TWM618388U - Filter structure with any combination of R, G, B and IR - Google Patents
Filter structure with any combination of R, G, B and IR Download PDFInfo
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- TWM618388U TWM618388U TW109215799U TW109215799U TWM618388U TW M618388 U TWM618388 U TW M618388U TW 109215799 U TW109215799 U TW 109215799U TW 109215799 U TW109215799 U TW 109215799U TW M618388 U TWM618388 U TW M618388U
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- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 6
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 238000002834 transmittance Methods 0.000 claims description 31
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 29
- 229910052709 silver Inorganic materials 0.000 claims description 29
- 239000004332 silver Substances 0.000 claims description 29
- 230000008033 biological extinction Effects 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 6
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 6
- AZCUJQOIQYJWQJ-UHFFFAOYSA-N oxygen(2-) titanium(4+) trihydrate Chemical compound [O-2].[O-2].[Ti+4].O.O.O AZCUJQOIQYJWQJ-UHFFFAOYSA-N 0.000 claims description 6
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 6
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 8
- 229910009815 Ti3O5 Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
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Abstract
一種R、G、B、IR之其中任意組合濾光結溝,係包括一基板及一濾光層,其中該基板係為晶圓半導體感測元件,該濾光層係形成於該基板之一側面,由矩陣排列之複數基本單元所組成,每一基本單元包含由真空鍍膜方式形成之複數像素濾光膜,該複數像素濾光膜包含一R像素濾光膜、一G像素濾光膜、一B像素濾光膜及一IR像素濾光膜之其中任意複數者,且使該複數像素濾光膜僅只能供相對應波長之光線通過;藉此係可使濾光薄膜均勻性較佳(uniformity±5nm),以及可符合光學之規格需求。 A filter junction of any combination of R, G, B, and IR, comprising a substrate and a filter layer, wherein the substrate is a wafer semiconductor sensing element, and the filter layer is formed on one of the substrates The side surface is composed of a plurality of basic units arranged in a matrix. Each basic unit includes a plurality of pixel filter films formed by vacuum coating. The plurality of pixel filter films includes an R pixel filter film, a G pixel filter film, Any plural of a B pixel filter film and an IR pixel filter film, and the plural pixel filter films can only pass light of the corresponding wavelength; thereby, the uniformity of the filter film can be better ( uniformity±5nm), and can meet the requirements of optical specifications.
Description
本創作係一種關於應用於環境光源感測晶片(Ambient Light Sensor,ALS)、近接感測晶片(Proximity Sensor,PS)、RGB色溫感測晶片及手勢感測晶片…等光學傳感器之感測晶片上的濾光結構方面的技術領域,尤指一種可使濾光薄膜均勻性較佳(uniformity±5nm),以及可符合光學之規格需求之R、G、B、IR之任意組合濾光結構者。。 This creation is about the application of Ambient Light Sensor (ALS), Proximity Sensor (PS), RGB color temperature sensor and gesture sensor... In the technical field of the filter structure, it particularly refers to a filter structure with any combination of R, G, B, and IR that can achieve better uniformity of the filter film (uniformity ± 5 nm) and can meet the requirements of optical specifications. .
傳統的光學傳感器,如可見光攝像模組,需要採用红外光截止濾波器,將不必要的低頻近红外光過濾掉,以免红外光線對可見光部分造成影響,產生偽色或波纹,但該傳統的可見光攝像模組,未有獨立光譜R像素、G像素、B像素及IR像素,因此在350nm至700nm波段大範圍內皆高透過率,形成圖像具有低敏感分辨率,因此便需利用彩色濾光片進行R像素、G像素、B像素及IR像素之濾光作用,使形成圖像具有較高敏感分辨率。 Traditional optical sensors, such as visible light camera modules, need to use infrared light cut-off filters to filter out unnecessary low-frequency near-infrared light, so as to prevent infrared light from affecting the visible light part and produce false colors or ripples, but the traditional visible light The camera module does not have independent spectral R pixels, G pixels, B pixels and IR pixels, so it has high transmittance in a wide range of 350nm to 700nm, and the formed image has a low sensitivity resolution, so color filtering is required The film performs the filtering function of R pixels, G pixels, B pixels and IR pixels, so that the formed image has a higher sensitive resolution.
一般習知的彩色濾光片,如台灣申請第100112527號專利所示,其主要係使用噴墨印刷法,彩色濾光薄膜厚度在5微米左右,對於顏料光阻液的使用較為浪費,解析度及位置重現性較差,製造流程隨著基板尺寸逐步的增大,最初光阻劑塗佈的方式是由中央滴下(tube)再加上旋塗(spin coat),演進至今成為狹縫式塗佈(slit)加上旋塗,其目的無非是為了降低光阻 劑的使用量,而未來基板尺寸的更大型化,將會造成濾光薄膜之均勻性(uniformity)無法達到規格需求(±2%)及光學透光度和波長無法達到規格需求(截止帶低於穿透率1%)。 Commonly known color filters, as shown in the Taiwan Patent Application No. 100112527, mainly use inkjet printing. The thickness of the color filter film is about 5 microns, which wastes the use of pigment photoresist. The resolution And the reproducibility of the position is poor. The manufacturing process gradually increases with the size of the substrate. Initially, the method of photoresist coating is from the center drop (tube) plus spin coating (spin coating), and has evolved into a slit coating. Slit plus spin coating, its purpose is nothing more than to reduce photoresistance The amount of solvent used, and the larger size of the substrate in the future, will cause the uniformity of the filter film to fail to meet the specification requirements (±2%) and the optical transmittance and wavelength to fail to meet the specification requirements (low cut-off band) The penetration rate is 1%).
有鑒於此,本創作人乃係針對上述之問題,而深入構思,且積極研究改良試做而開發設計出本創作。 In view of this, the author developed and designed this creation based on the above-mentioned problems, and in-depth ideas, and actively researched and improved trial-making.
本創作主要目的係在於有效的解決習知彩色濾光片及其製造方法所存在之製作大型基板尺寸時濾光薄膜均勻性(uniformity)無法達到規格需求(±2%)及光學透光度和波長無法達到規格需求(截止帶低於穿透率1%)等問題者。 The main purpose of this creation is to effectively solve the problem of conventional color filters and their manufacturing methods when making large substrate sizes. The uniformity of the filter film cannot meet the specification requirements (±2%) and the optical transmittance. Those who have problems such as the wavelength that cannot meet the specification requirements (cut-off band is less than 1% of the transmittance).
本創作係提供一種R、G、B、IR之任意組合濾光結構,包括一基板及一濾光層。其中,該基板係為晶圓半導體感測元件。該濾光層係形成於該基板之一側面,由矩陣排列之複數基本單元所組成,每一基本單元包含由真空鍍膜方式形成之複數像素濾光膜,該複數像素濾光膜包含一R像素濾光膜、一G像素濾光膜、一B像素濾光膜及一IR像素濾光膜之其中任意複數者,且使該複數像素濾光膜僅只能供相對應波長之光線通過。 This creation is to provide a filter structure of any combination of R, G, B, and IR, including a substrate and a filter layer. Wherein, the substrate is a wafer semiconductor sensing element. The filter layer is formed on one side of the substrate and consists of a plurality of basic units arranged in a matrix. Each basic unit includes a plurality of pixel filter films formed by a vacuum coating method, and the plurality of pixel filter films includes an R pixel Any plural of the filter film, a G pixel filter film, a B pixel filter film, and an IR pixel filter film, and the plurality of pixel filter films can only pass light of corresponding wavelengths.
本創作所提供之R、G、B、IR之任意組合濾光結構,係可藉由真空鍍膜配合光阻遮罩之製作方式,使得即使是在製作大型基板尺寸時可使濾光薄膜厚度在300奈米至900奈米,均勻性達±5nm以下,而符合截止帶穿透率低於1%規格需求,進而當其應用於環境光感測晶片(Ambient Light Sensor,ALS)、近接感測晶片(Proximity Sensor,PS)、RGB色溫感測晶片及手勢感測晶片……等光學傳感器的感測晶片時,可使反應時間更為 快速,相對於同產品顏色辨別率及調整靈敏度可大幅提高,更是可大大提升感光對比的亮度呈現。。 The filter structure of any combination of R, G, B, IR provided by this creation can be made by vacuum coating with the photoresist mask, so that the thickness of the filter film can be reduced even when large substrate sizes are made. 300nm to 900nm, uniformity of less than ±5nm, and meets the cut-off band penetration rate of less than 1% specification requirements, and then when it is used in Ambient Light Sensor (ALS), proximity sensing Chip (Proximity Sensor, PS), RGB color temperature sensor chip and gesture sensor chip... When the sensor chip of the optical sensor, it can make the reaction time more Fast. Compared with the same product, the color recognition rate and adjustment sensitivity can be greatly improved, and the brightness of the photosensitive contrast can be greatly improved. .
10:基板 10: substrate
20:濾光層 20: filter layer
21:基本單元 21: basic unit
22:像素濾光膜 22: Pixel filter film
23:銀(Ag)層 23: Silver (Ag) layer
24:高折射率層 24: High refractive index layer
〔圖1〕係本創作之結構示意圖。 [Figure 1] is a schematic diagram of the structure of this creation.
〔圖2〕係本創作之濾光層的基本單元配置示意圖。 [Figure 2] is a schematic diagram of the basic unit configuration of the filter layer of this creation.
〔圖3〕係本創作之R像素濾光膜之光譜圖。 [Figure 3] is the spectrum of the R pixel filter film created by this creation.
〔圖4〕係本創作之G像素濾光膜之光譜圖。 [Figure 4] is the spectrogram of the G pixel filter film created by this creation.
〔圖5〕係本創作之B像素濾光膜之光譜圖。 [Figure 5] is the spectrum of the B pixel filter film created by this creation.
〔圖6〕係本創作之IR像素濾光膜之光譜圖。 [Figure 6] is the spectrum of the IR pixel filter film of this creation.
請參閱圖1及圖2所示,係顯示本創作所述之R、G、B、IR之任意組合濾光結構包括一基板10及一濾光層20,其中:
Please refer to Figures 1 and 2, which show that the filter structure of any combination of R, G, B, and IR described in this creation includes a
該基板10,係為晶圓半導體感測元件。
The
該濾光層20,係形成於該基板10之一側面,由矩陣排列之複數基本單元21所組成,每一基本單元21包含由真空鍍膜方式形成之複數像素濾光膜22。該複數像素濾光膜22包含一R像素濾光膜、一G像素濾光膜、一B像素濾光膜及一IR像素濾光膜之其中任意複數者,且使該複數像素濾光膜僅只能供相對應波長之光線通過。
The
本創作之每一基本單元21之複數像素濾光膜22之組合方式可為R像素濾光膜、一G像素濾光膜、一B像素濾光膜及一IR像素濾光膜之其中任意二者、任意三者或四者之組合,本實施例係以四者組合舉例之。
其中:
The combination of the plural
該R像素濾光膜,係由複數銀(Ag)層23及折射率比銀(Ag)層高之複數高折射率層24相互堆疊形成,厚度為300nm至900nm,使具有在300nm至1100nm波長範圍內形成一通帶,該通帶中心波長在625nm至740nm,其餘截止帶透過率低於1%,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%。
The R pixel filter film is formed by stacking a plurality of silver (Ag)
該G像素濾光膜,係由複數銀(Ag)層23及折射率比銀(Ag)層高之複數高折射率層24相互堆疊形成,厚度為300nm至900nm,使具有在300nm至1100nm的波長範圍內形成一通帶,該通帶中心波長在500nm至565nm,其餘截止帶透過率低於1%,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%。
The G pixel filter film is formed by stacking a plurality of silver (Ag)
該B像素濾光膜,係由複數銀(Ag)層23及折射率比銀(Ag)層高之複數高折射率層24相互堆疊形成,厚度為300nm至900nm,使具有在300nm至1100nm的波長範圍內形成的一通帶,該通帶中心波長在485nm至500nm,其餘截止帶透過率低於1%,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%。
The B pixel filter film is formed by stacking a plurality of silver (Ag)
該IR像素濾光膜,係由複數銀(Ag)層23及折射率比銀(Ag)層高之複數高折射率層24相互堆疊形成,厚度為300nm至900nm,使具有在300nm至1100nm的波長範圍內形成的一通帶,該中心波長在紅外800nm至1100nm之波長範圍內僅一部份或部分重疊形成一通帶,其餘截止帶透過率低於1%,該通帶的中心波長在入射角於0°時透過率(transmittance)大於30%。
The IR pixel filter film is formed by stacking a plurality of silver (Ag)
上述之該複數像素濾光膜22,其中該複數銀(Ag)層23在
350nm至2000nm波長範圍內的折射率為0.1至0.48,消光系數為5.85至14.4。該複數高折射率層24,其可為五氧化三鈦(Ti3O5)、二氧化鈦(TiO2)、五氧化二鈮(Nb2O5)、五氧化二鉭(Ta2O5)、混合膜料(H4)及其混合物。而且,該複數高折射率層24在350nm至1100nm的波長範圍內的折射率大於1.6,消光系數接近0。利用不同厚度及層數之該複數銀(Ag)層23及該複數高折射率層24的配合係可形成該R像素濾光膜、該G像素濾光膜、該B像素濾光膜及該IR像素濾光膜。
In the above-mentioned plural
以下茲就該R像素濾光膜、該G像素濾光膜、該B像素濾光膜及該IR像素濾光膜之各種結構條件舉例說明之。 Hereinafter, various structural conditions of the R pixel filter film, the G pixel filter film, the B pixel filter film, and the IR pixel filter film are described as examples.
該R像素濾光膜:該R像素濾光膜係由複數銀(Ag)層23及高折射率層24相互堆疊而成,該高折射率層24分別為五氧化三鈦(Ti3O5)、二氧化鈦(TiO2)、五氧化二鈮(Nb2O5)、五氧化二鉭(Ta2O5)、混合膜料(H4),相互堆疊厚度约400nm至800nm,其中,該五氧化三鈦(Ti3O5)層在350nm至1100nm波長範圍內的折射率大於2.5,消光系數接近0。該銀(Ag)層在350nm至2000nm波長範圍內的折射率為0.1至0.48,消光系數為5.85至14.4。其結構條件如下列諸表:
The R pixel filter film: The R pixel filter film is formed by stacking a plurality of silver (Ag)
如圖3所示,該R像素濾光膜具有在300nm至1100nm的波長範圍內形成一通帶,該通帶中心波長在625nm至740nm,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%,其餘截止帶透過率低於1%。 As shown in Figure 3, the R pixel filter film has a passband formed in the wavelength range of 300nm to 1100nm, the center wavelength of the passband is 625nm to 740nm, and the transmittance ( transmittance) is greater than 55%, and the transmittance of the other cut-off bands is less than 1%.
該G像素濾光膜:該G像素濾光膜係由複數銀(Ag)層23及高折射率層24相互堆疊而成,該高折射率層24分別為五氧化三鈦(Ti3O5)、二氧化鈦(TiO2)、五氧化二鈮(Nb2O5)、五氧化二鉭(Ta2O5)、混合膜料(H4),相互堆疊厚度约150nm至450nm,其中,該五氧化三鈦(Ti3O5)層在350nm至1100nm波長範圍內的折射率大於2.5,消光系數接近0。該銀(Ag)層在350nm至2000nm波長範圍內的折射率為0.1至0.48,消光系數為5.85至14.4。其結構
條件如下列諸表:
The G pixel filter film: The G pixel filter film is formed by stacking a plurality of silver (Ag)
如圖4所示,該G像素濾光膜具有在300nm至1100nm的波長範圍內形成一通帶,該通帶中心波長在500nm至565nm,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%,其餘截止帶透過率低於1%。 As shown in Figure 4, the G pixel filter film has a passband formed in the wavelength range of 300nm to 1100nm, the center wavelength of the passband is 500nm to 565nm, and the transmittance of the center wavelength of the passband at the incident angle of 0° ( transmittance) is greater than 55%, and the transmittance of the other cut-off bands is less than 1%.
該B像素濾光膜:該B像素濾光膜係由複數銀(Ag)層23及高折射率層24相互堆疊而成,該高折射率層24分別為五氧化三鈦(Ti3O5)、二氧化鈦(TiO2)、五氧化二鈮(Nb2O5)、五氧化二鉭(Ta2O5)、混合膜料(H4),相互堆疊厚度约200nm至600nm,其中,該五氧化三鈦(Ti3O5)層在350nm至1100nm波長範圍內的折射率大於2.5,消光系數接近0。該銀(Ag)層在350nm至2000nm波長範圍內的折射率為0.1至0.48,消光系數為5.85至14.4。其結構條件如下列諸表:
The B pixel filter film: The B pixel filter film is formed by stacking a plurality of silver (Ag) layers 23 and a high
如圖5所示,該B像素濾光膜具有在300nm至1100nm的波長範圍內形成一通帶,該通帶中心波長在485nm至500nm,該通帶中心波長在入射角於0°時透過率(transmittance)大於55%,其餘截止帶透過率低於1%。 As shown in Figure 5, the B pixel filter film has a passband formed in the wavelength range of 300nm to 1100nm, the central wavelength of the passband is 485nm to 500nm, and the transmittance of the central wavelength of the passband is at an incident angle of 0° ( transmittance) is greater than 55%, and the transmittance of the other cut-off bands is less than 1%.
該IR像素濾光膜:該IR像素濾光膜係由複數銀(Ag)層23及高折射率層24相互堆疊而成,該高折射率層24分別為五氧化三鈦(Ti3O5)、二氧化鈦(TiO2)、五氧化二鈮(Nb2O5)、五氧化二鉭(Ta2O5)、混合膜料(H4),相互堆疊厚度约200nm至600nm,其中,該五氧化三鈦(Ti3O5)層在350nm至1100nm波長範圍內的折射率大於2.5,消光系數接近0。該銀(Ag)層在350nm至2000nm波長範圍內的折射率為0.1至0.48,消光系數為5.85至14.4。其結構條件如下列諸表:
The IR pixel filter film: The IR pixel filter film is formed by stacking a plurality of silver (Ag) layers 23 and a high
如圖6所示,該IR像素濾光膜具有在300nm至1100nm的波長範圍內形成一通帶,該中心波長在紅外800nm至1100nm之波長範圍內僅一部份或部分重疊形成一通帶,其餘截止帶透過率低於1%,該通帶的中心波長在入射角於0°時透過率(transmittance)大於30%。 As shown in Figure 6, the IR pixel filter film has a pass band in the wavelength range of 300nm to 1100nm. The center wavelength is only partially or partially overlapped to form a pass band in the infrared wavelength range of 800nm to 1100nm, and the rest is cut off. The band transmittance is less than 1%, and the central wavelength of the passband has a transmittance greater than 30% when the incident angle is 0°.
本創作所提供之R、G、B、IR之任意組合濾光結構,係可藉由真空鍍膜配合光阻遮罩之製作方式,使得即使是在製作大型基板尺寸時可使濾光薄膜厚度在300奈米至900奈米,均勻性達±5nm以下,而符合光學規格需求,進而當其應用於環境光感測晶片(Ambient Light Sensor, ALS)、近接感測晶片(Proximity Sensor,PS)、RGB色溫感測晶片及手勢感測晶片……等光學傳感器的感測晶片時,可使反應時間更為快速,相對於同產品顏色辨別率及調整靈敏度可大幅提高,更是可大大提升感光對比的亮度呈現。 The filter structure of any combination of R, G, B, IR provided by this creation can be made by vacuum coating with the photoresist mask, so that the thickness of the filter film can be reduced even when large substrate sizes are made. 300nm to 900nm, the uniformity is less than ±5nm, and meets the requirements of optical specifications, and then when it is applied to the ambient light sensor chip (Ambient Light Sensor, ALS), proximity sensor chip (Proximity Sensor, PS), RGB color temperature sensor chip, gesture sensor chip... and other optical sensor sensor chips, which can make the reaction time faster, compared to the color recognition rate of the same product And adjusting the sensitivity can be greatly improved, and it can greatly improve the brightness of the photosensitive contrast.
10:基板 10: substrate
20:濾光層 20: filter layer
22:像素濾光膜 22: Pixel filter film
23:銀(Ag)層 23: Silver (Ag) layer
24:高折射率層 24: High refractive index layer
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