according to the driving method of the display as mentioned above, and transistors can be formed when the display is actively driven.
- the arrangement and the relationship of the anodes, cathodes, transistors, and the stacked layers of the color-converting layer 112 and the color filter 114 are described above, thus, for brevity, are not illustrated again.
- the buffer 106 is formed on the white light-emitting OLED 104 , preferably by spin-coating.
- the first passivation layer 108 is subsequently formed to cover the buffer 106 .
- the ribs 110 are formed on the first passivation layer 108 , preferably by screen printing, and are separated from each other at intervals. Subsequently, the color-converting layer 112 and the color filter 114 are filled into the intervals between the ribs 110 by spin-coating.
- the second passivation layer 116 is formed on the surface and sidewalls of the stacked layers of the color-converting layer 112 and the color filter 114 by sputtering to cover the whole display.
- the polarized plate 118 is formed on the second passivation layer 116 to enhance contrast.
- the full-color OLED display uses top emission, with increased emission area, enhancing intensity of light and life of the device.
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Abstract
Description
- 1. Field of the Invention
- The present invention relates to an organic light-emitting diode display and in particular to a full-color organic light-emitting diode display using top emission.
- 2. Description of the Related Art
- Flat panel displays have become important elements in electronic products such as notebook computers and others. Organic light-emitting diode displays employed therein have advantages of light emission, high luminous efficiency, wide viewing angle, fast response speed, high reliability, full color, low-voltage drive, low power consumption, and simple fabrication, making them a frequent choice in device configuration.
- The structure and the manufacture of a conventional full color OLED display involve using a precision photomask to achieve a pixel array of red, green, and blue (RGB) colors in a small molecule system, and a color filter to achieve the pixel array on a white light OLED device, light converting layers to convert the original blue or purple light into other colors of light, employing medium stacking layers of various thickness to convert original wide-band light spectrum to RGB colors, and stacking devices of RGB colors on the same pixel element on a two-sided transparent OEL device.
- Generally, most conventional OLED displays use bottom emission, as disclosed in U.S. Pat. Nos. 6,114,805 and 6,121,726.
- However, the open area of the OLED display for emission is usually not large enough for strong light intensity.
- Accordingly, an object of the invention is to provide a full-color organic light-emitting diode (OLED) display emitting light from the top of the display, providing enhanced light intensity and life of the display.
- Another object of the invention is to provide a full-color OLED display with reduced thickness.
- It is further another object of the invention to provide a full-color OLED display with simplified structure.
- To achieve the above objects, the present invention provides a full-color OLED display comprising a substrate, a white light-emitting OLED, a first passivation layer, stacked layers of a color-converting layer and color filter, and a second passivation layer. The white light-emitting OLED, comprising anodes, cathodes, and at least one white light-emitting organic material layer is disposed on the substrate. The white light-emitting organic material layer is disposed between t h e anode and the cathode. The first passivation layer is disposed covering the surface and sidewalls of the white light-emitting OLED. The stacked layers of color-converting layer and color filter are disposed on the first passivation layer and separated at intervals. As well, the second passivation layer is disposed covering the surface and sidewalls of the stacked layers.
- The material of the substrate comprises glass, the first passivation layer, silicon nitride (Si3N4) and silicon oxide (SiO2), and the second passivation layer, silicon nitride (Si3N4) and silicon oxide (SiO2).
- A reflective layer is further disposed between the substrate and the white light-emitting OLED, comprising chromium (Cr) and aluminum (Al).
- The display can be actively driven, such that a plurality of transistors are further disposed on the substrate to electrically connect with the cathodes.
- The display can, conversely, be passively driven, in which case the anodes, parallel with each other and separated at intervals, are perpendicular to the cathodes, also parallel with each other and separated at intervals.
- The stacked layers are separated by a plurality of ribs at intervals, the material of the rib comprising a resin.
- A polarized plate is further disposed on the second passivation layer.
- A buffer is further disposed between the white light-emitting OLED and the first passivation layer. The anodes and cathodes comprise transparent conductive material.
- To achieve the above objects, the present invention further provides a method of fabricating a full-color OLED display. First, a substrate is provided. Next, a white light-emitting OLED comprising anodes, cathodes, and at least one white light-emitting organic material layer is formed on the substrate, wherein the white light-emitting organic material layer is disposed between the anodes and the cathodes. A first passivation layer is formed to cover the surface and sidewalls of the white light-emitting OLED. A plurality of ribs are formed on the first passivation layer, separated at intervals. Stacked layers of a color-converting layer and a color filter are disposed in the intervals between the ribs. Finally, a second passivation layer is formed to cover the surface and sidewalls of the stacked layers.
- A reflective layer is further formed on the substrate, and a polarized plate is formed on the second passivation layer. As well, a buffer is formed on the white light-emitting OLED.
- The color-converting layer and color filter are formed by spin-coating, while the first passivation layer and the second passivation layer are formed by sputtering.
- A detailed description is given in the following embodiments with reference to the accompanying drawings.
- The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
-
FIGS. 1 through 6 are cross-sections illustrating a method of fabricating a full-color OLED display according to the invention; -
FIG. 7 is a top view of a white light-emitting OLED of the passively driven full-color OLED display according to the invention. - A preferred embodiment of the present invention is now described with reference to the figures.
- In
FIG. 6 , a full-color organic light-emitting diode (OLED) display using top emission according to the present invention is shown. The display comprises asubstrate 100, a white light-emittingOLED 104, afirst passivation layer 108, stacked layers of a color-convertinglayer 112 and acolor filter 114, and asecond passivation layer 116. - The
substrate 100 preferably comprises glass. The white light-emittingOLED 104 comprising anodes, cathodes, and at least one white light-emitting organic material layer, is disposed over thesubstrate 100. The anodes and the cathodes are made of transparent conductive materials, such as indium tin oxide (ITO), for example. Areflective layer 102 can be further disposed between thesubstrate 100 and the white light-emittingOLED 104. The material of thereflective layer 102 preferably comprises chromium (Cr) and aluminum (Al) Most light from the white light-emitting OLED 104 is reflected toward the color-convertinglayers 112 andcolor filters 114 by thereflective layer 102. - The
first passivation layer 108 is disposed covering the surface and sidewalls of the white light-emittingOLED 104. Thefirst passivation layer 108 comprising silicon nitride (Si3N4) and silicon oxide (SiO2) is preferably formed by sputtering. However, the white light-emitting OLED 104 overlying thefirst passivation layer 108 may be damaged during sputtering. Thus, abuffer 106 comprising a polymer material is preferably formed on the white light-emittingOLED 104 by spin-coating before formation of thefirst passivation layer 108. - The stacked layers of a color-converting
layer 112 and acolor filter 114 are disposed on thefirst passivation layer 108 and separated at intervals to change and filter light from the white light-emitting OLED 104, such that blue light, green light, and red light all can be produced. Only light of specific wavelength can pass through thecolor filter 114. The color-convertinglayer 112 preferably comprising an organic material can absorb light of specific wavelength and convert it to another wavelength. Thus, wavelength, primary color of the full-color light, blue light, red light, and green light can be controlled. - The stacked layers of the color-converting
layer 112 and thecolor filter 114 are separated by a plurality ofribs 110 at intervals. Theribs 110, comprising a resin, can be set in arrays. - As well, the
second passivation layer 116 is disposed on the entire display to cover the surface and sidewalls of the stacked layers, preventing machine and moisture damage. Thesecond passivation layer 116 comprises silicon nitride (Si3N4) and silicon oxide (SiO2) or other transparent materials. - Moreover, a
polarized plate 118 is further disposed on thesecond passivation layer 116 to enhance contrast. - The display can be actively or passively driven. When actively driven, a plurality of transistors respectively corresponding to each of the stacked layers of color-converting
layer 112 and thecolor filter 114 are disposed on thesubstrate 100 in advance to electrically connect with the cathodes to act as a switch in the circuit layout to determine if light is emitting from each of the stacked layers. As shown inFIG. 7 , when the display is passively driven, theanodes 1042, parallel with each other and separated at intervals, are perpendicular to thecathodes 1043, also parallel with each other and separated at intervals. Thus, each of the intersection points of theanodes 1042 andcathode 1043 is a pixel respectively corresponding to each of the stacked layers of color-convertinglayer 112 and thecolor filter 114. Theanodes 1042 andcathodes 1043 can be made of transparent conductive material. - As a result, a full-color OLED display using top emission is obtained. Each of the stacked layers of color-converting
layer 112 and thecolor filter 114 corresponds to a pixel. - The formation of the full-color OLED display according to the present invention is described as follows.
- First, in
FIG. 1 , thesubstrate 100 is provided, and thereflective layer 102 comprising chromium (Cr) and aluminum (Al) is formed thereon by sputtering. - In
FIG. 2 , the white light-emittingOLED 104 is formed on thereflective layer 102, comprising the cathodes, the anodes, and at least one white light-emitting organic electroluminescent material. The anodes and the cathodes can be arranged according to the driving method of the display as mentioned above, and transistors can be formed when the display is actively driven. The arrangement and the relationship of the anodes, cathodes, transistors, and the stacked layers of the color-convertinglayer 112 and thecolor filter 114 are described above, thus, for brevity, are not illustrated again. - In
FIG. 3 , thebuffer 106 is formed on the white light-emittingOLED 104, preferably by spin-coating. Thefirst passivation layer 108 is subsequently formed to cover thebuffer 106. - In
FIG. 4 , theribs 110 are formed on thefirst passivation layer 108, preferably by screen printing, and are separated from each other at intervals. Subsequently, the color-convertinglayer 112 and thecolor filter 114 are filled into the intervals between theribs 110 by spin-coating. - In
FIG. 5 , thesecond passivation layer 116 is formed on the surface and sidewalls of the stacked layers of the color-convertinglayer 112 and thecolor filter 114 by sputtering to cover the whole display. - In
FIG. 6 , thepolarized plate 118 is formed on thesecond passivation layer 116 to enhance contrast. - There are several advantages to the present invention. First, the full-color OLED display uses top emission, with increased emission area, enhancing intensity of light and life of the device. Second, only one substrate is required, thereby both thickness and cost of the display are reduced.
- While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation to encompass all such modifications and similar arrangements.
Claims (35)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92126956 | 2003-09-30 | ||
| TW092126956A TWI220240B (en) | 2003-09-30 | 2003-09-30 | Full-color organic electroluminescent device (OLED) display and method of fabricating the same |
Publications (2)
| Publication Number | Publication Date |
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| US20050068474A1 true US20050068474A1 (en) | 2005-03-31 |
| US6882383B1 US6882383B1 (en) | 2005-04-19 |
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| TW (1) | TWI220240B (en) |
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| US20060028125A1 (en) * | 2004-08-04 | 2006-02-09 | Hoon Kim | Display device and method and apparatus for manufacturing the same |
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| WO2009053890A3 (en) * | 2007-10-23 | 2009-07-30 | Koninkl Philips Electronics Nv | A colored organic electronic device |
| US20140117335A1 (en) * | 2012-10-26 | 2014-05-01 | Samsung Display Co., Ltd. | Organic light emitting diode display |
| US20140367661A1 (en) * | 2013-06-12 | 2014-12-18 | Seiko Epson Corporation | Electro-optic device, method of manufacturing electro-optic device, and electronic apparatus |
| US10164215B2 (en) * | 2013-06-12 | 2018-12-25 | Seiko Epson Corporation | Electro-optic device that prevents deterioration of a light emitting element |
| WO2015169040A1 (en) * | 2014-05-09 | 2015-11-12 | 京东方科技集团股份有限公司 | Oled display panel and preparation method therefor, and display device |
| US9704930B2 (en) | 2014-05-09 | 2017-07-11 | Boe Technology Group Co., Ltd. | OLED display panel and fabrication method thereof, and display device |
| US11171313B2 (en) * | 2018-09-24 | 2021-11-09 | Apple Inc. | Incoherent thin film encapsulation for display |
Also Published As
| Publication number | Publication date |
|---|---|
| US6882383B1 (en) | 2005-04-19 |
| TWI220240B (en) | 2004-08-11 |
| TW200512687A (en) | 2005-04-01 |
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