TWM636093U - Rework apparatus - Google Patents

Abstract

A repairing device, which is suitable for being installed above a workbench for carrying an object to be repaired and for installing a ductile film, and a surface of the film is provided with an adhesive layer to remove the object on the object to be repaired Bad crystal grains or solder balls, or reset crystal grains on the object to be repaired, the rework device includes a holding module for fixing the film and can be in a slightly tensioned state, and can vacuum absorb the film and has A needle is used to push a pushing module for pushing the film. The rework device can be applied to the process of removing dies, solder balls, and refilling dies. It not only has multiple uses, but also can adjust the needle size of the push module according to the size of dies and solder balls, and can remove a single die in a small area. No chips or solder balls will affect nearby chips and solder balls that do not need to be removed, and the rework device itself will not be polluted.

Description

Rework device

The present invention relates to a rework device, in particular to a rework device for repairing circuit boards.

Generally, if a circuit board with multiple LED chips is soldered, if some of the chips are defective, it is necessary to remove the defective chips and the solder balls of the soldered chips, and then re-solder the replacement chips to avoid The entire circuit board is scrapped to reduce losses.

At present, most of the ways to remove the die and solder balls on the circuit board are to use suction nozzles to remove them. However, this removal method not only easily causes contamination of the suction nozzle, but also requires frequent replacement of the suction nozzle, and the removal range is limited by the size of the suction nozzle. Since the grain size is getting smaller and smaller, and the size of the suction nozzle is larger and cannot match the size of a single grain, it is easy to pick up good grains near the bad grains.

Therefore, one purpose of the present invention is to provide a rework device that can solve the aforementioned problems.

Therefore, in some embodiments, the new rework device is suitable for being installed above a workbench for carrying an object to be repaired and for installing a ductile film, and a surface of the film is provided with an adhesive layer. To remove bad chips or solder balls on the object to be repaired, or to reset chips on the object to be repaired, the rework device includes: a holding module and a pushing module. The holding module includes a bearing frame and a pressing frame to fix the film and be in a slightly tensioned state. The pushing module is arranged above the holding module, and includes a base and an ejector mechanism. The base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and a plurality of air holes distributed around the pinhole, the gas channel communicates with the air holes and is connected to a gas pump The device is used to vacuum absorb the film on the bottom wall. The thimble mechanism is arranged on the base along the up-down direction and is partly located in the gas passage, and has a needle body, which can be operated to pass through the pinhole and pass through the bottom wall to push the film.

In some embodiments, the base has a base, a cap connected to the base and having the bottom wall, a first sealing ring disposed between the base and the cap, and a first sealing ring disposed between the base and the cap. A second sealing ring between the base body and the thimble mechanism, the first sealing ring and the second sealing ring are used to block the gas channel from communicating with the external environment.

In some embodiments, the supporting frame is used for the film to be adhered and fixed by the adhesive layer and the adhesive layer faces downward, and the pressure frame has a horizontally arranged ring plate portion and vertically extends from the inner edge of the ring plate portion. a ring pushing part, the ring plate part leans against the carrying frame and sandwiches the film between the ring plate part and the carrying frame, and the ring pushing part pushes down the film to stretch the film .

In some implementation aspects, the bearing frame and the pressurizing frame are sub-mother rings matched inside and outside.

In some embodiments, the new rework device is suitable for being installed above a workbench for carrying a circuit board to be repaired and for installing a ductile film, and a surface of the film is provided with an adhesive layer, so as to To remove bad grains or solder balls on the circuit board to be repaired, the rework device includes: a holding module and a pushing module. The holding module includes a bearing frame and a pressing frame to fix the film and be in a slightly tensioned state. The pushing module is arranged above the holding module, and includes a base and an ejector mechanism. The base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and a plurality of air holes distributed around the pinhole, the gas channel communicates with the air holes and is connected to a gas pump The device is used to vacuum absorb the film on the bottom wall. The thimble mechanism is arranged on the base along the up and down direction and is partly located in the gas channel, and has a needle body, which can be operated to pass through the pinhole to pass through the bottom wall to correspond to the crystal grain or tin to be removed. The position of the ball pushes against the film, causing the film to adhere to the die or solder ball to be removed.

In some embodiments, the new rework device is suitable for being installed above a workbench for carrying a circuit board to be repaired and for installing a ductile film, and a surface of the film is adhered to a plurality of replacement parts. Die, the circuit board to be repaired is provided with solder balls to be repaired, and the rework device includes: a holding module and a pushing module. The holding module includes a bearing frame and a pressing frame to fix the film and be in a slightly tensioned state. The pushing module is arranged above the holding module, and includes a base and an ejector mechanism. The base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and a plurality of air holes distributed around the pinhole, the gas channel communicates with the air holes and is connected to a gas pump The device is used to vacuum absorb the film on the bottom wall. The thimble mechanism is arranged on the base along the up-down direction and partly located in the gas channel, and has a needle body, which can be operated to pass through the bottom wall through the pinhole to push against the position corresponding to the crystal grain to be replaced. Pushing the film, so that the crystal grain to be replaced is transferred to the solder ball to be replaced.

This new model has the following effects: This new rework device can be applied to the process of removing dies, solder balls, and repairing dies. It not only has multiple uses, but also can adjust the needle body size of the push module according to the size of dies and solder balls. It can remove a single die or solder ball in a small area without affecting nearby die and solder balls that do not need to be removed, and the rework device itself will not be polluted.

Referring to Fig. 1 and Fig. 9, one embodiment of the novel rework device 100 is suitable for being arranged above a workbench (not shown) for carrying an object A to be repaired and for installing a stretchable film B to Remove the defective die A1 or solder ball A2 on the object A to be repaired, or replace the die on the object A to be repaired. For example, the object A to be repaired is a circuit board to be repaired A', as shown in FIG. As shown in FIG. 9 , a plurality of substituting dies B1 are adhered to one surface of the installed film B′, and the circuit board A′ to be repaired is provided with solder balls A2 for substituting the substituting dies B1.

Referring to FIGS. 1 to 3 , the rework device 100 includes a holding module 1 and a pushing module 2 . The holding module 1 includes a supporting frame 11 and a pressing frame 12 for fixing the film B in a slightly tensioned state. In this embodiment, an adhesive layer B2 is provided on one surface of the film B, and the carrier frame 11 is a wafer frame for the film B to be adhered and fixed by the adhesive layer B2 and the adhesive Layer B2 faces down. The pressurizing frame 12 is an expansion ring, and has a ring plate portion 121 disposed horizontally and a ring pushing portion 122 vertically extending from the inner edge of the ring plate portion 121 . The supporting frame 11 and the pressurizing frame 12 are arranged in a clamping mechanism 13, and the clamping mechanism 13 includes a base plate 131, a cover 132, and a pair of clamping fingers 133 respectively arranged on opposite sides of the cover 132. The substrate 131 and the pair of fingers 133 are connected by a plurality of connection components 134 and can be opened and closed relative to each other. The ring plate portion 121 of the pressure frame 12 is fixed on the base plate 131 , and the bearing frame 11 is detachably held by the pair of clamping fingers 133 . When the carrier frame 11 is to be installed, the clamping mechanism 13 needs to be opened to separate the substrate 131 from the pair of fingers 133, and after the carrier frame 11 is placed, the clamping mechanism 13 is closed to make the substrate 131 abuts against the pair of clamping fingers 133, as shown in the schematic cross-sectional view of FIG. Between the part 121 and the supporting frame 11, and the ring pushing part 122 pushes down the film B to stretch the film B, so that the film B is in a slightly taut state. In a variant embodiment, the supporting frame 11 and the pressurizing frame 12 can also adopt the existing internal and external matching rings (not shown), which can also make the film in a slightly tensioned state.

Referring to FIG. 1 , FIG. 4 to FIG. 6 , the pushing module 2 is arranged above the holding module 1 and includes a base 21 and an ejector mechanism 22 . In this embodiment, the base 21 defines a gas passage 211 and has a base 212, a cap 213 connected to the base 212, and a first seal between the base 212 and the cap 213. The ring 214, and a second sealing ring 215 disposed between the seat body 212 and the ejector mechanism 22. The first sealing ring 214 and the second sealing ring 215 are used to block the communication between the gas channel 211 and the external environment. The cap 213 has a bottom wall 213a facing the film B. As shown in FIG. The bottom wall 213a has a pinhole 213b and a plurality of air holes 213c distributed around the pinhole 213b, and the gas channel 211 communicates with the air holes 213c. A pneumatic connector 216 connected to the gas passage 211 is provided on the base 212 to connect to a suction device (not shown), so as to pump air to the gas passage 211 and vacuum absorb the film B on the bottom wall 213a. . The thimble mechanism 22 is arranged on the base 21 along the up-down direction and partly located in the gas passage 211, and has a needle seat 221 and a needle body 222, and the needle body 222 can be operated to pass through the bottom wall through the needle hole 213b 213a to push the film B.

Referring to FIG. 1 , FIG. 7 and FIG. 8 , the operation flow of removing the defective die A1 using the rework apparatus 100 is described as follows. Firstly, the pushing module 2 is moved to the working position, so that the position of the needle body 222 corresponds up and down to the position of the defective die A1 to be removed. Then the pushing module 2 is lowered to the working height, and then the gas channel 211 is pumped to make the film B vacuum adsorbed on the bottom wall 213a, and then the needle body 222 is passed through the bottom wall 213a through the pinhole 213b, Pushing the film B at a position corresponding to the bad die A1 to be removed, so that the film B adheres to the bad die A1 to be removed. By making the film B vacuum adsorbed on the bottom wall 213a, when the needle body 222 protrudes from the bottom wall 213a, the film B is attached to the needle body 222 to reduce the protruding area of the film B, That is to say, the range in which the film B can adhere to the crystal grains can be narrowed, and a single crystal grain can be precisely adhered. After the film B has picked up the defective die A1, the needle body 222 is retracted into the bottom wall 213a, and then the suction is turned off, and then the pushing module 2 is raised back to the original height, thus completing the removal. Action flow of a bad die A1. If there are multiple bad dies A1 , the above-mentioned action flow is repeated several times, and the action flow of removing the bad solder ball A2 is the same as the action flow of removing the bad die A1 . The size of the needle body 222 and the viscosity of the adhesive layer B2 of the film B can be adjusted according to the size of the chip A1 and the solder ball A2 to be removed. With this method of removing the crystal grain A1 and the solder ball A2, not only can a single crystal grain A1 or a single solder ball A2 be removed in a small area, but also the needle body 222 will not directly contact the crystal grain A1 and the solder ball A2, and The film B can be replaced, so that the rework device 100 will not be polluted.

Referring to Fig. 9 to Fig. 11, after the defective grain A1 and solder ball A2 are removed from the circuit board A' to be repaired, the solder ball A2 can be installed at the position where the solder ball A2 was removed by using the solder spotting equipment, and then the rework device can be used 100 refill crystals. When using the rework device 100 for chip repair, it is necessary to install thin films B', such as blue film or UV film, on which a plurality of replacement dies B1 are attached to the surface. The process of chip repair is described as follows. First move the pushing module 2 to the working position, so that the position of the needle body 222 corresponds up and down to the position of the solder ball A2 of the grain to be repaired. Then the pushing module 2 is lowered to the working height, and then the needle body 222 is passed through the pinhole 213b to pass through the bottom wall 213a, so as to push the film B' at the position corresponding to the die B1 to be replaced and make the The grain B1 to be replaced contacts the solder ball A2, and then the gas channel 211 is pumped to make the film B' vacuum adsorbed on the bottom wall 213a, so that the grain B1 to be replaced is transferred to the solder ball A2 to be replaced . By making the film B' vacuum-adsorbed on the bottom wall 213a, the film B' can be attached to the needle body 222, so as to reduce the area where the film B' adheres to the die B1 to be replaced, so that the to-be-replaced The crystal grains B1 are easily detached from the film B' and transferred to the solder balls A2. Then the needle body 222 is retracted into the bottom wall 213a, and then the suction is turned off, and then the pushing module 2 is raised back to the original height, thus completing the operation process of replenishing a die. There are multiple positions that need to replenish crystal grains, that is, repeat the aforementioned action flow for many times.

At least two rework devices 100 can be installed on one machine, one of which is used to remove dies and solder balls, and the other rework device 100 is used to replenish crystals, thereby improving production efficiency.

To sum up, the new rework device 100 can be applied to the process of removing dies, solder balls, and repairing dies. It not only has multiple uses, but also can adjust the needle body 222 of the pushing module 2 according to the size of dies and solder balls. size, and can remove a single grain or solder ball in a small area without affecting nearby grains and solder balls that do not need to be removed, and at the same time, the rework device 100 itself will not be polluted.

But the above-mentioned ones are only embodiments of the present invention, and should not limit the scope of implementation of the present invention with this. All simple equivalent changes and modifications made according to the patent scope of the present application and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this patent.

100: Rework device 1: Holding module 11: Bearing frame 12: Pressurized frame 121: ring plate part 122: ring push department 13: Clamping mechanism 131: Substrate 132: cover 133: pinch finger 134: Connection components 2: push module 21: base 211: gas channel 212: seat body 213: cap 213a: bottom wall 213b: pinhole 213c: stomata 214: the first sealing ring 215: the second sealing ring 216: Pneumatic connector 22: Ejector mechanism 221: Needle seat 222: needle body A: Items to be repaired A’: circuit board to be repaired A1: Bad grain A2: solder ball B: film B': film B1: Substitute grains B2: Adhesive layer

Other features and functions of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a side view schematic diagram of an embodiment of the new rework device loaded with film to remove crystal grains and solder balls of the object to be repaired; Fig. 2 is a three-dimensional exploded view of the holding module and the clamping mechanism of the embodiment; Fig. 3 is a schematic cross-sectional view of the holding module of this embodiment in a holding film state; Fig. 4 is a perspective view of the pushing module of this embodiment; Fig. 5 is a sectional view of the pushing module; Fig. 6 is an incomplete perspective view of the pushing module; 7 and FIG. 8 are schematic side views similar to FIG. 1, and cooperate with FIG. 1 to illustrate the operation process of removing the die in this embodiment; and FIG. 9 to FIG. 11 are schematic side views similar to FIG. 1 , illustrating the operation flow of this embodiment for crystal replenishment.

100: Rework device

1: Holding module

11: Bearing frame

12: Pressurized frame

2: push module

21: base

22: Ejector mechanism

222: needle body

A: Items to be repaired

A’: circuit board to be repaired

A1: Bad grain

A2: solder ball

B: film

B2: Adhesive layer

Claims (6)

A repairing device, which is suitable for being installed above a workbench for carrying an object to be repaired and for installing a ductile film, and a surface of the film is provided with an adhesive layer to remove the object on the object to be repaired Defective chips or solder balls, or reset chips on the object to be repaired, the rework device includes: A holding module, including a load frame and a pressure frame, to fix the film and be in a slightly taut state; and A pushing module is arranged above the holding module, and includes a base and a thimble mechanism, the base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and multiple A gas hole distributed around the pinhole, the gas passage communicates with the gas holes and connects with an air pumping device for vacuum adsorption of the film on the bottom wall, the thimble mechanism is arranged on the base along the up and down direction and partially It is located in the gas channel and has a needle body, which can be operated to pass through the pinhole and pass through the bottom wall to push the film. The rework device according to claim 1, wherein the base has a base, a cap connected to the base and having the bottom wall, and a first sealing ring arranged between the base and the cap, And a second sealing ring arranged between the seat body and the thimble mechanism, the first sealing ring and the second sealing ring are used to block the communication between the gas channel and the external environment. The rework device as described in claim 1, wherein, the carrying frame is used for the film to be adhered and fixed by the adhesive layer and the adhesive layer faces downward, and the pressure frame has a horizontally arranged ring plate portion and a ring plate from the ring plate A ring push portion vertically extending from the inner edge of the ring plate portion, the ring plate portion leans against the carrier frame and sandwiches the film between the ring plate portion and the carrier frame, and the ring push portion pushes the film downward to The film is stretched. The rework device as described in Claim 1, wherein the bearing frame and the pressurizing frame are rings with inner and outer fit. A repairing device, which is suitable for being installed above a workbench for carrying a circuit board to be repaired and for installing a ductile film, and a surface of the film is provided with an adhesive layer to remove the circuit board to be repaired Bad die or solder balls on the surface, the rework device includes: A holding module, including a load frame and a pressure frame, to fix the film and be in a slightly taut state; and A pushing module is arranged above the holding module, and includes a base and a thimble mechanism, the base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and multiple A gas hole distributed around the pinhole, the gas passage communicates with the gas holes and connects with an air pumping device for vacuum adsorption of the film on the bottom wall, the thimble mechanism is arranged on the base along the up and down direction and partially Located in the gas channel and having a needle body, the needle body can be operated to penetrate the bottom wall through the pinhole to push the film at the position corresponding to the chip or solder ball to be removed, so that the film adheres to be Removed die or solder balls. A rework device is suitable for being installed above a workbench for carrying a circuit board to be repaired and for installing a ductile film, and a surface of the film is adhered to a plurality of crystal grains for replacement, the circuit to be repaired The board is equipped with solder balls to be repaired. The rework device includes: A holding module, including a load frame and a pressure frame, to fix the film and be in a slightly taut state; and A pushing module is arranged above the holding module, and includes a base and a thimble mechanism, the base has a bottom wall facing the film and defines a gas channel, the bottom wall has a pinhole and multiple A gas hole distributed around the pinhole, the gas passage communicates with the gas holes and connects with an air pumping device for vacuum adsorption of the film on the bottom wall, the thimble mechanism is arranged on the base along the up and down direction and partially It is located in the gas channel and has a needle body, which can be operated to pass through the pinhole to pass through the bottom wall to push the film at the position corresponding to the grain to be replaced, so that the grain to be replaced is transferred to On the solder ball to be refilled.

Images