TWM624078U - Surface-modified heat-dissipation device for vehicle - Google Patents

Abstract

The present invention provides a surface-modified vehicle heat-dissipating device comprising a metal heat-dissipating device, a sputtered metal layer, and a sintering layer. The sputtered metal layer is partially formed on the surface of the metal heat dissipation device by sputtering to form a modified region of the metal heat dissipation device, so as to modify the surface of the metal heat dissipation device. The sintered layer is formed between the sputtered metal layer and the at least one automotive electronic component module in a sintered bonding manner, so that the metal heat sink and the at least one automotive electronic component module are thermally coupled . Thereby, in addition to improving the bonding property, the electrical conductivity and thermal conductivity can be improved.

Description

A surface-modified vehicle radiator

The new model relates to a vehicle radiator, in particular to a vehicle radiator with a modified surface.

The current automotive electronic component modules, such as automotive IGBT modules or automotive ADAS modules, will generate high heat during operation. Without proper heat dissipation measures, the automotive electronic component modules may exceed the allowable temperature. , resulting in performance degradation and damage.

The technical problem to be solved by the present invention is to provide a surface-modified vehicle radiator in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides a surface-modified heat dissipation device for vehicles, including: a metal heat dissipation device; a sputtered metal layer partially formed on the surface of the metal heat dissipation device by sputtering forming a modification area of the metal heat dissipation device to modify the surface of the metal heat dissipation device; a sintered layer formed between the sputtered metal layer and at least one automotive electronic component module in a sintered bonding manner , so that the metal heat dissipation device is thermally coupled with the at least one vehicle electronic component module.

In a preferred embodiment, a fin structure is provided inside the metal heat sink.

In a preferred embodiment, the metal heat sink is a water-cooled or air-cooled metal heat sink.

In a preferred embodiment, the metal heat sink is a closed or semi-open metal heat sink.

In a preferred embodiment, the metal heat sink is formed of at least one of aluminum, aluminum alloy, copper, and copper alloy.

In a preferred embodiment, the sputtered metal layer is formed of one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy.

In a preferred embodiment, the sintered layer is a copper sintered layer formed by sintering paste-like copper or copper alloys.

In a preferred embodiment, the sintered layer is a silver sintered layer formed by sintering silver or a silver alloy of the paste.

In a preferred embodiment, the automotive electronic component module is one of an automotive IGBT module and an automotive ADAS module.

For a further understanding of the features and technical contents of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the related embodiments disclosed by the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Referring to FIG. 1 to FIG. 3 , a new embodiment of the present invention provides a surface modification and bonding method of a vehicle heat sink, which mainly includes the following steps.

First, (a) a metal heat sink 10 is provided. Further, in this embodiment, the metal heat sink 10 is provided with a fin structure 101, which may be a sheet-like fin structure or a pin-fin type structure, and Not limited to the above. Moreover, the metal heat sink 10 may be a water-cooled or air-cooled metal heat sink, or a closed or semi-open metal heat sink. Furthermore, the metal heat sink 10 may be made of at least one of aluminum, aluminum alloy, copper, and copper alloy.

Next, (b) forming a patterned sputtered metal layer 20 on the surface of the metal heat dissipation device 10 by sputtering to form a modified region of the metal heat dissipation device 10, so that the metal heat dissipation device 10 surface modification. Further, it can be masked by masking methods, such as masking jig, ink, and anti-plate tape, so as to form at least one masking area 90 on the surface of the metal heat sink 10, so that the masking area 90 is not formed with metal layer, so that the patterned sputtered metal layer 20 is formed on the surface of the metal heat dissipation device 10 .

In one embodiment, the sputtered metal layer 20 may be formed by sputtering a single metal. The single metal can be nickel, copper, silver. Therefore, the sputtered metal layer 20 may be a sputtered nickel layer, a sputtered copper layer, or a sputtered silver layer. Moreover, the thickness of the sputtered metal surface layer 20 is preferably in the range of 1 um to 5 um.

In one embodiment, the sputtered metal layer 20 may be formed by sputtered alloy metal. The alloying metal may be a nickel alloy, a copper alloy, or a silver alloy. Therefore, the sputtered metal layer 20 may also be a nickel alloy sputtered layer, a copper alloy sputtered layer, or a silver alloy sputtered layer.

Finally, (c) forming a joint with at least one automotive electronic component module 40 on the surface of the sputtered metal layer 20 by sintering, so that the metal heat sink 10 and the at least one automotive electronic component The modules 40 form thermal couplings. Further, in step (c), at least one sintered layer 30 is formed on the surface of the sputtered metal layer 20 to form a joint with at least one automotive electronic component module 40 . In addition, the sintered layer 30 may be a copper sintered layer formed by sintering copper or a copper alloy in a paste, or a silver sintering layer formed by sintering silver or a silver alloy in the paste. Furthermore, the automotive electronic component module 40 may be an automotive IGBT (Insulated Gate Bipolar Transistor) module, or an automotive ADAS (Advanced Driving Assistant System) module. Therefore, by forming a modified region on the surface of the metal heat sink 10, and the modified region is formed by the sputtered metal layer 20, the modified region has different properties than other regions, so that the modified region can pass through The formation of the modified region and the sintered bonding method enable the metal heat sink 10 to form thermal coupling with the at least one vehicle electronic component module 40, thereby not only improving the bonding, but also improving the electrical conductivity and thermal conductivity sex.

In addition, according to the above, the novel embodiment also provides a surface-modified vehicle heat dissipation device, which has a metal heat dissipation device 10 , a sputtered metal layer 20 , a sintered layer 30 , and a vehicle electronic component module 40 . Further, the sputtered metal layer 20 is partially formed on the surface of the metal heat sink 10 by sputtering to form a modified region of the metal heat sink 10 , so that the metal heat sink 10 is Surface modification. In addition, the sintered layer 30 is formed between the sputtered metal layer 20 and the automotive electronic component module 40 by sintering bonding, so that the metal heat sink 10 and the automotive electronic component module Group 40 forms a thermal coupling.

In one embodiment, a fin structure 101 may be disposed inside the metal heat dissipation device 10 . The metal heat sink 10 may be a water-cooled or air-cooled metal heat sink. The metal heat sink 10 can be a closed or semi-open metal heat sink. Furthermore, the metal heat sink 10 may be formed of at least one of aluminum, aluminum alloy, copper, and copper alloy.

In one embodiment, the sputtered metal layer 20 may be formed of one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy.

In one embodiment, the sintered layer 30 may be a copper sintered layer formed by sintering copper or copper alloys in a paste, or a silver sintering layer formed by sintering silver or silver alloys in a paste.

In one embodiment, the vehicle electronic component module 40 may be a vehicle IGBT module or a vehicle ADAS module.

To sum up the above, the surface-modified vehicle heat sink provided by the present invention can be locally formed on the surface of the metal heat sink 10 by sputtering through "metal heat sink 10" and "sputtered metal layer 20". , so as to form a modified region of the metal heat sink 10 to modify the surface of the metal heat sink 10 ”, “a sintered layer 30 is formed on the sputtered metal layer 20 and at least one vehicle Between the electronic component modules 40, the overall technical solution of the thermal coupling between the metal heat sink 10 and the at least one vehicle electronic component module 40 can be achieved through the formation of the surface modification zone and the sintering. In the bonding method, the metal heat sink 10 and the at least one vehicle electronic component module 40 are thermally coupled, thereby not only improving the bonding, but also improving the electrical conductivity and thermal conductivity.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Metal heat sink 101: Fin structure 20: Sputtering metal layer 30: Sintered layer 40: Automotive electronic component module 90: Shaded area

FIG. 1 is a schematic side view of a metal heat dissipation device in a new embodiment.

FIG. 2 is a schematic side view of a metal heat dissipation device in a new embodiment with a shielding region and a modified region formed on the surface thereof.

FIG. 3 is a schematic side view of the thermal coupling between the metal heat sink and the vehicle electronic component module according to the new embodiment.

10: Metal heat sink

101: Fin structure

20: Sputtering metal layer

30: Sintered layer

40: Automotive electronic component module

90: Shaded area

Claims (9)

A surface-modified vehicle radiator, comprising: a metal heat sink; a sputtered metal layer, which is partially formed on the surface of the metal heat dissipation device by sputtering to form a modified region of the metal heat dissipation device, so as to modify the surface of the metal heat dissipation device; A sintered layer is formed between the sputtered metal layer and the at least one automotive electronic component module in a sintered bonding manner, so that the metal heat sink and the at least one automotive electronic component module are thermally coupled . The surface-modified vehicle heat sink according to claim 1, wherein a fin structure is provided inside the metal heat sink. The surface-modified vehicle heat sink according to claim 2, wherein the metal heat sink is a water-cooled or air-cooled metal heat sink. The surface-modified vehicle heat sink according to claim 2, wherein the metal heat sink is a closed or semi-open metal heat sink. The surface-modified vehicle heat sink according to claim 2, wherein the metal heat sink is formed of at least one of aluminum, aluminum alloy, copper, and copper alloy. The surface-modified vehicle heat sink according to claim 1, wherein the sputtered metal layer is formed of one of nickel, nickel alloy, copper, copper alloy, silver, and silver alloy. The surface-modified vehicle heat sink according to claim 1, wherein the sintered layer is a copper sintered layer formed of sintered paste-like copper or copper alloy. The surface-modified vehicle heat sink according to claim 1, wherein the sintered layer is a silver sintered layer formed by sintering silver or a silver alloy of a paste-like body. The surface-modified vehicle heat sink according to claim 1, wherein the vehicle electronic component module is one of a vehicle IGBT module and a vehicle ADAS module.

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