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US20040200609A1 - Heat sink with multiple micro bosses - Google Patents

Heat sink with multiple micro bosses Download PDF

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Publication number
US20040200609A1
US20040200609A1 US10/408,268 US40826803A US2004200609A1 US 20040200609 A1 US20040200609 A1 US 20040200609A1 US 40826803 A US40826803 A US 40826803A US 2004200609 A1 US2004200609 A1 US 2004200609A1
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US
United States
Prior art keywords
heat dissipating
heat
heat sink
dissipating fin
dissipating fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/408,268
Inventor
Vincent Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auras Technology Co Ltd
Original Assignee
Auras Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auras Technology Co Ltd filed Critical Auras Technology Co Ltd
Priority to US10/408,268 priority Critical patent/US20040200609A1/en
Assigned to AURAS TECHNOLOGY LTD. reassignment AURAS TECHNOLOGY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, VINCENT
Publication of US20040200609A1 publication Critical patent/US20040200609A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • H10W40/226—
    • H10W40/43—

Definitions

  • the present invention relates to a heat sink, and more particularly to a heat sink composed of multiple heat dissipating fins each with multiple micro bosses formed on a periphery of the heat dissipating fin to increase an overall area in contact with air so that heat dissipation effect is increased.
  • a conventional approach to increase heat dissipation efficiency is to enlarge the length and/or width of the heat dissipating fins in a heat sink. With the increase of the length and width, the overall exposure area to the air is increased. Therefore, when heat is conducted to the heat dissipating fins, the heat is able to be dissipated by the air flowing by each of the heat dissipating fins.
  • Increasing the heat dissipating efficiency by increasing the length and width of the heat dissipating fins was effective in earlier times, however, due to the available space in high tech electronic devices becoming smaller and smaller, increasing the length and width can no longer solve the problem.
  • each of the heat dissipating fins of the heat sink has multiple bosses formed on a periphery of the heat dissipating fin so that the overall exposure area to the air is increased. Therefore, when air flows through the heat sink, the heat volume on the heat sink and taken away by the air is increased. Using the concept of increasing the overall area of the heat sink exposed to the air so as to increase the heat dissipating volume is practical, inexpensive and reliable. However, a side effect of this type of heat sink is unavoidable.
  • the present invention tends to provide an improved heat sink to mitigate and obviate the aforementioned problems.
  • the primary objective of the present invention is to provide an improved heat sink with multiple heat dissipating fins each securely connected to one another and having multiple micro bosses on a surface of the heat dissipating fin. Due to the size of the bosses being minimized, the small scale of the laminar flow is not able to influence the air flow over the heat dissipating fins such that the overall heat dissipating volume is increased in that the overall area in contact with the air is increased.
  • Another objective of the present invention is to provide an improved heat sink with multiple heat dissipating fins each provided with two side walls oppositely formed on the surface of the heat dissipating fin so that the heat dissipating fin is able to securely connect to an adjacent heat dissipating fin via the opposed side walls.
  • each heat dissipating fin has a through hole aligning with the through hole of the adjacent heat dissipating fin so that a heat conducting bar is able to extend into the aligned through hole and thus securely engage with each one of the heat dissipating fins.
  • each of the heat dissipating fins has a flange formed around a periphery defining the through hole thus when the heat conducting bar extends into the aligned through holes, the heat conducting bar is able to securely connect to each one of the heat dissipating fins via the flanges.
  • FIG. 1 is a perspective view of the heat sink of the present invention
  • FIG. 2 is a schematic side view showing the inside of the heat sink in FIG. 1;
  • FIG. 3 is a schematic view showing the bosses formed on a surface of each of the heat dissipating fins.
  • FIG. 4 is a perspective view showing another preferred embodiment of the heat sink of the present invention.
  • a heat sink in accordance with the present invention has multiple heat dissipating fins ( 1 ) and a heat conducting bar ( 2 ).
  • Each heat dissipating fin ( 1 ) has two side walls ( 11 ) oppositely formed on two sides of the heat dissipating fin ( 1 ), a through hole ( 12 ) defined through a periphery of the heat dissipating fin ( 1 ) and sandwiched between the two side walls ( 11 ) and a flange ( 13 ) formed around a periphery defining the through hole ( 12 ).
  • the multiple heat dissipating fins ( 1 ) are securely connected to one another via the side walls ( 11 ).
  • the through holes ( 12 ) are aligned with and communicated to each other.
  • the heat conducting bar ( 2 ) is extended into the aligned through holes ( 12 ) and is securely connected to the flanges ( 13 ) of each of the heat dissipating fins ( 1 ).
  • the heat conducting bar ( 2 ) is placed to be in contact with a heat generating element, i.e. a central processing unit (CPU). After operation of the CPU, the generated heat is conducted to the heat conducting bar ( 2 ) and then is conducted to the heat dissipating fins ( 1 ).
  • a heat generating element i.e. a central processing unit (CPU).
  • each heat dissipating fin ( 1 ) has multiple micro bosses ( 14 ) formed on a periphery of the heat dissipating fin ( 1 ).
  • Each micro boss ( 14 ) is in the order of 10 ⁇ 6 to 10 ⁇ 9 mm, such that the formation of the micro bosses ( 14 ) on the periphery of the heat dissipating fin ( 1 ) has only little influence to the air flow over each of the heat dissipating fins ( 1 ). That is, because the dimension of the micro bosses ( 14 ) is so small that the laminar effect caused by the formation of the micro bosses ( 14 ) is negligible. Furthermore, because the overall area of each of the heat dissipating fins ( 1 ) to be in contact with the air is increased, the heat dissipating capability is also increased.
  • FIG. 4 another preferred embodiment of the present invention is shown, wherein the heat sink of the present invention in this embodiment has multiple heat dissipating fins ( 1 ) each provided with two opposite side walls ( 11 ). Each heat dissipating fin ( 1 ) is connected to an adjacent heat dissipating fin ( 1 ) via engagement between the opposite side walls ( 11 ) and a bottom face of the adjacent heat dissipating fin ( 1 ). That is, this embodiment is substantially the same as that disclosed in the first embodiment. The only difference therebetween is that the second embodiment does not have the through hole ( 12 ) and the heat conducting bar ( 2 ).
  • the formation of the micro bosses on the dissipating fins not only increases the heat dissipating capability of the heat sink of the present invention, but also avoids the occurrence of laminar effect which would otherwise decrease the heat dissipating volume.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes multiple heat dissipating fins each with two opposite side walls. Multiple micro bosses are formed on a periphery of the heat dissipating fin. Each heat dissipating fin is securely connected to an adjacent heat dissipating fin via secure engagement between the side walls and a bottom face of the adjacent heat dissipating fin. Each micro boss is in the order between 10−6 to 10−9 mm so that laminar effect to decrease heat dissipating capability of the heat sink is avoided.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heat sink, and more particularly to a heat sink composed of multiple heat dissipating fins each with multiple micro bosses formed on a periphery of the heat dissipating fin to increase an overall area in contact with air so that heat dissipation effect is increased. [0002]
  • 2. Description of Related Art [0003]
  • A conventional approach to increase heat dissipation efficiency is to enlarge the length and/or width of the heat dissipating fins in a heat sink. With the increase of the length and width, the overall exposure area to the air is increased. Therefore, when heat is conducted to the heat dissipating fins, the heat is able to be dissipated by the air flowing by each of the heat dissipating fins. Increasing the heat dissipating efficiency by increasing the length and width of the heat dissipating fins was effective in earlier times, however, due to the available space in high tech electronic devices becoming smaller and smaller, increasing the length and width can no longer solve the problem. [0004]
  • In order to cope with the existing problem of having smaller and smaller available space and higher and higher heat generated by high speed electronic elements, a novel heat sink is introduced to the market. Each of the heat dissipating fins of the heat sink has multiple bosses formed on a periphery of the heat dissipating fin so that the overall exposure area to the air is increased. Therefore, when air flows through the heat sink, the heat volume on the heat sink and taken away by the air is increased. Using the concept of increasing the overall area of the heat sink exposed to the air so as to increase the heat dissipating volume is practical, inexpensive and reliable. However, a side effect of this type of heat sink is unavoidable. That is, when the air flows around each of the heat dissipating fins, the bosses on each of the heat dissipating fins disturb the air flow, which causes the laminar effect. When there is a laminar effect on a surface, the fluid flowing over the surface is not smooth. Therefore, if the laminar flow occurs on the heat dissipating surface on the heat dissipating fins, the heat dissipating efficiency is seriously influenced and thus degraded. In another word, the heat convection between the heat dissipator and the air is seriously influenced. Thus, heat dissipation effect is decreased. [0005]
  • To overcome the shortcomings, the present invention tends to provide an improved heat sink to mitigate and obviate the aforementioned problems. [0006]
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide an improved heat sink with multiple heat dissipating fins each securely connected to one another and having multiple micro bosses on a surface of the heat dissipating fin. Due to the size of the bosses being minimized, the small scale of the laminar flow is not able to influence the air flow over the heat dissipating fins such that the overall heat dissipating volume is increased in that the overall area in contact with the air is increased. [0007]
  • Another objective of the present invention is to provide an improved heat sink with multiple heat dissipating fins each provided with two side walls oppositely formed on the surface of the heat dissipating fin so that the heat dissipating fin is able to securely connect to an adjacent heat dissipating fin via the opposed side walls. [0008]
  • Still another object of the present invention is that each heat dissipating fin has a through hole aligning with the through hole of the adjacent heat dissipating fin so that a heat conducting bar is able to extend into the aligned through hole and thus securely engage with each one of the heat dissipating fins. [0009]
  • Another object of the present invention is that each of the heat dissipating fins has a flange formed around a periphery defining the through hole thus when the heat conducting bar extends into the aligned through holes, the heat conducting bar is able to securely connect to each one of the heat dissipating fins via the flanges. [0010]
  • Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.[0011]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of the heat sink of the present invention; [0012]
  • FIG. 2 is a schematic side view showing the inside of the heat sink in FIG. 1; [0013]
  • FIG. 3 is a schematic view showing the bosses formed on a surface of each of the heat dissipating fins; and [0014]
  • FIG. 4 is a perspective view showing another preferred embodiment of the heat sink of the present invention.[0015]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • With reference to FIGS. 1 and 2, a heat sink in accordance with the present invention has multiple heat dissipating fins ([0016] 1) and a heat conducting bar (2).
  • Each heat dissipating fin ([0017] 1) has two side walls (11) oppositely formed on two sides of the heat dissipating fin (1), a through hole (12) defined through a periphery of the heat dissipating fin (1) and sandwiched between the two side walls (11) and a flange (13) formed around a periphery defining the through hole (12).
  • When the heat sink is in assembly, the multiple heat dissipating fins ([0018] 1) are securely connected to one another via the side walls (11). After the heat dissipating fins (1) are securely connected to one another, the through holes (12) are aligned with and communicated to each other. The heat conducting bar (2) is extended into the aligned through holes (12) and is securely connected to the flanges (13) of each of the heat dissipating fins (1). After the assembly of the heat sink of the present invention, the heat conducting bar (2) is placed to be in contact with a heat generating element, i.e. a central processing unit (CPU). After operation of the CPU, the generated heat is conducted to the heat conducting bar (2) and then is conducted to the heat dissipating fins (1).
  • With reference to FIG. 3, it is noted that each heat dissipating fin ([0019] 1) has multiple micro bosses (14) formed on a periphery of the heat dissipating fin (1). Each micro boss (14) is in the order of 10−6 to 10−9 mm, such that the formation of the micro bosses (14) on the periphery of the heat dissipating fin (1) has only little influence to the air flow over each of the heat dissipating fins (1). That is, because the dimension of the micro bosses (14) is so small that the laminar effect caused by the formation of the micro bosses (14) is negligible. Furthermore, because the overall area of each of the heat dissipating fins (1) to be in contact with the air is increased, the heat dissipating capability is also increased.
  • With reference to FIG. 4, another preferred embodiment of the present invention is shown, wherein the heat sink of the present invention in this embodiment has multiple heat dissipating fins ([0020] 1) each provided with two opposite side walls (11). Each heat dissipating fin (1) is connected to an adjacent heat dissipating fin (1) via engagement between the opposite side walls (11) and a bottom face of the adjacent heat dissipating fin (1). That is, this embodiment is substantially the same as that disclosed in the first embodiment. The only difference therebetween is that the second embodiment does not have the through hole (12) and the heat conducting bar (2).
  • In summary, the formation of the micro bosses on the dissipating fins not only increases the heat dissipating capability of the heat sink of the present invention, but also avoids the occurrence of laminar effect which would otherwise decrease the heat dissipating volume. [0021]
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. [0022]

Claims (5)

What is claimed is:
1. A heat sink comprising:
multiple heat dissipating fins each provided with two opposite side walls and multiple micro bosses formed on a periphery of the heat dissipating fin; each heat dissipating fin securely connected to an adjacent heat dissipating fin via secure engagement between the side walls and a bottom face of the adjacent heat dissipating fin, wherein each micro boss is in the order between 10−6 to 10−9 mm.
2. The heat sink as claimed in claim 1, wherein each heat dissipating fin further has a through hole and after the heat dissipating fins are securely connected to one another, the through holes are aligned with and communicated to each other.
3. The heat sink as claimed in claim 2 further comprising a heat conducting bar extending into the aligned through holes to securely engage with each one of the heat dissipating fins.
4. The heat sink as claimed in claim 2, wherein a flange is formed around a periphery defining the through hole.
5. The heat sink as claimed in claim 3, wherein a flange is formed around a periphery defining the through hole so that after the heat conducting bar extends into the aligned through holes, the heat conducting bar is able to securely engage with each one of the heat dissipating fins via the flanges.
US10/408,268 2003-04-08 2003-04-08 Heat sink with multiple micro bosses Abandoned US20040200609A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20100139892A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US11402157B2 (en) * 2016-09-02 2022-08-02 Acer Incorporated Lattice boiler evaporator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5351166A (en) * 1991-12-30 1994-09-27 Goldstar Co., Ltd. Cooling apparatus of magnetrons
US5353865A (en) * 1992-03-30 1994-10-11 General Electric Company Enhanced impingement cooled components
US5730213A (en) * 1995-11-13 1998-03-24 Alliedsignal, Inc. Cooling tube for heat exchanger
US6269864B1 (en) * 2000-02-18 2001-08-07 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US6402464B1 (en) * 2000-08-29 2002-06-11 General Electric Company Enhanced heat transfer surface for cast-in-bump-covered cooling surfaces and methods of enhancing heat transfer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5351166A (en) * 1991-12-30 1994-09-27 Goldstar Co., Ltd. Cooling apparatus of magnetrons
US5353865A (en) * 1992-03-30 1994-10-11 General Electric Company Enhanced impingement cooled components
US5730213A (en) * 1995-11-13 1998-03-24 Alliedsignal, Inc. Cooling tube for heat exchanger
US6269864B1 (en) * 2000-02-18 2001-08-07 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US6402464B1 (en) * 2000-08-29 2002-06-11 General Electric Company Enhanced heat transfer surface for cast-in-bump-covered cooling surfaces and methods of enhancing heat transfer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US8205665B2 (en) * 2008-07-28 2012-06-26 Foxconn Technology Co., Ltd. Heat dissipation device
US20100139892A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US11402157B2 (en) * 2016-09-02 2022-08-02 Acer Incorporated Lattice boiler evaporator

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Legal Events

Date Code Title Description
AS Assignment

Owner name: AURAS TECHNOLOGY LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, VINCENT;REEL/FRAME:013952/0429

Effective date: 20030404

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION