TWM633531U - Water-cooling type heat sink device - Google Patents
Water-cooling type heat sink device Download PDFInfo
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- TWM633531U TWM633531U TW111208276U TW111208276U TWM633531U TW M633531 U TWM633531 U TW M633531U TW 111208276 U TW111208276 U TW 111208276U TW 111208276 U TW111208276 U TW 111208276U TW M633531 U TWM633531 U TW M633531U
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- water
- pump
- water inlet
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- 238000001816 cooling Methods 0.000 title claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 123
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000005192 partition Methods 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
本新型係關於一種水冷式散熱裝置,包括入出水模組、泵浦模組及排管,入出水模組包括第一箱體、入水接頭及出水接頭,第一箱體內部設有分隔板以分隔出入水腔室和出水腔室,入水接頭連通入水腔室,出水接頭連通出水腔室,在入水腔室和出水腔室側邊分別設有第一槽孔;泵浦模組與入出水模組間隔設置,泵浦模組包括第二箱體及設於第二箱體內的泵浦,第二箱體側邊設有第二槽孔;排管的兩端分別連接第一槽孔和第二槽孔。藉此,不僅結構簡單組裝容易,還能夠延長散熱裝置的使用壽命。The new model relates to a water-cooled heat dissipation device, including a water inlet and outlet module, a pump module and a drain pipe. The water inlet and outlet module includes a first box body, a water inlet joint and a water outlet joint. The inside of the first box body is provided with a partition plate In order to separate the water inlet and outlet chambers and the water outlet chambers, the water inlet connector is connected to the water inlet chamber, and the water outlet connector is connected to the water outlet chamber. First slots are respectively arranged on the sides of the water inlet chamber and the water outlet chamber; the pump module is connected to the water inlet and outlet chambers. The modules are arranged at intervals. The pump module includes a second box and a pump installed in the second box. There is a second slot on the side of the second box; the two ends of the pipe are respectively connected to the first slot and the Second slot. Thereby, not only the structure is simple and the assembly is easy, but also the service life of the heat sink can be prolonged.
Description
本新型係有關一種散熱裝置的技術,尤指一種水冷式散熱裝置。The present invention relates to the technology of a heat dissipation device, especially a water-cooled heat dissipation device.
隨著電子產品內的處理器等元件之運算速度不斷的提昇,其所產生的熱量也越來越高,導致一般的空冷式散熱裝置已無法達到現階段的散熱需求,勢必需要利用具有水等工作液體進行循環冷卻功效的水冷式散熱裝置,才能有效地對前述的電子發熱元件進行散熱。As the computing speed of processors and other components in electronic products continues to increase, the heat generated by them is also getting higher and higher. As a result, ordinary air-cooled heat sinks cannot meet the current heat dissipation requirements, and it is necessary to use water, etc. Only the water-cooled heat dissipation device with circulating cooling effect of the working liquid can effectively dissipate heat from the aforementioned electronic heating elements.
現有的水冷式散熱裝置,雖然解決了前述空冷式散熱裝置的問題,但卻存在著下述的問題點,由於水冷式散熱裝置的體積龐大且結構複雜,因而限制其使用範圍和場域,業界雖有提出相關的解決方案,卻仍然存在著使用壽命不長等相關問題待改善。Although the existing water-cooled heat sink solves the problems of the aforementioned air-cooled heat sink, it still has the following problems. Due to the large volume and complex structure of the water-cooled heat sink, its scope of use and field are limited. Although related solutions have been proposed, there are still related problems such as short service life to be improved.
有鑑於此,本新型創作人遂針對上述現有技術的缺失,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本新型創作人改良之目標。In view of this, the inventor of the present invention aimed at the deficiency of the above-mentioned prior art, devoted himself to research and cooperated with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor of the present invention to improve.
本新型之一目的,在於提供一種水冷式散熱裝置,其不僅結構簡單組裝容易,還能夠延長散熱裝置的使用壽命。One purpose of the present invention is to provide a water-cooled heat sink, which not only has a simple structure and is easy to assemble, but also prolongs the service life of the heat sink.
為了達成上述之目的,本新型提供一種水冷式散熱裝置,包括一入出水模組、一泵浦模組及複數排管,該入出水模組包括一第一箱體、一入水接頭及一出水接頭,該第一箱體內部設有一分隔板以分隔出一入水腔室和一出水腔室,該入水接頭連通該入水腔室,該出水接頭連通該出水腔室,在該入水腔室和該出水腔室側邊分別設有複數第一槽孔;該泵浦模組與該入出水模組間隔設置,該泵浦模組包括一第二箱體及設於該第二箱體內的至少一泵浦,該第二箱體側邊設有複數第二槽孔;每一該排管的兩端分別連接其中之一該第一槽孔和其中之一該第二槽孔。In order to achieve the above purpose, the present invention provides a water-cooled heat dissipation device, including a water inlet and outlet module, a pump module and a plurality of pipes, the water inlet and outlet module includes a first box, a water inlet joint and a water outlet The first box body is provided with a partition plate to separate a water inlet chamber and a water outlet chamber, the water inlet connector communicates with the water inlet chamber, the water outlet connector communicates with the water outlet chamber, and the water inlet chamber and The sides of the water outlet chamber are respectively provided with a plurality of first slots; the pump module is spaced apart from the water inlet and outlet module, and the pump module includes a second box body and at least For a pump, a plurality of second slots are arranged on the side of the second box; two ends of each row of pipes are respectively connected to one of the first slots and one of the second slots.
本新型還具有以下功效,通過泵浦的串聯和形成於各排管的上方,不僅能夠應用在流量揚程高的產品,並且可延長整體裝置的使用壽命,還能夠增加散熱面積以提升散熱效能。通過入出水模組和泵浦模組的立式擺設,進而增加內部的儲水容量。通過風扇組件配置在出水模組和泵浦模組之間,使得整體造型更顯美觀和一體化。This new model also has the following effects. By connecting the pumps in series and forming them above the pipes, it can not only be applied to products with high flow and head, but also prolong the service life of the overall device, and increase the heat dissipation area to improve heat dissipation efficiency. Through the vertical arrangement of the water inlet and outlet module and the pump module, the internal water storage capacity is increased. The fan assembly is arranged between the water outlet module and the pump module, making the overall shape more beautiful and integrated.
有關本新型之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本新型加以限制者。The detailed description and technical content of the new model are described below with the accompanying drawings, but the attached drawings are only for reference and illustration, and are not used to limit the new model.
請參閱圖1至圖4所示,本新型提供一種水冷式散熱裝置,其主要包括一入出水模組10、一泵浦模組20及複數排管30。Please refer to FIGS. 1 to 4 , the present invention provides a water-cooled heat dissipation device, which mainly includes a water inlet and
入出水模組10主要包括一第一箱體11、一入水接頭12及一出水接頭13,第一箱體11大致呈一矩形狀,在第一箱體11內部設有一分隔板111,以將第一箱體11內部分隔出一入水腔室112和一出水腔室113,出水腔室113和入水腔室112互不相通。入水接頭12連通入水腔室112,出水接頭13連通出水腔室113,在入水腔室112和出水腔室113側邊分別設有複數第一槽孔114。The water inlet and
在一實施例中,於第一箱體11設有一注水接頭14,此注水接頭14是鄰近於入水接頭12配置且連通前述入水腔室112,以作為補水之需求。In one embodiment, a
泵浦模組20與前述入出水模組10間隔設置且彼此相互對應,且泵浦模組20主要包括一第二箱體21及設置在第二箱體21內部的至少一泵浦22,第二箱體21的形狀大致與第一箱體11的形狀相同或相近,於第二箱體21朝向第一箱體11的側邊設有複數第二槽孔211,每一第二槽孔211是對應於前述每一第一槽孔114配設。The
在一實施例中,泵浦22包括一第一泵浦221及一第二泵浦222,第一泵浦221和第二泵浦222是並列配置且分別形成在各第二槽孔211的上方,在第二箱體21內部具有一進水腔212、一輸水腔213及一排水腔214,其中進水腔212與一部分的第二槽孔211連通,排水腔214與另一部分的第二槽孔211連通。第一泵浦221配置在進水腔212和輸水腔213之間,第二泵浦222則配置在輸水腔213和排水腔214之間,在進水腔212設有連通第一泵浦221的一進水孔215,於輸水腔213設有連通第一泵浦221的一第一輸水孔216及連通第二泵浦222的一第二輸水孔217,於排水腔214則設有連通第二泵浦222的一排水孔218。In one embodiment, the
各排管30大致呈一扁平狀,每一排管30的兩端分別連接其中之一第一槽孔114和其中之一第二槽孔211。Each row of
在一實施例中,於入水腔室112和出水腔室113內分別設有一擋板115,各排管30的一端在插接第一槽孔114後是通過各擋板115予以止擋。In one embodiment, a
在一實施例中,本新型水冷式散熱裝置還包括複數散熱片40,各散熱片40是呈一波浪狀,每一散熱片40介於任兩相鄰的排管30之間且與各排管30熱接觸。In one embodiment, the novel water-cooled heat dissipation device further includes a plurality of cooling fins 40, each
在一實施例中,本新型水冷式散熱裝置還包括一風扇組件50,其是由兩個風扇單元所組成,此風扇組件50是設置在各排管30和各散熱片40上方,並且介於入出水模組10和泵浦模組20之間,藉以對各排管30和各散熱片40提供強制氣流來散逸熱量。
In one embodiment, the new water-cooled heat dissipation device of the present invention also includes a
請續閱圖5至圖10所示,使用時,利用水等工作流體從入水接頭12進入,依序流經入水腔室112、一部分的排管30內部及進水腔212,通過第一泵浦221的葉輪將水從進水孔215汲入第一泵浦221內,並通過第一泵浦221的葉輪將水從第一輸水孔216汲出進入輸水腔213中;其次,通過第二泵浦222的葉輪將前述水從第二輸水孔217汲入第二泵浦222內,再通過第二泵浦222的葉輪將水從排水孔218汲出進入排水腔214中;繼之,水再經由另一部分的排管30內部而到達出水腔室113,最後,則從出水接頭13排出。其中前述水在流經各排管30內部時,通過各散熱片40與各排管30的熱傳導以及風扇組件50所產生的強制氣流來對各散熱片40與各排管30做散熱,進而提升整體的散熱效能。Please continue to refer to Figures 5 to 10. During use, water and other working fluids are used to enter from the
綜上所述,本新型水冷式散熱裝置,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障新型創作人之權利。To sum up, the new type of water-cooled heat dissipation device can indeed achieve the expected purpose of use, and solve the lack of conventional knowledge, and because it is very novel and progressive, it fully meets the requirements for new patent applications. Please file an application in accordance with the Patent Law. Please check carefully and grant the patent of this case to protect the rights of new creators.
10:入出水模組 11:第一箱體 111:分隔板 112:入水腔室 113:出水腔室 114:第一槽孔 115:擋板 12:入水接頭 13:出水接頭 14:注水接頭 20:泵浦模組 21:第二箱體 211:第二槽孔 212:進水腔 213:輸水腔 214:排水腔 215:進水孔 216:第一輸水孔 217:第二輸水孔 218:排水孔 22:泵浦 221:第一泵浦 222:第二泵浦 30:排管 40:散熱片 50:風扇組件 10: Water entry and exit module 11: The first box 111: Partition board 112: Water entry chamber 113: Outlet chamber 114: The first slot 115: Baffle 12: Water inlet connector 13: Outlet connector 14: Water injection joint 20: Pump module 21: The second box 211: Second slot 212: water inlet cavity 213: water delivery cavity 214: drainage cavity 215: water inlet hole 216: The first water delivery hole 217: The second water delivery hole 218: drainage hole 22: Pump 221: The first pump 222:Second pump 30: row pipe 40: heat sink 50: Fan assembly
圖1 係本新型水冷式散熱裝置立體外觀圖。Fig. 1 is a perspective view of the new water-cooled heat sink.
圖2 係本新型水冷式散熱裝置組合透視圖。Fig. 2 is a combined perspective view of the new water-cooled heat sink.
圖3 係本新型之入出水模組示意圖。Figure 3 is a schematic diagram of the water inlet and outlet module of this new model.
圖4 係本新型之泵浦模組示意圖。Figure 4 is a schematic diagram of the pump module of the present invention.
圖5 係本新型水冷式散熱裝置使用狀態剖視圖(一)。Fig. 5 is a sectional view (1) of the use state of the new water-cooled heat sink.
圖6 係圖5之局部區域放大圖。Fig. 6 is an enlarged view of a local area of Fig. 5 .
圖7 係本新型水冷式散熱裝置使用狀態剖視圖(二)。Fig. 7 is a sectional view (2) of the use state of the new water-cooled heat sink.
圖8 係本新型水冷式散熱裝置使用狀態剖視圖(三)。Fig. 8 is a sectional view (3) of the use state of the new water-cooled heat sink.
圖9 係本新型水冷式散熱裝置使用狀態剖視圖(四)。Fig. 9 is a sectional view (four) of the use state of the new water-cooled heat sink.
圖10 係本新型水冷式散熱裝置使用狀態剖視圖(五)。Fig. 10 is a sectional view (5) of the use state of the new water-cooled heat sink.
10:入出水模組 10: Water entry and exit module
11:第一箱體 11: The first box
12:入水接頭 12: Water inlet connector
13:出水接頭 13: Outlet connector
14:注水接頭 14: Water injection joint
20:泵浦模組 20: Pump module
21:第二箱體 21: The second box
22:泵浦 22: Pump
221:第一泵浦 221: The first pump
222:第二泵浦 222:Second pump
30:排管 30: row pipe
40:散熱片 40: heat sink
50:風扇組件 50: Fan assembly
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111208276U TWM633531U (en) | 2022-08-01 | 2022-08-01 | Water-cooling type heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111208276U TWM633531U (en) | 2022-08-01 | 2022-08-01 | Water-cooling type heat sink device |
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| Publication Number | Publication Date |
|---|---|
| TWM633531U true TWM633531U (en) | 2022-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111208276U TWM633531U (en) | 2022-08-01 | 2022-08-01 | Water-cooling type heat sink device |
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| TW (1) | TWM633531U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118775296A (en) * | 2024-06-25 | 2024-10-15 | 北京市九州风神科技股份有限公司 | Double-pump serial water-cooling heat dissipation device |
| TWI884589B (en) * | 2023-11-20 | 2025-05-21 | 建準電機工業股份有限公司 | Liquid driven module |
-
2022
- 2022-08-01 TW TW111208276U patent/TWM633531U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI884589B (en) * | 2023-11-20 | 2025-05-21 | 建準電機工業股份有限公司 | Liquid driven module |
| CN118775296A (en) * | 2024-06-25 | 2024-10-15 | 北京市九州风神科技股份有限公司 | Double-pump serial water-cooling heat dissipation device |
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| GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |