[go: up one dir, main page]

US20050061661A1 - Electrodeposition device and electrodeposition system for coating structures which have already been made conductive - Google Patents

Electrodeposition device and electrodeposition system for coating structures which have already been made conductive Download PDF

Info

Publication number
US20050061661A1
US20050061661A1 US10/916,308 US91630804A US2005061661A1 US 20050061661 A1 US20050061661 A1 US 20050061661A1 US 91630804 A US91630804 A US 91630804A US 2005061661 A1 US2005061661 A1 US 2005061661A1
Authority
US
United States
Prior art keywords
electrodeposition
contact
electrically conductive
substrate
making unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/916,308
Other languages
English (en)
Inventor
Andreas Muller-Hipper
Ewald Simmerlein-Erlbacher
Andreas Karl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10234705A external-priority patent/DE10234705B4/de
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MULLER-HIPPER, ANDREAS, KARL, ANDREAS, SIMMERLEIN-ERLBACHER, EWALD
Publication of US20050061661A1 publication Critical patent/US20050061661A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to an electrodeposition device and to an electrodeposition system for the electrodeposition of an electrically conductive layer on a substrate.
  • Electrodeposition devices and electrodeposition systems are used to produce conductor structures or conductor layers which cover the entire surface.
  • antenna coils, printed circuit boards, chip card modules or the like are produced using devices of this type.
  • conductor structures of this type have been produced using subtractive processes.
  • a metal cylinder which is continuously connected as cathode, is at least partially immersed in an electrolyte bath in which there is an electrolyte and is set in rotation. There is an anode device in the electrolyte bath.
  • a metal layer is deposited on the slowly rotating cathode, and outside the electrolyte this metal layer is laminated onto a nonconductive sheet which is referred to as the substrate.
  • the minimum thickness of metal which can be achieved, since the metal foil, which is generally made from copper, is peeled off the cathode and applied to the sheet, which consists of plastic.
  • the minimum sheet thickness is limited to approximately 17 ⁇ m by the subsequent further processing, on account of the possibility of cracks then forming.
  • a further drawback is the fact that anodic cleaning of the cylindrical cathode has to take place at regular intervals.
  • the anodic cleaning may take place either with nitric acid, so that it is necessary to completely drain the electrolyte out of the electrolyte bath.
  • the electrodeposition device cannot be used for production.
  • a cathodic-anodic pulsed switching is known for cleaning purposes.
  • very high demands are imposed on the rectifier, since it has to apply very high currents for very short times in pulsed mode. Therefore, an installation of this type is very expensive in terms of procurement and maintenance costs.
  • the invention is therefore based on an object of providing an electrodeposition device and an electrodeposition system which, compared to the prior art, allows more rapid and simpler as well as less expensive production of an electrically conductive layer on a substrate.
  • the production of the electrically conductive layer by means of the electrodeposition device according to the invention takes place on a substrate which has structures which have already been made conductive.
  • the conductive structures preferably consist of conductive particles which have been applied to a surface of the substrate and -are fixed to the substrate.
  • the conductive particles are applied to the surface of the substrate in “uncovered” form, i.e. without an embedding material surrounding them.
  • the conductive particles are applied, for example, by being blown, sprayed, rolled or brushed on.
  • the particles may have been applied to the substrate body thermally and/or statically and/or magnetically and/or by means of a bonding layer.
  • the conductive particles may, for example, consist of metal, preferably of copper, iron, nickel, gold, silver, aluminum, brass or an alloy, of graphites or of conductive polymer particles.
  • the particles are preferably in powder form.
  • the substrate preferably consists of a nonconductive material, the surface of the substrate having adhesive properties.
  • the adhesive properties of the surface may be activated, for example, by the surface being softened or by the application of an adhesive.
  • the softening of the surface may be brought about by means of thermal radiation, ultrasound or a solvent.
  • the surface may for this purpose have been treated with a solvent in advance, i.e. before the application of the conductive particles.
  • the conductive particles may also be pretreated with a solvent before they are applied to the substrate body.
  • the application of the conductive particles to the substrate means that the desired conductor structure, which may, of course, also cover the entire surface, is already defined.
  • the pretreatment of the substrate ensures that the conductive particles continue to adhere to the substrate only at those locations at which a bonding agent is provided.
  • the electrodeposition device or the electrodeposition system therefore serves to thicken the conductive particles by electrodeposition. It can be seen from this description that in the electrodeposition device according to the invention it is possible to dispense with a supply belt—the sheet described in the introduction—since only the layout which is actually desired, i.e. for example a conductor structure, is subjected to electrodeposition.
  • the electrodeposition device according to the invention for the electrodeposition of an electrically conductive layer on the substrate has an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions, of which in each case at least one is connected cathodically and anodically.
  • the electrodeposition device Unlike in the prior art, in which the contact-making device comprises an element (metal cylinder) which is connected exclusively cathodically, the electrodeposition device according to the invention has a contact-making unit which can be connected both cathodically and anodically.
  • the electrodeposition device which is thereby defined is therefore self regenerating. This means that the electrodeposition device no longer has any down times which are required in standard devices for the anodic cleaning of the cathodically connected roller. As a result, it is possible to achieve significantly higher throughput rates, with the result that the unit costs of the conductor structures which are to be produced also fall.
  • the contact-making unit Since the conductive particles which accumulate at a cathodically connected electrically conductive region can only in part be used to thicken the conductive particles on the substrate by electrodeposition, over the course of time the electrically conductive regions become contaminated. Since each of the electrically conductive regions is connected anodically at least once after it has been connected cathodically, the contact-making unit is self-cleaning. The object which is to undergo electrodeposition serves as an auxiliary cathode.
  • each electrically conductive region of a contact-making device can be connected both as cathode or as anode.
  • the conductive regions are connected cathodically or anodically depending on their position. In particular, various electrically conductive regions can simultaneously be connected cathodically or anodically.
  • the electrodeposition device can operate continuously.
  • the conductor structures are, for example, the antenna coils or chip modules which were referred to in the introduction. Inexpensive production is also made possible by the fact that after the thickening by electrodeposition using the electrodeposition device, there is no need for any further processing steps apart from that of dividing up individual conductor structures. Therefore, the procedure according to the invention is an additive or semi-additive process for production of a conductor structure.
  • the qualitative metal structure of the electrically conductive layer results in a uniform thickness which can be controlled accurately and is extremely homogeneous. Furthermore, it is possible to use the electrodeposition device according the invention to produce a double-sided metalization on the substrate. For this purpose, it is necessary for the substrate to have been provided with the conductive particles in structured form on both sides before the treatment with the electrodeposition device. In addition to the advantage of the simultaneous formation of a double-sided metal layer, the self-generating formation of electrical through-contacts is then also possible. These contacts, together with the associated conductor structures on the opposite main sides of the substrate, form a metallic unit with a more or less uniform layer thickness.
  • a further advantage is that it is also possible to produce different layer thicknesses in a single operation in the electrodeposition device by varying the current intensity of the electrodeposition device and/or the rate of passage of the substrate through the electrodeposition device.
  • the contact-making unit may be of any desired form and in particular may be matched to the substrates which are to undergo electrodeposition. This is because it is possible to thicken by electrodeposition not only two-dimensional substrates but also substrates in three-dimensional form.
  • the contact-making unit may be connected into a pulsed process.
  • the contact-making unit prefferably be of cylindrical design.
  • the electrically conductive regions then extend the lateral surface of the cylindrical contact-making unit, from one base surface toward the other base surface.
  • the electrically conductive regions are spaced apart from one another and run in the shape of waves, zigzags or obliquely.
  • the electrically conductive regions may also be straight.
  • the wavy, zigzag or oblique shape has the advantage that the regions of the substrate which are to undergo electrodeposition can be reached uniformly with a high level of reliability, with the result that uniform growth of the conductive layer is ensured.
  • the shielding device may be designed in the form of wing like profiles above the cathodically connected regions, avoiding deposits directly on the cathodically connected electrical region.
  • the fixture may be a nonconductive roller.
  • the fixture may also be designed as a further contact-making unit.
  • the substrate which is to undergo electrodeposition is pressed onto the electrically conductive regions of a contact-making unit which are connected as cathode by the fixture.
  • the contact-making arrangement may have slides which are intended to make contact with regions of the substrate which are to undergo electrodeposition.
  • the slides can be used to reach regions of a three-dimensional substrate which are difficult to gain access to, e.g. undercut regions.
  • the slides can be removed from and put back onto the object which is to undergo electrodeposition by means of pneumatic or hydraulic control means. A slide is then connected cathodically or anodically depending on its position.
  • the contact-making unit has pins which can move with respect to a base plate and which can be actuated differently as desired, the pins being connected cathodically or anodically depending on their position.
  • the contact-making unit described is suitable in particular for thickening printed circuit boards by electrodeposition.
  • the pins are arranged in a grid at a distance from one another.
  • the pins are “extended” out of the base plate according to the conductor structure which is to be electrodeposited, so that cathodic connection is made possible at the locations of the conductor structures. Retracting the pins into the base plate causes them to be connected anodically, resulting in cleaning of the pins which have previously been connected cathodically.
  • the base plate is of two-layer structure and the first layer is connected anodically and the second layer is connected cathodically. Therefore, the pins are connected anodically or cathodically depending on which of the limit positions they are currently in.
  • the pins which form the electrically conductive regions, can be retracted and extended by means of conventional techniques, e.g. pneumatics, hydraulics or electrical actuation.
  • the electrodeposition system according to the invention has at least one electrodeposition device of the type described above, a feed device, which feeds the substrate which is to undergo electrodeposition to the at least one electrodeposition device, and a receiving device which receives the substrate which has completed electrodeposition.
  • the substrate can be fed to the at least one electrodeposition unit in continuous form. This allows efficient, inexpensive and reliable manufacture, since the electrodeposition device is not subject to any down times.
  • the electrodeposition unit prefferably be arranged in a collection vessel, into which an electrolyte which is displaced in the electrolyte bath by a filtered electrolyte can overflow, so that a self regenerating electrolyte is present in the electrolyte bath.
  • the collection vessel is equipped via an overflow with the electrolyte bath of the electrodeposition device.
  • the collection vessel has a pump and a filter which pumps the treated electrolyte back into the electrolyte bath.
  • the electrodeposition system according to the invention has at least two electrodeposition units which are connected in series and are operated using the same electrolyte or a different electrolyte.
  • the electrodeposition system according to the invention may therefore be a modular structure.
  • the working and throughput rate is then determined solely by the number of modules.
  • a further advantage of the electrodeposition device according to the invention is that it can be operated with different current intensities in the same electrolyte, and in particular the anode device and the auxiliary anodes can be operated with different current intensities.
  • FIG. 1 shows an outline of an exemplary embodiment of an electrodeposition device according to the invention in cross section
  • FIG. 2 shows the structure and method of operation of the contact-making unit used in the electrodeposition device
  • FIG. 3 shows a section through the first exemplary embodiment of the electrodeposition device according to the invention
  • FIG. 4 shows an electrodeposition system which comprises the electrodeposition device described in FIGS. 1 to 3 ,
  • FIGS. 5 and 6 show various arrangements of contact-making units for the electrodeposition of a continuous substrate
  • FIG. 7 shows a perspective view of a second exemplary embodiment of an electrodeposition device
  • FIG. 8 shows a section through the electrodeposition device shown in FIG. 7 .
  • FIGS. 9 and 10 each show an excerpt which illustrates the configuration of the electrically conductive regions of the second exemplary embodiment
  • FIG. 11 shows a third exemplary embodiment of an electrodeposition device in which the electrically conductive regions are designed in the form of lamellae
  • FIG. 12 shows the arrangement of shielding devices above the cathodically connected regions of a contact-making unit as shown in FIG. 2 .
  • FIG. 1 shows a first exemplary embodiment of an electrodeposition device 10 according to the invention.
  • electrodes 28 of an anode device 30 are illustrated between or next to a respective contact-making unit 16 .
  • the anodes 28 of the anode device 30 can in principle be arranged in any desired way.
  • a roller 18 which consists of nonconductive material and represents the fixture for pressing the substrate onto the contact-making unit is arranged above each of the contact-making units 16 .
  • the substrate which is to undergo electrodeposition would in each case be conveyed between a roller 18 and a contact-making unit 16 .
  • the substrate could be in continuous form and could be introduced into the electrolyte bath 14 from above and discharged again on the other side.
  • the structure of the contact-making unit 16 can be seen more clearly from FIG. 2 . It becomes clear from this figure that the lateral surface of the cylindrical contact-making unit is provided over its entire circumference with electrically conductive regions 20 which are spaced apart from one another. While the electrodeposition device is operating, the contact-making unit is set in rotation, either driven by a motor or moved by the substrate itself.
  • the electrically conductive regions 20 which are brought into contact with a cathode device 22 and are denoted by 20 k in FIG. 2 are then connected cathodically, while the electrically conductive regions 20 which are brought into contact with the two anode devices 24 illustrated by way of example (these regions being denoted as 20 a ) are connected anodically in order to clean the contact-making unit.
  • each conductive region 20 is connected at least once as cathode and twice as anode.
  • the cathode device 22 and the anode devices 24 may, for example, be designed in the form of wheels or rollers which are placed onto the contact-making device 16 .
  • the cathode device and the anode devices 24 are arranged opposite one another.
  • the anode devices 24 may in principle be arranged at any desired location and, contrary to what is illustrated in the drawing, are preferably connected as auxiliary anode just after the cathode.
  • the term “just after the cathode” is to be understood as meaning an angular offset of at most 90°. The preferred offset is approx. 90° with respect to the cathode 22 .
  • the contact-making unit 16 has a plurality of electrically conductive regions 20 , of which different conductive regions are simultaneously connected anodically or cathodically, allows the electrodeposition device according to the invention to be operated continuously.
  • the conductive particles which are deposited on the electrically conductive regions 20 k which are connected cathodically are automatically cleaned off by the anodic connection by means of the anode device 24 . This procedure allows the electrodeposition device to operate continuously without interruption or having to be shut down.
  • FIG. 12 shows the contact-making unit shown in FIG. 2 in a modification, in which, first of all, by way of example an anode device 28 and the substrate 12 which is to be metalized are illustrated.
  • the fact that the cathode device 22 and the anode device 30 are arranged along the internal circumference of the cylindrical contact-making unit 16 merely represents one structural configuration which is of no importance to the invention.
  • the significant difference with respect to FIG. 12 is the shielding devices 25 which are arranged above the cathodically connected regions 20 k . These shielding devices are intended to prevent deposits of metal on the sections of the regions 20 k which are not required to transmit current. These sections are indicated by the reference numeral 21 and are remote from the contact point between the regions 20 k and the substrate 12 .
  • the shielding devices 25 are expedient in particular if the electrically conductive regions 20 have a very pronounced wavy or zigzag profile or run very obliquely.
  • the shielding devices 25 have the wing-like profile illustrated in FIG. 12 and force a flow of ions indicated by the arrows between the substrate 12 which is to be metalized (the conductive structures which have previously already been formed on the substrate are denoted by 13 a , the layer formed after the electrodeposition is denoted by 13 b ) and the shielding device 25 .
  • FIG. 3 once again illustrates the arrangement of the cathode and anode devices 22 , 24 with respect to the electrolyte bath 14 and the contact-making unit 16 .
  • Both the cathode device 22 and the anode devices 24 are, by way of example, arranged outside the electrolyte bath 14 .
  • the rotation results in different conductive regions 20 being connected anodically and cathodically.
  • the nonconductive roller 18 is arranged above the contact-making unit 16 .
  • the substrate which is to undergo electrodeposition is passed through the slot which is formed between the roller 18 and the contact-making unit 16 and is clearly visible, the roller 18 providing the pressure which is required to press the preconfigured substrate onto the cathodically connected electrically conductive regions.
  • the electrodeposition device may comprise only a single contact-making unit 16 .
  • arranging a plurality of contact-making units 16 in an electrolyte bath increases the rate of growth of an electrically conductive layer by electrodeposition on the substrate which has already been provided with conductive particles.
  • FIG. 4 shows an electrodeposition system according to the invention which is constructed using the electrodeposition device described in FIGS. 1 to 3 .
  • the electrodeposition device 10 is arranged in a collection vessel 46 .
  • An overflow 48 which projects into the electrolyte bath 14 conveys overflowing electrolyte into the collection vessel 46 .
  • the collection vessel 46 has a pump with filter 50 , which pumps treated electrolyte back into the electrolyte bath 14 .
  • the electrodeposition system shown in FIG. 4 is particularly suitable for processing a substrate which is in continuous form.
  • the substrate which has already been structured with conductive particles, has been wound onto a feed device 42 in drum form.
  • the substrate is guided into the electrodeposition device 10 from the feed device 42 in the direction indicated by the arrow and is passed between respective contact-making devices 16 and rollers 18 and is then removed again from the electrodeposition device 10 on the left-hand side.
  • the substrate which has been thickened by electrodeposition is dried at a squeegee 52 in order to prevent electrolyte from being entrained.
  • the substrate, which is still in continuous form is introduced via a guide roller 54 into a rinsing device 56 .
  • FIG. 5 illustrates an exemplary embodiment in which the roller 18 which produces the pressure has been replaced by a further contact-making device 16 .
  • two respective contact-making units 16 are arranged opposite one another, so that once again the substrate can be passed between them.
  • the electrolyte bath and the anode device 30 have been omitted in FIG. 5 .
  • FIG. 6 in which, by way of example, contact-making units 16 are arranged in four offset rows.
  • the substrate 12 is therefore passed in meandering form between the contact-making units 16 .
  • the pressure required is in each case ensured by the offset arrangement.
  • Substrates which are metalized on two sides can be produced by means of the arrangements of contact-making units 16 illustrated in FIGS. 5 and 6 even if these metalized substrates do not have through-contacts. If the substrate does have through-contacts and if it has been provided with electrically conductive structures in the form described above prior to the treatment in the electrodeposition device according to the invention, it is sufficient for only one side of the substrate to be connected to a contact-making unit 16 . Nevertheless, it is ensured that two-sided metalization is possible, since through-contacts are automatically enriched with electrically conductive material, with the result that they form a metallic unit with the associated conductor structures on the side remote from the contact-making unit 16 . This results in the formation of a conductive structure with a more or less constant layer thickness. Through-contacts and associated conductors then form a metallic unit.
  • FIG. 7 shows a further exemplary embodiment of a contact-making unit 16 according to the invention.
  • This contact-making unit is now in sheet-like form. It has a multiplicity of pins 36 which are arranged next to and spaced apart from one another and can be lowered into the base plate 34 .
  • the pins 36 can be moved out of the base plate 34 into a limit position, in which the electrodeposition of a substrate can take place, by means of control mechanisms, which are not illustrated in more detail in FIG. 7 .
  • FIG. 8 in which six pins 36 have been moved out of the base plate 34 into their limit positions.
  • the base plate 34 comprises two layers 38 , 40 , the first layer 38 being connected as anode and the second layer 40 being connected as cathode.
  • the first and second layers 38 , 40 are electrically isolated from one another. The position of a pin 36 alone determines whether it is connected cathodically or anodically.
  • FIGS. 9 and 10 illustrate a pin 36 in its limit position outside the base plate 34 ( FIG. 9 ) and a pin 36 in its limit position within the base plate 34 ( FIG. 10 ).
  • the pin 36 Over a length which is greater than the thickness of the second layer 40 , the pin 36 has an insulation 82 .
  • a conductive region 80 which corresponds to the diameter of the pin 36 , is in contact with the walls of the recess within which it is moved. If the pin 36 is in its limit position shown in FIG. 9 , it is connected cathodically. By contrast, if the pin 36 is completely recessed in the base plate 34 , it is connected anodically.
  • the contact-making unit 16 illustrated in FIGS. 7 to 10 is particularly suitable for thickening a printed circuit board with any desired conductor structure by electrodeposition. Since the pins 36 are arranged at regular intervals with respect to one another, it is in principle possible to reproduce any desired conductor structure by moving the pins 36 into their limit position shown in FIG. 9 . Regular retracting of the pins into their limit position as shown in FIG. 10 ensures that the electrically conductive region 80 which is connected to the substrate which is to undergo electrodeposition is regularly cleaned anodically.
  • FIG. 11 shows a further exemplary embodiment of a contact-making unit 16 .
  • the contact-making unit 16 is constructed in the form of a conveyor belt, along which a multiplicity of lamellae 90 are arranged.
  • the lamellae 90 are connected to the conveyor belt via an articulated joint 96 .
  • the lamellae only have an electrically conductive region 94 at their end which is remote from the articulated joint 96 . Otherwise, they have an insulation 92 .
  • the electrically conductive regions 94 are alternately connected cathodically and anodically as a result of the conveyor belt being set in rotation.
  • the lamellae 90 are in contact with the substrate 12 which is to undergo electrodeposition, they are connected cathodically, which is intended to be indicated by the designation K.
  • K As soon as a lamella reaches a predetermined position along the conveyor belt, it is connected anodically (A) and in this way is cleaned.
  • the contact-making unit may be matched to the shape of the substrate which is to undergo electrodeposition, so that even electrodeposition on undercut regions is possible.
  • the electrodeposition device described can also be operated in the known pulsed mode.
  • the device can be used with all known, commercially available electrolytes.
  • the electrodeposition device according to the invention allows extremely inexpensive production combined with the highest possible, constant quality and with high throughput rates.
  • One advantage is that only the parts which are required for production of the desired conductor structure have to undergo electrodeposition.
  • a further advantage is the simple production and maintenance of the electrodeposition device described, since all the devices which are relevant for control purposes can be arranged outside the electrolyte bath.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
US10/916,308 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive Abandoned US20050061661A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10153056 2001-10-25
DE10153056.0 2001-10-25
DE10234705A DE10234705B4 (de) 2001-10-25 2002-07-30 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10234705.0 2002-07-30
PCT/DE2002/003916 WO2003038158A2 (fr) 2001-10-25 2002-10-16 Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003916 Continuation WO2003038158A2 (fr) 2001-10-25 2002-10-16 Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices

Publications (1)

Publication Number Publication Date
US20050061661A1 true US20050061661A1 (en) 2005-03-24

Family

ID=26010464

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/916,308 Abandoned US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Country Status (3)

Country Link
US (1) US20050061661A1 (fr)
TW (1) TW574437B (fr)
WO (1) WO2003038158A2 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080000769A1 (en) * 2006-06-08 2008-01-03 Peter Fleissner Conductive coating of surfaces
US20090020712A1 (en) * 2005-03-15 2009-01-22 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method
US20090178930A1 (en) * 2006-04-18 2009-07-16 Basf Se Electroplating device and method
US20130168256A1 (en) * 2011-12-30 2013-07-04 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
CN114790565A (zh) * 2022-05-26 2022-07-26 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323660A1 (de) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
US8815073B2 (en) * 2007-03-28 2014-08-26 Toray Industries, Inc. Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film
DE102008004592A1 (de) * 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
WO2021023789A1 (fr) * 2019-08-05 2021-02-11 Sms Group Gmbh Procédé et système de revêtement électrolytique d'une bande et/ou d'un matériau tissé, électriquement conducteurs, au moyen d'une technologie à impulsions
CN112663119B (zh) * 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
US5425862A (en) * 1992-09-03 1995-06-20 Hans Hollmuller Maschinenbau Gmbh & Co Apparatus for the electroplating of thin plastic films
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US20030000842A1 (en) * 2000-03-17 2003-01-02 Kai-Jens Matejat Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3325316A1 (de) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Verfahren und vorrichtung zum metallbeschichten, insbesondere zum verkupfern von zylindrischen koerpern
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE10007435A1 (de) * 2000-02-18 2001-08-23 Enthone Omi Deutschland Gmbh Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
US5425862A (en) * 1992-09-03 1995-06-20 Hans Hollmuller Maschinenbau Gmbh & Co Apparatus for the electroplating of thin plastic films
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
US20030000842A1 (en) * 2000-03-17 2003-01-02 Kai-Jens Matejat Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090020712A1 (en) * 2005-03-15 2009-01-22 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
US8253035B2 (en) 2005-03-15 2012-08-28 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method
US20090178930A1 (en) * 2006-04-18 2009-07-16 Basf Se Electroplating device and method
US20080000769A1 (en) * 2006-06-08 2008-01-03 Peter Fleissner Conductive coating of surfaces
US7837839B2 (en) 2006-06-08 2010-11-23 Bct Coating Technologies Ag Conductive coating of surfaces
US20130168256A1 (en) * 2011-12-30 2013-07-04 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
US9725817B2 (en) * 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
CN114790565A (zh) * 2022-05-26 2022-07-26 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Also Published As

Publication number Publication date
WO2003038158A3 (fr) 2004-09-16
TW574437B (en) 2004-02-01
WO2003038158A2 (fr) 2003-05-08

Similar Documents

Publication Publication Date Title
US20050061661A1 (en) Electrodeposition device and electrodeposition system for coating structures which have already been made conductive
RU2420616C2 (ru) Устройство и способ для гальванического покрытия
KR101076947B1 (ko) 전기 절연 구조체를 전해 처리하는 장치 및 방법
US6238529B1 (en) Device for electrolytic treatment of printed circuit boards and conductive films
US20090178930A1 (en) Electroplating device and method
US5804052A (en) Method and device for continuous uniform electrolytic metallizing or etching
TWI359882B (en) Method and device for electrolytically increasing
DE10234705B4 (de) Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
EP1756336B1 (fr) Dispositif et procede de traitement electrolytique de pieces atravailler plates
JP3226169B2 (ja) 流体ヘッドを利用した選択的電解メタライゼーション装置および方法
DE102006044673B3 (de) Kontaktiereinheit für die galvanische Abscheidung, Galvanisiervorrichtung und Galvanisiersystem
JP4252286B2 (ja) プリント配線板における導体回路形成方法およびプリント配線板
HK1102970B (en) Device and method for electrolytically treating flat work pieces
HK1084423B (en) Device and method for electrolytically treating electrically insulated structures

Legal Events

Date Code Title Description
AS Assignment

Owner name: INFINEON TECHNOLOGIES AG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MULLER-HIPPER, ANDREAS;SIMMERLEIN-ERLBACHER, EWALD;KARL, ANDREAS;REEL/FRAME:015408/0063;SIGNING DATES FROM 20041029 TO 20041102

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION