TWM628820U - Flexible thermally conductive sheet and unit and assembly of the same - Google Patents

Abstract

A flexible thermally conductive sheet and its unit and assembly are provided. The above-mentioned flexible thermally conductive sheet includes a flexible thermally conductive substrate, a thermally conductive layer and a primer. The above-mentioned thermally conductive layer is composed of a plurality of thermally conductive fibers, thermally conductive sheets or any combination thereof. The above-mentioned flexible heat-conducting sheet can further form a flexible heat-conducting unit or a flexible heat-conducting component, which is formed by combining the above-mentioned flexible heat-conducting sheets, so as to further provide a more excellent heat conduction effect in the XY plane.

Description

Flexible thermally conductive sheet and its unit and assembly

A heat-conducting element for electronic components, especially a flexible heat-conducting sheet and its unit and assembly.

Most of today's integrated circuits are designed with a high degree of integration, so that the integrated circuits can provide better operating performance at a smaller size. However, as the integration degree of the transistors in the integrated circuit continues to increase, the waste heat generated during the operation of the integrated circuit will become more and more obvious. Therefore, it has become an important issue to quickly export the waste heat generated by the integrated circuit.

However, in a thin and light electronic product, the surface area that can provide heat dissipation is limited by the size of the electronic product itself, and the waste heat is not evenly distributed on the surface of the electronic product. Therefore, in order to maximize the heat dissipation effect in a limited heat dissipation space, it is necessary to distribute the waste heat evenly on the entire surface of the electronic product, so as to avoid excessive concentration of the waste heat on the position of the chip or battery. A conventional method is to attach an integrated heat-conducting sheet, such as a graphite sheet, to the surface of the electronic component, so that the waste heat can be conducted to the casing or the heat-dissipating element of the electronic product to facilitate heat dissipation. Common heat dissipation components such as heat sinks are often made of metals with good thermal conductivity, light weight and easy processing.

However, if the above-mentioned integrated thermal conductive sheet is used in a flexible electronic product, the thermal conductive sheet may be easily broken at the folded position, and the thermal conduction path will be cut off at the fractured part, so that waste heat will accumulate at the fractured position. Therefore, how to develop a thermally conductive sheet that can be applied to flexible electronic products has become an urgent problem to be solved by those skilled in the art.

Embodiments of the present invention develop a flexible thermally conductive sheet. The above-mentioned flexible thermally conductive sheet includes a flexible thermally conductive substrate, a thermally conductive layer and a primer. The above-mentioned thermally conductive layer is located on the above-mentioned flexible thermally conductive substrate and has a rough surface, and the above-mentioned thermally conductive layer is a plurality of thermally conductive fibers, thermally conductive sheets or any combination thereof. The above-mentioned primer is used for bonding the above-mentioned thermally conductive fibers or thermally conductive sheets to the above-mentioned flexible thermally conductive substrate.

According to yet another embodiment, the above-mentioned flexible thermally conductive substrate is copper foil, aluminum foil, silver foil, tin foil or any combination thereof.

According to yet another embodiment, the above-mentioned primer is polyurethane, epoxy resin, polyether resin, silicone glue, acrylic glue or any combination thereof.

According to another embodiment, the material of the thermally conductive fiber is carbon nanotube, graphite fiber, carbon fiber, aluminum nitride, aluminum oxide, zinc oxide, silicon carbide, aluminum hydroxide, magnesium oxide, silicon nitride, crystalline silicon oxide or any combination thereof. The length of the above-mentioned thermally conductive fibers is 50-10000 μm, for example, 100-600 μm. The diameter of the above-mentioned thermally conductive fibers ranges from 0.5 to 90 μm, such as 20 to 50 μm.

According to yet another embodiment, the material of the thermally conductive sheet is boron nitride or graphite. The length of the thermally conductive sheet is between 30-500 μm, such as 50, 150, 250, 350 or 450 μm; the thickness is between 2-100 nm, such as 5, 10, 20, 30, 40, 50, 60, 70, 80, 90 or 95 nm.

According to another embodiment, the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer are attached to the primer by spraying and sticking. The density of the above-mentioned thermally conductive fibers or thermally conductive sheets in the thermally conductive layer is between 300-10000 thermally conductive fibers/cm ² or between 300-10000 thermally conductive sheets/cm ² .

According to yet another embodiment, one end of the thermally conductive fiber or thermally conductive sheet of the thermally conductive layer is attached to the primer.

According to another embodiment, the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer are electrostatically treated to make one end stand on the primer. The above-mentioned thermally conductive fiber or thermally conductive sheet produces a three-dimensional structure on the above-mentioned primer.

According to the above-mentioned embodiment, another embodiment of the present invention further develops a flexible heat-conducting unit. The flexible heat-conducting unit includes two of the above-mentioned flexible heat-conducting sheets and an interlayer adhesive layer. The interlayer adhesive layer is located on the between two flexible thermally conductive sheets.

According to the above-mentioned embodiment, another embodiment of the present invention further develops a flexible heat-conducting component. The flexible heat-conducting component may include a plurality of the above-mentioned flexible heat-conducting units and a laminated adhesive layer. between adjacent flexible thermally conductive units.

Combining the technical features of the above embodiments, the following effects can be specifically claimed.

(1) Through the above-mentioned flexible thermally conductive sheet of one embodiment of the present invention, wherein the thermally conductive layer replaces the past integrated thermally conductive material with a plurality of thermally conductive fibers or thermally conductive sheets, so that the thermally conductive sheet located on the flexible electronic product can be avoided. Broken by folding or flipping.

(2) Through the above-mentioned flexible heat-conducting sheet of one embodiment of the present invention, when the waste heat is introduced into the heat-conducting layer, the three-dimensional structure of a plurality of heat-conducting fibers or heat-conducting sheets in the heat-conducting layer can further increase the surface area for heat dissipation and increase heat dissipation. Effect.

(3) Through the above-mentioned flexible heat-conducting sheet and its units and components according to an embodiment of the present invention, materials with good axial thermal conductivity, such as carbon nanotubes, graphite fibers and carbon fibers, can be used to make waste heat energy It conducts quickly on the XY plane of the chip or electronic component, so that the generated waste heat is evenly distributed on the surface of the electronic product to facilitate heat dissipation. The above-mentioned XY plane means parallel to the above-mentioned flexible thermally conductive substrate.

In order to describe the various embodiments of the present invention more specifically, the following description is supplemented by the accompanying drawings.

Please refer to FIG. 1 . FIG. 1 is a schematic cross-sectional view of a flexible thermally conductive sheet according to an embodiment of the present invention. The flexible thermally conductive sheet 100 of the present invention includes a flexible thermally conductive substrate 120 , a thermally conductive layer 140 and a primer 160 .

The thermally conductive layer 140 is located on the flexible thermally conductive substrate 120 and has a rough surface. The thermally conductive layer 140 may be composed of, for example, a plurality of thermally conductive fibers, thermally conductive sheets, or any combination thereof. The above-mentioned primer 160 is used for bonding the above-mentioned thermally conductive fibers or thermally conductive sheets to the above-mentioned flexible thermally conductive substrate 120 .

According to yet another embodiment, the material of the flexible thermally conductive substrate 120 can be, for example, copper foil, aluminum foil, tin foil or any combination thereof.

According to yet another embodiment, the above-mentioned primer 160 is polyurethane, epoxy resin, polyether resin, silicone glue, acrylic glue or any combination thereof.

According to another embodiment, the material of the thermally conductive fibers of the thermally conductive layer 140 may be, for example, carbon nanotubes, graphite fibers, carbon fibers, aluminum nitride, aluminum oxide, zinc oxide, silicon carbide, aluminum hydroxide, magnesium oxide, nitrogen Silicon, crystalline silicon oxide, or any combination thereof.

According to yet another embodiment, the material of the thermally conductive sheet of the thermally conductive layer 140 may be, for example, boron nitride or graphite.

According to another embodiment, the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer 140 are attached to the primer 160 by spraying and sticking.

According to another embodiment, if the above-mentioned flexible heat-conducting sheet 100 is directly or indirectly attached to the electronic component, it can be used not only as a heat-conducting sheet, but also as a heat-dissipating sheet. When the flexible thermally conductive sheet 100 is used as a heat sink, one end of the thermally conductive fiber or thermally conductive sheet of the thermally conductive layer 140 can stand on the above-mentioned primer 160 to increase the surface area for heat dissipation to facilitate heat dissipation. The processing method for making one end of the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer 140 stand on the primer 160 may be, for example, electrostatic processing, such as electrostatic flocking.

According to yet another embodiment, please refer to FIG. 2 , which is a schematic cross-sectional structure diagram of a flexible heat-conducting unit according to an embodiment of the present invention. The flexible thermally conductive unit 200 of the present invention includes two flexible thermally conductive sheets 100a, 100b and an adhesive layer 220 between the flexible thermally conductive sheets 100a, 100b. The flexible thermally conductive sheet 100a includes a flexible thermally conductive substrate 120a, a thermally conductive layer 140a and a primer 160a, and the flexible thermally conductive sheet 100b includes a flexible thermally conductive substrate 120b, a thermally conductive layer 140b and a primer 160b. The combination of the two flexible thermally conductive sheets 100a and 100b can make the thermally conductive layer 140a of the flexible thermally conductive sheet 100a face the thermally conductive layer 140b of the flexible thermally conductive sheet 100b, or make the thermally conductive layer 140b of the flexible thermally conductive sheet 100a face. 140a faces the flexible thermally conductive substrate 120b of the flexible thermally conductive sheet 100b.

The constituent materials and processing methods of each layer of the above-mentioned flexible thermally conductive sheets 100a and 100b are similar to or the same as those of the flexible thermally conductive sheet 100 in FIG.

According to yet another embodiment, the material of the above-mentioned interlayer adhesive layer 220 may be, for example, polyurethane, epoxy resin, polyether resin, silicone glue, acrylic glue or any combination thereof.

One side of the above-mentioned flexible heat-conducting unit 200 , such as the outer surface of the flexible heat-conducting substrate 120 a , can be directly or indirectly attached to the surface of the electronic component to help the electronic component dissipate heat; and the other side of the above-mentioned flexible heat-conducting unit 200 , such as the outer surface of the flexible thermally conductive substrate 120b, and other heat sinks may be additionally added, or the outer surface of the flexible thermally conductive substrate 120b may be etched to increase the surface area for heat dissipation.

According to yet another embodiment, please refer to FIG. 3 , which is a schematic cross-sectional structure diagram of the flexible thermally conductive unit of FIG. 2 in a folded state. In FIG. 3, since the two thermally conductive layers 140a, 140b are composed of a plurality of thermally conductive fibers or thermally conductive sheets, it can improve the conventional flexible electronic products when an integrated thermally conductive sheet (eg, a single graphite sheet) is used as the thermally conductive material. , the thermal conductive layer may break at the fold.

According to yet another embodiment, please refer to FIG. 4 , which is a schematic cross-sectional structure diagram of a flexible thermally conductive component according to another embodiment of the present invention. The flexible thermally conductive component 400 of the present invention includes flexible thermally conductive units 200a, 200b and a laminated adhesive layer 420 between the flexible thermally conductive units 200a, 200b. The materials and processing methods of the layers of the flexible heat-conducting units 200a and 200b are similar to or the same as those of the flexible heat-conducting unit 200 in FIG.

According to an embodiment, the above-mentioned laminated adhesive layer 420 can be, for example, polyurethane, epoxy resin, polyether resin, silicone glue, acrylic glue or any combination thereof.

The flexible heat-conducting component 400 of FIG. 4 can further enhance the waste heat conduction in the XY plane by combining at least two flexible heat-conducting units 200 , so it can be applied to flexible electronic products that generate a large amount of waste heat.

According to yet another embodiment, please refer to FIG. 5 . FIG. 5 is a schematic cross-sectional structure diagram of the flexible thermally conductive component of FIG. 4 in a folded state.

According to yet another embodiment, the external view of the above-mentioned flexible thermally conductive sheet 100 can be referred to FIGS. 6-7 . FIG. 6 is an actual appearance view of a macroscopic scale of a flexible thermally conductive sheet 100 according to an embodiment of the present invention. FIG. 7 is an actual appearance view of a flexible thermal conductive sheet 100 according to an embodiment of the present invention on a microscopic scale. Among them, in FIG. 6 , it is the flexible heat-conducting sheet 100 whose surface is electrostatically treated, and the three-dimensional structure formed by the heat-conducting fibers on the surface can be seen.

In view of the above, as shown in FIGS. 1-7 , an embodiment of the present invention provides a flexible thermally conductive sheet 100, wherein the thermally conductive layer 140 is composed of a plurality of thermally conductive fibers or thermally conductive sheets. During the process, the thermal conductive layer 140 will not be broken. The above-mentioned flexible thermally conductive sheet 100 can also be electrostatically treated to make the above-mentioned thermally conductive fibers or thermally conductive sheets stand on the primer 160 to increase the heat dissipation area. Therefore, the flexible heat-conducting sheet 100 of the present invention can achieve multi-functional purposes of heat conduction and heat dissipation.

Furthermore, the embodiment of the present invention further provides a flexible heat-conducting unit 200 and its component 400 with better planar heat-conducting effect. It can be applied to quickly and evenly disperse the waste heat of electronic components on the surface of flexible electronic products. The above-mentioned flexible heat-conducting unit 200 is formed by sandwiching two flexible heat-conducting sheets 100, and the heat-conducting fibers or heat-conducting sheets in the heat-conducting layer 140 are distributed on the XY plane due to the sandwiching, so that the thermal conductivity on the XY plane can be strengthened. Heat Conduction. In addition, a plurality of flexible heat-conducting units 200 can be further stacked to form a flexible heat-conducting component 400 according to product requirements to further enhance heat conduction on the XY plane to achieve a better heat-conducting effect.

The present invention is only disclosed by preferred embodiments herein. However, any person skilled in the art should understand that the above-mentioned embodiments are only used to describe the present invention, and are not intended to limit the scope of the claimed patent rights of the present invention. All changes or substitutions that are equal or equivalent to the above embodiments should be construed as being covered within the spirit or scope of the present invention. Therefore, the protection scope of this new model shall be defined by the following patent application scope.

100, 100a, 100b: Flexible thermally conductive sheet 120, 120a, 120b: flexible thermally conductive substrate 140, 140a, 140b: thermally conductive layer 160, 160a, 160b: Primer 200, 200a, 200b: Flexible thermally conductive units 220: sandwich adhesive layer 400: Flexible thermally conductive components 420: Laminate glue layer

In order to make the above-mentioned and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic cross-sectional view of a flexible thermally conductive sheet according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional structure diagram of a flexible thermally conductive unit according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of the folded state of the flexible thermally conductive unit of FIG. 2 . FIG. 4 is a schematic cross-sectional structure diagram of a flexible thermally conductive component according to another embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the folded state of the flexible thermally conductive component of FIG. 4 . FIG. 6 is an actual appearance view of a macroscopic scale of a flexible thermally conductive sheet according to an embodiment of the present invention. FIG. 7 is an actual appearance view of a micro-scale of a flexible thermally conductive sheet according to an embodiment of the present invention.

200: Flexible thermally conductive unit

100a, 100b: Flexible thermally conductive sheet

120a, 120b: flexible thermally conductive substrate

140a, 140b: thermally conductive layer

160a, 160b: Primer

220: sandwich adhesive layer

Claims (10)

A flexible thermal conductive sheet, comprising: a flexible thermally conductive substrate; a thermally conductive layer, located on the flexible thermally conductive substrate and having a rough surface, the material of the thermally conductive layer is a plurality of thermally conductive fibers, thermally conductive sheets or any combination thereof; and A primer is used for bonding the thermally conductive fibers or thermally conductive sheets on the flexible thermally conductive substrate. The flexible thermally conductive sheet according to claim 1, wherein the material of the flexible thermally conductive substrate is copper foil, aluminum foil, tin foil or any combination thereof. The flexible thermally conductive sheet according to claim 1, wherein the material of the primer is polyurethane, epoxy resin, polyether resin, silicone glue, acrylic glue or any combination thereof. The flexible thermally conductive sheet according to claim 1, wherein the materials of the thermally conductive fibers are carbon nanotubes, graphite fibers, carbon fibers, aluminum nitride, aluminum oxide, zinc oxide, silicon carbide, aluminum hydroxide, magnesium oxide , silicon nitride, crystalline silicon oxide, or any combination thereof. The flexible thermally conductive sheet according to claim 1, wherein the material of the thermally conductive sheets is boron nitride or graphite. The flexible thermally conductive sheet according to claim 1, wherein the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer are attached to the primer by spraying and sticking. The flexible thermally conductive sheet according to claim 6, wherein one end of the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer is attached to the primer. The flexible thermally conductive sheet according to claim 7, wherein the thermally conductive fibers or thermally conductive sheets of the thermally conductive layer are electrostatically treated to make one end stand on the primer. A flexible thermal conduction unit, comprising: 2. the flexible thermally conductive sheet according to any one of claims 1 to 8; and A sandwich adhesive layer is located between the two flexible heat-conducting sheets. A flexible thermally conductive assembly, comprising: At least two flexible thermally conductive units as claimed in claim 9; and At least one laminated adhesive layer is located between the adjacent flexible heat-conducting units.

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