TWM618329U - Heat conduction structure with liquid-gas splitting mechanism - Google Patents

Abstract

This creation is about a heat-conducting structure with a liquid-gas splitting mechanism. The heat-conducting structure includes a shell, a capillary structure, a separator, and a working fluid. The shell has a chamber that is divided into an evaporation chamber and an The condensing chamber and a communicating chamber formed between the evaporation chamber and the condensing chamber; the capillary structure covers the inner bottom wall of the chamber; the separator is accommodated in the communicating chamber and is stacked on the capillary structure, and the separator is connected to the communicating chamber. An air flow channel is formed between the inner top wall; the working fluid is arranged inside the chamber. In this way, the liquid working fluid and the gaseous working fluid are split through the separator, so as to improve the heat dissipation efficiency of the heat conducting structure.

Description

Heat conduction structure with liquid-gas splitting mechanism

This creation is about a kind of uniform temperature plate structure, and especially about a kind of heat conduction structure with liquid-gas splitting mechanism.

As the computing speed of electronic components continues to increase, the heat generated by them is also getting higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used Vapor Chambers with good thermal conductivity. , But there is still room for improvement in the thermal conductivity of the existing uniform temperature plate.

The traditional uniform temperature plate mainly includes an upper shell and a lower shell, and a capillary tissue is installed in the inner space of the upper shell and the lower shell respectively, and then the upper shell and the lower shell are welded correspondingly. Then, the working fluid is filled into the upper shell and the lower shell, and finally, the process of degassing and sealing is applied to complete the process.

However, the traditional uniform temperature plate has the following problems. When the uniform temperature plate part is designed with a smaller cross-sectional area, the gaseous working fluid flowing through the smaller cross-sectional area will increase the flow rate. This increased flow rate will affect the return flow The liquid working fluid is used for dragging, and the backflowing liquid working fluid is blocked at a small cross-sectional area, so that the uniform temperature plate produces undesirable conditions such as empty burning.

In view of this, the creator has focused on the above-mentioned existing technology, specially researched and cooperated with the application of academic theory, and tried his best to solve the above-mentioned problems, which became the goal of the creator's improvement.

This creation provides a heat-conducting structure with a liquid-gas splitting mechanism, which utilizes liquid working fluid and gaseous working fluid to split through a separator to improve the heat dissipation efficiency of the heat-conducting structure.

In this creative embodiment, this creative system provides a heat-conducting structure with a liquid-gas splitting mechanism, including: a shell with a cavity, the cavity is divided into an evaporation chamber, a condensation chamber and formed in the evaporation chamber A communicating chamber with the condensing chamber; a capillary structure covering the inner bottom wall of the chamber; a partition plate accommodated in the communicating chamber and stacked above the capillary structure, the partition plate and the An air flow channel is formed between the inner top wall of the communicating chamber; and a working fluid is arranged inside the chamber.

Based on the above, the liquid working fluid and the gaseous working fluid are divided through the separator, so that the liquid working fluid flows from the condensation chamber to the evaporation chamber along the capillary structure, and the gaseous working fluid flows from the evaporation chamber to the condensation chamber along the airflow channel, so the liquid working fluid is not affected by The interference of the gaseous working fluid can then smoothly return to the evaporation chamber, and at the same time avoid the heat accumulation or empty burning of the heat-conducting structure, so that the heat-conducting structure has excellent heat dissipation efficiency.

Based on the above, when the inner circumference of the communicating chamber is smaller than the inner circumference of the evaporation chamber, the gaseous working fluid will flow into the communicating chamber with a smaller cross-sectional area to increase the flow rate, but the separator does divide the liquid working fluid and the gaseous working fluid, so the liquid The working fluid will not be blocked by the increasing gaseous working fluid but will return to the evaporation chamber smoothly, which further enhances the heat dissipation efficiency of the heat conducting structure.

The detailed description and technical content of this creation will be explained as follows with the drawings. However, the attached drawings are only for illustrative purposes and are not used to limit this creation.

Please refer to FIG. 1 to FIG. 5. The present invention provides a heat-conducting structure with a liquid-gas split mechanism. The heat-conducting structure 10 mainly includes a housing 1, a capillary structure 2, a separator 3, and a working fluid.

As shown in FIGS. 1 to 5, the housing 1 has a chamber 11, which is divided into an evaporation chamber 111, a condensation chamber 112, and a communication chamber 113 formed between the evaporation chamber 111 and the condensation chamber 112. The working fluid is arranged inside the chamber 11, and the working fluid is a liquid that can produce a vapor-liquid phase change, such as pure water.

In addition, the size of the inner periphery of the communication chamber 113 is smaller than the size of the inner periphery of the evaporation chamber 111, and the housing 1 includes an upper shell plate 12 and a lower shell plate 13 assembled up and down.

The detailed description is as follows. The inner left and right sides of the communication chamber 113 have an inner left wall 116 and an inner right wall 117. There is a distance h between the inner left wall 116 and the inner right wall 117, and the distance h faces from the evaporation chamber 111. The direction of the condensation chamber 112 gradually decreases.

As shown in Figures 1 to 5, the capillary structure 2 covers the inner bottom wall 114 of the inner bottom of the chamber 11. The capillary structure 2 is one of powder sintering, metal mesh, porous material, foamed material and groove structure. Through its capillary adsorption force to transport the liquid working fluid.

As shown in Figures 1 to 5, the separator 3 is a metal foil such as a copper foil or an aluminum foil. The separator 3 is accommodated in the communicating chamber 113 and stacked above the capillary structure 2. The separator 3 and the interior of the communicating chamber 113 An air flow channel s is formed between the inner top wall 115 of the top.

For further explanation, the top view shape of the partition 3 matches the cross-sectional shape inside the communication chamber 113, so that the partition 3 completely covers the capillary structure 2 of the communication chamber 113, and the width w of the partition 3 faces from the evaporation chamber 111. The direction of the condensation chamber 112 gradually decreases. Among them, the partition piece 3 of this embodiment is a trapezoidal piece body 31, but it is not limited thereto.

As shown in FIGS. 4 to 5, the thermal conductive structure 10 of the present invention further includes a plurality of heat dissipation fins 4, and the plurality of heat dissipation fins 4 are arranged outside the condensation chamber 112.

Wherein, the outside of the evaporation chamber 111 and the heating element 200 on the circuit board 100 are thermally attached to each other. The liquid working fluid in the evaporation chamber 111 absorbs the heat generated by the heating element 200 and turns into a gaseous working fluid. When the gaseous working fluid reaches the condensing chamber 112 , The gaseous working fluid transfers heat to the heat dissipation fins 4 to become a liquid working fluid, and the liquid working fluid returns to the evaporation chamber 111 along the capillary structure 2 to form a thermal cycle.

As shown in Figures 4 to 5, the use state of the thermally conductive structure 10 of the present creation is that the partition 3 is accommodated in the communicating chamber 113 and stacked above the capillary structure 2. The partition 3 and the inner top wall of the communicating chamber 113 An airflow channel s is formed between 115, allowing the liquid working fluid to flow from the condensation chamber 112 to the evaporation chamber 111 along the capillary structure 2, and the gaseous working fluid to flow from the evaporation chamber 111 to the condensation chamber 112 along the airflow channel s. Thereby, the liquid working fluid and the gaseous working fluid are divided through the partition 3, and the liquid working fluid is not interfered by the gaseous working fluid, and can return to the evaporation chamber 111 smoothly, while avoiding defects such as heat accumulation or air burning in the heat conducting structure 10 In this case, the heat conducting structure 10 has excellent heat dissipation efficiency.

In addition, when the size of the inner periphery of the communication chamber 113 is smaller than the size of the inner periphery of the evaporation chamber 111, the gaseous working fluid will flow into the communication chamber 113 with a smaller cross-sectional area to increase the flow rate, but the partition 3 does divide the liquid working fluid and the gaseous working fluid. Therefore, the liquid working fluid will not be blocked by the speed-increasing gaseous working fluid and return to the evaporation chamber 111 smoothly, which further enhances the heat dissipation efficiency of the heat conducting structure 10.

Please refer to FIG. 6, which is another embodiment of the thermally conductive structure 10 of the present invention. The embodiment in FIG. 6 is substantially the same as the embodiment in FIGS. 1 to 5, and the embodiment in FIG. 6 is the same as the embodiment in FIGS. 1 to 5 The difference is that the numbers of the condensing chamber 112, the communicating chamber 113, and the partition plate 3 are plural respectively.

The detailed description is as follows. The outside of the evaporation chamber 111 can be thermally attached to a plurality of heating elements 200, and the plurality of condensation chambers 112 are arranged on the periphery of the evaporation chamber 111. Each communication chamber 113 is connected to the evaporation chamber 111 and each condensation chamber 112, and each partition 3 They are respectively accommodated in the communicating chambers 113 and stacked above the capillary structure 2 so that the heat generated by the heating element 200 can be transferred from the evaporation chamber 111 to the plurality of condensing chambers 112 to dissipate, thereby greatly increasing the heat dissipation efficiency of the heat conducting structure 10.

In summary, the heat-conducting structure with a liquid-gas splitting mechanism in this creation can indeed achieve the intended purpose of use, and solve the lack of conventional knowledge, and has industrial utility, novelty and progress, and fully meets the requirements of a patent application. The application is filed in accordance with the Patent Law, please check carefully and grant the patent for this case to protect the rights of the creator.

10: Heat conduction structure 1: shell 11: Chamber 111: Evaporation Chamber 112: Condensation chamber 113: Connecting Room 114: inner bottom wall 115: inner top wall 116: inner left wall 117: inner right wall 12: Upper shell 13: Lower shell 2: Capillary structure 3: Separator 31: Trapezoidal sheet body 4: cooling fins h: spacing s: airflow channel w: width 100: circuit board 200: heating element

Figure 1 is a three-dimensional exploded view of the heat-conducting structure of this creation.

Figure 2 is a three-dimensional assembly diagram of the heat-conducting structure of this creation.

Figure 3 is a schematic cross-sectional view of the thermal conductive structure of this creation.

Figure 4 is a schematic cross-sectional view of the use state of the thermal conductive structure of this creation.

Figure 5 is another cross-sectional schematic diagram of the use state of the thermal conductive structure of this creation.

Fig. 6 is a schematic cross-sectional view of another embodiment of the thermal conductive structure of the present invention.

10: Heat conduction structure

1: shell

11: Chamber

111: Evaporation Chamber

112: Condensation chamber

113: Connecting Room

12: Upper shell

13: Lower shell

2: Capillary structure

3: Separator

31: Trapezoidal sheet body

w: width

Claims (10)

A heat-conducting structure with a liquid-gas diversion mechanism, including: A housing with a chamber, the chamber is divided into an evaporation chamber, a condensation chamber, and a communication chamber formed between the evaporation chamber and the condensation chamber; A capillary structure covering the inner bottom wall of the chamber; A partition plate accommodated in the communicating chamber and stacked above the capillary structure, and an air flow channel is formed between the partition plate and the inner top wall of the communicating chamber; and A working fluid is arranged inside the chamber. The heat conduction structure with a liquid-gas splitting mechanism as described in claim 1, wherein the size of the inner periphery of the communication chamber is smaller than the size of the inner periphery of the evaporation chamber. The heat-conducting structure with a liquid-gas splitting mechanism according to claim 2, wherein the communicating chamber has an inner left wall and an inner right wall, and there is a distance between the inner left wall and the inner right wall, and the distance is from the inner left wall and the inner right wall. The evaporation chamber gradually decreases toward the condensing chamber. According to claim 3, the heat-conducting structure with a liquid-gas splitting mechanism, wherein the width of the partition sheet gradually decreases from the evaporation chamber to the condensation chamber, and the partition sheet is a trapezoidal sheet body. The heat-conducting structure with a liquid-gas splitting mechanism as described in claim 1, wherein the top view shape of the partition is matched with the cross-sectional shape of the inside of the communication chamber, so that the partition is completely covered on the capillary structure of the communication chamber . The thermal conductive structure with a liquid-gas splitting mechanism as described in claim 1, wherein the separator is a copper foil or an aluminum foil. As described in claim 1, the heat conduction structure with a liquid-gas splitting mechanism further includes a plurality of radiating fins, and the plurality of radiating fins are arranged outside the condensing chamber. The heat-conducting structure with a liquid-gas splitting mechanism as described in claim 1, wherein the capillary structure is one of powder sintering, metal mesh, porous material, foaming material, and groove structure. The heat-conducting structure with a liquid-gas splitting mechanism as described in claim 1, wherein the casing includes an upper shell plate and a lower shell plate connected up and down. The heat conduction structure with a liquid-gas split mechanism as described in claim 1, wherein the number of condensation chambers, communication chambers, and partitions are plural respectively, the plurality of condensation chambers are arranged on the periphery of the evaporation chamber, and each communication chamber is respectively connected to The evaporation chamber and each condensing chamber, and each of the partition plates are respectively accommodated in each of the communication chambers and are stacked above the capillary structure.

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