TWM631264U - Integrated wafer debonding and cleaning apparatus - Google Patents

Abstract

The present application provides an integrated wafer debonding and cleaning apparatus. The integrated wafer debonding and cleaning equipment includes an input port, a debonding module, a wafer cleaning device and a transfer device. The input port is configured for inputting the substrate to be processed into the inside of the integrated wafer debonding and cleaning equipment. The substrate to be processed includes a bonded wafer and a carrier. The debonding module is configured to debond and separate the substrate to be processed into the wafer and the carrier which are independent of each other. The wafer cleaning apparatus is configured to clean the wafers. The transfer device is configured to transfer the substrate to be processed, the wafer and the carrier. The transfer device runs between the input port, the debonding module, and the wafer cleaning device.

Description

Integrated wafer debonding and cleaning equipment

The present application relates to a wafer debonding device, in particular to an integrated wafer debonding and cleaning device.

With the introduction of new consumer electronic products, high-end chips such as 5G communication and CPU/GPU are developing towards high frequency, high speed, multi-function, high performance, small size and high reliability. In order to meet the requirements of wafer miniaturization, multi-functionalization and intelligence, the development of Moore's Law has reached the physical limit. Packaging technology will play a role in assisting the continued development of Moore's Law in the manufacture of integrated circuit chips. The development of advanced packaging technology is mainly focused on 3D-IC stacked packaging, which not only reduces the package size, but also improves circuit performance, reduces parasitic effects and time delays. At present, integrated circuits have two important characteristics. One is that the front-end IC manufacturing is close to the physical limit, and the development of Moore's Law is slowing down; the other is the diversification of microelectronics products, mobile computing and cloud data centers, Internet of Things, artificial intelligence, 5G communication, etc. A hundred flowers bloom.

In order to meet the needs of multi-functional integrated circuits and thinner products, and further promote the development of new technologies such as 3D-IC, system-in-package, and heterogeneous integration, wafer thinning and thin wafer holding technology are becoming more and more important. Therefore, temporary bonding and debonding technology has become a key process in advanced manufacturing and packaging. As the chip size of advanced packaging shrinks, the wafer is getting thinner and thinner. When the thickness of the wafer is less than 200μm, warpage or even chipping is prone to occur.

In order to solve the problems of the prior art, the purpose of the present application is to provide an integrated wafer debonding and cleaning equipment, which integrates the debonding module and the wafer cleaning module in the same equipment to form a continuous process.

In order to achieve the above object, the present application provides an integrated wafer debonding and cleaning equipment, comprising: an input port configured to input a substrate to be processed into the integrated wafer debonding and cleaning equipment, wherein the substrate to be processed It includes a bonded wafer and a carrier board; a debonding module configured to debond and separate the substrate to be processed into the wafer and the carrier board that are independent of each other; a wafer cleaning device configured to clean the wafer circle; a first output port configured to output the cleaned wafer to the outside of the integrated wafer debonding and cleaning equipment; a second output port configured to output the carrier to the integrated wafer The outside of the debonding and cleaning equipment; a conveying device configured to convey the substrate to be processed, the wafer and the carrier, wherein the conveying device operates on the input port, the debonding module, the wafer cleaning device, and the first between an output port and the second output port.

In some embodiments, the debonding module includes a moving stage and a debonding area, and in the debonding area, the debonding module further includes a debonding device, and when the conveying device places the substrate to be processed on the moving carrier The debonding device is configured to debond the substrate to be processed when the mobile stage is on the stage and the mobile stage is located in the debonding area.

In some embodiments, in the debonding region, the debonding module further includes a first optical detection device, and before debonding the substrate to be processed, the first optical detection device is configured to detect the substrate to be processed.

In some embodiments, when the debonding device debonds the substrate to be processed, the substrate to be processed is disposed between the moving stage and the debonding device, and the carrier of the substrate to be processed is located close to the debonding device side, and the wafer is located on the side away from the debonding device.

In some embodiments, the debonding module further includes a separation area, the moving stage moves between the debonding area and the separation area, and in the separation area, the debonding module further includes a separation device, and when the When the moving stage moves the debonded substrate to be processed to the separation area, the separation device is configured to separate the carrier of the substrate to be processed from the wafer.

In some embodiments, in the separation area, the debonding module further includes a second optical inspection device, and after the separation device separates the carrier from the wafer, the second optical inspection device is configured to inspect the carrier board.

In some embodiments, the debonding module further includes a temporary storage area configured to place the separated carrier board.

In some embodiments, the wafer cleaning apparatus includes a first cavity and a second cavity, and the first cavity and the second cavity are respectively configured to clean two opposite surfaces of the wafer.

In some embodiments, the integrated wafer debonding and cleaning apparatus further includes a positioning device and a turning mechanism, the positioning device is configured to perform center point positioning of the substrate to be processed, and the turning mechanism is configured to perform the processing on the substrate. The substrate or the wafer is turned over.

Compared with the prior art, the present application directly performs a double-sided cleaning process on the debonded wafer to form a continuous process, thereby saving process time and improving productivity. Furthermore, the online optical inspection device is used to monitor whether the carrier board is cracked or damaged in real time, so as to quickly remove the carrier board and eliminate the process disturbance. Therefore, the moving stage of the debonding module can be maintained clean and improve operational continuity, as well as keep the debonding module operating smoothly.

In order to make the above-mentioned and other objects, features and advantages of the present disclosure more obvious and easy to understand, the preferred embodiments of the present disclosure will be exemplified below and described in detail in conjunction with the accompanying drawings.

In the thin wafer process, in order to smoothly handle the thin wafer, a temporary bonding technique must be used to bond the thin wafer to a thick carrier. , to provide sufficient mechanical support and ensure that the component wafers can successfully complete subsequent processing processes, such as lithography, etching, passivation, sputtering, electroplating and reflow. After the above process is completed, the wafer and the carrier are de-bonded to separate the wafer and the carrier.

The surface of the debonded wafer has foreign matter such as adhesive residue. In the prior art, the wafer is transferred to the downstream cleaning equipment through the transfer port of the debonding module. However, the transfer port where the wafer is temporarily placed is easily contaminated by adhesive residue from the wafer. Furthermore, the long-stroke transportation from the debonding module to the cleaning equipment will cause the wafer to be easily adhered to additional foreign matter, thereby making it difficult to clean the wafer. In order to avoid such problems as above, the present application provides an integrated wafer debonding and cleaning apparatus and a wafer debonding and cleaning method.

Please refer to FIG. 1 , which shows a schematic diagram of an integrated wafer debonding and cleaning apparatus according to an embodiment of the present application. The integrated wafer debonding and cleaning equipment 10 includes an in and out area 110 , a transfer device 120 , a positioning device 130 , a turning mechanism 140 , a debonding module 150 , and a wafer cleaning device 160 . The integrated wafer debonding and cleaning equipment 10 is an independent and closed workstation in a single area, and the conveying device 120 is within the scope of the workstation, and runs in the in-out area 110 and the positioning device through the track inside the integrated wafer debonding and cleaning equipment 10 130 , between the flipping mechanism 140 , the debonding module 150 , and the wafer cleaning device 160 .

As shown in FIG. 1 , the inbound and outbound area 110 includes at least 3 input/output ports, wherein the at least 3 input/output ports can be selectively designated as the input port 111 , the first output port 112 and the second output port 113 . The input port 111 is configured to input a substrate to be processed into the inside of the integrated wafer debonding and cleaning apparatus 10 . Please refer to FIG. 3A , which shows a schematic diagram of the substrate to be processed. The substrate to be processed 20 includes a bonded wafer 21 and a carrier 22 . For example, the wafer 21 and the carrier 22 can be bonded by the separation layer 23 and the adhesive layer 24 . After being processed by the integrated wafer debonding and cleaning equipment 10 , the substrate 20 to be processed is separated into independent wafers 21 and carrier plates 22 . The first output port 112 is configured to output the cleaned wafer 21 to the outside of the integrated wafer debonding and cleaning apparatus 10 . The second output port 113 is configured to output the carrier board 22 to the outside of the integrated wafer debonding and cleaning apparatus 10 .

As shown in FIG. 1 , the transfer device 120 is configured to transfer the substrate 20 to be processed, the wafer 21 and the carrier plate 22 . In addition, the conveying device 120 operates between the input port 111 , the first output port 112 and the second output port 113 , the positioning device 130 , the turning mechanism 140 , the debonding module 150 , and the wafer cleaning device 160 . In some embodiments, the delivery device 120 includes a robotic arm.

As shown in FIG. 1 , when the substrates 20 to be processed are received from the input port 111 , the substrates 20 to be processed are firstly transferred to the positioning device 130 via the transfer device 120 for center point positioning, and then the substrates 20 to be processed are turned over by the turning mechanism 140 , so that the carrier plate 22 of the substrate 20 to be processed faces upwards.

As shown in FIG. 1 , the inverted substrate 20 to be processed is transferred to the debonding module 150 . The debonding module 150 is configured to debond and separate the substrate 20 to be processed into the wafer 21 and the carrier 22 which are independent of each other.

Please refer to FIG. 1 and FIG. 2 . FIG. 2 shows a schematic diagram of a debonding module according to an embodiment of the present application. The debonding module 150 defines a debonding region R1, a separation region R2 and a temporary storage region R3. In addition, the debonding module 150 includes a moving stage 151 , a debonding device 152 , a separation device 153 , a platform 154 , a first optical detection device 155 and a second optical detection device 156 . The moving stage 151 can move between the debonding area R1 and the separation area R2. The debonding device 152 and the first optical detection device 155 are disposed in the debonding region R1. The separation device 153 can move between the separation area R2 and the temporary storage area R3. The second optical detection device 156 is provided in the separation region R2. The platform 154 is set in the temporary storage area R3.

As shown in FIGS. 1 and 2 , when the transfer device 120 places the substrate to be processed 20 on the moving stage 151 and the moving stage 151 is located in the debonding region R1 , the debonding device 152 is configured to debond the substrate to be processed 20 . At this time, the carrier 22 of the substrate 20 to be processed is located at the uppermost position. That is, when the debonding device 152 debonds the substrate to be processed 20 , the substrate to be processed 20 is disposed between the moving stage 151 and the debonding device 152 , and the carrier 22 of the substrate to be processed 20 is located close to one of the debonding devices 150 side, and the wafer 21 is located on the side away from the debonding device 152 .

In some embodiments, the debonding device 152 includes a laser head. The carrier plate 22 of the substrate 20 to be processed is irradiated by laser light to generate debonding, so that the bonding colloid loses its adhesion. In other embodiments, other types of debonding devices may also be used, which is not limited thereto. Preferably, the debonding region R1 is provided with a protective cover. The upper part of the debonding area R1 is connected to the exhaust system of the factory, and the lower part of the debonding area R1 is available for the moving stage 151 to move linearly. In the present application, since the debonding device 152 remains stationary and the substrate 20 to be processed is moved by moving the stage 151, the parameters (such as the focal length) of the debonding device 152 do not change, thereby improving the precision and stability of the process.

In some embodiments, before the substrate 20 to be processed is debonded, the first optical detection device 155 (eg, an AOI instrument) can be used to detect whether the substrate to be processed 20 is cracked. The debonding process can be performed if the substrate 20 to be processed is not cracked. If the substrate 20 to be processed is cracked, the debonding process will not be performed, and the integrated wafer debonding and cleaning equipment 10 can issue an alarm accordingly, and control the transfer device 120 to automatically take out the substrate 20 to be processed.

As shown in FIGS. 1 and 2 , when the moving stage 151 moves the debonded substrate to be processed 20 to the separation region R2 , the separating device 153 is configured to separate the carrier 22 of the substrate to be processed 20 from the wafer 21 . Specifically, after debonding, the moving stage 151 moves linearly from the debonding region R1 to the separation region R2 to perform the pulling action of the carrier 22 to separate the wafer 21 from the carrier 22 .

Please refer to FIG. 3A to FIG. 3C , which are schematic diagrams illustrating a separation process of a wafer and a substrate according to an embodiment of the present application. As shown in FIG. 3A , the substrate 20 to be processed includes a wafer 21 and a carrier 22 bonded with a separation layer 23 and an adhesive layer 24 . After the separation device 153 is moved down to contact with the substrate 20 to be processed, it is fixed to the carrier plate 22 by means of suction or clamping. As shown in FIG. 3B , the separation device 153 pulls out the carrier board 22 , so that the carrier board 22 is separated from the wafer 21 by the separation layer 23 . As shown in FIG. 3C , a second separation operation is then performed to remove the separation layer 23 and the adhesive layer 24 from the wafer 21 . Optionally, the separation layer 23 and the adhesive layer 24 can also be removed by the subsequent wafer cleaning device 160 .

In some embodiments, the separation region R2 is provided with a second optical detection device 156 (eg, an AOI instrument). The second optical detection device 156 is configured to detect whether the extracted carrier plate 22 is broken. If the carrier board 22 is not broken, the carrier board 22 is moved to the temporary storage area R3 by the separating device 153 , and the separated carrier board 22 is placed on the platform 154 . The transfer device 120 can transfer the carrier board 22 on the platform 154 to the second output port 113 . On the other hand, when the second optical detection device 156 detects that the extracted carrier board 22 is cracked, the integrated wafer debonding and cleaning equipment 10 can correspondingly issue a fault alarm, and then the fault can be eliminated by manual or automated equipment. (eg take out the broken carrier plate 22).

As shown in FIG. 1 , the wafer cleaning apparatus 160 includes a first cavity 161 and a second cavity 162 . The first cavity 161 and the second cavity 162 are respectively configured to clean two opposite surfaces of the wafer 21 . Specifically, after the wafer 21 is separated from the carrier 22 , the transfer device 120 transfers the wafer 21 to the first cavity 161 to clean the first wafer 21 with residual adhesive (separation layer 23 and adhesive layer 24 ). surface. Next, the transfer device 120 transfers the wafer 21 from the first cavity 161 to the inversion mechanism 140 . The wafer 21 is turned over using the turning mechanism 140 so that the second surface of the wafer 21 faces upward. Next, the transfer device 120 transfers the wafer 21 from the inversion mechanism 140 to the second cavity 162 to clean the second surface of the wafer. After the wafers are cleaned on both sides, the wafers 21 are transferred to the first output port 112 via the transfer device 120 for shipment.

In another aspect, the present application also provides a wafer debonding and cleaning method. The wafer debonding and cleaning method is applicable to the above-mentioned integrated wafer debonding and cleaning apparatus. As shown in FIG. 1 , the integrated wafer debonding and cleaning apparatus 10 includes a loading and unloading area 110 , a conveying device 120 , a positioning device 130 , a turning mechanism 140 , a debonding module 150 , and a wafer cleaning device 160 . The inbound and outbound area 110 includes at least 3 input/output ports, wherein the at least 3 input/output ports can be selectively designated as the input port 111 , the first output port 112 and the second output port 113 .

As shown in FIG. 1 , the wafer debonding and cleaning method of the present application includes the following steps. First, the substrate 20 to be processed is input into the integrated wafer debonding and cleaning equipment 10 through the input port 111 . As shown in FIG. 2 , the substrate to be processed 20 includes a bonded wafer 21 and a carrier 22 . Next, the substrate 20 to be processed is transferred to the debonding module 150 by the transfer device 120 .

As shown in FIG. 1 , when the substrate 20 to be processed is located in the debonding module 150 , the substrate 20 to be processed is debonded and separated into the wafer 21 and the carrier 22 which are independent of each other by the debonding device 152 . Next, after the substrates 20 to be processed are debonded and separated, the separated wafers 21 are transferred to the wafer cleaning device 160 by the transfer device 120 , and the wafers 21 are cleaned by the wafer cleaning device 160 .

As shown in FIG. 1 , after both sides of the wafer 21 are cleaned, the cleaned wafer 21 and the carrier 22 are respectively transferred to the first output port 112 and the second output port 113 by the transfer device 120 . Next, the wafer 21 and the carrier board 22 are respectively outputted to the outside of the integrated wafer debonding and cleaning apparatus 10 through the first output port 112 and the second output port 113 .

As shown in FIGS. 1 and 2 , the debonding module 150 defines a debonding area R1 , a separation area R2 and a temporary storage area R3 . In addition, the debonding module 150 includes a moving stage 151 , a debonding device 152 , a separation device 153 , a platform 154 , a first optical detection device 155 and a second optical detection device 156 . The moving stage 151 can move between the debonding area R1 and the separation area R2. The debonding device 152 and the first optical detection device 155 are disposed in the debonding region R1. The separation device 153 can move between the separation area R2 and the temporary storage area R3. The second optical detection device 156 is provided in the separation region R2. The platform 154 is set in the temporary storage area R3.

In some embodiments, when the transfer device 120 places the substrate 20 to be processed on the moving stage 151 and the moving stage 151 is located in the debonding region R1 , the wafer debonding and cleaning method of the present application includes: The substrate 20 to be processed is debonded. When the debonding device 152 debonds the substrate to be processed 20, the substrate to be processed 20 is disposed between the moving stage 151 and the debonding device 152, and the carrier 22 of the substrate to be processed 20 is located on a side close to the debonding device 152, and the Circle 21 is located on the side away from debonding device 152 .

In some embodiments, before the substrate 20 to be processed is debonded, the wafer debonding and cleaning method of the present application includes: detecting the substrate 20 to be processed by the first optical inspection device 155 .

In some embodiments, when the moving stage 151 moves the debonded substrate to be processed 20 to the separation area R2 , the wafer debonding and cleaning method of the present application includes: using the separation device 153 to remove the carrier of the substrate to be processed 20 . 22 is separated from the wafer 21 . Preferably, the separation device 153 moves the carrier board 22 to the temporary storage area R3 and places the separated carrier board 22 on the platform 154 .

In some embodiments, after the separation device 153 separates the carrier 22 from the wafer 21 , the carrier 22 is inspected by the second optical inspection device 156 .

As shown in FIG. 1 , the wafer cleaning apparatus 160 includes a first cavity 161 and a second cavity 162 . The first cavity 161 and the second cavity 162 are respectively configured to clean two opposite surfaces of the wafer 21 . Specifically, after the wafer 21 is separated from the carrier 22 , the transfer device 120 transfers the wafer 21 to the first cavity 161 . The first surface of the wafer 21 with the residual adhesive (the separation layer 23 and the adhesive layer 24 ) is cleaned by the first cavity 161 . Next, the transfer device 120 takes out the wafer 21 from the first cavity 161 and transfers it to the inversion mechanism 140 . The wafer 21 is turned over using the turning mechanism 140 so that the second surface of the wafer 21 faces upward. Next, the transfer device 120 transfers the wafer 21 from the inversion mechanism 140 to the second cavity 162 . The second surface of the wafer is cleaned by the second cavity 162 . After the wafers are cleaned on both sides, the wafers 21 are transferred to the first output port 112 via the transfer device 120 for shipment.

It should be understood that, in the wafer debonding and cleaning method of the present application, the specific debonding steps, cleaning steps, transfer steps, detection steps, relative component arrangement and related advantages are all the same as those of the integrated wafer debonding and cleaning apparatus 10 above. The contents of the corresponding paragraphs are described and will not be repeated here.

In summary, the present application provides an integrated wafer debonding and cleaning apparatus and a wafer debonding and cleaning method. In the present application, the bonded wafer and carrier are transferred to the moving stage of the debonding module, and the debonding process is performed by the debonding device in the debonding area. After the adhesive colloid is debonded, the moving stage moves back and forth in the debonding area and the separation area along a straight line. In the separation area, the carrier board is pulled out by the separation device to separate the wafer and the carrier board. Compared with the prior art, the present application directly performs a double-sided cleaning process on the debonded wafer to form a continuous process, thereby saving process time and improving productivity. Furthermore, the online optical inspection device is used to monitor whether the carrier board is cracked or damaged in real time, so as to quickly remove the carrier board and eliminate the process disturbance. Therefore, the moving stage of the debonding module can be maintained clean and improve operational continuity, as well as keep the debonding module operating smoothly.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

10: Integrated wafer debonding and cleaning equipment 110: Inbound and outbound area 111: input port 112: The first output port 113: The second output port 120: Teleporter 130: Positioning device 140: Flip Mechanism 150: Debonding module 151: Mobile stage 152: Debonding device 153: Separation device 154: Platform 155: The first optical detection device 156: Second optical detection device 160: Wafer cleaning device 161: The first cavity 162: Second cavity R1: Debonding region R2: separation zone R3: staging area 20: Substrate to be processed 21: Wafer 22: carrier board 23: Separation Layer 24: Adhesive layer

FIG. 1 shows a schematic diagram of an integrated wafer debonding and cleaning apparatus according to an embodiment of the present application; FIG. 2 shows a schematic diagram of a debonding module according to an embodiment of the present application; and 3A to 3C are schematic diagrams illustrating a separation process of a wafer and a substrate according to an embodiment of the present application.

10: Integrated wafer debonding and cleaning equipment

110: Inbound and outbound area

111: Input port

112: The first output port

113: The second output port

120: Teleporter

130: Positioning device

140: Flip Mechanism

150: Debonding module

160: Wafer cleaning device

161: The first cavity

162: Second cavity

R1: Debonding region

R2: separation zone

R3: staging area

Claims (9)

An integrated wafer debonding and cleaning equipment, comprising: an input port configured to input a substrate to be processed into the integrated wafer debonding and cleaning equipment, wherein the substrate to be processed includes a bonded wafer and a carrier; a debonding module configured to debond and separate the substrate to be processed into the wafer and the carrier which are independent of each other; a wafer cleaning device configured to clean the wafer; a first output port configured to output the cleaned wafer to the outside of the integrated wafer debonding and cleaning equipment; a second output port configured to output the carrier board to the outside of the integrated wafer debonding and cleaning equipment; a transfer device configured to transfer the substrate to be processed, the wafer and the carrier, wherein the transfer device operates on the input port, the debonding module, the wafer cleaning device, the first output port, the second output port between the output ports. The integrated wafer debonding and cleaning equipment of claim 1, wherein the debonding module includes a moving stage and a debonding area, and in the debonding area, the debonding module further includes a debonding device, and when the transfer device transfers When the substrate to be processed is placed on the moving stage and the moving stage is located in the debonding area, the debonding device is configured to debond the substrate to be processed. The integrated wafer debonding and cleaning equipment of claim 2, wherein in the debonding area, the debonding module further includes a first optical inspection device, and before the substrate to be processed is debonded, the first optical inspection device is configured In order to detect the substrate to be processed. The integrated wafer debonding and cleaning apparatus of claim 2, wherein when the debonding device debonds the substrate to be processed, the substrate to be processed is disposed between the moving stage and the debonding device, and the substrate to be processed is disposed between the moving stage and the debonding device. The carrier is located on a side close to the debonding device, and the wafer is located on a side away from the debonding device. The integrated wafer debonding and cleaning equipment of claim 2, wherein the debonding module further includes a separation area, the moving stage moves between the debonding area and the separation area, and in the separation area, the debonding module A separation device is also included, and when the moving stage moves the debonded substrate to be processed to the separation area, the separation device is configured to separate the carrier of the substrate to be processed from the wafer. The integrated wafer debonding and cleaning equipment of claim 5, wherein in the separation area, the debonding module further includes a second optical detection device, and after the separation device separates the carrier from the wafer, the The second optical detection device is configured to detect the carrier. The integrated wafer debonding and cleaning apparatus of claim 1, wherein the debonding module further includes a temporary storage area configured to place the separated carrier. The integrated wafer debonding and cleaning apparatus of claim 1, wherein the wafer cleaning device comprises a first cavity and a second cavity, and the first cavity and the second cavity are respectively configured to clean the Opposite surfaces of the wafer. The integrated wafer debonding and cleaning equipment of claim 1, wherein the integrated wafer debonding and cleaning equipment further comprises a positioning device and a turning mechanism, the positioning device is configured to perform center point positioning of the substrate to be processed, and The inversion mechanism is configured to invert the substrate to be processed or the wafer.

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