TWM637997U - Electronic component and conductive pins thereof - Google Patents

Abstract

An electronic component and its conductive pin can be used to be inserted into a housing base of an electronic component, the conductive pin is a hollow structure, and the hollow structure is provided with at least one through hole; thereby one of the electronic components A wire can pass through one end of the hollow structure and form an electrical connection with the conductive pin.

Description

Electronic components and their conductive pins

The invention relates to the technical field of a conductive pin structure, in particular to a hollow conductive pin and an electronic component provided with the conductive pin.

The principle of the transformer is to pass the current through the primary side coil to generate a magnetic field. The magnetic field is transmitted to the secondary side coil through the magnetic material, and the current is generated at the secondary side coil. The number of turns of the primary side coil and the secondary side coil is different. produce a voltage-changing effect.

Existing transformers, as disclosed in Taiwan Invention Patent Case I773608, include a winding frame, a magnetic core group and a winding group, and the winding group and the magnetic core group are assembled on the winding frame. The wire is wound on the pin of the winding frame, and then the wire is fixed on the pin by soldering tin. However, during the wire winding and soldering process, it is easy to cause the pins to be skewed and the wires to be broken, resulting in poor electrical characteristics. In addition, tools are needed to manage the wires, and in order to avoid poor electrical characteristics caused by the distance between the pins being too close to the size of the solder joints, and because it is difficult to control the size of the solder joints, the distance between the pins must be designed more. In order to avoid the above-mentioned problems of poor electrical characteristics, the size of the conductive pin itself must also have a larger diameter to avoid breakage of the lead now and after connection. In order to prevent the conductive pins from being skewed, it is also necessary to implement dispensing at the connection between the conductive pins and the winding frame. Such a transformer as a whole cannot be miniaturized.

In view of this, the object of the present invention is to provide a conductive pin and an electronic component provided with the conductive pin, and the electronic component may be a transformer. By setting the conductive pin to have a hollow structure, the wire of the electronic component passes through the hollow structure of the conductive pin, and the solder is poured into the conductive pin so that the wire and the conductive pin are electrically connected. The prior art wire management process solved by this method makes the conductive pins easily skewed and the wires are broken. At the same time, the solder is poured into the conductive pins, so that the distance between the conductive pins does not need to consider the poor electrical characteristics caused by the size of the solder. The distance between the conductive pins is shortened, and the conductive pins do not need to be dispensed, so that the miniaturization of electronic components can be realized.

An embodiment of the conductive pin of the present invention has a hollow structure and is arranged on an electronic component, and the hollow structure is provided with at least one through hole, and a wire of the electronic component enters the hollow structure from the first end and forms an electrical connection with the conductive pin .

In another embodiment, the conductive pin is a hollow tube.

In another embodiment, the hollow structure is provided with at least one slot.

In another embodiment, the exhaust structure is a plurality of through holes arranged in an array.

The invention provides an electronic component, which includes an accommodating base, the above-mentioned conductive pins and at least one wire. The accommodating base has at least one installation slot. The first end of the conductive pin is disposed in the installation slot. The wire enters the hollow structure from the installation slot through the first end.

The conductive pins of this creation form a hollow structure, the wires of the electronic components penetrate into the hollow structure of the conductive pins, and then solder is filled into the hollow structure of the conductive pins to electrically connect the wires to the conductive pins. In this way, the prior art wire management process makes the conductive pins tend to be skewed and the wires are broken. At the same time, the solder is poured into the conductive pins, so that the distance between the conductive pins does not need to consider the poor electrical characteristics caused by the size of the solder. can shorten the distance between conductive pins, and Moreover, the conductive pins do not need to be dispensed, which can realize the miniaturization of the electronic components, and also simplify the manufacturing process of the electronic components.

10: Electronic components

11:Accommodating the base

12, 12', 12", 12''': conductive pins

13:Electrical module

113: Mounting groove

121: first end

122: second end

123: Through hole

123': slot

123": slot

131: wire

1131: Trumpet structure

H, H': hollow structure

S: Solder

FIG. 1 is a perspective view of an embodiment of an electronic component of the present invention.

FIG. 2 is a partially exploded perspective view of the electronic component of FIG. 1 .

FIG. 3 is a cross-sectional view of the electronic component of FIG. 1 .

FIG. 4 is a cross-sectional view of another embodiment of the conductive pin of the present invention.

FIG. 5 is a perspective view of yet another embodiment of the conductive pin of the present invention.

FIG. 6 is a perspective view of yet another embodiment of the conductive pin of the present invention.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which represent an embodiment of the electronic component of the present invention. The electronic component 10 of this embodiment includes an accommodating base 11 and a plurality of conductive pins 12 . The accommodating base 11 is an electrical module 13 for accommodating electronic components. For example, the electronic component 10 is a transformer. The electrical module 13 includes a magnetic core set and a winding set. The winding set includes a coil formed by winding multiple turns of wires.

The accommodating base 11 has a plurality of installation grooves 113 , the installation grooves 13 of the accommodating base 11 in this embodiment are arranged in multiple rows, and the conductive pins 12 are correspondingly disposed in the installation grooves 113 .

Each conductive pin 12 has a hollow structure H. As shown in FIG. Both ends of each conductive pin 12 have a first end 121 and a second end 122 respectively. The hollow structure H of this embodiment runs through the first end 121 and the second end 122, so that the conductive pin 12 of this embodiment It is in the shape of a round tube.

As shown in FIG. 3 , the conductive pin 12 is inserted into the installation groove 113 . The wire 131 of the electrical module 13 penetrates the conductive pin 12 from the installation slot 113 , and enters the hollow structure H through the conductive pin 12 at the same time. Solder S is poured into the hollow structure H to electrically connect the wire 131 to the conductive pin 12 . The conductive pins 12 can be inserted into the circuit board to electrically connect the electronic component 10 with the circuit board. In addition, a flared mouth structure 1131 can also be formed in the mounting groove 113 , which is helpful for passing the wires in and increasing the pull-out force of the conductive pins 12 .

In addition, when the solder is injected into the hollow structure of the conductive pin 12, if air enters the solder, a gap will be formed and the electrical connection between the wire and the conductive pin 12 will be affected. The hole 123, the through hole 123 in this embodiment is a through hole or a plurality of through holes.

Please refer to FIG. 4 , which shows another embodiment of the conductive pin of the present invention. The hollow structure H' of the conductive pin 12' in this embodiment only extends to the first end 121, and the second end 122 is a solid closed structure. Similarly, the wire 131 of the electrical module 13 as shown in FIG. Solder S is poured into the hollow structure H to electrically connect the wire 131 to the conductive pin 12 .

Please refer to FIG. 5 , which shows yet another embodiment of the conductive pin of the present invention. The conductive pin 12"' of this embodiment may include a slot 123' extending to the first end 121, and the extending direction of the slot 123' is parallel to the axial direction of the conductive pin 12".

Please refer to FIG. 6 , which shows yet another embodiment of the conductive pin of the present invention. The conductive pin 12''' in this embodiment includes another slot 123", and the extending direction of the slot 123" is oblique to the axial direction of the conductive pin 12".

The conductive pins of this creation form a hollow structure, the wires of the electronic components penetrate into the hollow structure of the conductive pins, and then solder is filled into the hollow structure of the conductive pins to electrically connect the wires to the conductive pins. In this way, the prior art wire management process solves the problem that the conductive pins are easily skewed and the The wire is broken, and the solder is poured into the conductive pins at the same time, so that the distance between the conductive pins does not need to consider the poor electrical characteristics caused by the size of the solder and can shorten the distance between the conductive pins, which can realize the miniaturization of electronic components. Make the resistive impedance of the conductive pin equal to the line impedance. The conductive pins also do not require dispensing, which also simplifies the manufacturing process of the electronic components.

However, the above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation, that is, all simple equivalent changes and modifications made according to the patent scope of this creation and the content of the new description, All still belong to the scope covered by this creation patent.

In addition, any embodiment or patent scope of this creation does not need to achieve all the purposes or advantages or characteristics disclosed in this creation. In addition, the abstract part and the title are only used to assist in the search of patent documents, and are not used to limit the scope of rights of this creation. In addition, terms such as "first" and "second" mentioned in this specification or the scope of the patent application are only used to name elements (elements) or to distinguish different embodiments or ranges, and are not used to limit the number of elements. upper or lower limit.

10: Electronic components

11:Accommodating the base

12: Conductive pin

13:Electrical module

113: Mounting groove

Claims (5)

A conductive pin that can be inserted into an electronic component, the conductive pin is a hollow structure, and the hollow structure is provided with at least one through hole; whereby a wire of the electronic component can pass through one end of the hollow structure The hollow structure is electrically connected with the conductive pin. The conductive pin according to claim 1, wherein the hollow structure is a hollow tube. The conductive pin according to claim 2, wherein the hollow structure is circular in cross section or hollow tubular in geometric shape. The conductive pin as described in claim 3 further includes a plurality of through holes, and the through holes are arranged in an array. An electronic component comprising: a housing base with at least one mounting slot; At least one conductive pin as described in any one of claims 1 to 4, the conductive pin is arranged in the at least one installation groove; At least one wire, the at least one wire passes through the hollow structure from the at least one installation slot.

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