US20020050170A1 - Physical sensor component - Google Patents
Physical sensor component Download PDFInfo
- Publication number
- US20020050170A1 US20020050170A1 US09/429,099 US42909999A US2002050170A1 US 20020050170 A1 US20020050170 A1 US 20020050170A1 US 42909999 A US42909999 A US 42909999A US 2002050170 A1 US2002050170 A1 US 2002050170A1
- Authority
- US
- United States
- Prior art keywords
- physical sensor
- filter
- sensor component
- selective
- physically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H10W90/756—
Definitions
- This invention relates, in general, to electronics and, more particularly, to physical sensor components.
- Physical sensor components such as silicon pressure sensors can be used in automotive, industrial, consumer white goods, and various other applications.
- encapsulants have been used to protect the silicon pressure sensor.
- none of these encapsulants are entirely impermeable to corrosive solutions.
- the encapsulants do not completely satisfy the customers' stringent reliability requirements, and the encapsulants also do not enable the silicon pressure sensors to remain fully operative during their expected lifetimes.
- a common failure mechanism for a silicon pressure sensor having a prior art encapsulant involves diffusion of the corrosive media followed by the delamination of the encapsulant from the silicon pressure sensor. This delamination exposes portions of the sensor that subsequently corrode from the direct exposure to the chemical environments.
- most of the encapsulants produce adverse mechanical effects on the performance of the silicon pressure sensor, and these adverse mechanical effects severely limit the use of the sensor.
- FIG. 1 illustrates a cross-sectional view of a physical sensor component in accordance with a first embodiment of the present invention
- FIG. 2 illustrates a cross-sectional view of a physical sensor component in accordance with a second embodiment of the present invention.
- FIG. 1 illustrates a cross-sectional view of a physical sensor component 100 in accordance with a first embodiment of the present invention.
- Component 100 includes a support structure or housing 110 .
- Housing 110 includes a portion 111 that defines a recess or cavity 112 within housing 110 .
- Housing 110 should be comprised of a material that is resistant to or that is inert in the environment in which component 100 is to be used.
- portion 111 is comprised of an electrically insulating material such as, for example, a plastic.
- Housing 110 also includes electrical leads 113 that extend from within cavity 112 through the walls of portion 111 .
- Component 100 also includes a physical sensor device 120 .
- Device 120 is preferably an electromechanical device or a transducer such as, for example, a pressure sensor.
- Device 120 includes a physical sensing portion 121 .
- portion 121 represents a flexible diaphragm in the pressure sensor.
- Device 120 is located in cavity 112 and is mounted to portion 111 of housing 110 .
- an adhesive 130 can be used to physically couple device 120 to portion 111 .
- the term “couple” as used herein is defined as directly or indirectly connected in a mechanical, magnetic, electrostatic, or other manner.
- Device 120 is electrically coupled to leads 113 .
- wire bonds 140 can be used to provide the electrical coupling.
- Component 100 also includes a lid 150 that covers cavity 112 and housing 110 .
- Lid 150 protects device 120 from the environment outside of housing 110 while permitting pressure from the environment to pass through lid 150 and into cavity 112 . This pressure within recess 112 is subsequently detected by device 120 .
- lid 150 is permanently or fixedly coupled to housing 110 .
- lid 150 can be replaced by another lid if lid 150 becomes damaged during the use of component 100 .
- Lid 150 is fastened or secured to housing 110 by a mechanism 160 , which can be, for example, chemical, mechanical, magnetic, ultrasonic, heat stake or any combination thereof.
- mechanism 160 provides a hermetic seal around the perimeter of housing 110 .
- mechanism 160 can be comprised of an adhesive such as, for example, an epoxy.
- Lid 150 includes a port 151 having a hole 152 overlying cavity 112 .
- a filter 153 is placed adjacent to hole 152 to form a lid assembly.
- the lid assembly is placed over cavity 112 to seal cavity 112 .
- Filter 153 is preferably fixedly coupled to the underside of port 151 , which faces towards device 120 and cavity 112 .
- filter 153 can be ultrasonically bonded to port 151 .
- Lid 150 , filter 153 , and mechanism 160 should be comprised of materials that are resistant to or that are inert in the environment in which component 100 is to be used.
- Filter 153 is preferably a chemically selective and physically selective filter.
- filter 153 is porous to permit pressure in the environment outside of cavity 112 to move through filter 153 and into cavity 112 , and vice versa.
- filter 153 is comprised of a polymer resin comprised of fluorine, such as poly-tetra-fluoro-ethylene.
- filter 153 is preferably chemically treated to be both hydrophobic and oleophobic. With these characteristics, filter 153 is capable of preventing water and oil from entering cavity 112 .
- filter 153 can be commercially purchased from Donaldson Europe N.V. in Leuven, Belgium.
- Components in the prior art typically encapsulate a pressure sensitive device with a prior art gel that transmits pressure to provide the protection afforded by filter 153 .
- the prior art pressure sensitive encapsulation introduces an offset in the electrical output of the pressure sensitive device.
- the sensor span or sensitivity and temperature coefficients can be altered with the prior art gels. This effect on device output is highly undesirable, especially because it can be difficult to compensate.
- Component 100 solves the problem of the prior art by separating or spacing apart filter 153 and the pressure sensitive portion 121 of device 120 such that filter 153 does not directly contact physical sensing portion 121 of device 120 .
- lid 150 provides superior protection from the environment for device 120 compared to the prior art gels, and lid 150 is also more versatile than prior art gels because lid 150 is replaceable while the prior art gels are not replaceable.
- FIG. 2 illustrates a cross-sectional view of a physical sensor component 200 , which is similar to component 100 of FIG. 1 in accordance with a second embodiment of the present invention.
- Component 200 in FIG. 2 includes, among other features, a passivation layer 210 in cavity 112 .
- Layer 210 is located between filter 153 and device 120 .
- Layer 210 covers and provides additional protection for the metallic portions of component 200 against corrosion resulting from the environment outside of cavity 112 that inadvertently pass through filter 153 and into the cavity 112 .
- Layer 210 may overlie portion 121 of device 120 , but layer 210 can be thinner than the encapsulants used in the prior art because of the additional protection provided by lid 150 . In this manner, the prior art problem of the variable offset in the output of the pressure sensitive device is alleviated.
- layer 210 should be a flexible material in order to permit device 120 to sense the pressure through layer 210 .
- layer 210 can be comprised of a dimethyl silicone, fluorosilicone, or fluorocarbon gel or a parylene film.
- an improved physical sensor component is provided to overcome the disadvantages of the prior art.
- the component described herein is protected against corrosion by a technique that does not introduce adverse mechanical effects on the performance of the pressure sensing device. Accordingly, the component described herein has fewer limitations as to its use.
- a chemically selective and physically selective filter can be directly attached to the housing without the use of a port.
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
- This invention relates, in general, to electronics and, more particularly, to physical sensor components.
- Physical sensor components such as silicon pressure sensors can be used in automotive, industrial, consumer white goods, and various other applications. To provide compatibility with different chemical environments, encapsulants have been used to protect the silicon pressure sensor. However, none of these encapsulants are entirely impermeable to corrosive solutions. Furthermore, the encapsulants do not completely satisfy the customers' stringent reliability requirements, and the encapsulants also do not enable the silicon pressure sensors to remain fully operative during their expected lifetimes. A common failure mechanism for a silicon pressure sensor having a prior art encapsulant involves diffusion of the corrosive media followed by the delamination of the encapsulant from the silicon pressure sensor. This delamination exposes portions of the sensor that subsequently corrode from the direct exposure to the chemical environments. In addition to this common failure mechanism, most of the encapsulants produce adverse mechanical effects on the performance of the silicon pressure sensor, and these adverse mechanical effects severely limit the use of the sensor.
- Accordingly, a need exists for an improved physical sensor component that provides effective corrosion protection while not introducing adverse mechanical effects on the performance of the component.
- FIG. 1 illustrates a cross-sectional view of a physical sensor component in accordance with a first embodiment of the present invention; and
- FIG. 2 illustrates a cross-sectional view of a physical sensor component in accordance with a second embodiment of the present invention.
- The present invention will be better understood from a reading of the following detailed description, taken in conjunction with the accompanying drawing figures. For simplicity and clarity of illustration, elements in the figures are not necessarily drawn to scale, and the same reference numerals in different figures denote the same elements. Additionally, descriptions and details of well-known features and processing techniques are omitted to avoid unnecessarily obscuring the present invention.
- FIG. 1 illustrates a cross-sectional view of a
physical sensor component 100 in accordance with a first embodiment of the present invention.Component 100 includes a support structure orhousing 110.Housing 110 includes aportion 111 that defines a recess orcavity 112 withinhousing 110.Housing 110 should be comprised of a material that is resistant to or that is inert in the environment in whichcomponent 100 is to be used. In this embodiment,portion 111 is comprised of an electrically insulating material such as, for example, a plastic.Housing 110 also includeselectrical leads 113 that extend from withincavity 112 through the walls ofportion 111. -
Component 100 also includes aphysical sensor device 120.Device 120 is preferably an electromechanical device or a transducer such as, for example, a pressure sensor.Device 120 includes aphysical sensing portion 121. In this embodiment,portion 121 represents a flexible diaphragm in the pressure sensor.Device 120 is located incavity 112 and is mounted toportion 111 ofhousing 110. As an example, anadhesive 130 can be used to physically coupledevice 120 toportion 111. The term “couple” as used herein is defined as directly or indirectly connected in a mechanical, magnetic, electrostatic, or other manner.Device 120 is electrically coupled toleads 113. As an example,wire bonds 140 can be used to provide the electrical coupling. -
Component 100 also includes alid 150 that coverscavity 112 andhousing 110. Lid 150 protectsdevice 120 from the environment outside ofhousing 110 while permitting pressure from the environment to pass throughlid 150 and intocavity 112. This pressure withinrecess 112 is subsequently detected bydevice 120. - In this embodiment,
lid 150 is permanently or fixedly coupled tohousing 110. However, in an alternative embodiment,lid 150 can be replaced by another lid iflid 150 becomes damaged during the use ofcomponent 100.Lid 150 is fastened or secured to housing 110 by amechanism 160, which can be, for example, chemical, mechanical, magnetic, ultrasonic, heat stake or any combination thereof. In a preferred embodiment,mechanism 160 provides a hermetic seal around the perimeter ofhousing 110. In this embodiment,mechanism 160 can be comprised of an adhesive such as, for example, an epoxy. -
Lid 150 includes aport 151 having ahole 152 overlyingcavity 112. Afilter 153 is placed adjacent tohole 152 to form a lid assembly. The lid assembly is placed overcavity 112 toseal cavity 112.Filter 153 is preferably fixedly coupled to the underside ofport 151, which faces towardsdevice 120 andcavity 112. As an example,filter 153 can be ultrasonically bonded toport 151.Lid 150,filter 153, andmechanism 160 should be comprised of materials that are resistant to or that are inert in the environment in whichcomponent 100 is to be used. -
Filter 153 is preferably a chemically selective and physically selective filter. In this embodiment,filter 153 is porous to permit pressure in the environment outside ofcavity 112 to move throughfilter 153 and intocavity 112, and vice versa. Also in this embodiment,filter 153 is comprised of a polymer resin comprised of fluorine, such as poly-tetra-fluoro-ethylene. Furthermore,filter 153 is preferably chemically treated to be both hydrophobic and oleophobic. With these characteristics,filter 153 is capable of preventing water and oil from enteringcavity 112. As an example,filter 153 can be commercially purchased from Donaldson Europe N.V. in Leuven, Belgium. - Components in the prior art typically encapsulate a pressure sensitive device with a prior art gel that transmits pressure to provide the protection afforded by
filter 153. However, the prior art pressure sensitive encapsulation introduces an offset in the electrical output of the pressure sensitive device. Furthermore, the sensor span or sensitivity and temperature coefficients can be altered with the prior art gels. This effect on device output is highly undesirable, especially because it can be difficult to compensate.Component 100 solves the problem of the prior art by separating or spacing apartfilter 153 and the pressuresensitive portion 121 ofdevice 120 such thatfilter 153 does not directly contactphysical sensing portion 121 ofdevice 120. Furthermore, in the preferred embodiment,lid 150 provides superior protection from the environment fordevice 120 compared to the prior art gels, andlid 150 is also more versatile than prior art gels becauselid 150 is replaceable while the prior art gels are not replaceable. - FIG. 2 illustrates a cross-sectional view of a
physical sensor component 200, which is similar tocomponent 100 of FIG. 1 in accordance with a second embodiment of the present invention.Component 200 in FIG. 2 includes, among other features, apassivation layer 210 incavity 112.Layer 210 is located betweenfilter 153 anddevice 120.Layer 210 covers and provides additional protection for the metallic portions ofcomponent 200 against corrosion resulting from the environment outside ofcavity 112 that inadvertently pass throughfilter 153 and into thecavity 112. -
Layer 210 may overlieportion 121 ofdevice 120, butlayer 210 can be thinner than the encapsulants used in the prior art because of the additional protection provided bylid 150. In this manner, the prior art problem of the variable offset in the output of the pressure sensitive device is alleviated. In this embodiment,layer 210 should be a flexible material in order to permitdevice 120 to sense the pressure throughlayer 210. As an example,layer 210 can be comprised of a dimethyl silicone, fluorosilicone, or fluorocarbon gel or a parylene film. - Therefore, an improved physical sensor component is provided to overcome the disadvantages of the prior art. The component described herein is protected against corrosion by a technique that does not introduce adverse mechanical effects on the performance of the pressure sensing device. Accordingly, the component described herein has fewer limitations as to its use.
- The disclosure of the present invention described herein is enabled and can be realized and practiced without undue experimentation. Although the best mode of carrying out the present invention contemplated by the inventors is disclosed hereinabove, practice of the present invention is not limited thereto. Furthermore, while the present invention has been particularly shown and described mainly with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made to the embodiments herein without departing from the spirit or scope of the present invention. For instance, the numerous details set forth herein such as, for example, the material compositions are provided to facilitate the understanding of the present invention and are not provided to limit the scope of the present invention. Furthermore, the chemically selective and physically selective filter can be modified to filter out other chemicals in addition to water and oil. These other chemicals can include, but are not limited to, acidic or alkaline aqueous solutions, organic solvents, or vapors or mixtures thereof. Moreover, a chemically selective and physically selective filter can be directly attached to the housing without the use of a port.
- Accordingly, the disclosure of the present invention is not intended to be limiting. Instead, the disclosure of the present invention is intended to be illustrative of the scope of the present invention. It is intended that the scope of the present invention shall be limited only to the extent required by the appended claims and the rules and principles of applicable law. The appended claims are not to be interpreted as including means-plus-function limitations, unless such a limitation is expressly recited in a given claim using the phrase “means for”.
Claims (20)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/429,099 US6453749B1 (en) | 1999-10-28 | 1999-10-28 | Physical sensor component |
| EP00122976A EP1096243B1 (en) | 1999-10-28 | 2000-10-23 | Semiconductive pressure sensor with filter |
| DE60022719T DE60022719T2 (en) | 1999-10-28 | 2000-10-23 | Semiconductor pressure transducer with filter |
| JP2000328153A JP2001165799A (en) | 1999-10-28 | 2000-10-27 | Components of physical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/429,099 US6453749B1 (en) | 1999-10-28 | 1999-10-28 | Physical sensor component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20020050170A1 true US20020050170A1 (en) | 2002-05-02 |
| US6453749B1 US6453749B1 (en) | 2002-09-24 |
Family
ID=23701802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/429,099 Expired - Lifetime US6453749B1 (en) | 1999-10-28 | 1999-10-28 | Physical sensor component |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6453749B1 (en) |
| EP (1) | EP1096243B1 (en) |
| JP (1) | JP2001165799A (en) |
| DE (1) | DE60022719T2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050001316A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant bond pad and integrated device |
| US20050001324A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant copper bond pad and integrated device |
| US20140260678A1 (en) * | 2013-03-15 | 2014-09-18 | President And Fellows Of Harvard College | Tactile sensor |
| CN104515636A (en) * | 2013-09-27 | 2015-04-15 | 英飞凌科技股份有限公司 | Transducer arrangement comprising a transducer die and method of covering a transducer die |
| US20160231231A1 (en) * | 2015-02-09 | 2016-08-11 | The Boeing Company | Multi-Functional Fiber Optic Fuel Sensor System Having a Photonic Membrane |
| US11408788B2 (en) * | 2020-03-31 | 2022-08-09 | Toyota Research Institute, Inc. | Variable geometry and stiffness control for fluid filled sensor |
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| US6769319B2 (en) * | 2001-07-09 | 2004-08-03 | Freescale Semiconductor, Inc. | Component having a filter |
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| US7231829B2 (en) * | 2005-03-31 | 2007-06-19 | Medtronic, Inc. | Monolithic integrated circuit/pressure sensor on pacing lead |
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1999
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-
2000
- 2000-10-23 EP EP00122976A patent/EP1096243B1/en not_active Expired - Lifetime
- 2000-10-23 DE DE60022719T patent/DE60022719T2/en not_active Expired - Fee Related
- 2000-10-27 JP JP2000328153A patent/JP2001165799A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050001316A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant bond pad and integrated device |
| US20050001324A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant copper bond pad and integrated device |
| US7078796B2 (en) | 2003-07-01 | 2006-07-18 | Freescale Semiconductor, Inc. | Corrosion-resistant copper bond pad and integrated device |
| US20140260678A1 (en) * | 2013-03-15 | 2014-09-18 | President And Fellows Of Harvard College | Tactile sensor |
| US9625333B2 (en) * | 2013-03-15 | 2017-04-18 | President And Fellows Of Harvard College | Tactile sensor |
| US10488284B2 (en) | 2013-03-15 | 2019-11-26 | President And Fellows Of Harvard College | Method of making a contact pressure sensor |
| CN104515636A (en) * | 2013-09-27 | 2015-04-15 | 英飞凌科技股份有限公司 | Transducer arrangement comprising a transducer die and method of covering a transducer die |
| US20160231231A1 (en) * | 2015-02-09 | 2016-08-11 | The Boeing Company | Multi-Functional Fiber Optic Fuel Sensor System Having a Photonic Membrane |
| US10053269B2 (en) * | 2015-02-09 | 2018-08-21 | The Boeing Company | Multi-functional fiber optic fuel sensor system having a photonic membrane |
| US11408788B2 (en) * | 2020-03-31 | 2022-08-09 | Toyota Research Institute, Inc. | Variable geometry and stiffness control for fluid filled sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1096243B1 (en) | 2005-09-21 |
| US6453749B1 (en) | 2002-09-24 |
| EP1096243A2 (en) | 2001-05-02 |
| DE60022719T2 (en) | 2006-04-27 |
| EP1096243A3 (en) | 2002-06-12 |
| DE60022719D1 (en) | 2006-02-02 |
| JP2001165799A (en) | 2001-06-22 |
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