TWM618268U - Board-to-board bridge connector and connector assembly - Google Patents
Board-to-board bridge connector and connector assembly Download PDFInfo
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- TWM618268U TWM618268U TW110207157U TW110207157U TWM618268U TW M618268 U TWM618268 U TW M618268U TW 110207157 U TW110207157 U TW 110207157U TW 110207157 U TW110207157 U TW 110207157U TW M618268 U TWM618268 U TW M618268U
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- 239000002184 metal Substances 0.000 claims abstract description 36
- 230000008054 signal transmission Effects 0.000 description 13
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- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
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Abstract
本申請公開了一種板對板橋接連接器及連接器組件,板對板橋接連接器包含絕緣本體、複數訊號端子及金屬殼體,絕緣本體具有相對的第一表面及第二表面與位於第一表面及第二表面之間的側表面,第一表面及第二表面位於第一方向上;複數訊號端子沿與第一方向正交的第二方向間隔設置於絕緣本體且從第一表面露出;金屬殼體設置於絕緣本體的一側,金屬殼體位於絕緣本體的第二表面及側表面的一側,該些金屬殼體具有複數接地件,該些接地件位於絕緣本體在與第一方向及第二方向正交的第三方向上的側表面的一側。The application discloses a board-to-board bridge connector and a connector assembly. The board-to-board bridge connector includes an insulating body, a plurality of signal terminals, and a metal shell. The insulating body has a first surface and a second surface opposite to each other. The side surface between the surface and the second surface, the first surface and the second surface are located in the first direction; the plurality of signal terminals are arranged on the insulating body at intervals along the second direction orthogonal to the first direction and exposed from the first surface; The metal shell is arranged on one side of the insulating body, and the metal shell is located on one side of the second surface and the side surface of the insulating body. The metal shells have a plurality of grounding elements. One side of the side surface in the third direction orthogonal to the second direction.
Description
本申請涉及應用於連接器的技術領域,尤其涉及一種板對板橋接連接器及連接器組件。This application relates to the technical field applied to connectors, and in particular to a board-to-board bridge connector and a connector assembly.
目前板對板連接器通常包括二連接器及連接電路板,連接電路板與二連接器連接,連接電路板可為軟板及硬板。板對板連接器於使用時,板對板連接器的二連接器的端子分別與二電路板的接觸墊接觸或焊接,板對板連接器分別與二電路板之間透過螺絲鎖固。但目前板對板連接器無特別設置接地件與二電路板連接而接地,也表示板對板連接器在訊號傳輸過程中容易受到電磁干擾,進而影響板對板連接器的訊號傳輸性能。The current board-to-board connector usually includes two connectors and a connecting circuit board. The connecting circuit board is connected to the two connectors. The connecting circuit board can be a soft board or a hard board. When the board-to-board connector is used, the terminals of the two connectors of the board-to-board connector are respectively contacted or welded with the contact pads of the two circuit boards, and the board-to-board connectors are respectively locked with the two circuit boards through screws. However, the current board-to-board connector is grounded without a special grounding member to connect to the two circuit boards, which also means that the board-to-board connector is susceptible to electromagnetic interference during signal transmission, which affects the signal transmission performance of the board-to-board connector.
本申請實施例提供一種板對板橋接連接器及連接器組件,解決現有板對板連接器的訊號傳輸性能不佳的問題。The embodiments of the present application provide a board-to-board bridge connector and connector assembly to solve the problem of poor signal transmission performance of the existing board-to-board connector.
為了解決上述技術問題,本申請是這樣實現的:In order to solve the above technical problems, this application is implemented as follows:
在一實施例中,提供了一種板對板橋接連接器,包含:絕緣本體,具有相對的第一表面及第二表面與位於第一表面及第二表面之間的側表面,第一表面及第二表面位於第一方向上;複數訊號端子,沿與第一方向正交的第二方向間隔設置於絕緣本體且從第一表面露出;以及金屬殼體,設置於絕緣本體的一側,金屬殼體位於絕緣本體的第二表面及側表面的一側,該些金屬殼體具有複數接地件,該些接地件位於絕緣本體在與第一方向及第二方向正交的第三方向上的側表面的一側。In one embodiment, a board-to-board bridge connector is provided, including: an insulating body having a first surface and a second surface opposite to each other and a side surface located between the first surface and the second surface, the first surface and the second surface The second surface is located in the first direction; the plurality of signal terminals are arranged on the insulating body at intervals along the second direction orthogonal to the first direction and exposed from the first surface; and the metal shell is arranged on one side of the insulating body, and the metal The housing is located on one side of the second surface and the side surface of the insulating body, the metal housings have a plurality of grounding elements, and the grounding elements are located on the side of the insulating body in the third direction orthogonal to the first direction and the second direction. One side of the surface.
在另一實施例中,提供一種連接器組件,包含:如上述實施例的板對板橋接連接器;母電路板,具有複數第一訊號接觸墊及第一接地接觸墊,該些第一訊號接觸墊沿第二方向間隔設置,第一接地接觸墊設置於該些第一訊號接觸墊的一側;以及子電路板,具有複數第二訊號接觸墊及第二接地接觸墊,該些第二訊號接觸墊沿第二方向間隔設置,第二接地接觸墊設置於該些第二訊號接觸墊的一側;其中,板對板橋接連接器設置於母電路板及子電路板時,該些訊號端子分別與該些第一訊號接觸墊及該些第二訊號接觸墊接觸連接,該些接地件分別與第一接地接觸墊及第二接地接觸墊接觸連接。In another embodiment, a connector assembly is provided, including: the board-to-board bridge connector as in the above-mentioned embodiment; a mother circuit board having a plurality of first signal contact pads and first ground contact pads, the first signal The contact pads are arranged at intervals along the second direction, the first ground contact pads are arranged on one side of the first signal contact pads; and the sub-circuit board has a plurality of second signal contact pads and second ground contact pads, the second The signal contact pads are arranged at intervals along the second direction, and the second ground contact pads are arranged on one side of the second signal contact pads; wherein, when the board-to-board bridge connector is arranged on the mother circuit board and the daughter circuit board, the signal The terminals are respectively contact-connected with the first signal contact pads and the second signal contact pads, and the ground elements are contact-connected with the first ground contact pads and the second ground contact pads, respectively.
在又一實施例中,提供了一種連接器組件,包含:如上述實施例的二板對板橋接連接器;母電路板,其在第一方向上且相對的二表面分別具有複數第一訊號接觸墊及第一接地接觸墊,該些第一訊號接觸墊沿第二方向間隔設置,第一接地接觸墊設置於該些第一訊號接觸墊的一側;以及子電路板,其在第一方向上且相對的二表面分別具有複數第二訊號接觸墊及第二接地接觸墊,該些第二訊號接觸墊沿第二方向間隔設置,第二接地接觸墊設置於該些第二訊號接觸墊的一側;其中,二板對板橋接連接器分別設置於母電路板及子電路板在第一方向上且相對的二表面的一側時,該些訊號端子分別與該些第一訊號接觸墊及該些第二訊號接觸墊接觸連接,該些接地件分別與第一接地接觸墊及第二接地接觸墊接觸連接。In yet another embodiment, a connector assembly is provided, including: a two-board-to-board bridge connector as in the above-mentioned embodiment; a mother circuit board having a plurality of first signals on two opposite surfaces in a first direction Contact pads and first ground contact pads, the first signal contact pads are arranged at intervals along the second direction, the first ground contact pads are arranged on one side of the first signal contact pads; and the sub-circuit board, which is on the first Two opposite surfaces in the direction have a plurality of second signal contact pads and second ground contact pads respectively, the second signal contact pads are arranged at intervals along the second direction, and the second ground contact pads are arranged on the second signal contact pads Wherein, when the two board-to-board bridge connectors are respectively arranged on the side of the two opposite surfaces of the mother circuit board and the daughter circuit board in the first direction, the signal terminals are in contact with the first signals The pads and the second signal contact pads are in contact and connection, and the ground elements are respectively in contact and connection with the first ground contact pad and the second ground contact pad.
在本申請實施例中,透過在金屬殼體相對的二側設置有該些接地件,當板對板橋接連接器與母電路板及子電路板連接時,該些接地件與母電路板的第一接地接觸墊及子電路板的第二接地接觸墊,如此該些金屬殼體與母電路板及子電路板對該些訊號端子進行電磁屏蔽,防止板對板橋接連接器進行訊號傳輸時受到電磁干擾,有效提升板對板橋接連接器的訊號傳輸性能。本申請的該些訊號端子與母電路板的該些第一訊號接觸墊及子電路板的該些第二訊號接觸墊接觸連接,有效避免因焊接而產生虛焊或焊錫分布不均等問題,避免影響板對板橋接連接器的訊號傳輸性能。In the embodiment of the present application, by arranging the grounding parts on the two opposite sides of the metal shell, when the board-to-board bridge connector is connected to the mother circuit board and the daughter circuit board, the grounding parts and the mother circuit board The first ground contact pad and the second ground contact pad of the sub-circuit board, so that the metal shells, the mother circuit board and the sub-circuit board electromagnetically shield the signal terminals to prevent the board-to-board bridge connector from performing signal transmission Subject to electromagnetic interference, effectively improve the signal transmission performance of the board-to-board bridge connector. The signal terminals of the present application are in contact and connected with the first signal contact pads of the mother circuit board and the second signal contact pads of the sub-circuit board, effectively avoiding problems such as false soldering or uneven solder distribution due to soldering. Affect the signal transmission performance of the board-to-board bridge connector.
下面將結合本申請實施例中的圖式,對本申請實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例是本申請一部分實施例,而不是全部的實施例。基於本申請中的實施例,本領域普通技術人員在沒有作出進步性勞動前提下所獲得的所有其他實施例,均屬於本申請保護的範圍。The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without making progressive labor fall within the protection scope of this application.
請參閱圖1、圖2、圖3及圖4,是本申請第一實施例的板對板橋接連接器的立體圖、分解圖及圖1中沿A-A’線的剖視圖;如圖所示,板對板橋接連接器1包括絕緣本體10、複數訊號端子11及金屬殼體12,絕緣本體10具有相對的第一表面10a及第二表面10b與位於第一表面10a及第二表面10b之間的側表面10c,第一表面10a及該第二表面10b位於第一方向Z上。該些訊號端子11沿第二方向X間隔設置於絕緣本體10且從第一表面10a露出。金屬殼體12設置於絕緣本體10的一側,金屬殼體12位於絕緣本體10的第二表面10b及側表面10c的一側。Please refer to Figure 1, Figure 2, Figure 3 and Figure 4, which are a perspective view, an exploded view and a cross-sectional view along the line A-A' in Figure 1 of the board-to-board bridge connector of the first embodiment of the present application; , The board-to-
本實施例的絕緣本體10的第一表面10a具有複數第一凹槽101及複數第二凹槽102,該些第一凹槽101及該些第二凹槽102分別沿第二方向X間隔設置於第一表面10a上,該些第一凹槽101排列於該些第二凹槽102的一側,該些第一凹槽101分別與該些第二凹槽102一一對應。該些訊號端子11分別具有訊號連接部111、第一訊號接觸端部112及第二訊號接觸端部113,第一訊號接觸端部112及第二訊號接觸端部113設置於訊號連接部111的二側,該些訊號端子11的訊號連接部111分別設置於位於該些第一凹槽101及該些第二凹槽102之間的絕緣本體10中,該些訊號端子11的第一訊號接觸端部112分別位於該些第一凹槽101中,該些訊號端子11的第二訊號接觸端部113分別位於該些第二凹槽102中。本實施例的該些訊號端子11的第一訊號接觸端部112及第二訊號接觸端部113沿與第一方向Z及第二方向X正交的第三方向Y延伸,該些訊號端子11的第一訊號接觸端部112及第二訊號接觸端部113與水平方向大致上平行,該些訊號端子11的第一訊號接觸端部112分別具有第一訊號接觸凸部1121,該些訊號端子11的第二訊號接觸端部113分別具有第二訊號接觸凸部1131,該些訊號端子11的第一訊號接觸凸部1121及第二訊號接觸凸部1131沿第一方向Z且往遠離絕緣本體10的方向凸出。The
本實施例的金屬殼體12具有頂板121、複數側板122及複數接地件123,該些側板122沿頂板121的周緣間隔設置,該些接地件123設置於頂板121在第三方向Y上且相對的二側,該些接地件123位於相鄰的二側板122之間。當金屬殼體12組裝於絕緣本體10上時,頂板121設置於絕緣本體10的第二表面10b的一側,該些側板122設置於絕緣本體10的側表面10c的一側,該些接地件123位於絕緣本體10在第三方向Y上的側表面10c的一側,該些接地件123遠離頂板121的一端從絕緣本體10的第一表面10a凸出。具體的說,該些接地件123具有接地彈性臂1231及接地接觸凸部1232,接地彈性臂1231的一端與頂板121連接,接地接觸凸部1232設置於接地彈性臂1231遠離頂板121的一端連接,接地接觸凸部1232從絕緣本體10的第一表面10a凸出。The
請一併參閱圖5、圖6及圖7,是本申請第二實施例的連接器組件的立體圖、分解圖及圖5中沿B-B’線的剖視圖;如圖所示,本實施例的連接器組件2包括板對板橋接連接器1、母電路板21及子電路板22,板對板橋接連接器1是使用第一實施例的板對板橋接連接器,母電路板21具有複數第一訊號接觸墊211及第一接地接觸墊212,該些第一訊號接觸墊211沿第二方向X間隔設置,第一接地接觸墊212設置於該些第一訊號接觸墊211的一側,在本實施例中,第一接地接觸墊212為C字型,第一接地接觸墊212圍繞該些第一訊號接觸墊211設置。子電路板22具有複數第二訊號接觸墊221及第二接地接觸墊222,該些第二訊號接觸墊221沿第二方向X間隔設置,第二接地接觸墊222設置於該些第二訊號接觸墊221的一側,在本實施例中,第二接地接觸墊222為C字型,第二接地接觸墊222圍繞該些第二訊號接觸墊221設置。本實施例的母電路板21及子電路板22在第一方向Z上的厚度均相同,母電路板21及子電路板22位於同一水平面上,母電路板21具有該些第一訊號接觸墊211及第一接地接觸墊212的表面與子電路板22具有該些第二訊號接觸墊221及第二接地接觸墊222位於同一水平面上。當板對板橋接連接器1設置於母電路板21及子電路板22上時,板對板橋接連接器1的該些訊號端子11的第一訊號接觸凸部1121分別與該些第一訊號接觸墊211接觸連接,板對板橋接連接器1的該些訊號端子11的第二訊號接觸凸部1131分別與該些第二訊號接觸墊221接觸連接,板對板橋接連接器1的該些接地件123的接地接觸凸部1232分別與第一接地接觸墊212及第二接地接觸墊222接觸連接。Please refer to FIGS. 5, 6 and 7, which are a perspective view, an exploded view and a cross-sectional view along the line B-B' in FIG. 5 of the connector assembly of the second embodiment of the present application; as shown, this embodiment The
本實施例的該些訊號端子11透過折彎製程而形成,該些訊號端子11具有良好的彈性,該些訊號端子11無須與母電路板21的該些第一訊號接觸墊211及子電路板22的該些第二訊號接觸墊221焊接固定,也能確保該些訊號端子11的第一訊號接觸凸部1121及第二訊號接觸凸部1131能分別與母電路板21的該些第一訊號接觸墊211及子電路板22的該些第二訊號接觸墊221接觸連接。當板對板橋接連接器1受到過度擠壓時,因該些訊號端子11具有良好的彈性,避免該些訊號端子11過度擠壓母電路板21及子電路板22而使母電路板21及子電路板22損壞。The
此外,本實施例的金屬殼體12透過該些接地件123與母電路板21的第一接地接觸墊212及子電路板22的第二接地接觸墊222接觸連接,以電磁屏蔽位於金屬殼體12、母電路板21及子電路板22之間的該些訊號端子11和與該些訊號端子11連接的該些第一訊號接觸墊211及該些第二訊號接觸墊221,如此避免相接觸連接的該些訊號端子11、該些第一訊號接觸墊211及該些第二訊號接觸墊221在訊號傳輸過中發生電磁干擾的問題,本實施例的板對板橋接連接器1具有良好的電磁屏蔽效果,提升板對板橋接連接器1的訊號傳輸性能。In addition, the
如圖2、圖3及圖5所示,本實施例的板對板橋接連接器1還包括複數電源端子13,該些電源端子13設置於絕緣本體10且從第一表面10a露出,該些電源端子13位於絕緣本體10的二端或/及中部。在本實施例中,絕緣本體10的第一表面10a還具有複數第三凹槽103,該些電源端子13分別設置於該些第三凹槽103中。本實施例的該些電源端子13分別具有電源連接部131及複數電源接觸端部132,該些電源接觸端部132分別設置於電源連接部131的二端,該些電源接觸端部132沿第三方向Y延伸。該些電源接觸端部132分別具有電源接觸凸部1321,電源接觸凸部1321沿第一方向Z延伸且從絕緣本體10的第一表面10a凸出,如此板對板橋接連接器1適用於大功率的需求。母電路板21具有複數第一電源接觸墊213,子電路板22具有複數第二電源接觸墊223,當板對板橋接連接器1設置於母電路板21及子電路板22上時,該些電源端子13的電源接觸凸部1321分別與母電路板21的該些第一電源接觸墊213及子電路板22的該些第二電源接觸墊223接觸連接。As shown in Figures 2, 3, and 5, the board-to-
本實施例的絕緣本體10具有二第一固定穿孔104與在第三方向Y上且相對的第一側邊10d及第二側邊10e,二第一固定穿孔104位於絕緣本體10的二端,二第一固定穿孔104分別靠近第一側邊10d及第二側邊10e,換句話說,二第一固定穿孔104作對角設置。金屬殼體12具有二第二固定穿孔124,二第二固定穿孔124分別與二第一固定穿孔104對應,所以二第二固定穿孔124位於金屬殼體12的二端,二第二固定穿孔124作對角設置,二第二固定穿孔124分別靠近第一側邊10d及第二側邊10e。母電路板21的一端具有第三固定穿孔214,第三固定穿孔214與靠近第一側邊10d的第一固定穿孔104及第二固定穿孔124對應。子電路板22的一端具有第四固定穿孔224,第四固定穿孔224與靠近第二側邊10e的第一固定穿孔104及第二固定穿孔124對應,子電路板22的第四固定穿孔224與母電路板21的第三固定穿孔214作對角設置。因本實施例的板對板橋接連接器1透過鎖固方式固定於母電路板21及子電路板22,所以本實施例的該些訊號端子11不用與母電路板21及子電路板22焊接連接,如此能避免因焊接所產生虛焊或焊錫不均的問題而影響整體的訊號傳輸性能。The
本實施例的連接器組件2還包括二鎖固件23,二鎖固件23中一個分別穿過相對應的第二固定穿孔124、第一固定穿孔104及第三固定穿孔214而固定絕緣本體10、金屬殼體12及母電路板21,二鎖固件23中另一個分別穿過相對應的第二固定穿孔124、第一固定穿孔104及第四固定穿孔224而固定絕緣本體10、金屬殼體12及子電路板22。本實施例的鎖固件23是由螺絲與螺帽組成。本實施例的二鎖固件23的材質可為絕緣材質(例如塑膠)或導電材質(例如金屬),若二鎖固件23的材質為導電材質時,本實施例的母電路板21的第三固定穿孔214貫穿第一接地接觸墊212,子電路板22的第四固定穿孔224貫穿第二接地接觸墊222,二鎖固件23中一個與金屬殼體12及母電路板21的第一接地接觸墊212連接及二鎖固件23中另一個與金屬殼體12及子電路板22的第二接地接觸墊222連接,以達到接地的作用,進而增加板對板橋接連接器1的電磁屏蔽效果,並提升板對板橋接連接器1的訊號傳輸性能。The
本實施例的絕緣本體10的第一表面10a上還具有二定位柱105,二定位柱105位於絕緣本體10的二端,二定位柱105分別靠近第一側邊10d及第二側邊10e,換句話說,二定位柱105作對角設置。母電路板21的一端具有第一定位孔215,子電路板22遠離第一定位孔215的一端具有第二定位孔225。當板對板橋接連接器1設置於母電路板21及子電路板22上時,二定位柱105分別穿過母電路板21的第一定位孔215及子電路板22的第二定位孔225,以預先定位板對板橋接連接器1在母電路板21及子電路板22上的位置,確保該些訊號端子11及該些接地件123能準確地與母電路板21的該些第一訊號接觸墊211及第一接地接觸墊212及子電路板22的該些第二訊號接觸墊221及第二接地接觸墊222接觸連接,以利後續固定作業。The
本實施例的絕緣本體10的第一側邊10d及第二側邊10e分別還具有複數柱體106,該些柱體106沿第二方向X間隔設置且沿第三方向Y延伸,該些柱體106分別與該些側板122連接。該些側板122分別具有凹口1221及固持凸柱1222,固持凸柱1222位於凹口1221中且沿第一方向Z延伸。該些柱體106還分別具有固持孔1061,當絕緣本體10組裝於金屬殼體12時,該些柱體106分別設置於該些側板122的凹口1221中,該些側板122的固持凸柱1222分別穿過該些柱體106的固持孔1061,如此能增加絕緣本體10與金屬殼體12之間的穩固連接性。The
本實施例的絕緣本體10的第一側邊10d及第二側邊10e還分別具有凸肋107,凸肋107沿第三方向Y延伸。金屬殼體12在第三方向Y上且相對的二側還分別具有凸部125,凸部125沿第三方向Y延伸且包覆對應的凸肋107的第二表面10b及側表面10c,如此增加絕緣本體10及金屬殼體12的結構強度。In this embodiment, the
請參閱圖8、圖9及圖10,是本申請第三實施例的連接器組件的立體圖、分解圖及圖8中沿C-C’線的剖視圖;如圖所示,本實施例的連接器組件2包括二板對板橋接連接器1、母電路板21及子電路板22,二板對板橋接連接器1使用第一實施例的板對板橋接連接器,母電路板21在第一方向Z上且相對的二表面分別具有複數第一訊號接觸墊211及第一接地接觸墊212,該些第一訊號接觸墊211沿第二方向X間隔設置,第一接地接觸墊212設置於該些第一訊號接觸墊211的一側,在本實施例中,第一接地接觸墊212為C字型,第一接地接觸墊212圍繞該些第一訊號接觸墊211設置。子電路板22在第一方向Z上且相對的二表面分別具有複數第二訊號接觸墊221及第二接地接觸墊222,該些第二訊號接觸墊221沿第二方向X間隔設置,第二接地接觸墊222設置於該些第二訊號接觸墊221的一側。二板對板橋接連接器1分別設置於母電路板21及子電路板22在第一方向Z上且相對的二表面的一側時,二板對板橋接連接器1的該些訊號端子11的第一接觸凸部1121分別與該些第一訊號接觸墊211接觸連接,二板對板橋接連接器1的該些訊號端子11的第二訊號接觸凸部1131分別與該些第二訊號接觸墊221接觸連接,二板對板橋接連接器1的該些接地件123的接地接觸凸部1232分別與第一接地接觸墊212及第二接地接觸墊222接觸連接。Please refer to FIGS. 8, 9 and 10, which are a perspective view, an exploded view and a cross-sectional view along the line C-C' in FIG. 8 of the connector assembly of the third embodiment of the present application; as shown in the figure, the connection of this embodiment The
若有大功率的需求時,母電路板21在第一方向Z上且相對的二表面分別具有複數第一電源接觸墊213,子電路板22在第一方向Z上且相對的二表面分別具有複數第二電源接觸墊223,二板對板橋接連接器1的該些電源端子13的電源接觸凸部1321分別與母電路板21的該些第一電源接觸墊213及子電路板22的該些第二電源接觸墊223接觸連接。If there is a demand for high power, the
綜上所述,透過在金屬殼體相對的二側設置有該些接地件,當板對板橋接連接器與母電路板及子電路板連接時,該些接地件與母電路板的第一接地接觸墊及子電路板的第二接地接觸墊,如此該些金屬殼體與母電路板及子電路板對該些訊號端子進行電磁屏蔽,防止板對板橋接連接器進行訊號傳輸時受到電磁干擾,有效提升板對板橋接連接器的訊號傳輸性能。To sum up, by arranging the grounding parts on the two opposite sides of the metal shell, when the board-to-board bridge connector is connected to the mother circuit board and the daughter circuit board, the grounding parts are connected to the first circuit board of the mother circuit board. The ground contact pad and the second ground contact pad of the sub-circuit board, so that the metal shells, the mother circuit board and the sub-circuit board electromagnetically shield the signal terminals to prevent the board-to-board bridge connector from being electromagnetically exposed to the signal transmission Interference, effectively improve the signal transmission performance of the board-to-board bridge connector.
此外,本申請的該些訊號端子與母電路板的該些第一訊號接觸墊及子電路板的該些第二訊號接觸墊接觸連接,有效避免因焊接而產生虛焊或焊錫分布不均等問題,避免影響板對板橋接連接器的訊號傳輸性能。In addition, the signal terminals of the present application are in contact with the first signal contact pads of the mother circuit board and the second signal contact pads of the daughter circuit board, effectively avoiding problems such as false soldering or uneven solder distribution due to soldering. , To avoid affecting the signal transmission performance of the board-to-board bridge connector.
再者,本申請的該些訊號端子透過折彎製程而形成,且沿水平方向延伸,所以本申請的該些訊號端子具有良好的彈性,能確保該些訊號端子能與母電路板的該些第一訊號接觸墊及子電路板的該些第二訊號接觸墊接之間的接觸,也能避免該些訊號端子擠壓母電路板及子電路板而導致母電路板及子電路板損壞。Furthermore, the signal terminals of the present application are formed through a bending process and extend in a horizontal direction. Therefore, the signal terminals of the present application have good elasticity, which can ensure that the signal terminals can be connected to the mother circuit board. The contact between the first signal contact pads and the second signal contact pads of the daughter circuit board can also prevent the signal terminals from squeezing the mother circuit board and the daughter circuit board to damage the mother circuit board and the daughter circuit board.
1:板對板橋接連接器 10:絕緣本體 10a:第一表面 10b:第二表面 10c:側表面 10d:第一側邊 10e:第二側邊 101:第一凹槽 102:第二凹槽 103:第三凹槽 104:第一固定穿孔 105:定位柱 106:柱體 1061:固持孔 107:凸肋 11:訊號端子 111:訊號連接部 112:第一訊號接觸端部 1121:第一訊號接觸凸部 113:第二訊號接觸端部 1131:第二訊號接觸凸部 12:金屬殼體 121:頂板 122:側板 1221:凹口 1222:固持凸柱 123:接地件 1231:接地彈性臂 1232:接地接觸凸部 124:第二固定穿孔 125:凸部 13:電源端子 131:電源連接部 132:電源接觸端部 1321:電源接觸凸部 2:連接器組件 21:母電路板 211:第一訊號接觸墊 212:第一接地接觸墊 213:第一電源接觸墊 214:第三固定穿孔 215:第一定位孔 22:子電路板 221:第二訊號接觸墊 222:第二接地接觸墊 223:第二電源接觸墊 224:第四固定穿孔 225:第二定位孔 23:鎖固件 Z:第一方向 X:第二方向 Y:第三方向 1: Board-to-board bridge connector 10: Insulating body 10a: first surface 10b: second surface 10c: side surface 10d: first side 10e: second side 101: The first groove 102: second groove 103: third groove 104: The first fixed perforation 105: positioning column 106: Cylinder 1061: holding hole 107: Convex Rib 11: Signal terminal 111: Signal connection part 112: First signal contact end 1121: The first signal contacts the convex part 113: The second signal contact end 1131: The second signal contacts the convex part 12: Metal shell 121: top plate 122: side panel 1221: Notch 1222: holding boss 123: Grounding piece 1231: Ground elastic arm 1232: Ground contact protrusion 124: Second fixed perforation 125: Convex 13: Power terminal 131: Power connection 132: Power contact end 1321: Power contact protrusion 2: Connector assembly 21: Mother circuit board 211: The first signal contact pad 212: first ground contact pad 213: The first power contact pad 214: Third fixed perforation 215: The first positioning hole 22: Sub-circuit board 221: The second signal contact pad 222: second ground contact pad 223: second power contact pad 224: Fourth fixed perforation 225: second positioning hole 23: lock firmware Z: first direction X: second direction Y: Third party
此處所說明的圖式用來提供對本申請的進一步理解,構成本申請的一部分,本申請的示意性實施例及其說明用於解釋本申請,並不構成對本申請的不當限定。在圖式中: 圖1是本申請第一實施例的板對板橋接連接器的立體圖; 圖2是本申請第一實施例的板對板橋接連接器的另一立體圖; 圖3是本申請第一實施例的板對板橋接連接器的分解圖; 圖4是圖1中沿A-A’線的剖視圖; 圖5是本申請第二實施例的連接器組件的立體圖; 圖6是本申請第二實施例的連接器組件的分解圖; 圖7是圖5中沿B-B’線的剖視圖; 圖8是本申請第三實施例的連接器組件的立體圖; 圖9是本申請第三實施例的連接器組件的分解圖;以及 圖10是圖8中沿C-C’線的剖視圖。 The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The exemplary embodiments and descriptions of the application are used to explain the application, and do not constitute an improper limitation of the application. In the schema: Figure 1 is a perspective view of a board-to-board bridge connector according to a first embodiment of the present application; Figure 2 is another perspective view of the board-to-board bridge connector of the first embodiment of the present application; Figure 3 is an exploded view of the board-to-board bridge connector of the first embodiment of the present application; Figure 4 is a cross-sectional view taken along the line A-A' in Figure 1; Figure 5 is a perspective view of a connector assembly according to a second embodiment of the present application; Figure 6 is an exploded view of the connector assembly of the second embodiment of the present application; Figure 7 is a cross-sectional view taken along the line B-B' in Figure 5; Figure 8 is a perspective view of a connector assembly according to a third embodiment of the present application; Figure 9 is an exploded view of the connector assembly of the third embodiment of the present application; and Fig. 10 is a cross-sectional view taken along the line C-C' in Fig. 8.
1:板對板橋接連接器 1: Board-to-board bridge connector
10b:第二表面 10b: second surface
10c:側表面 10c: side surface
12:金屬殼體 12: Metal shell
121:頂板 121: top plate
122:側板 122: side panel
123:接地件 123: Grounding piece
1231:接地彈性臂 1231: Ground elastic arm
1232:接地接觸凸部 1232: Ground contact protrusion
Z:第一方向 Z: first direction
X:第二方向 X: second direction
Y:第三方向 Y: Third party
Claims (14)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110207157U TWM618268U (en) | 2021-06-21 | 2021-06-21 | Board-to-board bridge connector and connector assembly |
| CN202121786085.2U CN215681014U (en) | 2021-06-21 | 2021-08-02 | Board-to-Board Bridge Connectors and Connector Assemblies |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110207157U TWM618268U (en) | 2021-06-21 | 2021-06-21 | Board-to-board bridge connector and connector assembly |
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| TWM618268U true TWM618268U (en) | 2021-10-11 |
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| CN114976792B (en) * | 2022-06-29 | 2025-03-18 | Oppo广东移动通信有限公司 | Connectors and electronic devices |
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