[go: up one dir, main page]

US20050031483A1 - [solder composition] - Google Patents

[solder composition] Download PDF

Info

Publication number
US20050031483A1
US20050031483A1 US10/709,990 US70999004A US2005031483A1 US 20050031483 A1 US20050031483 A1 US 20050031483A1 US 70999004 A US70999004 A US 70999004A US 2005031483 A1 US2005031483 A1 US 2005031483A1
Authority
US
United States
Prior art keywords
solder composition
amount
mixture
component selected
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/709,990
Inventor
Cheng-Yi Liu
Shih-Chieh Hsu
Shen-Jie Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Central University
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to NATIONAL CENTRAL UNIVERSITY reassignment NATIONAL CENTRAL UNIVERSITY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, SHIH-CHIEH, LIU, CHENG-YI, WANG, SHEN-JIE
Publication of US20050031483A1 publication Critical patent/US20050031483A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C

Definitions

  • the present invention generally relates to a solder composition. More particularly, the present invention relates to a solder composition adapted to bond various materials.
  • Solder is a metal composition used for mechanically bonding two same metallic materials or two different metallic materials under low temperature. Soldering technique has advantages of high conductivity, high thermal diffusivity and high bonding reliability so that it has been widely used in the assembly of semiconductors and electronic components packaging as well.
  • the solder is composed of tin (Sn) and other metal to form a binary alloy such as Sn—Pb alloy, Sn—Ag alloy, Sn—In alloy or Sn—Ag—Cu alloy.
  • Sn tin
  • Sn—Pb alloy Sn—Ag alloy
  • Sn—In alloy Sn—Ag—Cu alloy.
  • solderable metal articles such as Sn—Pb alloy, Sn—Ag alloy, Sn—In alloy or Sn—Ag—Cu alloy.
  • the metal pad layer usually includes an adhesive layer such as Ti or Cr and a solderable metal layer such as Cu or Ni.
  • a conventional method is adding titanium (Ti) into the solder to form an active solder.
  • This active solder has higher bonding strength for non-metallic materials or non-solderable materials.
  • the surface of this active solder is very easy to oxidize and generate oxidation dross, and thus has poor printability.
  • additional mechanical activation steps such as brushing step, vibration step and ultrasonic pressure step are needed to improve printability and reactivity. Since this bonding process needs several additional steps, the cost of this bonding process is high.
  • the present invention is directed to a solder composition adapted to bond metallic materials and non-metallic materials.
  • the solder composition can enhance the bonding strength for various metallic materials and non-metallic materials.
  • a solder composition comprises chromium (Cr) in an amount of 5 ⁇ 20 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity.
  • the solder composition further comprises another component selected from a IVB group in the periodic table or a mixture thereof having an amount of 0.01 ⁇ 10 wt. %
  • the solder composition further comprises another component selected from a VB group in the periodic table or a mixture thereof having an amount of 0.01 ⁇ 10 wt. %
  • the solder composition further comprises another component selected from a IIIB group in the periodic table or a mixture thereof in an amount of 0.01 ⁇ 20 wt. %.
  • the metal selected from the IIIB group or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof.
  • the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01 ⁇ 10 wt. %.
  • the solder composition further comprises stibium (Sb) having an amount of 0.01 ⁇ 50 wt. %.
  • the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01 ⁇ 5 wt. %.
  • the solder composition further comprises gallium (Ga) in an amount of 0.01 ⁇ 10 wt. %.
  • the present invention also provides a solder composition
  • a solder composition comprising chromium (Cr) in an amount of 0.01 ⁇ 5 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity
  • the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01 ⁇ 10 wt. %
  • the solder composition further comprises stibium (Sb) in an amount of 0.01 ⁇ 50 wt. %.
  • the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01 ⁇ 5 wt. %.
  • the solder composition further comprises gallium (Ga) having an amount of 0.01 ⁇ 10 wt. %.
  • the main component of the solder composition of the present invention is chromium (Cr) that has higher affinity with oxygen. Chromium (Cr) can easily combine oxygen of oxide layer on glass, metal or semiconductor materials so as to enhance the wettability of the boned materials. It also can reduce surface energy between the solder composition and the bonded materials at melting state.
  • IIIB group, VB group, IVB group and other metal component such as silver (Ag), copper (Cu), stibium (Sb), nickel (Ni), cobalt (Co), manganese (Mn) and gallium (Ga) can be further added into the solder composition to regulate the solder composition property such as bonding strength and melting point.
  • the solder composition can provide good printability, wide use, simple bonding process and high bonding strength for different materials.
  • a first solder composition comprises chromium (Cr) in an amount of 5 ⁇ 20 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity that can not be avoided.
  • the solder composition further comprises another component selected from the IVB group in the periodic table or a mixture thereof having an amount of 0.01 ⁇ 10 wt. %. In another embodiment, the solder composition further comprises another component selected from the VB group in the periodic table or a mixture thereof having an amount of 0.01 ⁇ 10 wt. %. In another embodiment, the solder composition further comprises another component selected from the IIIB group in the periodic table or a mixture thereof in an amount of 0.01 ⁇ 20 wt. %.
  • the metal selected from the IIIB group or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof.
  • the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01 ⁇ 10 wt. %. In another embodiment, the solder composition further comprises stibium (Sb) in an amount of 0.01 ⁇ 50 wt. %. In another embodiment, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01 ⁇ 5 wt. %. In another embodiment, the solder composition further comprises gallium (Ga) in an amount of 0.01 ⁇ 10 wt. %.
  • a second solder composition comprises chromium (Cr) in an amount of 0.01 ⁇ 5 wt. %; a component selected a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity that can not be avoided.
  • the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01 ⁇ 10 wt. %. In another embodiment, the solder composition further comprises stibium (Sb) in an amount of 0.01 ⁇ 50 wt. %. In another embodiment, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01 ⁇ 5 wt. %. In another embodiment, the solder composition further comprises gallium (Ga) in an amount of 0.01 ⁇ 10 wt. %.
  • the bonding temperature of the solder composition is about between 100 ⁇ 550° C., for example. If the solder composition mainly contains Zn—Cr alloy, the bonding temperature thereof is about between 400 ⁇ 700° C., for example, and can be suitable for high temperature bonding process.
  • chromium (Cr) atoms in the solder composition When the solder composition is heated at melting state, chromium (Cr) atoms in the solder composition have an affinity with oxygen. These chromium (Cr) atoms collect at the surface of the solder and react with oxide or oxide layer on the bonded materials. Other metal atoms in the solder composition also join the reaction so that the surface energy between the solder composition and the bonded materials is changed.
  • silver (Ag) in the solder composition can reduce surface tension and bonding temperature of the solder composition at its melting state and can enhance bonding strength after bonding.
  • Copper (Cu) in the solder composition can enhance wettability especially for bonded materials containing iron. Copper (Cu) can also enhance bonding strength after bonding.
  • Gallium (Ga) in the solder composition is contributive to clean oxide layer on the bonded materials and can reduce the bonding temperature.
  • Stibium (Sb), nickel (Ni), cobalt (Co) or manganese (Mn) in the solder composition not only regulates the bonding temperature, but also enhances wettability of the solder composition and can enhance bonding strength after bonding.
  • the solder composition can bond metallic materials, non-metallic materials, oxygen-containing ceramic materials, ceramic materials free of oxygen or polymer materials, for example.
  • the metallic materials include, for example, aluminium (Al), copper (Cu), iron (Fe), stainless steel, nickel (Ni) and alloy-phosphorous alloy (Ni-Px).
  • the non-metallic materials include, for example, nitride, silicon (Si), glass and semiconductor material of IIIB group, IVB group or VB group in the periodic table.
  • solder composition of the invention conventional titanium (Ti) is replaced with chromium (Cr) as an active component so that metal element of IIIB group in the periodic table is not necessary to protect the active component from contacting with oxygen in the air.
  • the solder composition can be used to bond materials in oxygen-exiting conditions. Vacuum condition or other special condition is not needed so that process of bonding material through the solder composition is simplified. In other words, when performing the bonding process, only simple steps are needed.
  • the solder composition mainly comprises tin-chromium (Sn—Cr) alloy, and other metal such as silver (Ag), copper (Cu), stibium (Sb), nickel (Ni), cobalt (Co), manganese (Mn), gallium (Ga) or a mixture thereof that is for regulating the solder property can further be added, so that the solder composition can be used to bond various materials.
  • solder composition can provide good printability, smooth surfaces and not easy to be oxidized.
  • the solder composition can also provide low bonding temperature, high bonding strength and wide use.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder composition adapted to bond metallic materials and non-metallic materials is provided. The solder composition can enhance the bonding strength for the metallic materials and the non-metallic materials. The solder composition mainly comprises Sn—Cr alloy. The solder composition further includes anther metal component for regulating the bonding capability so that the solder composition can be used to bond various materials.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims the priority benefit of Taiwan application serial no. 92121256, filed Aug. 4, 2003.
    • BACKGROUND OF INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a solder composition. More particularly, the present invention relates to a solder composition adapted to bond various materials.
  • 2. Description of Related Art
  • Solder is a metal composition used for mechanically bonding two same metallic materials or two different metallic materials under low temperature. Soldering technique has advantages of high conductivity, high thermal diffusivity and high bonding reliability so that it has been widely used in the assembly of semiconductors and electronic components packaging as well.
  • Conventionally, the solder is composed of tin (Sn) and other metal to form a binary alloy such as Sn—Pb alloy, Sn—Ag alloy, Sn—In alloy or Sn—Ag—Cu alloy. These solders have been widely used to bond solderable metal articles. However, when bonding non-solderable materials or non-metallic materials, a metal pad layer must be first formed on these materials. The metal pad layer usually includes an adhesive layer such as Ti or Cr and a solderable metal layer such as Cu or Ni.
  • In currently semiconductor processes, bonding silicon wafer, glass, silicon nitride film, silicon oxide film or heat diffusion material is usually performed. It is noted that during reflowing, a flux is usually required for cleaning oxide layer on surfaces of the solder and enhancing the wettability of the bonded materials. However, flux residues and voids that are formed on the solder after removing the oxide layer may result in low bonding strength.
  • In order to resolve the foregoing problem, a conventional method is adding titanium (Ti) into the solder to form an active solder. This active solder has higher bonding strength for non-metallic materials or non-solderable materials. However, the surface of this active solder is very easy to oxidize and generate oxidation dross, and thus has poor printability. Moreover, when using this active solder for performing bonding process, additional mechanical activation steps such as brushing step, vibration step and ultrasonic pressure step are needed to improve printability and reactivity. Since this bonding process needs several additional steps, the cost of this bonding process is high.
    • SUMMARY OF INVENTION
  • Accordingly, the present invention is directed to a solder composition adapted to bond metallic materials and non-metallic materials. The solder composition can enhance the bonding strength for various metallic materials and non-metallic materials.
  • According to an embodiment of the present invention, a solder composition is provided. The solder composition comprises chromium (Cr) in an amount of 5˜20 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity.
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from a IVB group in the periodic table or a mixture thereof having an amount of 0.01˜10 wt. %
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from a VB group in the periodic table or a mixture thereof having an amount of 0.01˜10 wt. %
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from a IIIB group in the periodic table or a mixture thereof in an amount of 0.01˜20 wt. %. The metal selected from the IIIB group or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof.
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01˜10 wt. %.
  • According to another embodiment of the present invention, the solder composition further comprises stibium (Sb) having an amount of 0.01˜50 wt. %.
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.
  • According to another embodiment of the present invention, the solder composition further comprises gallium (Ga) in an amount of 0.01˜10 wt. %.
  • The present invention also provides a solder composition comprising chromium (Cr) in an amount of 0.01˜5 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity
  • According to an embodiment of the present invention, the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01˜10 wt. %
  • According to another embodiment of the present invention, the solder composition further comprises stibium (Sb) in an amount of 0.01˜50 wt. %.
  • According to another embodiment of the present invention, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.
  • According to another embodiment of the present invention, the solder composition further comprises gallium (Ga) having an amount of 0.01˜10 wt. %.
  • The main component of the solder composition of the present invention is chromium (Cr) that has higher affinity with oxygen. Chromium (Cr) can easily combine oxygen of oxide layer on glass, metal or semiconductor materials so as to enhance the wettability of the boned materials. It also can reduce surface energy between the solder composition and the bonded materials at melting state. In addition, IIIB group, VB group, IVB group and other metal component such as silver (Ag), copper (Cu), stibium (Sb), nickel (Ni), cobalt (Co), manganese (Mn) and gallium (Ga) can be further added into the solder composition to regulate the solder composition property such as bonding strength and melting point. The solder composition can provide good printability, wide use, simple bonding process and high bonding strength for different materials.
  • Both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
    • DETAILED DESCRIPTION
  • First Embodiment
  • Two solder compositions are described in the invention. According to a first embodiment, a first solder composition comprises chromium (Cr) in an amount of 5˜20 wt. %; a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity that can not be avoided.
  • In a embodiment, the solder composition further comprises another component selected from the IVB group in the periodic table or a mixture thereof having an amount of 0.01˜10 wt. %. In another embodiment, the solder composition further comprises another component selected from the VB group in the periodic table or a mixture thereof having an amount of 0.01˜10 wt. %. In another embodiment, the solder composition further comprises another component selected from the IIIB group in the periodic table or a mixture thereof in an amount of 0.01˜20 wt. %. The metal selected from the IIIB group or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof. In another embodiment, the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01˜10 wt. %. In another embodiment, the solder composition further comprises stibium (Sb) in an amount of 0.01˜50 wt. %. In another embodiment, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %. In another embodiment, the solder composition further comprises gallium (Ga) in an amount of 0.01˜10 wt. %.
  • Second Embodiment
  • According to a second embodiment, a second solder composition comprises chromium (Cr) in an amount of 0.01˜5 wt. %; a component selected a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and mixture thereof; and an impurity that can not be avoided.
  • In an embodiment, the solder composition further comprises another component selected from silver (Ag), copper (Cu) or a mixture thereof in an amount of 0.01˜10 wt. %. In another embodiment, the solder composition further comprises stibium (Sb) in an amount of 0.01˜50 wt. %. In another embodiment, the solder composition further comprises another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %. In another embodiment, the solder composition further comprises gallium (Ga) in an amount of 0.01˜10 wt. %.
  • The bonding temperature of the solder composition is about between 100˜550° C., for example. If the solder composition mainly contains Zn—Cr alloy, the bonding temperature thereof is about between 400˜700° C., for example, and can be suitable for high temperature bonding process.
  • When the solder composition is heated at melting state, chromium (Cr) atoms in the solder composition have an affinity with oxygen. These chromium (Cr) atoms collect at the surface of the solder and react with oxide or oxide layer on the bonded materials. Other metal atoms in the solder composition also join the reaction so that the surface energy between the solder composition and the bonded materials is changed. In addition, silver (Ag) in the solder composition can reduce surface tension and bonding temperature of the solder composition at its melting state and can enhance bonding strength after bonding. Copper (Cu) in the solder composition can enhance wettability especially for bonded materials containing iron. Copper (Cu) can also enhance bonding strength after bonding. Gallium (Ga) in the solder composition is contributive to clean oxide layer on the bonded materials and can reduce the bonding temperature. Stibium (Sb), nickel (Ni), cobalt (Co) or manganese (Mn) in the solder composition not only regulates the bonding temperature, but also enhances wettability of the solder composition and can enhance bonding strength after bonding.
  • No flux is needed when using the solder composition to bond materials. The solder composition can bond metallic materials, non-metallic materials, oxygen-containing ceramic materials, ceramic materials free of oxygen or polymer materials, for example. The metallic materials include, for example, aluminium (Al), copper (Cu), iron (Fe), stainless steel, nickel (Ni) and alloy-phosphorous alloy (Ni-Px). The non-metallic materials include, for example, nitride, silicon (Si), glass and semiconductor material of IIIB group, IVB group or VB group in the periodic table.
  • In the solder composition of the invention, conventional titanium (Ti) is replaced with chromium (Cr) as an active component so that metal element of IIIB group in the periodic table is not necessary to protect the active component from contacting with oxygen in the air. The solder composition can be used to bond materials in oxygen-exiting conditions. Vacuum condition or other special condition is not needed so that process of bonding material through the solder composition is simplified. In other words, when performing the bonding process, only simple steps are needed.
  • In an embodiment, the solder composition mainly comprises tin-chromium (Sn—Cr) alloy, and other metal such as silver (Ag), copper (Cu), stibium (Sb), nickel (Ni), cobalt (Co), manganese (Mn), gallium (Ga) or a mixture thereof that is for regulating the solder property can further be added, so that the solder composition can be used to bond various materials. Comparing with conventional tin-titanium (Sn—Ti) alloy, the solder composition can provide good printability, smooth surfaces and not easy to be oxidized. The solder composition can also provide low bonding temperature, high bonding strength and wide use.
  • It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims (14)

1. A solder composition, comprising:
chromium (Cr) in an amount of 5˜20 wt. %;
a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and a mixture thereof; and
an impurity.
2. The solder composition according to claim 1, further comprising another component selected from a IVB group in the periodic table or a mixture thereof in an amount of 0.01˜10 wt. %.
3. The solder composition according to claim 1, further comprising another component selected from a VB group in the periodic table or a mixture thereof in an amount of 0.01˜10 wt. %.
4. The solder composition according to claim 1, further comprising another component selected from a IIIB group in the periodic table or a mixture thereof in an amount of 0.01˜20 wt. %.
5. The solder composition according to claim 4, wherein the component selected from the IIIB group in the periodic table or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof.
6. The solder composition according to claim 1, further comprising another component selected from silver (Ag), copper (Cu) or a mixture thereof having an amount of 0.01˜10 wt. %.
7. The solder composition according to claim 1, further comprising stibium (Sb) in an amount of 0.01˜50 wt. %.
8. The solder composition according to claim 1, further comprising another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.
9. The solder composition according to claim 1, further comprising gallium (Ga) in an amount of 0.01˜10 wt. %.
10. A solder composition, comprising:
chromium (Cr) in an amount of 0.01˜5 wt. %;
a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and a mixture thereof; and
an impurity.
11. The solder composition according to claim 10, further comprising another component selected from silver (Ag), copper (Cu) or a mixture thereof having an amount of 0.01˜10 wt. %.
12. The solder composition according to claim 10, further comprising stibium (Sb) in an amount of 0.01˜50 wt. %.
13. The solder composition according to claim 10, further comprising another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.
14. The solder composition according to claim 10, further comprising gallium (Ga) in an amount of 0.01˜10 wt. %.
US10/709,990 2003-08-04 2004-06-11 [solder composition] Abandoned US20050031483A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW92121256 2003-08-04
TW092121256A TWI222910B (en) 2003-08-04 2003-08-04 Constituents of solder

Publications (1)

Publication Number Publication Date
US20050031483A1 true US20050031483A1 (en) 2005-02-10

Family

ID=34114669

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/709,990 Abandoned US20050031483A1 (en) 2003-08-04 2004-06-11 [solder composition]

Country Status (2)

Country Link
US (1) US20050031483A1 (en)
TW (1) TWI222910B (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20070048172A1 (en) * 2005-08-30 2007-03-01 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US20100084765A1 (en) * 2008-10-02 2010-04-08 Samsung Electro-Mechanics Co., Ltd. Semiconductor package having bump ball
WO2012106434A1 (en) * 2011-02-04 2012-08-09 Antaya Technologies Corporation Lead-free solder composition
US8673762B2 (en) 2011-01-31 2014-03-18 Fujitsu Limited Solder, soldering method, and semiconductor device
US20140290931A1 (en) * 2013-04-01 2014-10-02 University Of Maryland, College Park High Temperature Solder For Downhole Components
CN107627044A (en) * 2017-10-25 2018-01-26 吉林大学 The polynary zinc-tin copper bismuth neodymium solder and its preparation technology of a kind of soldering sintered NdFeB and steel
US10040349B2 (en) * 2015-10-13 2018-08-07 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
CN109055844A (en) * 2018-08-20 2018-12-21 黄河科技学院 A kind of long-life low-melting point metal alloy Heat Conduction Material and preparation method thereof
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
US12311759B1 (en) 2022-02-02 2025-05-27 Consumer Safety Technology, Llc Wireless vehicle interface for immobilization system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201244679A (en) * 2011-05-13 2012-11-16 Long-Quan Cao Multilayer composite alloy cookware

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009027A (en) * 1974-11-21 1977-02-22 Jury Vladimirovich Naidich Alloy for metallization and brazing of abrasive materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009027A (en) * 1974-11-21 1977-02-22 Jury Vladimirovich Naidich Alloy for metallization and brazing of abrasive materials

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20070048172A1 (en) * 2005-08-30 2007-03-01 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US20100084765A1 (en) * 2008-10-02 2010-04-08 Samsung Electro-Mechanics Co., Ltd. Semiconductor package having bump ball
US8673762B2 (en) 2011-01-31 2014-03-18 Fujitsu Limited Solder, soldering method, and semiconductor device
EP2990155A1 (en) * 2011-02-04 2016-03-02 Antaya Technologies Corporation Lead-free solder composition
CN103476539A (en) * 2011-02-04 2013-12-25 安塔亚技术公司 Lead-free solder composition
US8771592B2 (en) 2011-02-04 2014-07-08 Antaya Technologies Corp. Lead-free solder composition
WO2012106434A1 (en) * 2011-02-04 2012-08-09 Antaya Technologies Corporation Lead-free solder composition
US9975207B2 (en) 2011-02-04 2018-05-22 Antaya Technologies Corporation Lead-free solder composition
US20140290931A1 (en) * 2013-04-01 2014-10-02 University Of Maryland, College Park High Temperature Solder For Downhole Components
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
US10040349B2 (en) * 2015-10-13 2018-08-07 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
US10596903B2 (en) 2015-10-13 2020-03-24 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
US10604011B2 (en) 2015-10-13 2020-03-31 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
US10919389B2 (en) 2015-10-13 2021-02-16 Consumer Safety Technology, Llc Networked vehicle immobilization
US11338675B2 (en) 2015-10-13 2022-05-24 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
US12054044B2 (en) 2015-10-13 2024-08-06 Consumer Safety Technology, Llc Networked intoxication vehicle immobilization
CN107627044A (en) * 2017-10-25 2018-01-26 吉林大学 The polynary zinc-tin copper bismuth neodymium solder and its preparation technology of a kind of soldering sintered NdFeB and steel
CN109055844A (en) * 2018-08-20 2018-12-21 黄河科技学院 A kind of long-life low-melting point metal alloy Heat Conduction Material and preparation method thereof
US12311759B1 (en) 2022-02-02 2025-05-27 Consumer Safety Technology, Llc Wireless vehicle interface for immobilization system

Also Published As

Publication number Publication date
TW200505619A (en) 2005-02-16
TWI222910B (en) 2004-11-01

Similar Documents

Publication Publication Date Title
US5807626A (en) Ceramic circuit board
US8763884B2 (en) Joint with first and second members with a joining layer located therebetween containing Sn metal and another metallic material; methods for forming the same joint
JP4882229B2 (en) Semiconductor device and manufacturing method thereof
US20050031483A1 (en) [solder composition]
KR20010062748A (en) Solder material, device and manufacturing method thereof using the same
TW201615854A (en) Low temperature and high reliability alloy for solder level
JPH0788680A (en) Composition of high temperature lead-free tin-based solder
WO2005122252A1 (en) Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
JPH071178A (en) Three-component solder alloy
JPH06297185A (en) Dynamic solder paste composition
EP2799181B1 (en) Sn-Cu-Al-Ti BASED LEAD-FREE SOLDER ALLOY
JP7536882B2 (en) Bonding materials and semiconductor packages
JP6928297B2 (en) Copper / ceramic joints and insulated circuit boards
JP2001246493A (en) Solder material, device or apparatus using the same, and method of manufacturing the same
JP2005032834A (en) Bonding method of semiconductor chip and substrate
JP4147875B2 (en) Brazing material, method of assembling semiconductor device using the same, and semiconductor device
JP5828352B2 (en) Copper / ceramic bonding body and power module substrate
JP3398203B2 (en) Aluminum alloy and copper brazing filler metal and composites joined by this brazing filler metal
CN1977368B (en) Soldering method, solder particles for chip bonding, method for producing solder particles for chip bonding, and electronic parts
CN106112162B (en) A kind of method for being used to reduce the formation of tin bismuth solder joint intermetallic compound
JP2000343273A (en) Solder alloy
US20070122646A1 (en) Solder composition and soldering structure
JP5589642B2 (en) Pb-free solder alloy with excellent stress relaxation
JP5231727B2 (en) Joining method
JP5861432B2 (en) Method for producing solder bonded body

Legal Events

Date Code Title Description
AS Assignment

Owner name: NATIONAL CENTRAL UNIVERSITY, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, CHENG-YI;HSU, SHIH-CHIEH;WANG, SHEN-JIE;REEL/FRAME:014721/0897

Effective date: 20040601

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION