[go: up one dir, main page]

US20020084061A1 - Chemically compatible, lightweight heat pipe - Google Patents

Chemically compatible, lightweight heat pipe Download PDF

Info

Publication number
US20020084061A1
US20020084061A1 US09/753,858 US75385801A US2002084061A1 US 20020084061 A1 US20020084061 A1 US 20020084061A1 US 75385801 A US75385801 A US 75385801A US 2002084061 A1 US2002084061 A1 US 2002084061A1
Authority
US
United States
Prior art keywords
working fluid
recited
vessel
heat pipe
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/753,858
Inventor
John Rosenfeld
G. Eastman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/753,858 priority Critical patent/US20020084061A1/en
Assigned to THERMAL CORP. reassignment THERMAL CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EASTMAN, G. YALE, ROSENFELD, JOHN N.
Priority to PCT/US2001/050899 priority patent/WO2002054002A1/en
Publication of US20020084061A1 publication Critical patent/US20020084061A1/en
Priority to US10/643,435 priority patent/US7069978B2/en
Priority to US11/363,806 priority patent/US7743502B2/en
Priority to US12/825,733 priority patent/US8286694B2/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/06—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H10W40/73—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S138/00—Pipes and tubular conduits
    • Y10S138/07—Resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means

Definitions

  • a heat pipe is essentially a passive heat transfer device with an extremely high effective thermal conductivity.
  • a two-phase heat transfer mechanism results in heat transfer capabilities from one hundred to several thousand times that of an equivalent piece of copper.
  • Heat pipes are sealed vacuum vessels that are partially filled with a fluid, typically water in electronic cooling applications, which serves as the heat transfer medium.
  • the heat pipe envelope is typically made of cylindrical copper tubing, although rectangular cross sections and other materials are available.
  • the wall of the envelope is lined with a wick structure, which generates the capillary force that pulls the condensate from the condenser section of the heat pipe back to the evaporator section. Since the heat pipe is evacuated and then charged with the working fluid prior to being sealed, the internal pressure is set by the vapor pressure of the working fluid.
  • the working fluid As heat is applied to a portion of the surface of the heat pipe, the working fluid is vaporized.
  • the vapor at the evaporator section is at a slightly higher temperature and pressure than other areas and creates a pressure gradient that forces the vapor to flow to the cooler regions of the heat pipe.
  • the latent heat of vaporization is transferred to the condenser.
  • the capillary wick then transports the condensate back to the evaporator section. This is a closed loop process that continues as long as the heat is applied.
  • the orientation and layout of a heat pipe design are important. When the design allows, the heat source should be located below or at the same elevation as the cooling section for best performance. This orientation allows gravity to aid the capillary action, and results in a greater heat carrying capability. If this orientation is unacceptable, then a capillary wick structure such as sintered powder will be necessary. Additionally, heat pipes have the ability to adhere to the physical constraints of the system, and can be bent around obstructions.
  • the present invention takes advantage of the stabilizing effects of the “getter” type materials, such as zirconium when added to light metals such as magnesium or aluminum.
  • the addition of zirconium to the magnesium provides a more stable oxide and/or nitride, and provides a water-compatible surface.
  • This alloy is also lighter than aluminum is an added benefit.
  • the reduced thermal stresses which result with this alloy most likely allow the oxide/nitride to maintain its integrity.
  • the present invention is directed to an improvement in heat transfer vessels as used in weight-sensitive applications, e.g., laptop computers, these vessels composed of magnesium and substantially free of aluminum and zinc, these vessels further having a hollow interior cavity containing a working fluid.
  • the improvement comprises the formation of a stable, protective layer on the inside wall of the vessel, the layer establishing compatibility with the working fluid, and preventing base metal corrosion by the working fluid.
  • an alloy with no aluminum or zinc, but with 0.5 to 1 percent (by weight) zirconium was used.
  • the zirconium oxide helps provide compatibility with water by stabilizing the oxide surface layer in the presence of water, and similarly provides a stabilizing nitride surface in the presence of ammonia.
  • the present invention is directed to an improvement in vessels composed of magnesium and substantially free of aluminum and zinc, these vessels having a hollow interior cavity containing a working fluid.
  • the stable protective layer will be either an oxide or nitride layer depending on the working fluid. For instance, if ammonia is chosen as the working fluid, a stable nitride would be formed; in contrast, if water is used as the working fluid, a stable oxide would be formed.
  • the preferred vessel for purposes of the present invention is a heat pipe, although it is anticipated that other suitable vessels would benefit from the purposes of the present invention as well.
  • the magnesium alloy contains 0.1 to 5 percent of a “gettering” metal or metals e.g., zirconium, titanium, hafnium, yttrium, etc. Amounts of gettering metal of from about 0.1 to 2 percent are preferred, with an amount of about 1% gettering metal, e.g., zirconium, particularly preferred.
  • a “gettering” metal or metals e.g., zirconium, titanium, hafnium, yttrium, etc.
  • Amounts of gettering metal of from about 0.1 to 2 percent are preferred, with an amount of about 1% gettering metal, e.g., zirconium, particularly preferred.
  • a further benefit of the treatment of the present invention can be the strengthening of the primary metal (e.g., magnesium) with alloying materials in excess of the metal's natural solubility. This results in the dispersal of unalloyed particles in grain boundaries, thereby providing a further strengthening effect.
  • the primary metal e.g., magnesium
  • alloys of the present invention are compatible with chemical acids, e.g., water, methanol and other alcohol fluids, as well as chemical bases such as ammonia, pyridine, hydrazine, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

The present invention discloses an apparatus including a magnesium alloy vessel substantially free of aluminum and zinc, with the vessel having a hollow interior cavity containing a working fluid, wherein the improvement includes the formation of a stable, protective layer on the inside wall of the vessel, the layer establishing compatibility with the working fluid and preventing base metal corrosion by the working fluid, the vessel including magnesium in combination with a gettering metal.

Description

    BACKGROUND OF THE INVENTION
  • A heat pipe is essentially a passive heat transfer device with an extremely high effective thermal conductivity. A two-phase heat transfer mechanism results in heat transfer capabilities from one hundred to several thousand times that of an equivalent piece of copper. Heat pipes are sealed vacuum vessels that are partially filled with a fluid, typically water in electronic cooling applications, which serves as the heat transfer medium. The heat pipe envelope is typically made of cylindrical copper tubing, although rectangular cross sections and other materials are available. The wall of the envelope is lined with a wick structure, which generates the capillary force that pulls the condensate from the condenser section of the heat pipe back to the evaporator section. Since the heat pipe is evacuated and then charged with the working fluid prior to being sealed, the internal pressure is set by the vapor pressure of the working fluid. As heat is applied to a portion of the surface of the heat pipe, the working fluid is vaporized. The vapor at the evaporator section is at a slightly higher temperature and pressure than other areas and creates a pressure gradient that forces the vapor to flow to the cooler regions of the heat pipe. As the vapor condenses on the heat pipe walls, the latent heat of vaporization is transferred to the condenser. The capillary wick then transports the condensate back to the evaporator section. This is a closed loop process that continues as long as the heat is applied. [0001]
  • The orientation and layout of a heat pipe design are important. When the design allows, the heat source should be located below or at the same elevation as the cooling section for best performance. This orientation allows gravity to aid the capillary action, and results in a greater heat carrying capability. If this orientation is unacceptable, then a capillary wick structure such as sintered powder will be necessary. Additionally, heat pipes have the ability to adhere to the physical constraints of the system, and can be bent around obstructions. [0002]
  • There is a recurring need for heat pipes having low mass. There has been an extended effort to devise a method for using aluminum as the envelope and wick material. Much of this effort has been to use water as the preferred working fluid. Previous efforts have been focused on taking advantage of the fact that aluminum oxide is compatible with water, even though aluminum metal is not compatible. The programs have not been successful because of the large difference in thermal expansion between aluminum and its oxide. The resulting stresses cause the oxide layer to crack, often on the first thermal cycle, thereby allowing the water and aluminum to come into contact, resulting in hydrogen generation and heat pipe failure. [0003]
  • The present invention takes advantage of the stabilizing effects of the “getter” type materials, such as zirconium when added to light metals such as magnesium or aluminum. The addition of zirconium to the magnesium provides a more stable oxide and/or nitride, and provides a water-compatible surface. The fact that this alloy is also lighter than aluminum is an added benefit. The reduced thermal stresses which result with this alloy most likely allow the oxide/nitride to maintain its integrity. [0004]
  • Most commercially available magnesium alloys have significant amounts of aluminum, rare earths, and/or zinc as constituents. None of these materials are readily compatible with water. Therefore, an additional objective of the present invention is to specify a water-compatible alloy of magnesium which does not have these non-compatible constituents. [0005]
    • SUMMARY OF THE INVENTION
  • The present invention is directed to an improvement in heat transfer vessels as used in weight-sensitive applications, e.g., laptop computers, these vessels composed of magnesium and substantially free of aluminum and zinc, these vessels further having a hollow interior cavity containing a working fluid. The improvement comprises the formation of a stable, protective layer on the inside wall of the vessel, the layer establishing compatibility with the working fluid, and preventing base metal corrosion by the working fluid. In a preferred embodiment of the present invention, an alloy with no aluminum or zinc, but with 0.5 to 1 percent (by weight) zirconium, was used. The zirconium oxide helps provide compatibility with water by stabilizing the oxide surface layer in the presence of water, and similarly provides a stabilizing nitride surface in the presence of ammonia.[0006]
    • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention is directed to an improvement in vessels composed of magnesium and substantially free of aluminum and zinc, these vessels having a hollow interior cavity containing a working fluid. The stable protective layer will be either an oxide or nitride layer depending on the working fluid. For instance, if ammonia is chosen as the working fluid, a stable nitride would be formed; in contrast, if water is used as the working fluid, a stable oxide would be formed. The preferred vessel for purposes of the present invention is a heat pipe, although it is anticipated that other suitable vessels would benefit from the purposes of the present invention as well. [0007]
  • In a further preferred embodiment of the present invention, the magnesium alloy contains 0.1 to 5 percent of a “gettering” metal or metals e.g., zirconium, titanium, hafnium, yttrium, etc. Amounts of gettering metal of from about 0.1 to 2 percent are preferred, with an amount of about 1% gettering metal, e.g., zirconium, particularly preferred. [0008]
  • A further benefit of the treatment of the present invention can be the strengthening of the primary metal (e.g., magnesium) with alloying materials in excess of the metal's natural solubility. This results in the dispersal of unalloyed particles in grain boundaries, thereby providing a further strengthening effect. [0009]
  • In the testing of the present invention, there have been more than 30 on/off thermal cycles where a Mg/water heat pipe was heated to between 100 to 120° C., and then cooled to room temperature. Note that 1 to 2 of those cycles are normally enough to cause failure in an aluminum/water heat pipe. It has been found that there is no degradation in magnesium heat pipes. In further testing with more than 50 thermal cycles of a magnesium heat pipe with 0.6 wt % zirconium, no degradation or failure has been observed. Also note that the temperature for fluids within the vessel range from about room temperature (for ammonia) to up to 100° C. (for water). [0010]
  • It is anticipated that the process of the present invention would be effective with aluminum as well. Note that for both aluminum and magnesium systems, the addition of other “getter” alloying metals such as titanium, hafnium and yttrium may also be included in order to increase alloy strength and improve corrosion resistance. The alloys of the present invention are compatible with chemical acids, e.g., water, methanol and other alcohol fluids, as well as chemical bases such as ammonia, pyridine, hydrazine, etc. [0011]
  • While the above description constitutes the preferred embodiments of the present invention, it will be appreciated that the invention is susceptible to modification, variation and change without departing from the proper scope and fair meaning of the accompanying claims. [0012]

Claims (9)

What is claimed is:
1. In an apparatus including a magnesium alloy vessel substantially free of aluminum and zinc, said vessel having a hollow interior cavity containing a working fluid, the improvement comprising: the formation of a stable, protective layer on the inside wall of the vessel, said protective layer establishing compatibility with the working fluid and preventing base metal corrosion by the working fluid, wherein said vessel comprises magnesium in combination with an alloyed and/or dispersion strengthening, gettering metal.
2. The apparatus as recited in claim 1 wherein said stable protective layer is an oxide or nitride protective layer.
3. The apparatus as recited in claim 1 wherein said vessel is a heat pipe and/or a pumped-loop system.
4. The apparatus as recited in claim 1 wherein said gettering metal comprises from about 0.1-5 wt % of zirconium.
5. The apparatus as recited in claim 1 wherein the working fluid is ammonia.
6. The apparatus as recited in claim 1 wherein the working fluid is water.
7. The apparatus as recited in claim 1 wherein the gettering metal is selected from the group consisting of zirconium, titanium, hafnium and yttrium.
8. The apparatus as recited in claim 1 wherein the gettering metal comprises about 0.6 wt % zirconium alloy.
9. The apparatus as recited in claim 1, wherein said apparatus is a laptop computer.
US09/753,858 2001-01-03 2001-01-03 Chemically compatible, lightweight heat pipe Abandoned US20020084061A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US09/753,858 US20020084061A1 (en) 2001-01-03 2001-01-03 Chemically compatible, lightweight heat pipe
PCT/US2001/050899 WO2002054002A1 (en) 2001-01-03 2001-12-19 Chemically compatible , lightweight heat pipe
US10/643,435 US7069978B2 (en) 2001-01-03 2003-08-19 Chemically compatible, lightweight heat pipe
US11/363,806 US7743502B2 (en) 2001-01-03 2006-02-28 Chemically compatible, lightweight heat pipe
US12/825,733 US8286694B2 (en) 2001-01-03 2010-06-29 Chemically compatible, lightweight heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/753,858 US20020084061A1 (en) 2001-01-03 2001-01-03 Chemically compatible, lightweight heat pipe

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/643,435 Continuation US7069978B2 (en) 2001-01-03 2003-08-19 Chemically compatible, lightweight heat pipe

Publications (1)

Publication Number Publication Date
US20020084061A1 true US20020084061A1 (en) 2002-07-04

Family

ID=25032447

Family Applications (4)

Application Number Title Priority Date Filing Date
US09/753,858 Abandoned US20020084061A1 (en) 2001-01-03 2001-01-03 Chemically compatible, lightweight heat pipe
US10/643,435 Expired - Fee Related US7069978B2 (en) 2001-01-03 2003-08-19 Chemically compatible, lightweight heat pipe
US11/363,806 Expired - Fee Related US7743502B2 (en) 2001-01-03 2006-02-28 Chemically compatible, lightweight heat pipe
US12/825,733 Expired - Fee Related US8286694B2 (en) 2001-01-03 2010-06-29 Chemically compatible, lightweight heat pipe

Family Applications After (3)

Application Number Title Priority Date Filing Date
US10/643,435 Expired - Fee Related US7069978B2 (en) 2001-01-03 2003-08-19 Chemically compatible, lightweight heat pipe
US11/363,806 Expired - Fee Related US7743502B2 (en) 2001-01-03 2006-02-28 Chemically compatible, lightweight heat pipe
US12/825,733 Expired - Fee Related US8286694B2 (en) 2001-01-03 2010-06-29 Chemically compatible, lightweight heat pipe

Country Status (2)

Country Link
US (4) US20020084061A1 (en)
WO (1) WO2002054002A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100263837A1 (en) * 2001-01-03 2010-10-21 Rosenfeld John H Chemically compatible, lightweight heat pipe
RU2472090C2 (en) * 2011-04-08 2013-01-10 Открытое акционерное общество "Специальное конструкторско-технологическое бюро по релейной технике" (ОАО "СКТБ РТ") Method of filling heat pipe with heat carrier

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7965511B2 (en) * 2006-08-17 2011-06-21 Ati Technologies Ulc Cross-flow thermal management device and method of manufacture thereof
WO2009075692A2 (en) 2007-05-14 2009-06-18 Invista Technologies S.A.R.L. High efficiency reactor and process
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
US9238398B2 (en) * 2008-09-25 2016-01-19 B/E Aerospace, Inc. Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US20100155026A1 (en) * 2008-12-19 2010-06-24 Walther Steven R Condensible gas cooling system
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
CN101852564A (en) * 2009-03-30 2010-10-06 富准精密工业(深圳)有限公司 heat sink
CN101900503A (en) * 2009-05-27 2010-12-01 富瑞精密组件（昆山）有限公司 Heat pipe
EP2429118B1 (en) 2009-06-04 2014-09-10 Huawei Technologies Co., Ltd. Method and apparatus for realizing optical channel data unit shared protection ring
US20110024085A1 (en) * 2009-07-28 2011-02-03 Huang Yu-Po Heat pipe and method for manufacturing the same
TW201116794A (en) * 2009-11-10 2011-05-16 Pegatron Corp Vapor chamber and manufacturing method thereof
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
EP2395309A1 (en) 2010-06-08 2011-12-14 Thermal Corp. Heat pipe
EP2677261B1 (en) * 2012-06-20 2018-10-10 ABB Schweiz AG Two-phase cooling system for electronic components
US12523431B2 (en) * 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
EP3194113B1 (en) 2014-09-17 2022-06-08 The Regents Of The University Of Colorado, A Body Corporate, A Colorado Non-Profit Micropillar-enabled thermal ground plane
CN106358420B (en) * 2015-07-15 2020-05-19 宏碁股份有限公司 cooling module
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
EP3539156A4 (en) 2016-11-08 2020-07-15 Kelvin Thermal Technologies, Inc. METHOD AND DEVICE FOR DISTRIBUTING HIGH HEAT FLOWS ON THERMAL GROUND SURFACES
CN106852082A (en) * 2017-03-08 2017-06-13 联想(北京)有限公司 A kind of heat abstractor and electronic equipment
EP3622238A4 (en) 2017-05-08 2021-01-13 Kelvin Thermal Technologies, Inc. THERMAL MANAGEMENT PLANS
US11122715B2 (en) 2018-05-11 2021-09-14 General Electric Company Conformal heat pipe assemblies
CN113167546A (en) 2018-12-11 2021-07-23 开尔文热技术股份有限公司 Vapor chamber
US11234344B2 (en) * 2019-04-29 2022-01-25 Motorola Mobility Llc Heat transfer apparatus for a mobile device
WO2021258028A1 (en) 2020-06-19 2021-12-23 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
JP7029009B1 (en) * 2021-03-09 2022-03-02 古河電気工業株式会社 heatsink
CN221802601U (en) * 2024-01-18 2024-10-01 泰硕电子股份有限公司 Integrated liquid cooling and temperature equalizing module

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568723A (en) * 1967-06-23 1971-03-09 Du Pont Metal-ceramic composite structures
US3692682A (en) * 1969-12-18 1972-09-19 Dyna Shield Inc Heat barrier material and process
US3672020A (en) * 1970-05-18 1972-06-27 Rca Corp Method of making a heat pipe having an easily contaminated internal wetting surface
DE2129352C3 (en) * 1971-06-14 1982-03-18 Honsel-Werke Ag, 5778 Meschede Use of AlMgSi casting alloys for cylinder heads subject to alternating thermal loads
US4018269A (en) * 1973-09-12 1977-04-19 Suzuki Metal Industrial Co., Ltd. Heat pipes, process and apparatus for manufacturing same
US4101699A (en) * 1973-11-23 1978-07-18 Samuel Moore & Company Synthetic resinous tube
US4082575A (en) * 1976-04-21 1978-04-04 Thermacore, Inc. Production of liquid compatible metals
US4082576A (en) * 1976-10-04 1978-04-04 Youngstown Sheet And Tube Company Ultra-high strength low alloy titanium bearing flat rolled steel and process for making
US4196504A (en) * 1977-04-06 1980-04-08 Thermacore, Inc. Tunnel wick heat pipes
US4197957A (en) * 1978-12-26 1980-04-15 Gte Laboratories Incorporated Vacuum tight assembly
US4292345A (en) * 1980-02-04 1981-09-29 Kolesnik Mikhail I Method of protecting carbon-containing component parts of metallurgical units from oxidation
JPS582596A (en) * 1981-06-30 1983-01-08 Nippon Parkerizing Co Ltd Surface treatment method for aluminum heat exchanger
US4478275A (en) * 1983-07-25 1984-10-23 Thermacore, Inc. Abrasion resistant heat pipe
DE3433984C2 (en) * 1984-09-15 1986-07-24 Daimler-Benz Ag, 7000 Stuttgart Heat pipe made of aluminum or steel
US4696455A (en) 1984-10-30 1987-09-29 Consolidated Ceramic Products, Inc. Zircon and MgO preheatable insulating refractory liners and methods of use thereof
JPS61238864A (en) * 1985-04-17 1986-10-24 Matsushita Refrig Co Coating composition for heat exchanger
US4703796A (en) 1987-02-27 1987-11-03 Stirling Thermal Motors, Inc. Corrosion resistant heat pipe
JPS6430997A (en) * 1987-07-23 1989-02-01 Sumitomo Light Metal Ind Copper alloy pipe with inner-surface corrosionproof coated film for heat exchanger
US4980133A (en) * 1988-03-16 1990-12-25 Ltv Aerospace & Defense Company Apparatus comprising heat pipes for controlled crystal growth
US4831965A (en) 1988-04-21 1989-05-23 The United States Of America As Represented By The United States Department Of Energy Fabrication of solid oxide fuel cell by electrochemical vapor deposition
US4969420A (en) * 1988-07-15 1990-11-13 Mckeon R Clayton Magnesium pressure vessel water tank
US4966201A (en) * 1989-06-16 1990-10-30 General Electric Company Transfer tube
US5004629A (en) * 1989-06-16 1991-04-02 General Electric Company Transfer tube
JPH0320594A (en) * 1989-06-19 1991-01-29 Honda Motor Co Ltd Heat exchanger
DE4238606C1 (en) * 1992-11-17 1994-06-30 Rasmussen Gmbh Multi-layer line
US5599404A (en) 1992-11-27 1997-02-04 Alger; Donald L. Process for forming nitride protective coatings
US5413642A (en) * 1992-11-27 1995-05-09 Alger; Donald L. Processing for forming corrosion and permeation barriers
US5780157A (en) * 1994-06-06 1998-07-14 Ultramet Composite structure
GB9502238D0 (en) * 1995-02-06 1995-03-29 Alcan Int Ltd Magnesium alloys
US5623988A (en) * 1995-09-25 1997-04-29 Gas Research Institute Polymeric heat exchanger with ceramic material insert
US6371201B1 (en) * 1996-04-03 2002-04-16 Ford Global Technologies, Inc. Heat exchanger and method of assembly for automotive vehicles
US5771967A (en) * 1996-09-12 1998-06-30 The United States Of America As Represented By The Secretary Of The Navy Wick-interrupt temperature controlling heat pipe
US6911231B2 (en) * 1996-10-25 2005-06-28 New Qu Energy Limited Method for producing a heat transfer medium and device
DE19702953C2 (en) 1997-01-28 1999-08-26 Daimlerchrysler Aerospace Ag Magnesium material with a corrosion protection layer
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
DE19805930A1 (en) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Cooling arrangement for electrical component with heat convection line
JPH10292128A (en) * 1997-04-16 1998-11-04 Kobe Steel Ltd Hydrophilic film-forming agent, and members for heat exchanger coated therewith
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
JPH11183084A (en) * 1997-12-24 1999-07-06 Nkk Corp Heat exchanger
WO1999053255A1 (en) * 1998-04-13 1999-10-21 Furukawa Electric Co., Ltd. Plate type heat pipe and cooling structure using it
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
DE19947730C1 (en) * 1999-10-05 2000-09-21 Fraunhofer Ges Forschung Heat exchanger unit with heat absorbing surface and chamber system thermally coupled to it through which heat-absorbing or supplying liquid can flow is made from cellulose-containing material with liquid-impermeable coating
US20020084061A1 (en) * 2001-01-03 2002-07-04 Rosenfeld John H. Chemically compatible, lightweight heat pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100263837A1 (en) * 2001-01-03 2010-10-21 Rosenfeld John H Chemically compatible, lightweight heat pipe
US8286694B2 (en) 2001-01-03 2012-10-16 Thermal Corp. Chemically compatible, lightweight heat pipe
RU2472090C2 (en) * 2011-04-08 2013-01-10 Открытое акционерное общество "Специальное конструкторско-технологическое бюро по релейной технике" (ОАО "СКТБ РТ") Method of filling heat pipe with heat carrier

Also Published As

Publication number Publication date
US8286694B2 (en) 2012-10-16
US20060144574A1 (en) 2006-07-06
US7743502B2 (en) 2010-06-29
US7069978B2 (en) 2006-07-04
WO2002054002A1 (en) 2002-07-11
US20040134643A1 (en) 2004-07-15
US20100263837A1 (en) 2010-10-21

Similar Documents

Publication Publication Date Title
US8286694B2 (en) Chemically compatible, lightweight heat pipe
US7594537B2 (en) Heat pipe with capillary wick
US7520315B2 (en) Heat pipe with capillary wick
Yang et al. Recent developments of lightweight, high performance heat pipes
Dunn et al. The heat pipe
US6911231B2 (en) Method for producing a heat transfer medium and device
US20050099775A1 (en) Pumped liquid cooling for computer systems using liquid metal coolant
US6675887B2 (en) Multiple temperature sensitive devices using two heat pipes
US20070240858A1 (en) Heat pipe with composite capillary wick structure
US4372377A (en) Heat pipes containing alkali metal working fluid
WO1998019859A9 (en) Super conducting heat transfer medium
US20050092467A1 (en) Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe
US20070246194A1 (en) Heat pipe with composite capillary wick structure
US20090316359A1 (en) Heat-transfer mechanism including a liquid-metal thermal coupling
CN104540919B (en) Inorganic aqueous solution (IAS) for phase-change heat transfer medium
EP0948430A1 (en) Super conducting heat transfer medium
JP2003302178A (en) Loop type thermosiphon and Stirling refrigerator
US20070089860A1 (en) Heat pipe with sintered powder wick
CN102326047A (en) boiling cooling device
TWI255294B (en) Heat pipe
US20070202321A1 (en) Thermally conductive microporous coating
US7308931B2 (en) Heat pipe remote heat exchanger (RHE) with graphite block
WO2011154366A1 (en) Heat exchange apparatus
Fujimoto et al. Evaluation on cooling performance and reliability of low-height aluminum thermosyphon in high-temperature environment
Akyurt et al. Heat pipes for waste-heat recovery

Legal Events

Date Code Title Description
AS Assignment

Owner name: THERMAL CORP., DELAWARE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ROSENFELD, JOHN N.;EASTMAN, G. YALE;REEL/FRAME:011420/0871;SIGNING DATES FROM 20001221 TO 20010102

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION