US1352331A - Process of electroplating non-conducting substances with copper - Google Patents
Process of electroplating non-conducting substances with copper Download PDFInfo
- Publication number
- US1352331A US1352331A US203179A US20317917A US1352331A US 1352331 A US1352331 A US 1352331A US 203179 A US203179 A US 203179A US 20317917 A US20317917 A US 20317917A US 1352331 A US1352331 A US 1352331A
- Authority
- US
- United States
- Prior art keywords
- article
- copper
- mixture
- conducting substances
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title description 8
- 239000000126 substance Substances 0.000 title description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 4
- 229910052802 copper Inorganic materials 0.000 title description 4
- 239000010949 copper Substances 0.000 title description 4
- 238000009713 electroplating Methods 0.000 title description 2
- 239000000203 mixture Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 229940045860 white wax Drugs 0.000 description 3
- 235000013871 bee wax Nutrition 0.000 description 2
- 239000012166 beeswax Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- -1 and whitewax Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000011363 dried mixture Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/919—Waterproofing
Definitions
- My invention relates to an improved process of electrically depositing a metal such as copper on non-conducting substances, such as wood, porcelain, paper, cloth, plaster, and the like, and has for its objects to provide an economical method whereby such substances can be coated, in a relatively short space of time, with a metallic'skin adapted to stand considerable wear.
- My said invention has articular reference to that class of met od wherein the article to be treated is first impregnated with afsubstance adapted to expel air and moisture, and is then coated with a conducting material.
- article to be coated is first treated so as to while the bath is kept hot until the article is thoroughly impregnated with the mixture, and provided with a wax coating.
- the said mixture is dried and powdered
- the ether during which operation it is made homogeneous, and the ether, of course, evaporates.
- the dried mixture is then applied to the surface of the impregnated article, by means of a brush, or in any other convenient manner, to the wax-coated surface of the article in such manner that the whole of such surface is covered therewith.
- the auric chlorid being soluble in the sulfuric ether, is uniformly distributed in the mixture, and as both mercury and auric chlorid are better conductors than graphite, the article is thus easily provided with an equally distributed conductive coating in a finelydivided condition, whereby the time and cost of plating are considerably reduced.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Description
. No Drawing.
UMIKIGHI UNNO, 0F TOKYO, JAPAN.
To (ZZZ whom it may concern:
Be it known that I, UMIKIGHI UNNo, a subject of the Emperor of Japan, residing at No. 20, Nichome, Shin-ogawa-machi, Ushigome-ku, city of Tokyo, andEmpire of Japan, have invented certain new and useful Improvements in Processes of Electroplat--. ing Non-Conducting Substances with Gopper, of which the following is a specification.
My invention relates to an improved process of electrically depositing a metal such as copper on non-conducting substances, such as wood, porcelain, paper, cloth, plaster, and the like, and has for its objects to provide an economical method whereby such substances can be coated, in a relatively short space of time, with a metallic'skin adapted to stand considerable wear.
My said invention has articular reference to that class of met od wherein the article to be treated is first impregnated with afsubstance adapted to expel air and moisture, and is then coated with a conducting material. i
It has been proposed in. a process of'this nature to immerse the article in boiling white-wax, and it has also been proposed in another class of process to coat thearticle with a mixture containing gold graphite.
In carrying my invention into effect, the
" article to be coated is first treated so as to while the bath is kept hot until the article is thoroughly impregnated with the mixture, and provided with a wax coating. i
' It is then treated witlia' conducting mixture, made from {the following ingredients Graphite 100 parts Mercury 2 parts 'Auric chlorid 1 part Sulfuric ether 50 parts,
(said materials being mixed in the presence of a small amount of mineral acid, such as nitric and sulfuric).
The said mixture is dried and powdered,
I Specification of Letters Patent.
Patented Sept. 7, 1920.
Application filed November 21, 1917. Serial No. 203,179.
during which operation it is made homogeneous, and the ether, of course, evaporates. The dried mixture is then applied to the surface of the impregnated article, by means of a brush, or in any other convenient manner, to the wax-coated surface of the article in such manner that the whole of such surface is covered therewith. The auric chlorid being soluble in the sulfuric ether, is uniformly distributed in the mixture, and as both mercury and auric chlorid are better conductors than graphite, the article is thus easily provided with an equally distributed conductive coating in a finelydivided condition, whereby the time and cost of plating are considerably reduced.
n electrolytic bath of copper sulfate solution of ordinary strength is provided, in which the article to be coated is now immersed and attached to the negative pole, while the positive pole-is a plate or the like of copper.v An electric current, such as is usually emplo ed for electroplating, a1
- though prefera 1y of slightly, less voltage, is
passed through the bath, and according to the length of time during which the passage of the current is mainta ned, a copper coating of greater-p ssthickness .will be deposited onthe artic e" under treatment.
Having fullyjdescribed my invention, what I claim as"new,";and desire to secure by Letters Patent, is Y 1'. The method of electrolytically depositing metal upon 'an article made of a nonconducting substance which consists in impregnating the article with a mixture of beeswax, paraflin wax' and white wax, preparing a coating mixture by mixing together .relatively large proportions of graphite and sulfuric ether, and relatively small propor- 'tions of mercury and gold chlorid, drying and powdering the mixture, and coating the impregnated article therewith, then immersing the article so coated in a bath of electrolyte' and electrolytically depositing a metal on said article while so immersed.
2. The method of electrolytically depositing metal upon an article made of a nonconducting substance which consists in impregnating the article with a mixture of beeswax, paraffin wax, and whitewax, coating the impregnated article with a powder formed from a homogeneous mixture con:
taining a relatively large amount of graph- I ite, and relatively small amounts of merarticle While so immersed.
In testimony whereof I affix my signature in the presence of two Witnesses.
UMIKICHI UN N O.
Witnesses DAIJIRO IsHI, KoIoHI URIN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US203179A US1352331A (en) | 1917-11-21 | 1917-11-21 | Process of electroplating non-conducting substances with copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US203179A US1352331A (en) | 1917-11-21 | 1917-11-21 | Process of electroplating non-conducting substances with copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US1352331A true US1352331A (en) | 1920-09-07 |
Family
ID=22752843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US203179A Expired - Lifetime US1352331A (en) | 1917-11-21 | 1917-11-21 | Process of electroplating non-conducting substances with copper |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US1352331A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4622107A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4631117A (en) * | 1985-05-06 | 1986-12-23 | Olin Hunt Specialty Products Inc. | Electroless plating process |
| US4684560A (en) * | 1985-11-29 | 1987-08-04 | Olin Hunt Specialty Products, Inc. | Printed wiring board having carbon black-coated through holes |
| US4718993A (en) * | 1987-05-29 | 1988-01-12 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
| US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
| US4994153A (en) * | 1990-06-28 | 1991-02-19 | Olin Corporation | Process for preparing nonconductive substrates |
| US5106537A (en) * | 1990-04-12 | 1992-04-21 | Olin Hunt Sub Iii Corp. | Liquid dispersion for enhancing the electroplating of a non-conductive surface |
| US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
| US5674372A (en) * | 1996-09-24 | 1997-10-07 | Mac Dermid, Incorporated | Process for preparing a non-conductive substrate for electroplating |
-
1917
- 1917-11-21 US US203179A patent/US1352331A/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
| US4631117A (en) * | 1985-05-06 | 1986-12-23 | Olin Hunt Specialty Products Inc. | Electroless plating process |
| US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
| US4684560A (en) * | 1985-11-29 | 1987-08-04 | Olin Hunt Specialty Products, Inc. | Printed wiring board having carbon black-coated through holes |
| US4622107A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4718993A (en) * | 1987-05-29 | 1988-01-12 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
| US5106537A (en) * | 1990-04-12 | 1992-04-21 | Olin Hunt Sub Iii Corp. | Liquid dispersion for enhancing the electroplating of a non-conductive surface |
| US4994153A (en) * | 1990-06-28 | 1991-02-19 | Olin Corporation | Process for preparing nonconductive substrates |
| US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
| USRE37765E1 (en) | 1991-05-01 | 2002-06-25 | Macdermid, Incorporated | Process for preparing a nonconductive substrate for electroplating |
| US5674372A (en) * | 1996-09-24 | 1997-10-07 | Mac Dermid, Incorporated | Process for preparing a non-conductive substrate for electroplating |
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