TWM631923U - Bonding mechanism for warped substrates - Google Patents

Abstract

The new type is a bonding mechanism suitable for warping substrates, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier and a plurality of flattening devices. The first cavity is used for connecting with the second cavity, and a closed space is formed between the two. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The lamination unit faces the stage and is used for bonding the substrates placed on the stage. The flattening device is arranged on the stage, and includes a plurality of flattening units and a plurality of telescopic rotating motors, wherein the flattening units are located around the substrate. The telescopic rotation motor is connected to drive the flattening unit to rotate and lift, and the flattening unit flattens the substrate placed on the stage to improve the accuracy of aligning the substrate.

Description

Bonding mechanism for warped substrates

The new model relates to a bonding mechanism suitable for warping substrates, which mainly flattens the substrates placed on the carrier through a flattening unit, so as to improve the accuracy of aligning the substrates.

The development of integrated circuit technology has matured, and electronic products are currently developing towards the trend of light, thin, short, high performance, high reliability and intelligence. The wafer in an electronic product can have a significant impact on the performance of the electronic product, which is partly related to the thickness of the wafer. For example, thinner wafers can improve thermal efficiency, increase mechanical performance, improve electrical performance, and reduce package size and weight.

In the semiconductor manufacturing process, a thinning process, a via etching process and a backside metallization process are usually performed on the backside (ie, lower surface) of the wafer. Generally speaking, a bonding process is performed before the wafer thinning process, and the bonding layer is mainly disposed between the wafer and the carrier (eg, sapphire glass), and is laminated through the lamination unit and the carrier. Wafer and carrier to complete the bonding of wafer and carrier. After the wafer thinning process is completed, a debonding process is performed to separate the wafer from the carrier.

However, the expansion coefficients of the material layers of the wafer are different, so the wafer is often subject to warpage after a high temperature process. In addition, each wafer may have different warpage shapes, such as saddle-shaped, hill-shaped protrusions, etc., which is not conducive to the subsequent alignment of stacked wafers in the bonding process, and is prone to inaccurate alignment situation.

In order to solve the problems faced by the prior art, the present invention proposes a novel bonding mechanism suitable for warped substrates, which can flatten the warped substrates placed on the bearing surface of the carrier through a plurality of flattening devices, so as to reduce the warped substrates The warped substrate is flattened, and then the flattened substrate is aligned to improve the accuracy of alignment of the warped substrate.

An object of the present invention is to provide a bonding mechanism suitable for warping substrates, which mainly includes a first cavity, a second cavity, a pressing unit, a stage, and a plurality of flattening devices, wherein the first cavity A cavity is used to connect the second cavity and form a closed space therebetween.

A plurality of flattening devices are arranged on the stage, and include a telescopic rotating motor and a flattening unit, wherein the flattening unit is arranged around the substrate. The telescopic rotary motor is connected to and drives the flattening unit to lift or rotate relative to the bearing surface of the carrier.

In practical application, the substrate can be placed on the bearing surface of the stage, and the telescopic rotation motor will drive the elongated flattening unit to rotate, so that part of the flattening unit is located above the substrate. When the telescopic rotary motor drives the flattening unit to rotate, there is a gap between the flattening unit and the base plate, so as to avoid the base plate being worn during the rotation. The telescopic rotation motor will drive the flattening unit to retract and approach the substrate to flatten the warped substrate, and then align the substrate through a plurality of alignment units.

In the process of aligning the substrate by the alignment unit, the flattening unit will continue to press the substrate and keep the substrate flat, so that the alignment unit can align the flat substrate to improve the accuracy of the alignment of the substrate.

An object of the present invention is to provide a bonding mechanism suitable for warping substrates, mainly including a plurality of flattening devices, a plurality of alignment units and a plurality of air extraction lines on the bearing surface of the carrier. The suction line communicates with the bearing surface of the stage and is located below the substrate to absorb the warped substrate. The flattening device and the alignment unit are located around the substrate, wherein the flattening unit lifts and rotates relative to the substrate to flatten the warped substrate. The alignment unit is close to the substrate along the radial direction of the bearing surface to align the flattened substrate.

In order to achieve the above purpose, the present invention proposes a bonding mechanism suitable for warping substrates, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the first cavity Two cavities, forming a closed space between the first cavity and the second cavity; a pressing unit, connected to the first cavity, and located in the closed space; a carrier, connected to the second cavity, located in the closed space In a closed space, the carrier includes a bearing surface facing the pressing unit, wherein the bearing surface includes a placing area for bearing a first substrate, and placing a second substrate on the first substrate; and a plurality of flattening devices, including: A plurality of flattening units are located around the placement area of the carrier; a plurality of telescopic rotary motors are connected to the flattening unit and drive the flattening unit to lift and swing relative to the bearing surface of the carrier, so that the flattening unit flattens the placement area on the first substrate.

In at least one embodiment of the present invention, a plurality of air extraction lines are provided on the carrier and communicate with the placement area of the carrier, wherein the plurality of air extraction lines are used to form negative pressure to adsorb the first substrate placed in the placement area. .

In at least one embodiment of the present invention, an air extraction device and a plurality of valves are included, wherein the air extraction device is connected to a plurality of air extraction pipelines, so that the air extraction pipelines connected to the placement area form a negative pressure, and the plurality of valves are respectively connected to a plurality of air extraction pipelines. A suction line is used to switch whether a plurality of suction lines generate negative pressure.

In at least one embodiment of the present invention, a plurality of rod bodies pass through the carrier, a plurality of telescopic and rotating motors are located outside the closed space, and are respectively connected to a plurality of flattening units through the plurality of rods to drive the flattening units relative to the load. The bearing surface of the table lifts or swings.

In at least one embodiment of the present invention, a plurality of alignment units are provided on the bearing surface of the carrier and surround the placement area. The alignment units are used for alignment of the first substrate and the second substrate. The alignment unit During the process of aligning the first substrate or the second substrate, the air suction line will not adsorb the first substrate.

In at least one embodiment of the present invention, the telescopic rotary motor is used to drive the flattening unit to swing at a first position and a second position, the flattening unit operating in the first position is located outside the placement area, and the flattening unit operating in the first position is located outside the placement area. The flattening unit in the second position will enter the placement area.

In at least one embodiment of the present invention, the telescopic rotary motor is used to drive the flattening unit to move at a first height and a second height, and the first height is higher than the second height.

In at least one embodiment of the present invention, there is a gap between the flattening unit operating at the first height and the bearing surface of the stage, and the gap is larger than the thickness of the first substrate, and the flattening unit operating at the second height is The first substrate placed on the carrier surface will be contacted and flattened.

In at least one embodiment of the present invention, a plurality of distance measuring units are disposed on the pressing unit, and are used to measure the distance between each distance measuring unit and the first substrate, so as to determine whether the distance measuring unit is placed on the bearing surface of the carrier. whether the first substrate is warped.

In at least one embodiment of the present invention, the distance measuring unit is a laser distance meter.

Please refer to FIG. 1 and FIG. 2 , which are a three-dimensional schematic view and a cross-sectional schematic view of an embodiment of a new bonding mechanism suitable for warped substrates, respectively. As shown in the figure, the bonding mechanism 10 suitable for warping substrates includes a first cavity 111, a second cavity 113, a pressing unit 13, a stage 15 and a plurality of flattening devices 17, wherein the first cavity 111 A cavity 111 faces the second cavity 113 , and the first cavity 111 can be displaced relative to the second cavity 113 .

As shown in FIG. 2 , the pressing unit 13 is located in the first cavity 111 and is connected to the first cavity 111 . The carrier 15 is located in the second cavity 113 and connected to the second cavity 113 . The bearing surface 151 of the stage 15 faces the pressing unit 13 . After the first cavity 111 is connected to the second cavity 113 , a closed space 112 is formed therebetween, and the pressing unit 13 and the stage 15 are located in the closed space 112 .

As shown in FIG. 1 , in an embodiment of the present invention, the first cavity 111 can be connected to a cavity driver 191 , wherein the cavity driver 191 is located outside the closed space 112 and is connected to the first cavity 111 . The cavity driver 191 is used to drive the displacement of the first cavity 111 relative to the second cavity 113 . For example, the cavity driver 191 may be a linear actuator.

In addition, the pressing unit driver 193 is located outside the closed space 112 and is connected to the pressing unit 13 . After the alignment of the first substrate 121 and the second substrate 123 is completed, the pressing unit driver 193 can drive the pressing unit 13 to approach the bearing surface 151 of the carrier 15 and press the first substrate 121 and the second substrate carried by the carrier 15 Two substrates 123 to complete the bonding of the first substrate 121 and the second substrate 123 .

As shown in FIG. 2 , the first cavity 111 or the second cavity 113 can be provided with an air extraction motor 16 , wherein the air extraction motor 16 is fluidly connected to the enclosed space 112 and used to extract the gas in the enclosed space 112 to reduce the enclosed space The pressure in 112 keeps the closed space 112 in a vacuum or low pressure state.

As shown in FIG. 3 , the carrying surface 151 of the stage 15 is used to carry a first substrate 121 and a second substrate 123 that are stacked, for example, the first substrate 121 is a carrying substrate, and the second substrate 123 is a wafer, wherein the first substrate 121 is a carrier substrate, and the second substrate 123 is a wafer. An adhesive layer is disposed between a substrate 121 and the second substrate 123 for bonding the first substrate 121 and the second substrate 123 . In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone a semiconductor process.

The pressing unit 13 includes a pressing plate 131 , a connecting plate 133 and a plurality of fixing rods 135 , wherein the connecting plate 133 is connected to the pressing plate 131 through the fixing rods 135 . The pressing plate 131 faces the bearing surface 151 of the carrier 15 and is used for pressing the first substrate 121 and the second substrate 123 placed on the carrier 15 . The pressing unit 13 including the pressing plate 131 , the connecting plate 133 and the fixing rod body 135 is only an embodiment of the present invention and is not intended to limit the scope of the rights of the present invention.

In an embodiment of the present invention, a first heating unit 152 may be arranged in the carrier 15 , and a second heating unit 132 may be arranged in the pressing unit 13 . The first heating unit 152 and the second heating unit 132 can heat the first substrate 121 , the second substrate 123 and the adhesive layer between the pressing unit 13 and the stage 15 during the bonding process, so that the first substrate 121 and the The second substrates 123 are bonded to each other.

As shown in FIG. 2 and FIG. 4 , the flattening device 17 includes a telescopic rotating motor 171 and a flattening unit 173 , wherein the telescopic rotating motor 171 is connected to and drives the flattening unit 173 to move up and down relative to the bearing surface 151 of the stage 15 and/or or swing.

In an embodiment of the present invention, the telescopic rotation motor 171 may include a linear actuator 1711 and a rotation motor 1713 , wherein the linear actuator 1711 is connected to the flattening unit 173 via the rotation motor 1713 . The linear actuator 1711 can be used to drive the rotation motor 1713 and the flattening unit 173 to move up and down relative to the bearing surface 151 of the carrier 15 , and the rotation motor 1713 is used to drive the flattening unit 173 to swing relative to the bearing surface 151 of the carrier 15 . .

The telescopic rotation motor 171 is located outside the closed space 112 , and the flattening unit 173 is located inside the closed space 112 . In an embodiment of the present invention, the telescopic rotation motor 171 can be connected through a rod body 175 to drive the flattening unit 173 to lift or swing, wherein the rod body 175 passes through the second cavity 113 and/or the carrier 15 . In addition, a shaft seal and/or a bearing may be arranged between the rod body 175 and the second cavity 113 and/or the carrier 15, so that the rod body 175 can rotate and extend relative to the second cavity 113 and/or the carrier 15, and The low pressure and vacuum state in the closed space 112 are maintained.

The flattening unit 173 can be disposed on the bearing surface 151 of the carrier 15 , wherein the flattening unit 173 can be a plate with any geometric shape and has a flat lower surface. In practical application, the flat lower surface of the flattening unit 173 can flatten the first substrate 121 placed on the bearing surface 151 of the stage 15 to flatten the warped first substrate 121 .

As shown in FIG. 5 , a plurality of flattening devices 17 are located in the closed space 112 and are arranged on the bearing surface 151 of the stage 15 . In an embodiment of the present invention, a placement area 153 may be defined on the bearing surface 151 of the stage 15 , wherein the area and/or shape of the placement area 153 is approximately similar to the first substrate 121 and smaller than or equal to the bearing surface 151 .

When the first substrate 121 is placed on the bearing surface 151 of the stage 15 , the first substrate 121 is located in the placement area 153 , and the flattening units 173 are arranged around the placement area 153 .

As shown in FIG. 5 and FIG. 6 , the telescopic rotation motor 171 can drive the flattening unit 173 to swing along the direction parallel to the bearing surface 151 of the stage 15 . In an embodiment of the present invention, the telescopic rotation motor 171 can drive the flattening unit 173 to swing between a first position and a second position.

Specifically, the flattening unit 173 operating at the first position is located outside the placement area 153 of the stage 15 without overlapping or interfering with the first substrate 121 in the placement area 153 , as shown in FIG. 5 . The flattening unit 173 operating at the second position enters the placement area 153 of the stage 15 and is positioned above the first substrate 121 in the placement area 153 , as shown in FIG. 6 .

As shown in FIG. 4 , during the process of placing the first substrate 121 on the bearing surface 151 of the stage 15 , the flattening unit 173 is located at the first position. The flattening unit 173 does not interfere with the placement area 153 of the carrier surface 151 , so that the first substrate 121 can be placed in the placement area 153 of the carrier table 15 through the robot arm.

As shown in FIG. 7 and FIG. 8 , the telescopic rotation motor 171 can drive the flattening unit 173 to move along the axial direction of the parallel bearing surface 151 and adjust the distance between the flattening unit 173 and the bearing surface 151 and/or the first substrate 121 the distance. In an embodiment of the present invention, the telescopic rotation motor 171 can drive the flattening unit 173 to move between a first height and a second height, wherein the first height is higher than the second height, such as the flattening unit located at the second height 173 is closer to the bearing surface 151 of the stage 15 than the first height.

As shown in FIG. 7 , the telescopic rotation motor 171 drives the flattening unit 173 to axially displace along the bearing surface 151 , so that the flattening unit 173 is away from the bearing surface 151 of the carrier 15 and operates at the first height. There is a distance G between the flattening unit 173 and the bearing surface 151 , wherein the distance G is greater than the thickness of the first substrate 121 . Then, the telescopic rotation motor 171 drives the flattening unit 173 to swing along the direction parallel to the bearing surface 151 , so that part of the flattening unit 173 is located above the placement area 153 and the first substrate 121 .

As shown in FIG. 8 , the telescopic rotation motor 171 drives the flattening unit 173 to axially displace along the bearing surface 151 , so that the flattening unit 173 approaches the bearing surface 151 of the carrier platform 15 and operates at the second height. The flattening unit 173 contacts and flattens the first substrate 121 placed on the placement area 153 of the carrying surface 151 , so that the first substrate 121 is flatly placed on the carrying surface 151 .

As shown in FIG. 5 and FIG. 6 , a plurality of alignment units 14 can be disposed on the bearing surface 151 of the carrier 15 , and the alignment units 14 surround the placement area 153 of the carrier 15 and can be close to or far away from the placement area 153 and /or the first substrate 121 to align the first substrate 121 and/or the second substrate 123 . For example, the alignment unit 14 can be rod-shaped and can be raised and lowered relative to the bearing surface 151 of the carrier 15 . After the alignment unit 14 protrudes from the bearing surface 151 , it can approach the placement area 153 along the radial direction of the bearing surface 151 , The alignment unit 14 will contact and align the first substrate 121 during the displacement process, so as to locate the first substrate 121 at a fixed position in the placement area 153 .

During the process of aligning the first substrate 121 by the alignment unit 14 , the flattening unit 173 will continue to contact and flatten the first substrate 121 , thereby improving the accuracy of the alignment unit 14 in aligning the first substrate 121 .

In an embodiment of the present invention, as shown in FIG. 2 and FIG. 3 , a plurality of distance measuring units 18 may be disposed on the pressing unit 13 . For example, the distance measuring units 18 may be 18 is used to project the measuring beam onto the first substrate 121 placed on the bearing surface 151 of the stage 15, and measure the distance between the first substrate 121 and each distance measuring unit 18 to determine the first substrate 121 Is it warped. In different embodiments, the pressing unit 13 can also be disposed on the stage 15 , and the distance between the pressing unit 13 and the first substrate 121 is measured from the lower surface of the first substrate 121 .

Specifically, if the distances between the distance measuring units 18 and the first substrate 121 are similar, it can be determined that the first substrate 121 is not warped, and the first substrate 121 can be aligned directly through the alignment unit 14 . Then, the second substrate 123 is placed on the first substrate 121 , and the first substrate 121 and the second substrate 123 are bonded by the pressing unit 13 without the need to flatten the first substrate 121 by the flattening device 17 .

Conversely, if the distance difference between each distance measuring unit 18 and the first substrate 121 is greater than a threshold value, it means that the first substrate 121 is warped, and the first substrate 121 needs to be flattened by the flattening device 17 , for example The flattening steps of FIGS. 4 , 7 and 8 are carried out.

After the flattening and alignment of the first substrate 121 is completed, the flattening unit 173 can be separated from the first substrate 121 and the placement area 153 , as shown in FIG. 6 and FIG. 4 . When the flattening unit 173 leaves the first substrate 121 and the placement area 153 , the telescopic and rotating motor 171 will extend and drive the flattening unit 173 to leave the first substrate 121 along the axial direction of the bearing surface 151 , and then the telescopic and rotating motor 171 will The flattening unit 173 is driven to swing, so that the flattening unit 173 is separated from the top of the first substrate 121 and/or the placement area 153 .

After the alignment step of the first substrate 121 is completed, the second substrate 123 can be placed on the first substrate 121 , the second substrate 123 can be aligned with the alignment unit 14 , and the first substrate 121 can be bonded by the pressing unit 13 and the second substrate 123 .

In the new drawings, the rod body 175 of the flattening device 17 or the telescopic rotary motor 171 will pass through the second cavity 113 and the carrier 15 and connect to the flattening unit 173 disposed on the bearing surface 151 of the carrier 15 . . In another embodiment of the present invention, the rod body 175 , the telescopic rotation motor 171 and/or the flattening unit 173 can be arranged around the stage 15 , and the telescopic rotation motor 171 and/or the rod body 175 only pass through the second cavity 113 without passing through stage 15 .

At this time, the flattening unit 173 operating at the first position is located outside the carrying surface 151 and/or the placement area 153 of the stage 15 without overlapping or interfering with the carrying surface 151 and the first substrate 121 . The flattening unit 173 operating at the second position will enter the bearing surface 151 and/or the placement area 153 of the carrier 15 and be positioned above the carrier surface 151 and the first substrate 121 to flatten the carrier surface 151 of the carrier 15 . on the first substrate 121 .

As shown in FIG. 5 , FIG. 6 and FIG. 9 , the carrier 15 may include a plurality of air extraction lines 155 , wherein the air extraction lines 155 are disposed on the carrier 15 , for example, pass through the carrier 15 , and one end of the air extraction lines 155 is connected to the carrier The bearing surface 151 and/or the placement area 153 of the table 15 . The air extraction line 155 can be connected to an air extraction device 157, such as an air extraction motor. When the air extraction device 157 is pumping, the air extraction device 157 connected to the bearing surface 151 and/or the placement area 153 will form a negative pressure, so as to adsorb and place the air in the suction device 157. The first substrate 121 of the placement area 153 of the stage 15 .

In an embodiment of the present invention, each suction line 155 can generate negative pressure at the same time, and adsorb the first substrate 121 in the placement area 153 . In an embodiment of the present invention, each of the air extraction lines 155 can be connected to a valve 154, wherein the valves 154 are used to switch whether each air extraction line 155 generates negative pressure, and can control the air extraction lines 155 to generate negative pressure in sequence, For example, the suction line 155 located on the inner side first generates negative pressure to adsorb the inner side of the first substrate 121, and then along the direction from the center of the placement area 153 to the edge, the other suction lines 155 are sequentially controlled to generate negative pressure to adsorb the first substrate 155. An outer side of the substrate 121 .

Specifically, the flattening unit 173 is mainly used to flatten the side or outer edge of the first substrate 121 , and the negative pressure generated by the air suction line 155 can be used to adsorb the inner side of the first substrate 121 . The flatness of the flattened first substrate 121 can be further improved through the combination of the flattening unit 173 and the air extraction line 155 , and the alignment accuracy of the first substrate 121 can be improved. In addition, during the alignment of the first substrate 121 and/or the second substrate 123 by the alignment unit 14, the air extraction device 157 will stop air extraction, and the air extraction line 155 will not adsorb the first substrate 121, so that the alignment is performed. The unit 14 can move or push the first substrate 121 on the bearing surface 151 of the stage 15 and perform alignment of the first substrate 121 .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included in the scope of the patent application of the present invention.

10: Bonding mechanism suitable for warped substrates 111: The first cavity 112: Confined space 113: Second cavity 121: The first substrate 123: Second substrate 13: Press unit 131: plywood 132: Second heating unit 133: Connection board 135: Fixed rod body 14: Alignment unit 15: Carrier 151: Bearing surface 152: First heating unit 153: Placement area 154: Valve 155: Exhaust line 157: Air extraction device 16: Air extraction motor 17: Flattening device 171: Telescopic rotary motor 1711: Linear Actuator 1713: Turn the motor 173: Flattening Unit 175: Rod body 18: Distance measurement unit 191: Cavity driver 193: Press unit driver G: Spacing

[FIG. 1] is a three-dimensional schematic diagram of an embodiment of a new bonding mechanism suitable for warped substrates.

2 is a schematic cross-sectional view of an embodiment of a bonding mechanism suitable for warped substrates of the new type.

FIG. 3 is a partial cross-sectional schematic view of another embodiment of the new bonding mechanism suitable for warped substrates.

FIG. 4 is a schematic three-dimensional cross-sectional view of an embodiment of a stage and a flattening device for a bonding mechanism suitable for warped substrates.

FIG. 5 is a plan view of an embodiment of a stage and a flattening unit of a bonding mechanism suitable for warped substrates.

FIG. 6 is a top view of another embodiment of a stage and a flattening unit of a bonding mechanism suitable for warped substrates of the new type.

FIG. 7 is a schematic three-dimensional cross-sectional view of another embodiment of a stage and a flattening device for a bonding mechanism suitable for warped substrates.

FIG. 8 is a schematic three-dimensional cross-sectional view of another embodiment of a stage and a flattening device for a bonding mechanism suitable for warped substrates.

FIG. 9 is a schematic cross-sectional view of an embodiment of a carrier, a flattening device, and an air extraction line of the new bonding mechanism suitable for warped substrates.

10: Bonding mechanism suitable for warped substrates

111: The first cavity

112: Confined space

113: Second cavity

13: Press unit

15: Carrier

16: Air extraction motor

17: Flattening device

18: Distance measurement unit

Claims (10)

A bonding mechanism suitable for warped substrates, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a closed space between the first cavity and the second cavity; an air extraction motor, connected to the enclosed space, and used to extract the gas in the enclosed space; a pressing unit connected to the first cavity and located in the closed space; a carrier, connected to the second cavity, and located in the closed space, the carrier includes a bearing surface facing the pressing unit, wherein the bearing surface includes a placement area for bearing a first substrate, and is placed on the first substrate A second substrate is placed on a substrate; and A plurality of flattening devices, including: a plurality of flattening units located around the placement area of the carrier; A plurality of telescopic and rotating motors are connected to the flattening unit, and drive the flattening unit to lift and swing relative to the bearing surface of the carrier, so that the flattening unit flattens the first substrate on the placement area. The bonding mechanism suitable for warped substrates as claimed in claim 1, comprising a plurality of air extraction lines disposed on the carrier and communicating with the placement area of the carrier, wherein the plurality of air extraction lines are used to form a negative pressing to adsorb the first substrate on the placement area. The bonding mechanism suitable for warped substrates as claimed in claim 2, comprising an air extraction device and a plurality of valves, wherein the air extraction device is connected to the plurality of air extraction pipelines so as to communicate with the air extraction pipelines in the placement area Negative pressure is formed, and the plurality of valves are respectively connected to the plurality of suction lines, and are used to switch whether the plurality of suction lines generate negative pressure. The bonding mechanism suitable for warped substrates according to claim 2, comprising a plurality of alignment units disposed on the bearing surface of the carrier and surrounding the placement area, the alignment units are used for alignment The first substrate and the second substrate are positioned, and the air suction line will not adsorb the first substrate during the process of positioning the first substrate or the second substrate by the positioning unit. The bonding mechanism suitable for warping substrates as claimed in claim 1, comprising a plurality of rod bodies passing through the carrier, a plurality of telescopic and rotating motors located outside the closed space, and respectively connected with the plurality of rod bodies through the plurality of rod bodies A plurality of flattening units are used to drive the flattening units to lift or swing relative to the bearing surface of the carrier. The bonding mechanism suitable for warping substrates as claimed in claim 1, wherein the telescopic rotation motor is used to drive the flattening unit to swing at a first position and a second position, and operate the pressing force at the first position. The flat unit is located outside the placement area, and the flattening unit operating in the second position enters the placement area. The bonding mechanism suitable for warping substrates as claimed in claim 6, wherein the telescopic rotation motor is used to drive the flattening unit to move at a first height and a second height, the first height being higher than the second height high. The bonding mechanism suitable for warped substrates according to claim 7, wherein there is a distance between the flattening unit operating at the first height and the bearing surface of the stage, and the distance is larger than the first substrate thickness, and the flattening unit operating at the second height contacts and flattens the first substrate placed on the carrying surface. The bonding mechanism suitable for warped substrates as claimed in claim 1, comprising a plurality of distance measuring units disposed on the pressing unit and used to measure the distance between each of the distance measuring units and the first substrate , to judge whether the first substrate placed on the carrying surface of the stage is warped. The bonding mechanism suitable for warped substrates according to claim 9, wherein the distance measuring unit is a laser range finder.

Images