US20040200601A1 - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- US20040200601A1 US20040200601A1 US10/834,693 US83469304A US2004200601A1 US 20040200601 A1 US20040200601 A1 US 20040200601A1 US 83469304 A US83469304 A US 83469304A US 2004200601 A1 US2004200601 A1 US 2004200601A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink assembly
- heat
- thermally conductive
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H10W40/226—
-
- H10W40/43—
-
- H10W40/73—
Definitions
- This invention generally relates to cooling devices such as heat exchangers and, particularly, to a heat sink assembly having an improved heat exchanger arrangement.
- An object, therefore, of the invention is to provide a new and improved heat sink assembly of the character described.
- the heat sink assembly used to dissipate heat from a heat producing electronic device includes a heat exchanging section having a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges.
- the folded sheet is formed into a generally cylindrical configuration, whereby the troughs form an inner-segmented cylinder and the ridges form an outer-segmented cylinder generally concentric with the inner cylinder.
- the heat exchanging section is in thermal contact with a heat-producing device via a thermally conductive path which is thermally connected to at least one of the troughs of the fins.
- the assembly may include a cylindrical heat conductive rod within the inner-segmented cylinder defined by the troughs of the folded sheet.
- the rod is dimensioned for engaging the troughs, and the fins are generally parallel to the rod.
- the rod may be hollow, solid or comprise a fluid filled heat pipe.
- the heat sink assembly is shown as part of a heat exchanger assembly including a fan mounted on the heat exchanging section at an end thereof opposite the heat producing electronic device.
- the end edges of the fins adjacent the heat producing electronic device are spaced from the heat producing electronic device so that the fan can circulate cooling air completely through the heat exchanging section.
- apertures can be place in the ridges of the fins so that the end edges of the fins can be placed on the heat producing electronic device, with the apertures in the ridges of the fins allowing air to circulate fully through the heat exchanging section.
- the invention may also have a thermally conductive base plate at an end opposite the fan.
- FIG. 1 is a top perspective view of a heat exchanger assembly incorporating the heat sink assembly of the invention
- FIG. 2 is an exploded perspective view of the heat exchanger assembly of FIG. 1;
- FIG. 3 is an exploded perspective view of the heat exchanger assembly of FIG. 1 including a base plate.
- a heat sink assembly generally designated 10
- a circular fan assembly 12 having lead wires 14 extending therefrom and terminating in an electrical connector 16 .
- the fan assembly is mounted on top of a heat exchanging section, generally designated 18 .
- the heat exchanging section is mounted above a base assembly, generally designated 20 .
- heat exchanging section 18 includes a thermally conductive sheet, generally designated 22 , which is folded into alternating ridges 24 and troughs 26 defining generally parallel spaced fins 28 having opposite end edges 30 and 32 .
- Folded sheet 22 is formed into a generally cylindrical configuration as best seen in FIG. 2, whereby troughs 26 form an inner segmented cylinder 34 and ridges 24 form an outer segmented cylinder 36 generally concentric with inner cylinder 34 .
- the inner and outer cylinders are “segmented” because they are not defined by continuously smooth surfaces, therefore allowing air to circulate to or from the side of fins 28 .
- ridges 24 and troughs 26 form axially extending circumferentially spaced segments of the cylinders.
- the ridges 24 may also include apertures 29 to allow air contained inside the fins 28 to escape in those instances where the end edge 30 of the fins 28 are in direct contact with the heat producing electronic device 38 , or in those instances where additional air escape paths are desired to meet the required cooling requirements of the system.
- Heat sink assembly 10 also includes a cylindrical heat conductive rod 40 disposed within inner-segmented cylinder 34 defined by troughs 26 of heat exchanging section 22 . It can be seen in FIG. 2 that the rod has a greater diameter than inner-segmented cylinder 34 .
- the folded sheet of the section expands in an accordion-like fashion, whereby troughs 34 are biased into engagement with the outer cylindrical surface of rod 40 .
- the folded sheet which forms heat exchanging section 22 sort of grips the rod to provide good heat conductivity therebetween.
- the rod may be a solid structure, a hollow structure or may comprise a fluid filled heat pipe.
- the diameter of the rod 40 may be the same as the diameter of the inner-segmented cylinder 34 , with the inner-segmented cylinder 34 being affixed to the rod with any known means of affixing two items together, such as an epoxy material or a clamping device (not shown).
- the rod 40 is in direct contact with the heat generating electronic device 38 .
- a spring bracket generally designated 42 (FIGS. 2 and 3), may be used to mount the heat sink assembly 10 to the electronic device to be cooled.
- the spring bracket 42 includes a center ring portion 44 and a pair of diametrically disposed arms 46 terminating in apertured latch hooks 48 .
- Ring portion 44 snaps into a circular peripheral groove 50 about the rod spaced from the bottom of rod 40 .
- Apertured latch hooks 48 at the distal ends of arms 40 snap over a pair of hooked latch bosses 52 on opposite sides of base assembly 20 .
- Spring bracket 42 is effective to bias a bottom end 40 a of rod 40 into thermal engagement with heat generating electronic device 38 .
- the spring bracket also is effective to space end edges 30 at the bottom end of folded sheet 22 above the base plate 41 so that fan assembly 12 circulates cooling air completely through fins 28 .
- a fan mounting bracket generally designated 54 (FIG. 2), also includes a ring portion 56 which is appropriately fixed to the top end of rod 40 .
- Four arms 58 radiate outwardly from ring portion 56 and terminate in four mounting posts 60 .
- Appropriate fasteners (not shown) are inserted through four holes 62 in fan assembly 12 and into mounting posts 60 to hold the fan assembly onto bracket 54 which, in turn, is mounted to the top of rod 40 .
- Fan assembly 12 causes cooler air from the atmosphere to flow between and around the fins in a heat exchanging fashion.
- Heat sink assembly 10 may also include a thermally conductive base plate 41 (FIG. 3) which transfers heat to be dissipated to the rod, with the thermally conductive base plate 41 being mounted at the bottom end 40 a of rod 40 , and end edges 30 of fins 28 at the bottom end of heat exchanging section 22 are located above the base plate 41 .
- the bottom end 40 a of rod 40 may be directly attached to the thermally conductive base plate 41 , such as by welding, brazing or epoxy, or the rod 40 and base plate 41 may comprise a single integral structure.
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration whereby the troughs form an inner-segmented cylinder and the ridges form an outer-segmented cylinder generally concentric with the inner cylinder. The heat sink assembly may include a heat conductive rod dimensioned to engage the troughs of the thermally conductive sheet. The ridges of the thermally conductive sheet may also contain apertures to allow air to fully circulate through the fins. The heat sink assembly may also include a fan and a thermally conductive base plate.
Description
- This application is a continuation of application Ser. No. 09/386,103, filed on Aug. 30, 1999.
- This invention generally relates to cooling devices such as heat exchangers and, particularly, to a heat sink assembly having an improved heat exchanger arrangement.
- In various industries, such as in the computer industry, there is a need for low cost high performance heat exchangers to cool such components as microprocessors or semiconductors. Many semiconductors create so much heat that they can be irreparably damaged if the heat is not removed. Consequently, heat exchangers employing heat sinks have been used to pull the heat away from the semiconductor and disperse that heat into the atmosphere. The present invention is directed to improvements in such heat sink assemblies.
- An object, therefore, of the invention is to provide a new and improved heat sink assembly of the character described.
- In one embodiment of the invention, the heat sink assembly used to dissipate heat from a heat producing electronic device includes a heat exchanging section having a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration, whereby the troughs form an inner-segmented cylinder and the ridges form an outer-segmented cylinder generally concentric with the inner cylinder. The heat exchanging section is in thermal contact with a heat-producing device via a thermally conductive path which is thermally connected to at least one of the troughs of the fins.
- The invention contemplates that the assembly may include a cylindrical heat conductive rod within the inner-segmented cylinder defined by the troughs of the folded sheet. The rod is dimensioned for engaging the troughs, and the fins are generally parallel to the rod. The rod may be hollow, solid or comprise a fluid filled heat pipe.
- The heat sink assembly is shown as part of a heat exchanger assembly including a fan mounted on the heat exchanging section at an end thereof opposite the heat producing electronic device. The end edges of the fins adjacent the heat producing electronic device are spaced from the heat producing electronic device so that the fan can circulate cooling air completely through the heat exchanging section. Alternatively, in situations where the overall length of the heat sink assembly is a design driver, apertures can be place in the ridges of the fins so that the end edges of the fins can be placed on the heat producing electronic device, with the apertures in the ridges of the fins allowing air to circulate fully through the heat exchanging section.
- The invention may also have a thermally conductive base plate at an end opposite the fan.
- Other objects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying drawings.
- The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:
- FIG. 1 is a top perspective view of a heat exchanger assembly incorporating the heat sink assembly of the invention;
- FIG. 2 is an exploded perspective view of the heat exchanger assembly of FIG. 1; and
- FIG. 3 is an exploded perspective view of the heat exchanger assembly of FIG. 1 including a base plate.
- Referring to the drawings in greater detail, one embodiment of the invention is incorporated in a heat sink assembly, generally designated 10, which includes a
circular fan assembly 12 havinglead wires 14 extending therefrom and terminating in anelectrical connector 16. The fan assembly is mounted on top of a heat exchanging section, generally designated 18. The heat exchanging section, in turn, is mounted above a base assembly, generally designated 20. - More particularly,
heat exchanging section 18 includes a thermally conductive sheet, generally designated 22, which is folded intoalternating ridges 24 andtroughs 26 defining generally parallel spacedfins 28 having 30 and 32. Foldedopposite end edges sheet 22 is formed into a generally cylindrical configuration as best seen in FIG. 2, wherebytroughs 26 form an inner segmentedcylinder 34 andridges 24 form an outer segmentedcylinder 36 generally concentric withinner cylinder 34. The inner and outer cylinders are “segmented” because they are not defined by continuously smooth surfaces, therefore allowing air to circulate to or from the side offins 28. In other words,ridges 24 andtroughs 26 form axially extending circumferentially spaced segments of the cylinders. Theridges 24 may also includeapertures 29 to allow air contained inside thefins 28 to escape in those instances where theend edge 30 of thefins 28 are in direct contact with the heat producingelectronic device 38, or in those instances where additional air escape paths are desired to meet the required cooling requirements of the system. -
Heat sink assembly 10 also includes a cylindrical heatconductive rod 40 disposed within inner-segmentedcylinder 34 defined bytroughs 26 ofheat exchanging section 22. It can be seen in FIG. 2 that the rod has a greater diameter than inner-segmentedcylinder 34. When the rod is inserted into the cylinder within the inside ofheat exchanging section 22, the folded sheet of the section expands in an accordion-like fashion, wherebytroughs 34 are biased into engagement with the outer cylindrical surface ofrod 40. In other words, the folded sheet which formsheat exchanging section 22 sort of grips the rod to provide good heat conductivity therebetween. The rod may be a solid structure, a hollow structure or may comprise a fluid filled heat pipe. Alternatively, the diameter of therod 40 may be the same as the diameter of the inner-segmentedcylinder 34, with the inner-segmentedcylinder 34 being affixed to the rod with any known means of affixing two items together, such as an epoxy material or a clamping device (not shown). In the preferred embodiment, therod 40 is in direct contact with the heat generatingelectronic device 38. - A spring bracket, generally designated 42 (FIGS. 2 and 3), may be used to mount the
heat sink assembly 10 to the electronic device to be cooled. Thespring bracket 42 includes acenter ring portion 44 and a pair of diametrically disposedarms 46 terminating in aperturedlatch hooks 48.Ring portion 44 snaps into a circularperipheral groove 50 about the rod spaced from the bottom ofrod 40. Aperturedlatch hooks 48 at the distal ends ofarms 40 snap over a pair of hookedlatch bosses 52 on opposite sides ofbase assembly 20.Spring bracket 42 is effective to bias abottom end 40 a ofrod 40 into thermal engagement with heat generatingelectronic device 38. The spring bracket also is effective tospace end edges 30 at the bottom end of foldedsheet 22 above the base plate 41 so thatfan assembly 12 circulates cooling air completely throughfins 28. - A fan mounting bracket, generally designated 54 (FIG. 2), also includes a
ring portion 56 which is appropriately fixed to the top end ofrod 40. Fourarms 58 radiate outwardly fromring portion 56 and terminate in fourmounting posts 60. Appropriate fasteners (not shown) are inserted through fourholes 62 infan assembly 12 and intomounting posts 60 to hold the fan assembly ontobracket 54 which, in turn, is mounted to the top ofrod 40. - Heat generated from the
electronic device 38, such as microprocessors, semiconductors and the like, withinbase assembly 20 is conducted to therod 40 and intoheat exchanging section 22 where fins 28 dissipate the heat to the atmosphere.Fan assembly 12 causes cooler air from the atmosphere to flow between and around the fins in a heat exchanging fashion. -
Heat sink assembly 10 may also include a thermally conductive base plate 41 (FIG. 3) which transfers heat to be dissipated to the rod, with the thermally conductive base plate 41 being mounted at thebottom end 40 a ofrod 40, andend edges 30 offins 28 at the bottom end ofheat exchanging section 22 are located above the base plate 41. Thebottom end 40 a ofrod 40 may be directly attached to the thermally conductive base plate 41, such as by welding, brazing or epoxy, or therod 40 and base plate 41 may comprise a single integral structure. - It will be understood that the invention may be embodied in other specific forms without departing from the spirit or central characteristics thereof. The present examples and embodiments, therefore, are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (16)
1. A heat sink assembly, comprising:
a heat exchanging section including a thermally conductive sheet folded into alternating ridges and troughs defining spaced fins having opposite end edges, said folded sheet being formed into a generally cylindrical configuration whereby the troughs form an inner segmented cylinder and the ridges form an outer segmented cylinder generally concentric with the inner cylinder; and
a heat conductive rod within said inner-segmented cylinder defined by said troughs, wherein said rod is solid.
2. The heat sink assembly of claim 1 wherein said fins are generally parallel to each other.
3. The heat sink assembly of claim 1 wherein said fins are generally parallel to said rod.
4. The heat sink assembly of claim 1 , including a fan mounted on the heat exchanging section at an end thereof.
5. The heat sink assembly of claim 1 wherein at least one of the troughs contains an aperture.
6. The heat sink assembly of claim 5 wherein the aperture is proximate a bottom end of the trough.
7. The heat sink assembly of claim 1 , including a thermally conductive base plate above which the heat exchanging section is mounted, with the first end edges of the fins of the cylindrically configured folded sheet being between the base plate and the second end edges of the fins.
8. The heat sink assembly of claim 7 wherein one end of said rod is in engagement with the thermally conductive base plate.
9. The heat sink assembly of claim 7 wherein the rod and the thermally conductive base plate constitute a single, integral structure.
10. The heat sink assembly of claim 7 wherein at least one of the troughs contains an aperture.
11. The heat sink assembly of claim 7 , including a fan mounted on the heat exchanging section at an end thereof opposite the thermally conductive base plate.
12. A heat sink assembly, comprising:
a heat exchanging section including a thermally conductive sheet folded into alternating ridges and troughs defining spaced fins having opposite end edges, said folded sheet being formed into a generally cylindrical configuration whereby the troughs form an inner segmented cylinder and the ridges form an outer segmented cylinder generally concentric with the inner cylinder; and
a heat conductive rod within said inner segmented cylinder defined by said troughs, wherein said rod is a heat pipe containing a fluid inside.
13. The heat sink assembly of claim 12 , including a thermally conductive base plate above which the heat exchanging section is mounted, with the first end edges of the fins of the cylindrically configured folded sheet being between the base plate and the second end edges of the fins.
14. The heat sink assembly of claim 13 wherein one end of said rod is in engagement with the thermally conductive base plate.
15. The heat sink assembly of claim 13 wherein the rod and the thermally conductive base plate constitute a single, integral structure.
16. The heat sink assembly of claim 13 , including a fan mounted on the heat exchanging section at an end thereof opposite the thermally conductive base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/834,693 US20040200601A1 (en) | 1999-08-30 | 2004-04-29 | Heat sink assembly |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/386,103 US6851467B1 (en) | 1999-08-30 | 1999-08-30 | Heat sink assembly |
| US10/834,693 US20040200601A1 (en) | 1999-08-30 | 2004-04-29 | Heat sink assembly |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/386,103 Continuation US6851467B1 (en) | 1999-08-30 | 1999-08-30 | Heat sink assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20040200601A1 true US20040200601A1 (en) | 2004-10-14 |
Family
ID=23524168
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/386,103 Expired - Fee Related US6851467B1 (en) | 1999-08-30 | 1999-08-30 | Heat sink assembly |
| US10/834,693 Abandoned US20040200601A1 (en) | 1999-08-30 | 2004-04-29 | Heat sink assembly |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/386,103 Expired - Fee Related US6851467B1 (en) | 1999-08-30 | 1999-08-30 | Heat sink assembly |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6851467B1 (en) |
| EP (1) | EP1081760A3 (en) |
| JP (2) | JP2001102509A (en) |
| CN (1) | CN1299553C (en) |
| MX (1) | MXPA00008166A (en) |
| TW (1) | TW498993U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
| US20090014154A1 (en) * | 2005-11-09 | 2009-01-15 | Tir Technology Lp | Passive Thermal Management System |
| US20090236078A1 (en) * | 2008-03-20 | 2009-09-24 | Chin-Kuang Luo | Heat-dissipating device |
| US20110030920A1 (en) * | 2009-08-04 | 2011-02-10 | Asia Vital Components (Shen Zhen) Co., Ltd. | Heat Sink Structure |
| USD662898S1 (en) * | 2011-03-24 | 2012-07-03 | Graftech International Holdings Inc. | Heat sink for LED light bulb |
| US20120186798A1 (en) * | 2011-01-26 | 2012-07-26 | Celsia Technologies Taiwan, I | Cooling module for led lamp |
| US8534878B2 (en) | 2008-08-22 | 2013-09-17 | Virginia Optoelectronics, Inc. | LED lamp assembly |
| US10724712B2 (en) | 2008-07-08 | 2020-07-28 | Us Vaopto, Inc. | Modular LED lighting systems, including flexible, rigid, and waterproof lighting strips and connectors |
| US11024558B2 (en) * | 2010-03-26 | 2021-06-01 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940073A (en) | 1996-05-03 | 1999-08-17 | Starsight Telecast Inc. | Method and system for displaying other information in a TV program guide |
| US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
| US6557626B1 (en) * | 2000-01-11 | 2003-05-06 | Molex Incorporated | Heat sink retainer and Heat sink assembly using same |
| US7225859B2 (en) * | 2000-09-01 | 2007-06-05 | Sharp Kabushiki Kaisha | Heat exchanger element and heat exchanger member for a stirling cycle refrigerator and method of manufacturing such a heat exchanger member |
| US6501655B1 (en) | 2000-11-20 | 2002-12-31 | Intel Corporation | High performance fin configuration for air cooled heat sinks |
| US6633484B1 (en) * | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
| MXPA03004441A (en) | 2000-11-20 | 2005-01-25 | Intel Corp | HIGH PERFORMANCE THERMAL BATTERY SETTINGS TO BE USED IN HIGH DENSITY PACKAGING APPLICATIONS. |
| US6479895B1 (en) | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
| US6827130B2 (en) | 2001-06-05 | 2004-12-07 | Heat Technology, Inc. | Heatsink assembly and method of manufacturing the same |
| US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
| US6705144B2 (en) | 2001-09-10 | 2004-03-16 | Intel Corporation | Manufacturing process for a radial fin heat sink |
| US6543522B1 (en) * | 2001-10-31 | 2003-04-08 | Hewlett-Packard Development Company, L.P. | Arrayed fin cooler |
| US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
| US6668910B2 (en) * | 2002-04-09 | 2003-12-30 | Delphi Technologies, Inc. | Heat sink with multiple surface enhancements |
| US6830097B2 (en) | 2002-09-27 | 2004-12-14 | Modine Manufacturing Company | Combination tower and serpentine fin heat sink device |
| US6712128B1 (en) | 2002-11-20 | 2004-03-30 | Thermal Corp. | Cylindrical fin tower heat sink and heat exchanger |
| CN1307716C (en) * | 2002-12-06 | 2007-03-28 | 诺亚公司 | Multidirectional liquid storage slot heat conducting apparatus and method |
| CN1293627C (en) * | 2003-01-15 | 2007-01-03 | 诺亚公司 | Energy transfer method and device with unidirectional airflow and hollow cavity |
| TWM246687U (en) | 2003-10-28 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
| CN2676128Y (en) * | 2003-12-11 | 2005-02-02 | 东莞莫仕连接器有限公司 | Heat conducting device |
| US7149083B2 (en) * | 2004-03-05 | 2006-12-12 | Hul-Chun Hsu | Heat dissipation structure |
| US7497248B2 (en) | 2004-04-30 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device |
| CN2706868Y (en) * | 2004-05-26 | 2005-06-29 | 鸿富锦精密工业(深圳)有限公司 | Radiating device combination |
| US7296619B2 (en) * | 2004-10-21 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with heat spreader |
| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| TWI274539B (en) * | 2005-04-01 | 2007-02-21 | Delta Electronics Inc | Heat dissipating assembly with composite heat dissipating structure |
| JP2007273868A (en) * | 2006-03-31 | 2007-10-18 | Fujikura Ltd | heatsink |
| US7362573B2 (en) * | 2006-04-28 | 2008-04-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US8832742B2 (en) | 2006-10-06 | 2014-09-09 | United Video Properties, Inc. | Systems and methods for acquiring, categorizing and delivering media in interactive media guidance applications |
| CN101203117B (en) * | 2006-12-13 | 2010-08-25 | 富准精密工业(深圳)有限公司 | heat sink |
| ITFI20070235A1 (en) * | 2007-10-23 | 2009-04-24 | Iguzzini Illuminazione | DISSIPATION DEVICE FOR LED AND CONNECTED PRODUCTION METHOD. |
| USD593963S1 (en) * | 2008-04-23 | 2009-06-09 | 4187318 Canada Inc. | Modular heat sink |
| TWM348981U (en) * | 2008-06-12 | 2009-01-11 | Acpa Energy Conversion Devices Co Ltd | Heat dissipation module |
| USD592613S1 (en) * | 2008-06-18 | 2009-05-19 | 4187318 Canada Inc. | Heat sink |
| USD603810S1 (en) * | 2008-08-29 | 2009-11-10 | Lighthouse Technology Co., Ltd. | Heat sink for illuminating device |
| US7740380B2 (en) * | 2008-10-29 | 2010-06-22 | Thrailkill John E | Solid state lighting apparatus utilizing axial thermal dissipation |
| US7972037B2 (en) | 2008-11-26 | 2011-07-05 | Deloren E. Anderson | High intensity replaceable light emitting diode module and array |
| JP2010219428A (en) * | 2009-03-18 | 2010-09-30 | Delong Chen | Structure of led heat radiator |
| USD642732S1 (en) | 2010-03-23 | 2011-08-02 | Cooper Technologies Company | Lighting fixture |
| KR101506070B1 (en) | 2010-04-05 | 2015-03-25 | 쿠퍼 테크놀로지스 컴파니 | Lighting assemblies having controlled directional heat transfer |
| US8757852B2 (en) | 2010-10-27 | 2014-06-24 | Cree, Inc. | Lighting apparatus |
| USD683890S1 (en) | 2011-04-11 | 2013-06-04 | Cree, Inc. | Lighting fixture |
| CN102271486A (en) * | 2011-07-21 | 2011-12-07 | 尹钟哲 | Radiating structure, and application, manufacturing device and manufacturing method thereof |
| TWI512440B (en) * | 2012-08-01 | 2015-12-11 | Asia Vital Components Co Ltd | Heat-dissipating device and method for manufacturing the same |
| DE102012217399A1 (en) * | 2012-09-26 | 2014-03-27 | Robert Bosch Gmbh | Cooling structure for cooling a cylinder |
| US9326424B2 (en) * | 2014-09-10 | 2016-04-26 | Opentv, Inc. | Heat sink assembly and method of utilizing a heat sink assembly |
| US9581322B2 (en) * | 2014-09-30 | 2017-02-28 | Aeonovalite Technologies, Inc. | Heat-sink for high bay LED device, high bay LED device and methods of use thereof |
| CN106143521B (en) * | 2016-07-20 | 2018-10-02 | 广州市日森机械股份有限公司 | A kind of intelligent high-pressure hot-air cooling operations unit |
| JP7023141B2 (en) | 2018-03-06 | 2022-02-21 | 一般財団法人沖縄美ら島財団 | Deep-sea creature capture device and capture method |
| US11204340B2 (en) | 2018-09-21 | 2021-12-21 | Rosemount Inc. | Forced convection heater |
| US11041660B2 (en) * | 2018-09-21 | 2021-06-22 | Rosemount Inc. | Forced convection heater |
| DE212019000499U1 (en) * | 2019-05-08 | 2022-01-12 | Siemens Energy Global GmbH & Co. KG | heatsink |
| TWD210771S (en) * | 2020-04-09 | 2021-04-01 | 宏碁股份有限公司 | Heat-dissipation fin |
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技(上海)有限公司 | Novel cooling apparatus |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2413179A (en) * | 1943-09-20 | 1946-12-24 | Westinghouse Electric Corp | Radiator |
| US3187082A (en) * | 1961-02-01 | 1965-06-01 | Cool Fin Electronics Corp | Heat dissipating electrical shield |
| US3239003A (en) * | 1962-11-30 | 1966-03-08 | Wakefield Engineering Co Inc | Heat transfer |
| US3372733A (en) * | 1964-02-11 | 1968-03-12 | Russell J. Callender | Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor |
| US3422777A (en) * | 1963-05-28 | 1969-01-21 | Chausson Usines Sa | Method of manufacturing a heat exchanger |
| US5019880A (en) * | 1988-01-07 | 1991-05-28 | Prime Computer, Inc. | Heat sink apparatus |
| US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
| US6460609B1 (en) * | 2001-06-20 | 2002-10-08 | Hon Hai Precision Ind. Co., Ltd. | Heat sink for facilitating air flow |
| US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE44339C (en) * | J. BRUUN in Kopenhagen | Innovation on the lubrication pump protected by patent no. 43296 with a fixed spiral ring and rotating flat slide control | ||
| US2161417A (en) * | 1936-11-16 | 1939-06-06 | Frederick T Holmes | Water heater |
| US2396216A (en) * | 1943-04-03 | 1946-03-05 | Stevenson Jordan & Harrison In | Method for making air-cooled cylinders |
| USRE25184E (en) | 1959-08-03 | 1962-06-12 | Mcadam | |
| NL260951A (en) * | 1960-03-07 | |||
| US3185756A (en) * | 1960-05-02 | 1965-05-25 | Cool Fin Electronics Corp | Heat-dissipating tube shield |
| US3152217A (en) * | 1960-12-01 | 1964-10-06 | Rca Corp | Heat dissipating shield for electronic components |
| US3280907A (en) | 1964-09-01 | 1966-10-25 | Hoffman Sidney | Energy transfer device |
| US3566958A (en) | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
| JPS5989443A (en) | 1982-11-15 | 1984-05-23 | Nec Corp | Brazing process of heat radiating blade |
| US4607685A (en) * | 1984-07-06 | 1986-08-26 | Burroughs Corporation | Heat sink for integrated circuit package |
| US4715438A (en) | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
| US4753290A (en) | 1986-07-18 | 1988-06-28 | Unisys Corporation | Reduced-stress heat sink device |
| US4682651A (en) | 1986-09-08 | 1987-07-28 | Burroughs Corporation (Now Unisys Corporation) | Segmented heat sink device |
| US4716494A (en) | 1986-11-07 | 1987-12-29 | Amp Incorporated | Retention system for removable heat sink |
| US4733293A (en) | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
| US5704416A (en) | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
| US5810554A (en) | 1995-05-31 | 1998-09-22 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| JP3058818B2 (en) | 1995-10-05 | 2000-07-04 | 山洋電気株式会社 | Heat sink for cooling electronic components |
| CN2249920Y (en) * | 1996-01-29 | 1997-03-19 | 钟豪胜 | CPU cooler |
| US5785116A (en) | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| CN2267518Y (en) * | 1996-03-29 | 1997-11-12 | 陈熙亮 | Transformer cooling device |
| EP0809287A1 (en) | 1996-05-22 | 1997-11-26 | Jean Amigo | Heat dissipation device for an integrated circuit |
| US5794685A (en) | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
| CN2297615Y (en) * | 1997-01-22 | 1998-11-18 | 中国石化第四建设公司 | Heating device for oxygen pressure reducer |
| US5828551A (en) | 1997-03-04 | 1998-10-27 | Hoshino Kinzoku Koygo Kabushiki Kaisha | Heat sink apparatus for an electronic component |
| US5927385A (en) | 1998-01-21 | 1999-07-27 | Yeh; Ming Hsin | Cooling device for the CPU of computer |
-
1999
- 1999-08-30 US US09/386,103 patent/US6851467B1/en not_active Expired - Fee Related
-
2000
- 2000-08-21 MX MXPA00008166A patent/MXPA00008166A/en unknown
- 2000-08-25 EP EP00118477A patent/EP1081760A3/en not_active Withdrawn
- 2000-08-30 CN CNB001263218A patent/CN1299553C/en not_active Expired - Fee Related
- 2000-08-30 JP JP2000260340A patent/JP2001102509A/en active Pending
- 2000-09-27 TW TW089214921U patent/TW498993U/en unknown
-
2004
- 2004-04-29 US US10/834,693 patent/US20040200601A1/en not_active Abandoned
- 2004-05-17 JP JP2004002727U patent/JP3105270U/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2413179A (en) * | 1943-09-20 | 1946-12-24 | Westinghouse Electric Corp | Radiator |
| US3187082A (en) * | 1961-02-01 | 1965-06-01 | Cool Fin Electronics Corp | Heat dissipating electrical shield |
| US3239003A (en) * | 1962-11-30 | 1966-03-08 | Wakefield Engineering Co Inc | Heat transfer |
| US3422777A (en) * | 1963-05-28 | 1969-01-21 | Chausson Usines Sa | Method of manufacturing a heat exchanger |
| US3372733A (en) * | 1964-02-11 | 1968-03-12 | Russell J. Callender | Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor |
| US5019880A (en) * | 1988-01-07 | 1991-05-28 | Prime Computer, Inc. | Heat sink apparatus |
| US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
| US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
| US6460609B1 (en) * | 2001-06-20 | 2002-10-08 | Hon Hai Precision Ind. Co., Ltd. | Heat sink for facilitating air flow |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
| US7055577B2 (en) * | 2004-02-12 | 2006-06-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device for electronic device |
| US20090014154A1 (en) * | 2005-11-09 | 2009-01-15 | Tir Technology Lp | Passive Thermal Management System |
| US20090236078A1 (en) * | 2008-03-20 | 2009-09-24 | Chin-Kuang Luo | Heat-dissipating device |
| US10724712B2 (en) | 2008-07-08 | 2020-07-28 | Us Vaopto, Inc. | Modular LED lighting systems, including flexible, rigid, and waterproof lighting strips and connectors |
| US8534878B2 (en) | 2008-08-22 | 2013-09-17 | Virginia Optoelectronics, Inc. | LED lamp assembly |
| US20110030920A1 (en) * | 2009-08-04 | 2011-02-10 | Asia Vital Components (Shen Zhen) Co., Ltd. | Heat Sink Structure |
| US11024558B2 (en) * | 2010-03-26 | 2021-06-01 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
| US20120186798A1 (en) * | 2011-01-26 | 2012-07-26 | Celsia Technologies Taiwan, I | Cooling module for led lamp |
| USD662898S1 (en) * | 2011-03-24 | 2012-07-03 | Graftech International Holdings Inc. | Heat sink for LED light bulb |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1081760A2 (en) | 2001-03-07 |
| EP1081760A3 (en) | 2003-04-02 |
| JP2001102509A (en) | 2001-04-13 |
| CN1286593A (en) | 2001-03-07 |
| TW498993U (en) | 2002-08-11 |
| CN1299553C (en) | 2007-02-07 |
| JP3105270U (en) | 2004-10-21 |
| MXPA00008166A (en) | 2002-03-15 |
| US6851467B1 (en) | 2005-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6851467B1 (en) | Heat sink assembly | |
| US6625021B1 (en) | Heat sink with heat pipes and fan | |
| US6557626B1 (en) | Heat sink retainer and Heat sink assembly using same | |
| US6525939B2 (en) | Heat sink apparatus | |
| US6145586A (en) | Heat sink module with heat dissipating device | |
| US7142422B2 (en) | Heat dissipation device | |
| US6538888B1 (en) | Radial base heatsink | |
| US6093961A (en) | Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment | |
| US5701951A (en) | Heat dissipation device for an integrated circuit | |
| US7269013B2 (en) | Heat dissipation device having phase-changeable medium therein | |
| US7852630B2 (en) | Heat dissipating device | |
| US20050094377A1 (en) | Heat sink assembly incorporating spring clip | |
| US6860321B2 (en) | Heat-dissipating device | |
| US6867974B2 (en) | Heat-dissipating device | |
| US6446708B1 (en) | Heat dissipating device | |
| US20030019610A1 (en) | Rapidly self - heat-conductive heat - dissipating module | |
| US6816373B2 (en) | Heat dissipation device | |
| JP2004228484A (en) | Cooling device and electronic device | |
| US4961125A (en) | Apparatus and method of attaching an electronic device package and a heat sink to a circuit board | |
| US6542370B1 (en) | Heat dissipating device for a CPU | |
| JP3058818B2 (en) | Heat sink for cooling electronic components | |
| JP2004079754A (en) | heatsink | |
| US7589967B2 (en) | Heat dissipation device | |
| US7365978B2 (en) | Heat dissipating device | |
| JP3819316B2 (en) | Tower type heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |