TWM630356U - Heat dissipation module - Google Patents

Abstract

A heat dissipation module includes a base plate, a heat dissipation unit and an overflow prevention unit. The overflow prevention unit is arranged on a surface of the substrate, and the overflow prevention unit is in the shape of a sheet and has a plurality of mesh holes. The overflow prevention unit is formed with a placement area and surrounds the placement area, and the heat dissipation unit is placed in the placement area. The capillary phenomenon caused by the multiple mesh holes of the anti-overflow unit can effectively prevent the problem of short circuit on the motherboard caused by the overflow caused by the phase change of the heat dissipation unit.

Description

cooling module

The invention relates to a heat dissipation module, in particular to a heat dissipation module, which has a heat dissipation unit that can be changed into liquid metal.

At present, all kinds of common electronic components are developed and designed in the direction of miniaturization, and components such as central processing unit (CPU) or graphics processing unit (GPU) have been reduced due to many factors such as miniaturization and significant performance improvement. It is easy to generate high heat during the actual operation, which affects the overall operation performance. Therefore, it is necessary to dissipate heat by means of a micro-vapor chamber.

The current heat dissipation module is disposed on the electronic components by means of heat dissipation fins, and then uses the fan unit to guide the airflow to conduct the heat energy generated by the electronic components to the outside of the casing. However, due to the close arrangement of the components inside the casing, the heat generated by the heat source cannot be effectively discharged to the outside, resulting in a temperature rise effect inside the casing. In addition, under the vicious cycle of continuous heat accumulation, if the temperature inside the casing cannot be maintained at The normal range will affect the reliability and service life of the entire electronic device, and will cause leakage problems and excessive temperature during overclocking.

In addition, in order to effectively improve the heat dissipation efficiency, a metal heat conduction sheet with a higher heat dissipation coefficient needs to be used. However, the overflow generated by the phase change of the metal heat-conducting sheet can easily lead to the short circuit of the motherboard, and the uneven heating position of the heat source will also cause unstable heat dissipation.

Although in the prior art, a silicon-based paste material is used around the heat source to prevent leakage, or a glue dispensing method is used to solidify the surrounding parts to prevent short circuit, this method is time-consuming and labor-intensive in the production line, and the glue dispensing equipment needs to be fixed, resulting in Increased costs and man-hours.

Therefore, how to improve the heat dissipation effect of the heat dissipation module through the improvement of the structure design to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by this creation is to provide a heat dissipation module in view of the deficiencies of the prior art, so as to improve the heat dissipation effect of the heat dissipation module and solve the problem of external leakage at the same time.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted in this creation is to provide a heat dissipation module, which includes a substrate, a heat dissipation unit and an overflow prevention unit. The overflow prevention unit is sheet-shaped and has a plurality of mesh holes. The overflow prevention unit is arranged on a surface of the substrate, the overflow prevention unit forms a placement area, the overflow prevention unit surrounds the placement area, and the heat dissipation unit is placed in the placement area. The substrate is placed on a heat source.

In a preferred embodiment, the heat dissipation unit has a first state and a second state, the first state is a solid state, and the second state is a liquid state.

In a preferred embodiment, the heat dissipation unit is formed of liquid metal or heat dissipation paste.

In a preferred embodiment, when the heat dissipation unit is liquid metal in the first state, the outer edge of the overflow prevention unit has a first length and a first width, and twice the first length and twice the first width are added together. It is defined as the perimeter of the anti-overflow unit, the placement area has a second length and a second width, and the addition of twice the second length and twice the second width is defined as the perimeter of the placement area, and the liquid metal has a second length. Three lengths and third widths, the direction of the third length is parallel to the direction of the first length or the direction of the second length, the direction of the third width is parallel to the direction of the first width or the direction of the second width, overflow prevention The perimeter of the unit is 1.66 times the perimeter of the cooling unit.

In a preferred embodiment, the second length is 1 times the third length, and the second width is 1.25 times the third width.

In a preferred embodiment, the shape of the mesh hole can be a circle, an ellipse, a triangle or a polygon, and the thickness of the overflow prevention unit is 0.15 mm.

In a preferred embodiment, when the shape of the mesh hole is circular, the diameter of the mesh hole is 0.8 mm.

In a preferred embodiment, the area ratio of the overflow prevention unit on the substrate is defined as the aperture ratio, and the aperture ratio ranges from 30% to 80%.

In a preferred embodiment, the porosity is 50%.

In a preferred embodiment, the thickness of the overflow prevention unit is 100% to 120% of the thickness of the substrate.

One of the beneficial effects of the present invention is that the heat dissipation module provided by the present invention simplifies the design of the overall heat dissipation module due to the introduction of the anti-overflow unit. Not only can it effectively prevent the problem of short circuit on the motherboard caused by the overflow caused by the phase change of the heat dissipation unit, but also can avoid the uneven heat dissipation of the heat source and cause unstable heat dissipation. In addition, when workers are producing heat dissipation modules, because of the simplification of design, manufacturers can effectively reduce the equipment required for the production line, reduce costs and shorten assembly time. And as the situation requires, replace the liquid metal or heat dissipation paste to increase the flexibility of the use of the heat dissipation module.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the provided drawings are only for reference and description, and are not intended to limit this creation.

The following is a description of the implementation of the "heat dissipation module" disclosed in the present creation through specific specific embodiments, and those skilled in the art can understand the advantages and effects of the present creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIGS. 1 to 5 , the present invention provides a heat dissipation module 100 , which includes: a substrate 10 , a heat dissipation unit 20 and an overflow prevention unit 30 . The substrate 10 is used for carrying the heat dissipation unit 20 and the overflow prevention unit 30 , and the substrate 10 is placed on a heat source 200 .

It should be noted that the substrate 10 of the heat dissipation module 100 is attached to the heat source 200 . The heat source 200 may be disposed on a carrier substrate (not shown), and the heat source 200 may be a central processing unit (CPU), a graphics processing unit (GPU), a microcontroller (Microcontroller, MCU), microprocessor (Microprocessor, MPU), application specific integrated circuit unit (application specific integrated circuit, ASIC) or other electronic components, this creation is not limited.

The heat dissipation unit 20 may include a heat dissipation material with a high heat dissipation coefficient, and has a first state and a second state. For example, the first state may be a solid state, and the second state may be a liquid state, which is not limited in the present invention. When the heat dissipation unit 20 is heated, it will change from the first state to the second state. In a preferred embodiment, the heat dissipation unit 20 may be formed of liquid metal or heat dissipation paste.

The overflow prevention unit 30 is disposed on a surface of the substrate 10 . The area ratio of the overflow prevention unit 30 on the substrate 10 is defined as the aperture ratio, and the aperture ratio of the overflow prevention unit 30 ranges from 30% to 80%. In a preferred embodiment, the aperture ratio of the overflow prevention unit 30 is 50%.

As shown in FIG. 2 and FIG. 3 , the overflow prevention unit 30 is in a sheet shape and has a plurality of mesh holes 31 . The overflow preventing unit 30 has a thickness T1 of the overflow preventing unit, and the substrate 10 has a substrate thickness T2. The thickness T1 of the overflow prevention unit is between 0.1 millimeters (mm) and 0.3 millimeters (mm). In a preferred embodiment, the thickness T1 of the overflow prevention unit is 0.15 mm. The overflow prevention unit thickness T1 is 100% to 120% of the substrate thickness T2.

The shape of the overflow prevention unit 30 may be a rectangle, a circle, an ellipse, a triangle or a polygon. This creation is not limited. As shown in FIG. 4 , when the shape of the overflow prevention unit 30 is a rectangle, the outer edge of the overflow prevention unit 30 has a first length L1 and a first width W1, twice the first length L1 and twice the first length L1 The first width W1 is added to define the perimeter of the overflow prevention unit 30 .

The shape of the plurality of mesh holes 31 can be circle, ellipse, triangle or polygon. The shapes of the mesh holes 31 on the overflow prevention unit 30 are not necessarily all the same. That is to say, some of the mesh holes 31 on the overflow prevention unit 30 may be circular, and another part of the mesh holes 31 may be oval or other shapes. The present invention does not limit the shape of the mesh hole 31 .

Please refer to FIG. 3 again, when the shape of the mesh holes 31 is circular, each mesh hole 31 has a mesh hole diameter R, and the mesh hole diameter R is between 0.5 millimeters (mm) to 1 mm ( mm), in a preferred embodiment, the diameter R of the mesh holes is 0.8 mm.

The overflow preventing unit 30 is formed with a placement area S, and the overflow preventing unit 30 surrounds a placement area S. That is, the placement area S does not have an outward flow opening. The placement area S can be a rectangle, a triangle, a circle or a polygon, and the placement area S can be changed according to the actual situation, so this creation is not limited. The heat dissipation unit 20 is placed in the placement area S.

As shown in FIG. 4 , in the case where the placement area S is a rectangle, the placement area S has a second length L2 and a second width W2, and the double second length L2 and the double second width W2 are added together to define as The perimeter of the placement area S.

When the heat dissipation unit 20 is the liquid metal in the first state, the shape of the liquid metal may be a rectangle, a triangle, a circle or a polygonal liquid metal, which is not limited in this creation. When the liquid metal is rectangular, the liquid metal has a third length L3 and a third width W3. The direction of the third length L3 may be parallel to the direction of the first length L1 or the direction of the second length L2; the direction of the third length L3 may not be parallel to the direction of the first length L1 or the direction of the second length L2. The direction of the third width W3 may be parallel to the direction of the first width W1 or the direction of the second width W2; the direction of the third width W3 may not be parallel to the direction of the first width W1 or the direction of the second width W2.

When the direction of the third length L3 is parallel to the direction of the first length L1 or the direction of the second length L2, and the direction of the third width W3 is parallel to the direction of the first width W1 or the direction of the second width W2 , wherein the perimeter of the overflow prevention unit 30 is 1.66 times the perimeter of the heat dissipation unit 20 , the second length L2 is 1 times the third length L3 , and the second width W2 is 1.25 times the third width W3 .

As shown in FIG. 4 and FIG. 5 , FIG. 4 shows the liquid metal in the first state of the heat dissipation unit 20 . When the heat dissipation unit 20 is heated and changes from the first state (shown in FIG. 4 ) to the second state (shown in FIG. 5 ), the overflow prevention unit 30 can effectively prevent the heat dissipation unit 20 from flowing out in the second state, by The capillary phenomenon caused by the plurality of mesh holes 31 of the overflow prevention unit 30 causes the heat dissipation unit 20 in the second state to be adsorbed and solidified in the plurality of mesh holes 31 . Therefore, when the heat dissipation unit 20 in the second state is melted and overflowed, the capillary phenomenon caused by the plurality of mesh holes 31 of the overflow prevention unit 30 can effectively prevent the problem of short circuit of the motherboard caused by the overflow of the heat dissipation unit 20, and the second state The lower heat dissipation unit 20 can further avoid the phenomenon of unstable heat dissipation caused by the uneven position of the heat source 200 .

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the heat dissipation module provided by the present invention simplifies the design of the overall heat dissipation module due to the introduction of the anti-overflow unit. Not only can the capillary phenomenon caused by the multiple mesh holes of the anti-overflow unit be used to effectively prevent the overflow caused by the phase change of the cooling unit and cause the short circuit of the motherboard, it can also avoid the uneven heating position of the heat source, which will also cause poor heat dissipation. stable phenomenon. In addition, when workers produce heat dissipation modules, because of the simplicity of design, manufacturers can effectively reduce the equipment required for the production line, reduce costs and shorten assembly time. And as the situation requires, replace the liquid metal or heat dissipation paste to increase the flexibility of the use of the heat dissipation module.

The contents disclosed above are only the preferred and feasible embodiments of this creation, and are not intended to limit the scope of the patent application of this creation. Therefore, any equivalent technical changes made by using the descriptions and drawings of this creation are included in the application for this creation. within the scope of the patent.

100: cooling module 200: heat source 10: Substrate 20: Cooling unit 30: Anti-overflow unit 31: Mesh Holes S: Placement area R: mesh hole diameter T1: Thickness of anti-overflow unit T2: substrate thickness L1: first length L2: second length L3: third length W1: first width W2: Second width W3: third width

FIG. 1 is a top view of the created heat dissipation module.

FIG. 2 is a schematic cross-sectional view of the II-II section of the overflow prevention unit and the heat dissipation unit of FIG. 1 .

FIG. 3 is an enlarged schematic view of part III of FIG. 2 .

FIG. 4 is a schematic diagram of a heat dissipation unit of a created heat dissipation module in a first state.

FIG. 5 is a schematic diagram of the heat dissipation unit of the created heat dissipation module in a second state.

100: cooling module

200: heat source

10: Substrate

20: Cooling unit

30: Anti-overflow unit

S: Placement area

Claims (10)

A heat dissipation module, comprising: a substrate; a cooling unit; and an overflow prevention unit, the overflow prevention unit is in the shape of a sheet and has a plurality of mesh holes; The overflow prevention unit is disposed on a surface of the substrate, the overflow prevention unit forms a placement area, the overflow prevention unit surrounds the placement area, and the heat dissipation unit is placed in the placement area Inside; The substrate is placed on a heat source. The heat dissipation module of claim 1, wherein the heat dissipation unit has a first state and a second state, the first state is a solid state, and the second state is a liquid state. The heat dissipation module according to claim 2, wherein the heat dissipation unit is formed of liquid metal or heat dissipation paste. The heat dissipation module according to claim 3, wherein when the heat dissipation unit is liquid metal in the first state, the outer edge of the overflow prevention unit has a first length and a first width, which are twice as long as The first length and twice the first width are added together to define the perimeter of the overflow prevention unit, the placement area has a second length and a second width, and twice the second length The perimeter of the placement area is defined by adding twice the second width, the liquid metal has a third length and a third width, and the direction of the third length is parallel to the first length. direction or the direction of the second length, the direction of the third width is parallel to the direction of the first width or the direction of the second width, the perimeter of the overflow prevention unit is the heat dissipation 1.66 times the perimeter of the unit. The heat dissipation module of claim 4, wherein the second length is 1 times the third length, and the second width is 1.25 times the third width. The heat dissipation module according to claim 1, wherein the shape of the mesh hole can be a circle, an ellipse, a triangle or a polygon, and the thickness of the overflow prevention unit is 0.15 mm. The heat dissipation module according to claim 6, wherein when the shape of the mesh hole is circular, the diameter of the mesh hole is 0.8 mm. The heat dissipation module according to claim 1, wherein an area ratio of the overflow prevention unit on the substrate is defined as an aperture ratio, and the aperture ratio is between 30% and 80%. The heat dissipation module according to claim 8, wherein the aperture ratio is 50%. According to the heat dissipation module of claim 1, the thickness of the overflow prevention unit is 100% to 120% of the thickness of the substrate.

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