TWM629048U - Heat dissipation device assembly - Google Patents

Abstract

The present invention creates a heat dissipation device assembly, which includes an aluminum base, an aluminum fin set, and at least one U-shaped upright or inverted copper heat pipe. The aluminum base has at least one joint portion, and the joint portion is provided with There is a copper embedded layer, the aluminum fin set is assembled on the aluminum base, and the copper heat pipe has a heat dissipation part and a heat absorption part, which are respectively combined with the aluminum fin set and the aluminum base. On the joint portion of the aluminum base, the heat dissipation device of the present invention can be directly welded and combined with the copper heat pipe without the need for nickel treatment through the arrangement of the copper embedded layer.

Description

Cooling device combination

This creation relates to a combination of heat sinks, especially a copper embedded layer is arranged on the aluminum base or the part to be combined with the aluminum fin set, so that the aluminum base is respectively connected to the dissimilar metal. The copper heat pipe or the aluminum fin set of the same material can be directly welded to the heat sink assembly without the need for nickel treatment.

Conventional radiators or heat sinks are generally made of a combination of copper and aluminum. Since copper has the characteristics of high heat conduction efficiency, conventional radiators or heat sinks are usually made of copper as the heat dissipation base, which is regarded as a solution. The heat generated by the execution unit (central processing unit, graphics card chip or other crystal or heat source) is exchanged for heat; however, if the heat sink or heat sink is made of copper, its weight is extremely heavy and the cost is high; therefore, the current method adopted The parts that are in direct contact with the heat source and will be absorbed into the heat source (such as conduction units (pieces, bodies, seats), copper plates, heat pipes, temperature equalization plates, etc.) The radiator and heat sink) are made of aluminum material with relatively light weight and low cost, so as to reduce weight and cost.

For example, the current general heat dissipation device usually includes an aluminum base, a plurality of copper heat pipes, a snap-on aluminum fin set and a metal copper plate. The aluminum snap-on fin set is composed of a plurality of multi-piece fins. Each fin has two folded edges, each folded edge has a buckle part protruding outward, the buckle parts of the fins are mutually buckled with each other so that the two folded edges form the aluminum buckle The top surface and bottom surface of the aluminum fin set are arranged on the top surface of the aluminum base, and one of the heat-absorbing ends of the copper heat pipes is arranged on the top surface of the aluminum base. In a recessed groove on the bottom surface of the aluminum base, a heat dissipation end of the copper heat pipe is connected to the aluminum snap-on fin set, and finally matched with the metal copper plate to cover the aluminum base. The bottom surface is used to contact the heat source.

However, since the aluminum surface of the aluminum base is easily oxidized, and the high melting point oxide (Al2O3) will be formed during the welding process, it will directly hinder the fusion with the copper metal and bring difficulties to welding, because if the copper metal and the aluminum When the metal is welded directly, the part where the two copper and aluminum materials are directly welded will be prone to cracks due to the large brittleness after welding; It is easy to form a eutectic of cuAl2, and eutectic such as cuAl2 will be distributed near the grain boundary, which is prone to fatigue or cracks between the grain boundaries. Moreover, the melting point and eutectic temperature of copper and aluminum are quite different, so when the surface of the aluminum is completely melted in the fusion welding operation, the copper is still in a solid state; on the contrary, when the copper is melted, the aluminum has already melted a lot and It is impossible to coexist in a eutectic or eutectic state, which greatly increases the difficulty of welding copper metal and aluminum metal. In addition, because the welding seam is prone to pores, and the thermal conductivity of copper metal and aluminum metal is very good, the molten pool metal crystallizes quickly during welding, so that the metallurgical reaction gas at high temperature cannot escape, so pores are easily generated. Based on the above problems, it is the reason why the contact surface between the aluminum base and the copper heat pipe and/or the metal copper plate cannot be directly welded.

Therefore, in order to solve the above-mentioned problems that the conventional aluminum-copper metal cannot be directly welded and the above-mentioned extension, the method adopted by the industry is to surface treatment and modify the surface of the combined surface of the aluminum base, the copper heat pipe and/or the metal copper plate. After quality, it is convenient for dissimilar metal welding, that is, an electroless nickel layer should be formed on the bottom surface of the aluminum base and the inner side of the groove or its opposite joint contact surface. Metals (the two dissimilar metals are aluminum and copper) are welded. Those who are currently familiar with the art are the use of electroless nickel plating as a metal surface modification technique, which provides unique deposit properties, including deposit uniformity in deep depressions, holes and blind holes; among which electroless plating Nickel can also be called chemical nickel plating (Chemical Deposition) or autocatalytic plating (Autocatalytic Plating) and it is classified according to phosphorus content: low phosphorus, medium phosphorus and high phosphorus. The biggest difference between electroless nickel plating and electroplating is that the working environment is under the condition of no current, the metal ions are reduced by the reducing agent in the solution, and the surface of the test piece must be catalyzed before electroless nickel plating.

However, although the above-mentioned method can solve the welding problem of the aluminum base, the copper heat pipe and the metal copper plate, it also leads to environmental protection and other problems, because a large amount of chemical reaction liquid needs to be used in the electroless nickel plating process, and the electroless nickel plating process needs to use a large amount of chemical reaction liquid. After the nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of waste water containing yellow phosphorus and other toxic substances will be produced in the industrial waste liquid. Yellow phosphorus sewage contains yellow phosphorus with a concentration of 50~390mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and other diseases such as mandibular necrosis. Therefore, the current environmental awareness in various countries has begun to pay attention to and banned this electroless nickel plating related process, so efforts are made to promote non-toxic processes to protect the environment. In addition, the recent instability and severe shortage of nickel raw materials in electroless nickel plating in the global supply chain will also lead to higher overall costs.

Accordingly, how to weld and combine two dissimilar metals without using surface modification treatment is a problem that needs to be overcome urgently at present.

One objective of the present invention is to provide a copper intercalation layer on the aluminum base, through which the copper intercalation layer can be directly welded to the copper heat pipe of dissimilar metals without surface modification, so as to effectively achieve A combination of cooling devices for cost reduction and environmental protection.

Another object of the present invention is to provide a copper embedded layer on the part to be combined with the aluminum base and the aluminum fin set, so that the heat transfer element of dissimilar metals can be It can be directly welded to effectively achieve a combination of heat sinks that reduce costs and protect the environment.

In order to achieve the above purpose, the present invention provides a heat sink assembly, comprising: an aluminum base with an upper side surface and at least one joint portion, the joint portion is provided with a copper embedded layer; at least one is interlocked by a plurality of fins The set of aluminum fins is connected and is located or combined on the top of the aluminum base, each fin is provided with at least one through hole passing through the fin, and an airflow channel is defined between each two fins Vertical or parallel to the top side of the aluminum base; at least one U-shaped copper heat pipe that is upright and or inverted, the copper heat pipe has a heat dissipation part passing through the through holes of the aluminum fin set, and a heat absorption part It is combined with the joint part of the aluminum base, so that the heat absorption part is combined with the copper embedded layer of the joint part.

The copper embedded layer is provided at the desired joint portion of the aluminum base and/or the aluminum fin set of the present invention, so that the aluminum base can directly conduct heat with copper heat pipes and/or copper heat pipes of different metals The components and the aluminum fin set of the same material can be directly welded without nickel treatment, so as to effectively achieve the effect of cost reduction and environmental protection.

1: Cooling device combination

11: Aluminum fin set

110: Fins

1101: First fold

1102: Second hemming

1103: Buckle part

111: Bottom

112: top surface

113: Through hole

1131: Flange

1132: Flange inner side

114: Airflow channel

12: Aluminum base

121: upper side

122: lower side

143: Joint

13: Copper Insertion Layer

131: In-depth face

132: Contact Surface

14: Copper heat pipe

141: heat sink

1411: Heat pipe contact surface

1412: Heat pipe joint surface

142: heat dissipation department

143: capillary structure

144: Heat Pipe Chamber

145: middle section

16: Copper heat conduction element

161: Heat transfer surface

162: Endothermic Surface

Figure 1A is a three-dimensional exploded schematic diagram of the creation.

Figure 1B is a schematic diagram of another perspective of the three-dimensional decomposition of the creation.

Figure 2A is a schematic diagram of the three-dimensional composition of the creation.

FIG. 2B is a schematic cross-sectional view of FIG. 2A of the creation.

FIG. 3 is a schematic three-dimensional combined schematic diagram of another alternative embodiment of creating a copper heat pipe.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

The present invention provides a heat dissipation device assembly 1, please refer to Figures 1A, 1B, 2A, 2B, the heat dissipation device assembly 1 includes at least one aluminum fin group 11, an aluminum base 12, at least one copper heat pipe 14 and at least one a copper Heat conduction element 16; wherein, the aluminum fin set 11 is formed by a plurality of fins 110 interlocking with each other, each fin 110 has a first folded edge 1101 and a second folded edge 1102 protruding and aligned with each other The first folded edge 1101 and the second folded edge 1102 of the other adjacent fin 110, and the first folded edge 1101 and the second folded edge 1102 are respectively provided with a buckling portion 1103, and the buckling portion 1103 is shown in this figure Although it shows the structure of concave-convex matching, it is not limited to this, and also includes any combination of technical means. Each fin 110 is combined with the buckling portion 1103 of the buckling portion 1103 and the buckling portion 1103 of the adjacent fins 110 in a buckling (buckling or overlapping) manner to form the aluminum fins of the buckle type. Set of fins 11. Thus, the first folded edges 1101 together form a top surface 112 of the aluminum fin set 11 , and the second folded edges 1102 together constitute a bottom surface 111 of the aluminum fin set 11 .

Each fin 110 is provided with at least one through hole 113 , the through hole 113 penetrates the fin 110 , the through holes 113 are aligned with each other, and the through holes 113 are used for a heat dissipation of the copper heat pipe 14 The through hole 113 has a flange 1131 ringed around an edge of the through hole 113 and protrudes outward from one side of the fin 110 (the front side of the fin 110 is shown in the figure) And defines a flange inner side 1132 . In addition, an outermost fin 110 of the aluminum fin set 11 is provided with an inverted fin 110 to prevent the first and second folding edges 1101 and 1102 from scratching other parts or accidentally injuring the user (as shown in FIG. 1A ). And an airflow channel 114 is defined between every two fins 110, and the airflow channel 114 is used to provide an external airflow to pass through to take away the heat on the fins 110. Of course, in the actual implementation of this invention, the fins 110 At least one fan (eg, an axial flow fan) can be disposed on a side opposite to the airflow channel 114 , and the fins 110 are forcibly dissipated by generating external airflow through the fan.

The aluminum base 12 has an upper side 121, a lower side 122 and at least one joint 123. The upper side 121 of the aluminum base 12 is combined with the bottom surface 111 of the aluminum fin set 11, but Not limited to this, the aluminum fin set 11 can also be located above the upper side surface 121 corresponding to the aluminum base 12 with a heat dissipation gap formed therebetween. And the airflow channel 114 of the aluminum fin set 11 is perpendicular to the upper side 121 of the aluminum base 12 , and the joint portion 123 can be a groove or a hole that can be located on the upper side 121 or the lower side. 122 or two In this embodiment, the connecting portion 123 is described as a groove disposed on the lower side surface 122 of the aluminum base 12, but it is not limited to this. The connecting portion 123 can also be a through hole running through the aluminum base. The position between the upper and lower side surfaces 121 and 122 of the seat 12 . The coupling portion 123 is used for coupling with a heat absorbing portion 141 opposite to the copper heat pipes 14 . In addition, in the specific implementation, the shape of the joint portion 123 is matched with the shape of the heat absorption portion 141 of the copper heat pipe 14, such as a flat shape, a circular shape, or a D shape.

Continuing to refer to Figures 1A and 2B, as shown in the figures, the upper and lower side surfaces 121 and 122 of the aluminum base 12 and the joint 123 and the bottom surface 111 of the aluminum fin set 11 are respectively provided with a copper insert. A copper embedding layer 13 , but not limited thereto, the copper embedding layer 13 can be provided only on the bonding portion 123 and/or the lower side surface 122 of the aluminum base 12 .

The above-mentioned copper insertion layer 13 has a deep surface 131 and a contact surface 132, and the contact surface 132 serves as the exposed surface of the copper insertion layer 13, the bottom surface 111 of the aluminum fin group 11 and the aluminum base The upper and lower side surfaces 121 and 122 of the seat 12 are combined with the joint portion 123 , and the deep surface 131 is combined with the bottom surface 111 of the aluminum fin set 11 and the upper and lower side surfaces of the aluminum base 12 . 121 , 122 and the joint portion 123 . The copper intercalation layer 13 can be copper powder or copper foil or copper sheet or liquid copper through mechanical processing (such as air pressure, hydraulic pressure, stamping or hydraulic extrusion) or surface treatment process (such as spraying, printing, etc.) ) or chemical processing (such as electroplating, anodizing) is formed on the bottom surface 111 of the aluminum fin group 11 and the upper and lower sides 121 and 122 of the aluminum base 12 and the joint 123, and part of the The copper intercalation layer 13 will be directly engaged or embedded or embedded or penetrated into the bottom surface 111 of the aluminum fin group 11 and the upper and lower side surfaces 121 and 122 of the aluminum base 12 during the bonding formation process. The deep surface 131 is formed by deposition in the joint portion 123 . In this way, the copper intercalation layer 13 is not only bonded to the bottom surface 111 , the upper and lower side surfaces 121 , 122 and the joint portion 123 , but also the deep surface 131 is engaged or embedded or embedded or penetrated into the bottom surface 111 . The upper and lower side surfaces 121 , 122 and the joint portion 123 are deposited as the foundation of the copper intercalation layer 13 to strengthen the junction of the copper intercalation layer 13 The resultant force (bonding strength) can prevent the copper intercalation layer 13 from peeling off from the bottom surface 111 of the aluminum fin group 11 and the upper and lower side surfaces 121 and 122 of the aluminum base 12 and the bonding portion 123 (separation). With the above arrangement, the upper and lower side surfaces 121 and 122 of the aluminum base 12 are respectively combined with the bottom surface 111 of the aluminum fin group 11 and the copper heat conduction element 16 via the copper intercalation layer 13 . The heat absorbing portion 141 of the copper heat pipe 14 is combined with the copper embedded layer 13 of the joint portion 123 of the aluminum base 12 (eg, welded).

In addition, the copper heat pipe 14 is U-shaped and can be set upright or inverted, and is made of different metal materials from the aluminum base 12 and the aluminum fin group 11 respectively. In this embodiment, the copper heat pipe 14 is U-shaped. And it is shown upside down, each copper heat pipe 14 has a heat pipe chamber 144 filled with a working fluid (such as pure water), and the inner wall of the heat pipe chamber 144 is provided with a capillary structure 143 (such as sintered powder body, grooves) , mesh, fiber, sliver, or any combination of the foregoing).

The copper heat pipe 14 has the heat absorption part 141 and at least one heat dissipation part 142 and a middle section 145 connecting the heat absorption part 141 and the heat dissipation part 142. The heat dissipation part 142 penetrates the through hole 113 of the aluminum fin set 11 and is located at Above the upper side surface 121 of the aluminum base 12 , the heat absorbing portion 141 is combined with the joint portion 123 of the aluminum base 12 , and the heat absorbing portion 141 transmits the heat absorbed by the heat source to the heat dissipation portion 142 at the far end. Then the heat is dissipated to the outside through the aluminum fin set 11 ; the heat absorption part 141 has a heat pipe contact surface 1411 and a heat pipe joint surface 1412 , and the heat pipe contact surface 1411 of the heat absorption part 141 is flush with the aluminum base 12 . On the lower side 122 , the heat pipe joint surface 1412 of the heat absorbing portion 141 is welded to the copper embedded layer 13 of the joint portion 123 , and the heat dissipation portion 142 passes through the through hole 113 of the fin 110 and is connected to the flange. The inner side surfaces 1132 of the flanges of 1131 are tightly coupled with each other, but not limited thereto. In another alternative implementation, the heat dissipation portion 142 of the copper heat pipe 14 and the flange 1131 of the through hole 113 are loosely coupled, and the copper insert layer 13 and the copper heat pipe 14 are disposed on the inner side surface 1132 of the flange through the flange. The heat dissipation portion 142 is bonded (eg, welded).

In another alternative embodiment of the aforementioned copper heat pipe 14 , please refer to FIG. 3 , with reference to FIG. 1A , the copper heat pipe 14 is U-shaped and upright, and the middle section 145 of the copper heat pipe 14 is combined as the heat absorbing portion 141 On the joint portion 123 of the aluminum base 12 , the front and rear ends of the copper heat pipe 14 are respectively used as heat dissipation portions 142 to be perpendicular to the aluminum base 12 , and an aluminum fin set 11 is passed through. The fins 110 and the heat dissipation portion 142 of the copper heat pipe 14 are vertical, and the airflow channel 114 between each two fins 110 is parallel to the upper side surface 121 of the aluminum base 12 .

Furthermore, although the cross section of the heat dissipation portion 142 of the copper heat pipe 14 is shown as a circle, the heat pipe contact surface 1411 of the heat absorption portion 141 is a flat surface and is flush with the lower side surface 122 of the aluminum base 12 to avoid The cross section of the heat absorbing portion 141 is D-shaped (or flat). However, it is not limited to this, and in other alternative implementations, the cross-sections of the heat absorbing portion 141 and the heat dissipating portion 142 may both be circular, flat or D-shaped.

Continuing to refer to Figures 1B and 2B, the copper heat conduction element 16 is a copper plate body (such as a copper bottom plate). In this embodiment, the copper heat conduction element 16 and the aluminum base 12 are made of different metal materials, but are different from the copper heat pipe. 14 is the same metal material. And the copper heat conduction element 16 has a heat transfer surface 161 and a heat absorption surface 162, the heat transfer surface 161 is respectively connected with the copper embedded layer 13 of the lower side surface 122 of the aluminum base 12 and the copper heat pipe 14. The heat pipe contact surfaces 1411 are bonded (eg, welded).

The heat-absorbing surface 162 of the copper heat-conducting element 16 is attached to a heating element (such as a central processing unit or a graphics processor; not shown in the figure). The heat-absorbing surface 162 is used to conduct the heat generated by adsorbing the heating element to On the heat transfer surface 161 , the heat pipe contact surface 1411 of the heat absorbing part 141 of the copper heat pipe 14 absorbs the heat of the heat transfer surface 161 , and conducts the heat to the heat dissipation part 142 at the far end, and then the aluminum fin set 11 The heat on the heat dissipation part 142 is discharged to the outside for heat dissipation.

At the same time, part of the heat on the heat transfer surface 161 will be absorbed by the copper embedded layer 13 on the lower side 122 of the aluminum base 12 , and the heat will be exchanged outward through the aluminum base 12 .

Therefore, the copper intercalation layer 13 is provided at the position to be combined with the aluminum base 12 and/or the aluminum fin set 11 of the present invention, so that the aluminum base 12 can be directly connected to the copper made of different metals. The heat pipe 14 and/or the copper heat conduction element 16 and the aluminum fin set 11 can be directly welded without nickel treatment, which can not only effectively reduce the cost, but also achieve environmental protection and solve the shortage of conventional nickel phosphorus raw materials the problem.

The creation has been described in detail above, but the above is only a preferred embodiment of the creation, and should not limit the scope of implementation of the creation. That is, all equivalent changes and modifications made in accordance with the scope of the application of this creation shall still fall within the scope of the patent of this creation.

1: Cooling device combination

11: Aluminum fin set

110: Fins

1101: First fold

1102: Second hemming

1103: Buckle part

111: Bottom

112: top surface

113: Through hole

1131: Flange

1132: Flange inner side

114: Airflow channel

12: Aluminum base

121: upper side

122: lower side

123: Joint

13: Copper Insertion Layer

132: Contact Surface

14: Copper heat pipe

141: heat sink

1411: Heat pipe contact surface

1412: Heat pipe joint surface

142: heat dissipation department

145: middle section

16: Copper heat conduction element

161: Heat transfer surface

162: Endothermic Surface

Claims (8)

A heat dissipation device assembly, comprising: an aluminum base with an upper side surface and at least one joint part, the joint part is provided with a copper insertion layer; at least one aluminum fin group, formed by a plurality of fins buckled to each other , and is located or combined above the aluminum base, each fin is provided with at least one through hole running through the fin, and an airflow channel is defined between each two fins perpendicular or parallel to the aluminum base the upper side surface; at least one U-shaped copper heat pipe with at least one heat dissipation part penetrating the through hole of the at least one aluminum fin set, and a heat absorption part disposed at the joint part of the aluminum base, The heat absorbing part is combined with the aluminum base through the copper intercalation layer. The heat sink assembly as described in claim 1, wherein the aluminum base has a side surface, the joint part is a groove or a through hole, and is selected to be located on the upper side or the upper side of the aluminum base The at least one aluminum fin group has a bottom surface corresponding to the upper side surface of the aluminum base. The heat sink assembly as described in claim 2, wherein at least one of the bottom surface of the at least one aluminum fin set and the upper side surface of the aluminum base is provided with the copper embedded layer, so as to make The bottom surface of the at least one aluminum fin group is combined with the upper side surface of the aluminum base through the copper embedded layer. The heat sink assembly as described in claim 2, wherein the joint portion is disposed on the lower side surface of the aluminum base, and the heat absorbing portion is combined with the copper embedded layer of the joint portion. The heat dissipation device combination as described in item 2 of the claimed scope further comprises a copper heat conduction element with a heat transfer surface, and the copper embedded layer and the copper heat conduction element are disposed on the lower side of the aluminum base of this heat transfer surface combined. The heat dissipation device assembly as described in claim 3, wherein the copper intercalation layer is formed on the bottom surface of the at least one aluminum fin set and the aluminum alloy by mechanical processing, surface treatment process or chemical processing method. on the upper side surface and the joint portion of the base. The heat sink assembly as described in claim 3, wherein the copper intercalation layer has a deep surface and a contact surface, and the contact surface is bonded to the bottom surface of the at least one aluminum fin set and the aluminum On the upper side surface of the aluminum base and the joint portion, the deep surface is combined in the bottom surface of the at least one aluminum fin group and the upper side surface and the joint portion of the aluminum base. The heat sink assembly as described in claim 1, wherein the through hole of each fin has a flange protruding from one side of the fin and defines an inner side surface of the flange, and the inner side surface of the flange is provided with a flange. The copper insertion layer is combined with the heat dissipation portion.

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