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US20040226697A1 - Heat-dissipating module - Google Patents

Heat-dissipating module Download PDF

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Publication number
US20040226697A1
US20040226697A1 US10/459,581 US45958103A US2004226697A1 US 20040226697 A1 US20040226697 A1 US 20040226697A1 US 45958103 A US45958103 A US 45958103A US 2004226697 A1 US2004226697 A1 US 2004226697A1
Authority
US
United States
Prior art keywords
heat
fins
dissipating module
base plates
cooling fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/459,581
Inventor
Ko-Pin Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, KO-PIN
Publication of US20040226697A1 publication Critical patent/US20040226697A1/en
Abandoned legal-status Critical Current

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Classifications

    • H10W40/43—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H10W40/73—

Definitions

  • the present invention relates generally to heat-dissipating technology, and more particularly, to a heat-dissipating module composed of multiple heat pipes and heat sinks to have high heat-dissipative performance.
  • a conventional heat-dissipating device 70 is composed of three heat sinks 71 and 73 , two of which parallel face to each other and the other of which is positioned above the two heat sinks 71 , four U-shaped heat pipes 75 , and a cooling fan 77 .
  • the two opposite heat sinks 71 are stacked upon each other and each include a base 72 having elongated ditches 721 recessed thereon, and fins 722 facing to the others.
  • the heat pipes 75 are received in the ditches 721 for conducting the heat from the bottom of the lower heat sink 71 to the upper heat sinks 71 .
  • the cooling fan 77 is mounted at a lateral side of the heat sinks 71 and 73 for enhancing the heat-dissipative performance of the heat sinks 71 and 73 .
  • the fins 722 having more thickness are required. Relatively, the fins 722 having more thickness will be less disposed on the base 72 of the heat sink 71 , which has fixed area, thereby causing lower heat-dissipative performance due to less heat-dissipative area.
  • the heat pipes 75 contact the two heat sinks 71 with half of the outer periphery thereof, such that the conventional heat-dissipating device 70 has worse heat-dissipative performance.
  • the primary objective of the present invention is to provide a heat-dissipating module which has higher heat-dissipative performance than the prior art.
  • the heat-dissipating module which is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan.
  • the two base plates are made of a heat-conductive material and each include at least one tunnel.
  • the fins are made of a heat-conductive material and disposed between the two base plates.
  • the heat pipe which is U-shaped, includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.
  • FIG. 1 is a perspective view of a first preferred embodiment of the present invention
  • FIG. 2 is an exploded view of the first preferred embodiment of the present invention
  • FIG. 3 is a perspective view of a second preferred embodiment of the present invention.
  • FIG. 4 is a perspective view of a third preferred embodiment of the present invention.
  • FIG. 5 is a perspective view of a prior art
  • FIG. 6 is an exploded view of the prior art.
  • a heat-dissipating module 10 of a first preferred embodiment of the present invention is composed of two base plates 11 , a plurality of fins 21 , three heat pipes 31 , and a cooling fan 41 .
  • the two base plates 11 which are in positions parallel to each other and defined an upper base plate and a lower base plate, is made of a metallic heat-conductive material, like aluminum, copper, etc. and each include three tunnels 12 therethrough.
  • the fins 21 are disposed between the two base plates 11 and parallel to and spaced from one another.
  • Each of the three heat pipes 31 which are respectively U-shaped, includes two distal sections inserted into the tunnels 12 and a body portion exposed outside the fins 21 .
  • the heat pipes 31 are not restricted to three in numbers and can be any.
  • the cooling fan 41 is mounted at a side of the fins 21 .
  • the body portions of the heat pipes 31 are positioned at another side of the fins 21 .
  • the present invention is operated by rapidly conducting the heat from the lower base plate 11 via the fins 21 to the upper base plate 11 .
  • the heat in the two base plates 11 is conducted to the center of the fins 21 and dissipated outside by that the cooling fan blows towards the fins 21 to enable the flowing air to bring the heat outside.
  • the heat-dissipating module 10 of the first preferred embodiment of the present invention evenly dissipates the heat by the whole structure, thereby causing excellent heat-dissipative performance.
  • the heat-dissipating module 10 ′ of a second preferred. embodiment of the present invention is different from the heat-dissipating module 10 of the first preferred embodiment by that the cooling fan 41 ′ is mounted at a side of the fins 21 ′ and the body portions of the heat pipes 31 ′ are positioned at an opposite side of the fins 21 ′.
  • the flowing air generated by the cooling fan 41 ′ passes through the heat pipes 31 ′ to partially dissipate the heat out of the heat pipes 31 ′, thereby causing more excellent heat-dissipative performance.
  • the heat-dissipating module 10 ′′ of a third preferred embodiment of the present invention is different from those of the aforementioned embodiment by that the cooling fan 41 ′′ and the body portions of the heat pipes 31 ′ are mounted at the same side of the fins 21 ′′.
  • the cooling fan 41 ′′ and the heat pipes 31 ′′ are positioned very adjacently, such that the flowing air dissipates the heat out of the heat pipes 31 ′′ and the fins 21 ′′ at the same time, thereby causing more excellent heat-dissipative performance.
  • the fins of the present invention are connected between the two base plates such that the heat can be conducted from one of the base plates to the other.
  • the fins of the present invention are integrally connected to have larger heat-dissipative area, thereby causing higher heat-dissipative performance.
  • the fins are connected between the two base plates rather than the fins of the two heat sinks of the prior art stacked upon each other, such that the fins are not subject to random movement, thereby rendering the strengthened structure of the present invention.
  • the fins having less thickness can be more mounted between the two base plates to enlarge the heat-dissipative area, thereby enhancing the heat-dissipative performance.
  • the heat pipes are completely received in the tunnels to have an external periphery contacting the internal periphery of the tunnels, thereby causing complete heat-dissipative effect.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat-dissipating module is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe which is U-shaped includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates generally to heat-dissipating technology, and more particularly, to a heat-dissipating module composed of multiple heat pipes and heat sinks to have high heat-dissipative performance. [0002]
  • 2. Description of the Related Art [0003]
  • Referring to FIGS. 5-6, a conventional heat-[0004] dissipating device 70 is composed of three heat sinks 71 and 73, two of which parallel face to each other and the other of which is positioned above the two heat sinks 71, four U-shaped heat pipes 75, and a cooling fan 77. The two opposite heat sinks 71 are stacked upon each other and each include a base 72 having elongated ditches 721 recessed thereon, and fins 722 facing to the others. The heat pipes 75 are received in the ditches 721 for conducting the heat from the bottom of the lower heat sink 71 to the upper heat sinks 71. The cooling fan 77 is mounted at a lateral side of the heat sinks 71 and 73 for enhancing the heat-dissipative performance of the heat sinks 71 and 73.
  • However, the aforementioned conventional heat-[0005] dissipating device 70 needs to be improved in structure and heat-dissipative performance as stated below.
  • 1. Although the [0006] heat pipes 75 conduct the heat to the base 72 of each heat sink 71, the fins 722 of the two opposite heat sinks 71 are not connected or in contact with each other, such that the heat in the fins 722 of the lower heat sink 71 can not be directly conducted to the fins 722 of the upper heat sink 71, thereby causing uneven and low heat-dissipative performance.
  • 2. In order to keep the two opposite heat sinks [0007] 71 firmly stacked upon each other, the fins 722 having more thickness are required. Relatively, the fins 722 having more thickness will be less disposed on the base 72 of the heat sink 71, which has fixed area, thereby causing lower heat-dissipative performance due to less heat-dissipative area.
  • 3. The [0008] heat pipes 75 contact the two heat sinks 71 with half of the outer periphery thereof, such that the conventional heat-dissipating device 70 has worse heat-dissipative performance.
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide a heat-dissipating module which has higher heat-dissipative performance than the prior art. [0009]
  • The foregoing objective of the present invention is attained by the heat-dissipating module which is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe, which is U-shaped, includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.[0010]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a first preferred embodiment of the present invention; [0011]
  • FIG. 2 is an exploded view of the first preferred embodiment of the present invention; [0012]
  • FIG. 3 is a perspective view of a second preferred embodiment of the present invention; [0013]
  • FIG. 4 is a perspective view of a third preferred embodiment of the present invention; [0014]
  • FIG. 5 is a perspective view of a prior art; and [0015]
  • FIG. 6 is an exploded view of the prior art.[0016]
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1-2, a heat-dissipating [0017] module 10 of a first preferred embodiment of the present invention is composed of two base plates 11, a plurality of fins 21, three heat pipes 31, and a cooling fan 41.
  • The two [0018] base plates 11, which are in positions parallel to each other and defined an upper base plate and a lower base plate, is made of a metallic heat-conductive material, like aluminum, copper, etc. and each include three tunnels 12 therethrough.
  • The [0019] fins 21 are disposed between the two base plates 11 and parallel to and spaced from one another.
  • Each of the three [0020] heat pipes 31, which are respectively U-shaped, includes two distal sections inserted into the tunnels 12 and a body portion exposed outside the fins 21. Please be noted that the heat pipes 31 are not restricted to three in numbers and can be any.
  • The [0021] cooling fan 41 is mounted at a side of the fins 21. The body portions of the heat pipes 31 are positioned at another side of the fins 21.
  • Referring to FIG. 1, the present invention is operated by rapidly conducting the heat from the [0022] lower base plate 11 via the fins 21 to the upper base plate 11. In addition, the heat in the two base plates 11 is conducted to the center of the fins 21 and dissipated outside by that the cooling fan blows towards the fins 21 to enable the flowing air to bring the heat outside. Accordingly, the heat-dissipating module 10 of the first preferred embodiment of the present invention evenly dissipates the heat by the whole structure, thereby causing excellent heat-dissipative performance.
  • Referring to FIG. 3, the heat-[0023] dissipating module 10′ of a second preferred. embodiment of the present invention is different from the heat-dissipating module 10 of the first preferred embodiment by that the cooling fan 41′ is mounted at a side of the fins 21′ and the body portions of the heat pipes 31′ are positioned at an opposite side of the fins 21′. In addition, the flowing air generated by the cooling fan 41′ passes through the heat pipes 31′ to partially dissipate the heat out of the heat pipes 31′, thereby causing more excellent heat-dissipative performance.
  • Referring to FIG. 4, the heat-[0024] dissipating module 10″ of a third preferred embodiment of the present invention is different from those of the aforementioned embodiment by that the cooling fan 41″ and the body portions of the heat pipes 31′ are mounted at the same side of the fins 21″. In addition, the cooling fan 41″ and the heat pipes 31″ are positioned very adjacently, such that the flowing air dissipates the heat out of the heat pipes 31″ and the fins 21″ at the same time, thereby causing more excellent heat-dissipative performance.
  • In conclusion, the present invention includes advantages as follow. [0025]
  • 1. Excellent Heat-Dissipative Performance: [0026]
  • The fins of the present invention are connected between the two base plates such that the heat can be conducted from one of the base plates to the other. The fins of the present invention are integrally connected to have larger heat-dissipative area, thereby causing higher heat-dissipative performance. [0027]
  • 2. Strengthened Structure: [0028]
  • The fins are connected between the two base plates rather than the fins of the two heat sinks of the prior art stacked upon each other, such that the fins are not subject to random movement, thereby rendering the strengthened structure of the present invention. In addition, the fins having less thickness can be more mounted between the two base plates to enlarge the heat-dissipative area, thereby enhancing the heat-dissipative performance. [0029]
  • 3. Completely Heat-Dissipative: [0030]
  • The heat pipes are completely received in the tunnels to have an external periphery contacting the internal periphery of the tunnels, thereby causing complete heat-dissipative effect. [0031]

Claims (5)

What is claimed is:
1. A heat-dissipating module comprising:
two base plates made of a heat-conductive material and having at least one tunnel therein;
a plurality of fins made of heat-conductive material and mounted between said two base plates;
at least one heat pipe having two distal sections inserted into said tunnels and a body portion exposed outside said fins; and
a cooling fan mounted outside said fins.
2. The heat-dissipating module as defined in claim 1, wherein said heat pipe is three in numbers; each of said two base plates has three tunnels; each of said heat pipes is U-shaped to enable said two distal sections respectively to be inserted into said tunnels.
3. The heat-dissipating module as defined in claim 1, wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at another side of said fins.
4. The heat-dissipating module as defined in claim 1, wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at an opposite side of said fins.
5. The heat-dissipating module as defined in claim 1, wherein said cooling fan and said body portion of said heat pipe are positioned at the same side of said fins.
US10/459,581 2003-05-14 2003-06-12 Heat-dissipating module Abandoned US20040226697A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW92208769 2003-05-14
TW092208769U TWM241964U (en) 2003-05-14 2003-05-14 Heat sink module

Publications (1)

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US20040226697A1 true US20040226697A1 (en) 2004-11-18

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TW (1) TWM241964U (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050092465A1 (en) * 2003-11-05 2005-05-05 Kuo-Len Lin Dual-layer heat dissipating structure
US20050133199A1 (en) * 2003-12-19 2005-06-23 Wei-Ta Lo Heat sink with heat pipes
US20050139347A1 (en) * 2003-12-26 2005-06-30 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20050183849A1 (en) * 2004-02-19 2005-08-25 Ki-Tak Ko Heat radiating apparatus
US20050241808A1 (en) * 2004-04-29 2005-11-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060023423A1 (en) * 2004-07-30 2006-02-02 Via Technologies, Inc. Expandable heat sink
US20060054307A1 (en) * 2004-09-15 2006-03-16 Foxconn Technology Co., Ltd. Heat sink
US20060104032A1 (en) * 2004-11-16 2006-05-18 Hon Hai Precision Industry Co., Ltd Heat dissipation device
US20060181848A1 (en) * 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
US20060289149A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipating device with heat reservoir
US20060289150A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20070095509A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation having a heat pipe
US20070133175A1 (en) * 2005-12-08 2007-06-14 Yi-Qiang Wu Heat dissipation device
US20070139886A1 (en) * 2005-12-19 2007-06-21 Wan-Lin Xia Hybrid heat dissipation device
US20070137838A1 (en) * 2005-12-21 2007-06-21 Foster Jimmy G Sr Heat sink for distributing a thermal load
US20070215327A1 (en) * 2006-03-15 2007-09-20 Cheng-Tien Lai Heat dissipation device
US20070217153A1 (en) * 2006-03-14 2007-09-20 Cheng-Tien Lai Heat dissipation device
US20070295487A1 (en) * 2006-06-21 2007-12-27 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
US20080236798A1 (en) * 2007-04-02 2008-10-02 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipe
US20080314556A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US20090145582A1 (en) * 2007-12-10 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090194255A1 (en) * 2008-02-04 2009-08-06 Tsung-Hsien Huang Cooler device
US20110108244A1 (en) * 2009-11-11 2011-05-12 Fujitsu Limited Heat sink
US10721838B1 (en) * 2018-11-21 2020-07-21 Cisco Technology, Inc. Stacked base heat sink with heat pipes in-line with airflow

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6732786B1 (en) * 2002-10-29 2004-05-11 Taiwan Trigem Information Co., Ltd. Edge-mounted heat dissipation device having top-and-bottom fan structure
US6745824B2 (en) * 2002-06-13 2004-06-08 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
US6892800B2 (en) * 2002-12-31 2005-05-17 International Business Machines Corporation Omnidirectional fan-heatsinks

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6745824B2 (en) * 2002-06-13 2004-06-08 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
US6732786B1 (en) * 2002-10-29 2004-05-11 Taiwan Trigem Information Co., Ltd. Edge-mounted heat dissipation device having top-and-bottom fan structure
US6892800B2 (en) * 2002-12-31 2005-05-17 International Business Machines Corporation Omnidirectional fan-heatsinks

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US20050092465A1 (en) * 2003-11-05 2005-05-05 Kuo-Len Lin Dual-layer heat dissipating structure
US20050133199A1 (en) * 2003-12-19 2005-06-23 Wei-Ta Lo Heat sink with heat pipes
US7401642B2 (en) * 2003-12-19 2008-07-22 Hon Hai Precision Industry Co., Ltd. Heat sink with heat pipes
US7073568B2 (en) * 2003-12-26 2006-07-11 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20050139347A1 (en) * 2003-12-26 2005-06-30 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20050183849A1 (en) * 2004-02-19 2005-08-25 Ki-Tak Ko Heat radiating apparatus
US20050241808A1 (en) * 2004-04-29 2005-11-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7013960B2 (en) * 2004-04-29 2006-03-21 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060023423A1 (en) * 2004-07-30 2006-02-02 Via Technologies, Inc. Expandable heat sink
US20060054307A1 (en) * 2004-09-15 2006-03-16 Foxconn Technology Co., Ltd. Heat sink
US7296617B2 (en) * 2004-09-15 2007-11-20 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink
US20060104032A1 (en) * 2004-11-16 2006-05-18 Hon Hai Precision Industry Co., Ltd Heat dissipation device
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060181848A1 (en) * 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
US7448437B2 (en) * 2005-06-24 2008-11-11 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device with heat reservoir
US20060289150A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US7565925B2 (en) 2005-06-24 2009-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20060289149A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipating device with heat reservoir
US20070095509A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation having a heat pipe
US7298620B2 (en) * 2005-12-08 2007-11-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070133175A1 (en) * 2005-12-08 2007-06-14 Yi-Qiang Wu Heat dissipation device
US20070139886A1 (en) * 2005-12-19 2007-06-21 Wan-Lin Xia Hybrid heat dissipation device
US7447027B2 (en) * 2005-12-19 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Hybrid heat dissipation device
US20070137838A1 (en) * 2005-12-21 2007-06-21 Foster Jimmy G Sr Heat sink for distributing a thermal load
US7347251B2 (en) * 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US20070217153A1 (en) * 2006-03-14 2007-09-20 Cheng-Tien Lai Heat dissipation device
US7440279B2 (en) * 2006-03-14 2008-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070215327A1 (en) * 2006-03-15 2007-09-20 Cheng-Tien Lai Heat dissipation device
US7448438B2 (en) * 2006-06-21 2008-11-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat pipe type heat dissipation device
US20070295487A1 (en) * 2006-06-21 2007-12-27 Foxconn Technology Co., Ltd. Heat pipe type heat dissipation device
US20080236798A1 (en) * 2007-04-02 2008-10-02 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipe
US7537046B2 (en) * 2007-04-02 2009-05-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20080314556A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US7891411B2 (en) * 2007-06-22 2011-02-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US20090145582A1 (en) * 2007-12-10 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7753110B2 (en) * 2007-12-10 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090194255A1 (en) * 2008-02-04 2009-08-06 Tsung-Hsien Huang Cooler device
US20110108244A1 (en) * 2009-11-11 2011-05-12 Fujitsu Limited Heat sink
CN102074532A (en) * 2009-11-11 2011-05-25 富士通株式会社 Heat sink
US10721838B1 (en) * 2018-11-21 2020-07-21 Cisco Technology, Inc. Stacked base heat sink with heat pipes in-line with airflow

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Owner name: TAI-SOL ELECTRONICS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, KO-PIN;REEL/FRAME:014179/0277

Effective date: 20030531

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION