US2057475A - Electrodeposition of rhodium - Google Patents
Electrodeposition of rhodium Download PDFInfo
- Publication number
- US2057475A US2057475A US526786A US52678631A US2057475A US 2057475 A US2057475 A US 2057475A US 526786 A US526786 A US 526786A US 52678631 A US52678631 A US 52678631A US 2057475 A US2057475 A US 2057475A
- Authority
- US
- United States
- Prior art keywords
- rhodium
- metal
- plating
- bath
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010948 rhodium Substances 0.000 title description 18
- 229910052703 rhodium Inorganic materials 0.000 title description 18
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical group [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 title description 18
- 238000004070 electrodeposition Methods 0.000 title description 2
- 239000002253 acid Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 14
- -1 rhodium ammonium oxalate Chemical compound 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 7
- 150000007513 acids Chemical class 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000010970 precious metal Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid group Chemical group C(C1=CC=CC=C1)(=O)O WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004251 Ammonium lactate Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229940059265 ammonium lactate Drugs 0.000 description 1
- 235000019286 ammonium lactate Nutrition 0.000 description 1
- RZOBLYBZQXQGFY-HSHFZTNMSA-N azanium;(2r)-2-hydroxypropanoate Chemical compound [NH4+].C[C@@H](O)C([O-])=O RZOBLYBZQXQGFY-HSHFZTNMSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229940050390 benzoate Drugs 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229940001468 citrate Drugs 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229940001447 lactate Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000028161 membrane depolarization Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000001455 metallic ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- QNEIVTNMGMUAEX-UHFFFAOYSA-H oxalate rhodium(3+) Chemical compound [Rh+3].[Rh+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O QNEIVTNMGMUAEX-UHFFFAOYSA-H 0.000 description 1
- 229910000498 pewter Inorganic materials 0.000 description 1
- 239000010957 pewter Substances 0.000 description 1
- WMFZVLIHQVUVGO-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanol Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(O)C1=CC=CC=C1 WMFZVLIHQVUVGO-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Definitions
- This invention relates to a process for the electrolytic deposition of rhodium and to a bath for effecting said deposition.
- the precious metal, rhodium, according to general practice is usually plated from strongly acid aqueous baths containing said metal in the form of salts of strong mineral acids, the sulfate bath being that most usually employed.
- This, form of bath in order to be at all effective contains ahigh concentration of free sulfuric acid with the result, that during electrol "ysis a spray of this acid is given off thereby rendering the plating operation a possible source of danger to the plater.
- said acid spray may attachbase metal objects adjacent to the plating tank. While this dimculty could be overcome by providing a hood over the plating tank, the cost incident to thisconstruction which must be acid proof is a drawback to this process.
- the plating baths with which my process is operative comprise essentially aqueous bathscontaining the precious metal rhodium in the form of salts of weak acids.
- Any weak acid, whether organic or inorganic, which forms a salt with the above metal may be employed in connection with said metal for furnishing the metallic ions to the electrolyte.
- These weak acids will comprise preferably acids of an acidity of that of tartaric, oxalic, citric,
- said acids may be combined with said metal either as simple salts or as complex salts with the alkali metals and ammonium as for example rhodium ammonium oxalate, rhodium ammonium citrate, rhodium ammonium tartrate, rhodium ammonium benzoate, rhodium ammoniumlactate and the like.
- a peculiarity of these baths which greatly facilitates the deposition of the metal therefrom and enhances the emciency of the electrolysis is the fact that they may be employed with great success either in an acid, neutral or alkaline condition.
- the proper pH oi. the bath if it is to be alkaline, may be provided by adding a certain amount of a weak or strong alkali to an aqueous solution of the simple or double salts of said precious metal. bath on the other hand may be controlled by The acidity of the electrical resistance.
- the cathode of course may be any metal upon which it is desired .3 plate, such as silver, gold, platinum, copper, brass, German silver, pewter and the like. 01 course, the cathode, as in general plating should be clean and smooth to facilitate the production of clear, dense, brilliant deposits.
- the concentration of the metal ions in solution may vary depending upon-the conditions of temperature, electrical pressure and cathode current density but need not be high to secure good deposits.
- the anode current density is not of great importance but should be less than that of the cathode.
- An aqueous solution of a salt of rhodium with a weak acid such as rhodium oxalate, citrate, tartrate, benzoate, lactate, phosphate or the like or of a double salt of rhodium such as rhodium ammonium oxalate, rhodium ammonium citrate, rhodium ammonium benzoate or the like containing about 1 gram of rhodium per liter of solution is electrolyzed with a. platinum anode and a smooth copper cathode which it is desired to plate at a voltage of about 4 volts and a cathodic current density of about 2 amperes per sq. inch.
- the electrolyte is maintained at a temperature of between and C. during the electrolysis. In this way dense, brilliant deposits of rhodium are obtained. Of course, the usual D. C. current is used.
- the electrolyte may be acid, neutral or alkaline which conditions may be obtained by the use of the proper amount of a suitable acid or alkali. Generally an alkaline electrolyte is preferable. If, however, an acid bath is used, it is obvious that the acidity will not be made so high as to cause deposition of hydrogen to the exclusion of the metal. Likewise, excessive alkalinity should be avoided.
- the process oi depositing a brilliant and dense layer of rhodium for ornamental purposes which comprises passing a D. C. current through an aqueous alkaline bath containing said metal combined with phosphoric acid, at a temperature ranging from 60 to 90 C.
- a process of electro-depositing rhodium which comprises passing a D. C. current of about 4 volts at a cathodic current density of 2 amperes per sq. inch from a platinum anode through an alkaline rhodium ammonium phosphate solution containing about 1 gram of rhodium per liter of solution.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
PatentedOct. 13, 1936 2,057,475 so ELECTRODEPOSITION or anonnnu "Sigmund Colin, New York, N. Y., assignor to Newark, N. 3., a cor- Baker & Company, Inc poration of New Jersey No Drawing.
a Serial No.
Application March 31 6 Claims. (01.29491) This invention relates to a process for the electrolytic deposition of rhodium and to a bath for effecting said deposition.
The precious metal, rhodium, according to general practice is usually plated from strongly acid aqueous baths containing said metal in the form of salts of strong mineral acids, the sulfate bath being that most usually employed. This, form of bath in order to be at all effective contains ahigh concentration of free sulfuric acid with the result, that during electrol "ysis a spray of this acid is given off thereby rendering the plating operation a possible source of danger to the plater. In addition, said acid spray may attachbase metal objects adjacent to the plating tank. While this dimculty could be overcome by providing a hood over the plating tank, the cost incident to thisconstruction which must be acid proof is a drawback to this process. Still another drawback to the use of' the above bath resides in the corrosive action of the free acid on base metal cathodes which must not therefore be immersed or left stand- ;ing in the bath unless the current is on. Furthermore, the deposit obtained with this type of bath is not always bright and coherent and in order to obtain any satisfactory deposit, very careful regulation of the plating conditions must be maintained.
Since the cost of the above precious metal and its salts is very high, it can, be appreciated that in view of the many objections to the use of the above bath for plating these metals, the plating of said metal on a commercial scale has its i 35 hardly obtained any degree of importance.
Lhave now found that the many objections to the plating of said precious metal in the strongly acid bath above mentioned, can be overcome and clear, brilliant deposits of said metal obtained without a careful manipulation of the plating process, by depositing said metal from aqueous baths containing saidmetal in the form of salts with weak acids.
it is accordingly an object of this invention to provide a process for obtaining clear, brilliant deposits of rhodium without a careful and expensive control of the plating operation and without subjecting the operator to dangerous 50 and disagreeable working conditions.
It is a further object of this invention to provide a simple, efficient, relatively inexpensive process for electrolytically obtaining rhodium in dense deposits of a high clarity and brilliance.
Other and further important objects of this T OFFICE invention will become apparent from the following description and appended claims.
The plating baths with which my process is operative, as stated above, comprise essentially aqueous bathscontaining the precious metal rhodium in the form of salts of weak acids. Any weak acid, whether organic or inorganic, which forms a salt with the above metal may be employed in connection with said metal for furnishing the metallic ions to the electrolyte. These weak acids will comprise preferably acids of an acidity of that of tartaric, oxalic, citric,
benzoic, lactic and-like organic acids and also phosphoric and similar weak inorganic acids.
Moreover, said acids may be combined with said metal either as simple salts or as complex salts with the alkali metals and ammonium as for example rhodium ammonium oxalate, rhodium ammonium citrate, rhodium ammonium tartrate, rhodium ammonium benzoate, rhodium ammoniumlactate and the like.
A peculiarity of these baths which greatly facilitates the deposition of the metal therefrom and enhances the emciency of the electrolysis is the fact that they may be employed with great success either in an acid, neutral or alkaline condition. The proper pH oi. the bath, if it is to be alkaline, may be provided by adding a certain amount of a weak or strong alkali to an aqueous solution of the simple or double salts of said precious metal. bath on the other hand may be controlled by The acidity of the electrical resistance.
The cathode of course may be any metal upon which it is desired .3 plate, such as silver, gold, platinum, copper, brass, German silver, pewter and the like. 01 course, the cathode, as in general plating should be clean and smooth to facilitate the production of clear, dense, brilliant deposits.
The concentration of the metal ions in solution may vary depending upon-the conditions of temperature, electrical pressure and cathode current density but need not be high to secure good deposits.
As a general rule, the anode current density is not of great importance but should be less than that of the cathode.
It is also not necessary with the baths 0! my invention to agitate the solution during plating or provide any other means to efiect depolarization of the electrodes, although a more even plate may be obtained if this is done.
The following example will serve to more fully illustrate the nature of my invention, but it should be borne in mind that my process is not limited to the specific conditions recited therein.
An aqueous solution of a salt of rhodium with a weak acid such as rhodium oxalate, citrate, tartrate, benzoate, lactate, phosphate or the like or of a double salt of rhodium such as rhodium ammonium oxalate, rhodium ammonium citrate, rhodium ammonium benzoate or the like containing about 1 gram of rhodium per liter of solution is electrolyzed with a. platinum anode and a smooth copper cathode which it is desired to plate at a voltage of about 4 volts and a cathodic current density of about 2 amperes per sq. inch. The electrolyte is maintained at a temperature of between and C. during the electrolysis. In this way dense, brilliant deposits of rhodium are obtained. Of course, the usual D. C. current is used.
As stated above, the electrolyte may be acid, neutral or alkaline which conditions may be obtained by the use of the proper amount of a suitable acid or alkali. Generally an alkaline electrolyte is preferable. If, however, an acid bath is used, it is obvious that the acidity will not be made so high as to cause deposition of hydrogen to the exclusion of the metal. Likewise, excessive alkalinity should be avoided. These are however obvious details which will be varied at the option of the skilled plater under diilerent desired conditions of plating.
It can thus be seen that I have provided a novel and highly efllcient process for obtaining dense, brilliant deposits of rhodium.
Various details of my process may of course be varied and I therefore do not intend to be limited in the scope of my invention except as necessitated by the prior art.
I claim:
1. The process oi depositing a brilliant and dense layer of rhodium for ornamental purposes which comprises passing a D. C. current through an aqueous alkaline bath containing said metal combined with phosphoric acid, at a temperature ranging from 60 to 90 C.
2. The process of plating a brilliant and dense layer of rhodium'for ornamental purposes electrolytically which comprises passing a D. C. current through a solution containing rhodium ammonium phosphate.
3. The process as defined in the preceding claim wherein the bath is maintained at a temperature of 60 to 90 C.
4. The process of electro-plating rhodium which comprises passing a D. C. current at about 4 volts and a cathode current density of about 2 amperes per sq. inch through a rhodium phosphate solution maintained at a temperature of 60 to 90 C.
5. A process as defined in claim 4 wherein the metal is deposited from a solution of rhodium ammonium phosphate containing about 1 gram of rhodium per liter of solution.
6. A process of electro-depositing rhodium which comprises passing a D. C. current of about 4 volts at a cathodic current density of 2 amperes per sq. inch from a platinum anode through an alkaline rhodium ammonium phosphate solution containing about 1 gram of rhodium per liter of solution.
SIGMUND COHN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US526786A US2057475A (en) | 1931-03-31 | 1931-03-31 | Electrodeposition of rhodium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US526786A US2057475A (en) | 1931-03-31 | 1931-03-31 | Electrodeposition of rhodium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2057475A true US2057475A (en) | 1936-10-13 |
Family
ID=24098791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US526786A Expired - Lifetime US2057475A (en) | 1931-03-31 | 1931-03-31 | Electrodeposition of rhodium |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2057475A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3530050A (en) * | 1964-06-12 | 1970-09-22 | Johnson Matthey Co Ltd | Electrodeposition of palladium |
| US4416742A (en) * | 1980-09-25 | 1983-11-22 | Nippon Mining Co., Ltd. | Process and electrolytic bath for making a rhodium-plated article having a black or blue color |
-
1931
- 1931-03-31 US US526786A patent/US2057475A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3530050A (en) * | 1964-06-12 | 1970-09-22 | Johnson Matthey Co Ltd | Electrodeposition of palladium |
| US4416742A (en) * | 1980-09-25 | 1983-11-22 | Nippon Mining Co., Ltd. | Process and electrolytic bath for making a rhodium-plated article having a black or blue color |
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