TWM622891U - Light-emitting diode structure - Google Patents

Abstract

A light-emitting diode structure includes: a substrate, a conductive pad, and at least one light-emitting die. The substrate includes a connector. The conductive pad is arranged on the substrate. At least one light-emitting die is arranged on the substrate, and each light-emitting die is electrically connected to at least one conductive pad. Further, the conductive pad includes conductive layer or includes conductive layer and non-conductive layer that are non-volatile.

Description

Light Emitting Diode Structure

The present invention relates to a light-emitting diode structure, especially a light-emitting diode structure that improves production yield and saves production manpower requirements.

Light-emitting diode (LED) is a semiconductor component, which mainly converts electrical energy into light energy through semiconductor compounds to achieve luminous effect. Because of its advantages of long life, high stability and low power consumption, so It has been widely used in lighting. With the rapid development of light-emitting diodes and various application methods, in order to achieve the output of more color light, you can consider red (R), green (G), blue (B), or four colors in one. Red (R), green (G), blue (B), white (W), or red (R), green (G), blue (B), Alpha color space (A), etc. There are various combinations, and when a plurality of light emitting diodes need to change the exit angle of the light beam, a secondary optical lens is generally used, especially a total internal reflection (TIR) lens is more common. The traditional packaging production mode of multiple light-emitting diodes with connectors mainly includes the following two modes:

One of the production modes is to carry out the front-end operation of the surface mount technology (SMT) process in advance for mechanical components such as connectors, and use the machine to automatically brush the entire substrate with tin, which can make the distribution of the amount of solder paste. Good stability. . However, when the structural components of the substrate and the connector are produced through SMT, it will cause damage during the tin melting process. The sputtering of volatiles (such as rosin or flux, etc.) causes many abnormal conditions (for example, the oxidation of the surface of the substrate caused by the flux, etc.), so that subsequent processes such as die bonding are likely to encounter metal bonding wires The substrate or die-bonding bracket cannot be soldered, resulting in too low thrust of the gold ball or technical problems such as false soldering and sliding balls.

Another production mode is to place the connector mechanism components at the end of the production station for SMT operations, which is also the most commonly used method in the industry. In this way, it is expected to avoid other technical problems derived from the above-mentioned problem of splashing volatiles during the tin melting process. The procedural steps of the production mode are mainly to complete the die bonding and wire bonding process first, and then perform SMT to weld the connectors. However, before the semi-finished products in the workshop of the processing plant (the products that have completed the bonding and bonding) are moved to the SMT production station, solder paste must be applied to the semi-finished products, and then the connectors must be placed. Reflow oven for SMT soldering. Among them, because the semi-finished product cannot be directly brushed with tin, it is generally necessary to manually take out the semi-finished product, and place the semi-finished product on the dispenser to dispense solder paste, and it is also necessary to pay attention to whether the amount of solder paste is stable. Welding problem. As for the part where the connector is placed later, since the die bonding and wire bonding process has been completed on the substrate, the connector can only be placed by manual operation, and the automatic parting machine cannot be used for automatic action. In addition, each type of COB requires a lot of money to open molds of different sizes, and the COB needs to be placed in the reflow oven to be careful not to splash any solder paste or debris on the semi-finished product, otherwise cleaning will be difficult. very difficult. Usually, it is necessary to avoid touching the gold wire, so as to avoid short circuit, open circuit, concave deformation of the gold wire, etc., which will cause problems such as poor yield and increased product cost. Therefore, the labor cost and manufacturing cost required for the operation of placing the connector mechanism components at the end of the production station will be greatly increased, and there is a greater chance of human error resulting in a decrease in yield.

Therefore, how to design a light-emitting diode structure, especially how to solve the aforementioned technical problems in the prior art, is an important subject studied by the author of this case.

The purpose of this creation is to provide a light-emitting diode structure, which can solve the problem of volatiles splashing in the tin melting process in the prior art, and the technical problem that the manufacturing cost and yield cannot be improved, so as to achieve both the production cost and the manufacturing process. rate purpose.

In order to achieve the aforementioned objective, the light-emitting diode structure proposed in the present invention includes: a substrate, a conductive pad, and at least one light-emitting die. Wherein, the substrate includes a connector. The conductive pad is disposed on the substrate. The at least one light-emitting die is disposed on the substrate, and each light-emitting die is electrically connected to at least one of the conductive pads. Further, the conductive spacer is a non-volatile conductor layer, or a conductor layer and a non-conductor layer.

Further, in the light-emitting diode structure, the non-conductive layer is an FR-4 substrate comprising at least one of glass fiber, epoxy resin and BT resin.

Further, in the light-emitting diode structure, the conductor layers are two copper foils that are electrically connected to each other, and the two copper foils are respectively arranged on two symmetrical planes of the conductor layer.

Further, in the light-emitting diode structure, the conductive pad includes a FR-4 substrate and two copper foils. Wherein, the two copper foils are respectively disposed on two symmetrical planes of the FR-4 substrate, one of the copper foils has a through hole, the FR-4 substrate has a slot hole, and the through hole is aligned with the slot hole.

Further, in the light-emitting diode structure, the conductive pad further includes a copper-plated material, the copper-plated material is disposed on at least one of the through hole and the slot hole, and the copper-plated material is The material is electrically connected to the two copper foils.

Further, in the light-emitting diode structure, the conductive pad further includes two metal plating layers, the two metal plating layers are respectively disposed on the two copper foils, and one of the metal plating layers fills all the copper foils. The perforation makes the outer surfaces of the two metal plating layers flat.

Further, in the light-emitting diode structure, the metal plating layer is gold.

When using the light-emitting diode structure described in this invention, firstly, the conductive pad (or can be called as a Submount structure) and the at least one light-emitting die are arranged on the substrate, and then the Each light-emitting die is electrically connected to at least one conductive pad by a gold wire bonding process. Since the conductive pads include at least one conductive layer and at least one non-conductive layer that are symmetrically stacked and non-volatile, it can solve the technical problems of prior art connectors that perform the SMT process before the front-end operation (for example, The surface of the substrate is oxidized by the flux, etc.), which can be used in the subsequent processes such as die bonding and bonding to avoid technical problems such as the inability of metal bonding wires to be welded to the substrate or the die bonding bracket, or the gold ball thrust is too low, false soldering, sliding balls and other technical problems . Furthermore, in the bonding process of die bonding, by pre-configuring the Submount structure at the original bonding position, the solder paste volatiles that may be generated by the general technique of tin brushing in the subsequent SMT process can be prevented from adhering to the substrate and/or The technical problems on the die-bonding support ensure that the substrate and/or the die-bonding support can be smoothly bonded to the production process of the die-bonding line.

In addition, this creation is also because the Submount structure is introduced in the process of die bonding and bonding, so as to avoid the solder paste volatiles that may be generated in the SMT process from interfering with the bonding machine. problems such as optical/texture identification, or lead to poor wire bonding, for this reason, the identification ability of the production machine at the wire bonding station can also be improved. It improves the production efficiency of the factory or production line, solves the problems that cannot be solved by the prior art, and does not need to choose to place the connector mechanism components at the end of the production process, which can avoid the yield reduction caused by excessive manual operations. The benefit of reducing production costs can also be obtained.

Therefore, the light-emitting diode structure described in this creation can solve the problem of volatiles splashing in the tin melting process in the prior art, and the technical problem that the manufacturing cost and yield cannot be improved, so as to achieve both the production cost and the manufacturing process. the purpose of yield.

In order to have a better understanding of the techniques, means and effects of this creation to achieve the intended purpose, please refer to the following detailed descriptions and accompanying drawings of this creation. I believe that the features and characteristics of this creation can be used to gain an in-depth and specific understanding. , however, the attached drawings are only for reference and description, and are not intended to limit the creation.

10: Substrate

11: Contact

20: Conductive gasket

21: Copper foil

22: Non-conductor layer

23: Copper plated material

24: Metal Plating

30: Luminous Die

40: Gold wire

50: Connector

211: Perforation

221: slotted hole

1 is a schematic cross-sectional view of a light-emitting diode structure; FIG. 2 is a schematic top view of a light-emitting diode structure; FIG. 3 is a cross-sectional schematic view of a conductive pad of the light-emitting diode structure; And FIG. 4 is a schematic view of the processing of the conductive pad for creating the light-emitting diode structure.

The following describes the implementation of the present invention through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. This creation can also be implemented or applied through other different specific examples, and various details in this creation specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of this creation.

It should be noted that the structure, proportion, size, number of components, etc. shown in the drawings in this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those who are familiar with this technology, and are not intended to limit the possibilities of this creation. The limited conditions for implementation, so it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect and the purpose that this creation can produce, shall fall within the scope of this work. The technical content disclosed by the creation must be within the scope of coverage.

The technical content and detailed description of this creation are described below in conjunction with the drawings.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a schematic cross-sectional view of creating a light-emitting diode structure; and FIG. 2 is a top-view schematic view of creating a light-emitting diode structure. In one embodiment of the light-emitting diode structure described in the present invention, the light-emitting diode structure includes: a substrate 10 , a conductive pad 20 and at least one light-emitting die 30 . Wherein, the substrate 10 includes a connector 50 . The conductive pad 20 is disposed on the substrate 10 . The at least one light-emitting die 30 is disposed on the substrate 10 , and each light-emitting die 30 is electrically connected to at least one of the conductive pads 20 . Wherein, the conductive pad 20 includes a non-volatile conductor layer, or a conductor layer and a non-conductor layer 22 . Further, each light-emitting die 30 is electrically connected to at least one conductive pad 20 by a wire bonding process of the gold wire 40 . The numbers of the light-emitting die 30 and the conductive pads 20 are not necessarily the same, nor are they necessarily in a fixed quantity ratio relationship.

Please refer to FIGS. 2 to 4 , wherein, FIG. 2 is a schematic top view of a light-emitting diode structure; FIG. 3 is a cross-sectional schematic diagram of a conductive pad of a light-emitting diode structure; and FIG. 4 is The schematic diagram of the fabrication of the conductive pad of the light-emitting diode structure.

Further, the light-emitting die 30 can be fixed on the contacts 11 of the substrate 10 . The processing may be performed in a chip on board (COB) manner in which the bare die is directly attached to the substrate 10 . Chip direct packaging (COB) is relatively new to the LED market and offers more advantages than standard products. COB is basically a manufacturer bonding multiple LED chips (usually nine or more) directly to the substrate 10 to form a single module. Because the individual LEDs used in the COB are in chip form rather than traditional package form, the chip can be mounted in a space-reducing manner and the full potential of the LED chip can be utilized. After the COB package is energized, its appearance is more like a light-emitting board rather than multiple independent light-emitting bodies (the situation when multiple SMD LEDs are closely mounted). The COB is a packaging method of an integrated circuit. The method is to place a bare die on a carrier such as the substrate 10, and then use a thin metal wire as a wire to lead out the circuit. The package can also be matched with hard materials such as glass, quartz, sapphire, or other resin types other than polycarbonate (PC), acrylic (polymethyl methacrylate, PMMA), and silicone. High temperature resistant light-transmitting material. However, the foregoing content is only illustrative, and the present creation is not limited thereto.

The light-emitting die 30 may include red light-emitting diodes in the visible light range (eg, aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), indium gallium aluminum phosphide (AlGaInP), gallium phosphide doped Hetero zinc oxide (GaP: ZnO)), orange light-emitting diodes (eg: gallium arsenide phosphide (GaAsP), indium gallium aluminum phosphide (AlGaInP), gallium phosphide doped X (GaP: X)), Yellow light emitting diodes (eg: Gallium Arsenide Phosphide (GaAsP), Indium Gallium Aluminum Phosphide (AlGaInP), Gallium Phosphide Doped Nitrogen (GaP:N)), Green Light Emitting Diodes (eg: Indium Gallium Nitride (InGaN), gallium nitride (GaN), gallium phosphide (GaP), aluminum indium gallium phosphide (AlGaInP), aluminum gallium phosphide (lGaP), blue light-emitting diodes (eg: zinc selenide (ZnSe) , Indium Gallium Nitride (InGaN), Silicon Carbide (SiC), Violet Light Emitting Diodes (e.g. Indium Gallium Nitride (InGaN)), and Infrared Light Emitting Diodes (e.g. Arsenic) gallium nitride (GaAs), aluminum gallium arsenide (AlGaAs)) or UV light diodes (eg: diamond (diamond), aluminum nitride (AlN), aluminum gallium nitride (AlGaN), aluminum gallium indium nitride (AlGaInN) )Wait. And the form of the light-emitting die 30 can also include organic light-emitting diodes (organic light-emitting diodes, OLEDs). Further, a fluorescent colloid can be covered on the light-emitting die 30, so as to adjust the spectral range of the light and isolate it from the external environment, or can be further equipped with an anti-reflection film, an anti-fingerprint film, and an antibacterial film. , at least one of a hydrophobic film and an optically polarized film. However, the foregoing content is only illustrative, and the present creation is not limited thereto.

In the light-emitting diode structure described in this work, the non-conductive layer 22 is an FR-4 substrate including at least one of glass fiber, epoxy resin and BT resin. The BT resin is mainly composed of bismaleimide (BMI) and triazine, and is added with epoxy resins (epoxy resins), polyphenylene ether (PPE) or allyl compounds etc. as a thermosetting resin formed as a modified component. That is, the conductive pad 20 of the light-emitting diode structure of the present invention can be further processed by a printed circuit board (PCB). The most typical substrate materials of the printed circuit board are two types, namely copper clad Flexible copper clad laminate (FCCL) and resin coated copper (RCC) are currently the most widely used. The RCC is another type of multilayer board manufacturing material, which is an important base material for the production of laminates. The quality of the resin largely determines the reliability of the printed laminate. For example, cracks in the PCB pads and solder joints are likely to be caused by the quality of the resin. Today's PCB substrate outsole is made of copper foil layer (copper It is composed of three main components: foil, reinforcement, and epoxy. However, since the start of the lead-free process, the fourth item of fillers has been added to the PCB in large quantities. In order to improve the heat resistance or flame resistance of the PCB. However, the foregoing content is only illustrative, and the present creation is not limited thereto.

Further, in the light-emitting diode structure, the conductor layers are two copper foils 21 that are electrically connected to each other, and the two copper foils 21 are respectively disposed on two symmetrical planes of the conductor layer. The conductive spacer 20 of the light-emitting diode structure of the present invention can be further processed by a printed circuit board (PCB), as shown in FIG. 4( a ), which is a FCCL structure, a As shown in FIG. 4(b), the holes are drilled from the top of the conductive pad 20, but the copper foil 21 located under the conductive pad 20 is not drilled, so that the copper foil 21 located above the conductive pad 20 has a perforation 211, And the FR-4 substrate has a slot hole 221 , and the through hole 211 is aligned with the slot hole 221 . Further, as shown in FIG. 4( c ), the conductive pad 20 further includes a copper-plated material, and the copper-plated material 23 can be disposed on the through hole 211 and the slot hole 221 by a film coating process. And the copper plating material 23 is electrically connected to the two copper foils 21 . In one embodiment of the light-emitting diode structure described in the present invention, the conductive pad 20 may further include two metal plating layers 24, the two metal plating layers 24 are respectively disposed on the two copper foils 21, and one of the metal plating layers 24 fills the through hole 211 of one of the copper foils 21, so that the outer surfaces of the two metal plating layers 24 are flat, so as to improve the yield of the subsequent soldering process. Further, the metal plating layer is gold (Au). However, the foregoing content is only illustrative, and the present creation is not limited thereto.

When using the light-emitting diode structure described in this invention, firstly, the conductive pad 20 (or can be called a Submount structure) and the at least one light-emitting die 30 are arranged on the substrate 10 , and then the Each light-emitting die 30 is electrically connected to at least one conductive pad 20 by a wire-bonding process of gold wires 40 . Since the conductive spacer 20 comprises symmetrically laminated and non-volatile The at least one conductor layer and the at least one non-conductor layer 22 can solve the technical problems (for example, oxidation of the surface of the substrate 10 caused by the flux) that occurs when the connector 50 of the prior art performs the SMT process first in the front-end operation. Subsequent processes such as die bonding and wire bonding avoid technical problems such as the inability of metal bonding wires to bond to the substrate 10 and/or the die bonding support, or the low thrust force of the gold ball, false soldering, and sliding balls. Further, in the die bonding and wire bonding process, by pre-configuring the Submount structure at the original wire bonding position, it is possible to prevent the solder paste volatiles that may be generated in the subsequent SMT process by the solder brushing method of the general technology from adhering to the substrate 10 and/or. Or a technical problem on the die bonding support, to ensure that the substrate 10 and/or the die bonding support can be smoothly bonded to the production process of the die bonding line.

In addition, this creation also introduces the Submount structure in the process of bonding die bonding, so as to avoid the solder paste volatiles that may be generated in the SMT process from interfering with the optical/texture recognition of the bonding machine, or causing poor bonding. When such problems occur, the identification ability of the production machine at the welding line station can also be improved. The production efficiency of the factory or production line is improved, and the problems that cannot be solved by the prior art mentioned above are solved, and there is no need to choose to place the connector 50 mechanism components at the end of the production process, which can avoid the yield reduction caused by excessive manual operation. It also has the benefit of reducing production costs. At present, the implementation evaluation process of the submount structure of this creation has been actually used in the online identification and capture of the machine in the factory. The research results show that this creation can successfully perform operations such as die bonding and wire bonding, so that the identification rate of the machine can be improved. Reach 100%, and there is no bad identification or abnormal grasping problem.

Therefore, the light-emitting diode structure described in this creation can solve the problem of volatiles splashing in the tin melting process in the prior art, and the technical problem that the manufacturing cost and yield cannot be improved, so as to achieve both the production cost and the manufacturing process. the purpose of yield.

The above descriptions are only detailed descriptions and drawings of preferred specific embodiments of this creation, but the features of this creation are not limited to this, and are not intended to limit this creation, and all the scope of this creation The following patent application scope shall prevail. All embodiments that conform to the spirit of the patent application scope of this creation and its similar variations shall be included in the scope of this creation. Changes or modifications that can easily be conceived can be covered by the following patent scope of the present case.

10: Substrate

20: Conductive gasket

30: Luminous grains

40: Gold wire

50: Connector

Claims (7)

A light-emitting diode structure, comprising: a substrate including a connector; a conductive pad disposed on the substrate; and at least one light-emitting die disposed on the substrate, each of the light-emitting die is electrically connected to at least one The conductive pad; wherein, the conductive pad includes a non-volatile conductor layer, or a conductor layer and a non-conductor layer. The light-emitting diode structure of claim 1, wherein the non-conductive layer is an FR-4 substrate comprising at least one of glass fiber, epoxy resin and BT resin. The light-emitting diode structure of claim 1, wherein the conductor layers are two copper foils that are electrically connected to each other, and the two copper foils are respectively arranged on two symmetrical surfaces of the conductor layer. The light-emitting diode structure of claim 1, wherein the conductive spacer comprises an FR-4 substrate and two copper foils; wherein the two copper foils are respectively disposed on two symmetrical planes of the FR-4 substrate , one of the copper foils has a through hole, the FR-4 substrate has a slot hole, and the through hole is aligned with the slot hole. The light-emitting diode structure of claim 4, wherein the conductive pad further comprises a copper-plated material, the copper-plated material is disposed on at least one of the through hole and the slot hole, and the copper-plated material has electrical properties Connect the two copper foils. The light-emitting diode structure of claim 5, wherein the conductive pad further comprises two metal plating layers, the two metal plating layers are respectively disposed on the two copper foils, and one of the gold The metal plating layer fills the through hole of one of the copper foils, so that the outer surfaces of the two metal plating layers are flat. The light-emitting diode structure of claim 6, wherein each of the metal plating layers is gold.

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