TWM615992U - Passivation layer capable of preventing plasma corrosion - Google Patents

Abstract

The present invention provides a plasma corrosion resistant protective layer formed on a metal substrate. The plasma corrosion resistant protective layer includes a thermal barrier layer and a plasma corrosion resistant layer. The thermal barrier layer is arranged on the metal substrate. The plasma corrosion resistant layer is arranged on the thermal barrier layer. The thermal barrier layer can reduce the thermal expansion and contraction of the plasma cavity during operation, and avoid the stress caused by the difference in thermal expansion coefficient between the plasma cavity and the plasma corrosion resistant material, and the phenomenon of the plasma corrosion resistant material peeling off , In order to increase the stability of the anti-plasma protective film, and reduce the plasma corrosion of the plasma cavity, and reduce the frequency of machine maintenance.

Description

Protective layer resistant to plasma corrosion

This creation is about processes that require the application of plasma in optoelectronics and semiconductors such as IC manufacturing, liquid crystal display panels, light-emitting diodes, and micro-electromechanical industries, especially dry etching, physical meteorological deposition (PVD) and plasma-enhanced chemical meteorological deposition ( PE-CVD) and other technical fields, especially applied to any kind of optoelectronic and semiconductor industry dry etching or plasma-assisted thin film process, an anti-plasma layer structure that may be exposed to plasma internal components, the protective film The layer is used to improve the above-mentioned process yield and component service life.

In the current plasma process such as RIE (Reactive Ion Etch) or PECVD (Plasma enhanced chemical vapor deposition), the vacuum chamber or parts are exposed to the reactive plasma environment, and therefore are very susceptible to corrosion.

Please refer to Figure 1. Figure 1 shows a common way to improve corrosion. On the anodized layer 12 of the component 10, a plasma corrosion resistant material layer 11, such as yttrium aluminum garnet (Y ₃ Al ₅ O ₁₂ ) yttrium oxide (Y ₂ O ₃ ), yttrium fluoride (YF ₃ ), yttrium oxyfluoride (YOF) and other plasma corrosion resistant materials. Because these oxides contain heavier metal atoms, they are resistant to plasma corrosion. The ability is better, especially when forming a certain lattice directional structure (Texture structure), such as by ion beam electron gun evaporation (IAD) to extend the <111> direction of the plasma-resistant material lattice perpendicular to the surface of the substrate The arrangement, which is covered by a small single crystal structure in a specific direction, has better resistance to plasma erosion.

However, the plasma manufacturing process is performed in a highly corrosive environment, even if the plasma corrosion resistant material layer 11 is used to prevent the aluminum alloy substrate 13 from corroding. In fact, the plasma corrosion resistant material layer 11 has grain boundaries and defects that cause fine cracks. The plasma energy can still corrode the aluminum alloy substrate 13 through the cracks, resulting in the deterioration of the parts 10. In addition, the plasma process is still carried out in a high temperature environment (200oC~300oC), and the thermal expansion coefficient of the aluminum alloy substrate is relatively large (23.2×10 ^-6 /K @ 20℃), and the aluminum alloy substrate will expand after being heated. The cracks on the corrosion material layer 11 make the aluminum alloy substrate 13 more susceptible to plasma corrosion.

Therefore, how to solve the above problems is worth considering for those with ordinary knowledge in this field.

In order to solve the problem that the thermal expansion of the metal substrate expands the gap between the plasma corrosion resistant material layer, this creation is to add a low thermal conductivity thermal barrier layer between the plasma corrosion resistant layer and the anodized layer. It can reduce the thermal expansion of the metal substrate, and further improve the stability of the film structure and the corrosion resistance of the plasma corrosion resistance layer. The specific technical means are as follows: a protective layer resistant to plasma corrosion is formed on a metal substrate, and the protective layer resistant to plasma corrosion includes a thermal barrier layer and a plasma corrosion resistant layer. The thermal barrier layer is arranged on the metal substrate. The plasma corrosion resistant layer is arranged on the thermal barrier layer.

In the above-mentioned protective layer resistant to plasma corrosion, the metal substrate further includes an anode treatment layer, and the thermal barrier layer is disposed on the anode treatment layer.

In the above-mentioned plasma corrosion resistant protective layer, the thermal conductivity of the thermal barrier layer is less than half of the thermal conductivity of the anodized layer.

In the above-mentioned plasma corrosion resistant protective layer, the thermal conductivity of the thermal barrier layer is less than half of the thermal conductivity of the plasma corrosion resistant layer.

In the above-mentioned protective layer resistant to plasma corrosion, the thermal barrier layer has an amorphous structure.

The above-mentioned plasma corrosion resistant protective layer, wherein the thermal barrier layer is selected from the group consisting of yttrium (Y), gamma (Gd), and ytterbium (Yb) oxides and niobium (Nb) and zirconium (Zr) , Aluminum (Al), Hafnium (Hf) oxide group.

The above-mentioned plasma corrosion resistant protective layer, wherein the plasma corrosion resistant layer is selected from oxides of aluminum (Al), yttrium (Y), erbium (Er), rhodium (Rh), and oxides and nitrides of lanthanides , Borides and fluorides.

In the above-mentioned protective layer resistant to plasma corrosion, the thermal barrier layer is deposited by ion beam assisted electron gun evaporation (Ion Assisted Deposition, IAD) technology.

The above-mentioned plasma corrosion resistant protective layer, wherein the plasma corrosion resistant layer is deposited and formed by plasma spraying.

10: Parts

11: Use a layer of plasma corrosion resistant material

12: Anodized layer

13: Metal substrate

100: Protective layer resistant to plasma corrosion

110: Plasma corrosion resistant layer

120: Thermal barrier layer

200: Metal substrate

210: substrate

220: Anodized layer

S10~S20: Flowchart steps

Figure 1 shows a common way to improve corrosion.

Figure 2 shows a schematic diagram of the protective layer for plasma corrosion resistance created by this creation.

Figure 3 shows a side view of the thermal barrier layer.

FIG. 4 shows a method for forming a protective layer resistant to plasma corrosion.

Please refer to Figure 2. Figure 2 is a schematic diagram of the plasma corrosion resistant protective layer created for this creation. The protective layer 100 resistant to plasma corrosion is formed on a metal substrate 200. The plasma corrosion resistant protective layer 100 includes a thermal barrier layer 120 and a plasma corrosion resistant layer 110. The thermal barrier layer 120 is disposed on the metal substrate 200, and the plasma corrosion resistant layer 110 is disposed on the thermal barrier layer 120. In another embodiment, the metal substrate 200 includes a substrate 210 and an anodized layer 220, and the thermal barrier layer 120 is disposed on the anodized layer 220.

The thermal barrier layer 120 (Thermal Barrier Coating, TBC) is formed on the metal substrate through e-gun evaporation, physical vapor deposition (PVD), chemical weather deposition (CVD), plasma spraying and other methods. On 200, the deposition thickness is 5um~50um. The material of the thermal barrier layer 120 is selected from the group consisting of yttrium (Y), gamma (Gd), and ytterbium (Yb) oxides and niobium (Nb), zirconium (Zr), aluminum (Al), hafnium (Hf) ) A group of oxides. In this way, a thermal barrier layer 120 with low thermal conductivity can be formed, and the thermal conductivity of the thermal barrier layer 120 is less than half of the thermal conductivity of the anodized layer 220, and the thermal conductivity of the thermal barrier layer 120 is a plasma corrosion resistant layer The thermal conductivity of 110 is less than one-half. Furthermore, by controlling the deposition conditions, the thermal barrier layer 120 can be formed into an amorphous structure, which can reduce the porosity of the thermal barrier layer 120, thereby reducing the chance of plasma ions passing through the thermal barrier layer 120 to corrode the metal substrate 200 . In a preferred embodiment, the material of the thermal barrier layer 120 is yttrium stabilized zirconia (8YSZ), which has extremely low thermal conductivity (less than 4W/mk, and about 25W/mk for alumina). In another embodiment, the thermal barrier layer 120 may be deposited by ion beam assisted electron gun evaporation (Ion Assisted Deposition, IAD) technology, and the thickness of the laminate is 10 um to 20 um.

The plasma corrosion resistant layer 110 is deposited on the thermal barrier layer 120 through e-gun evaporation, physical vapor deposition (PVD), chemical vapor deposition (CVD), and plasma spraying. The material of the plasma corrosion resistant layer 110 is selected from the group consisting of aluminum (Al), yttrium (Y), erbium (Er), rhodium (Rh) oxides and lanthanide oxides, nitrides, borides, and fluorides Group. In a preferred embodiment, the material of the plasma corrosion resistant layer 110 is yttrium oxide (Y ₂ O ₃ ), which is deposited and formed by plasma spraying.

Please refer to FIG. 3, which is a side view of the thermal barrier layer. In FIG. 3, the thermal barrier layer 120 is formed by yttrium stabilized zirconia (8YSZ) deposition. Observation through a Thermal Field Emission Scanning Electron Microscope (FE-SEM) at a magnification of 35000, confirms that the porosity of the thermal barrier layer 120 is 0.5% or less.

Please refer to FIG. 4, which illustrates a method for forming a protective layer resistant to plasma corrosion. First, a thermal barrier layer 120 is formed on a metal substrate 200 (step S10). Wherein, in one embodiment, the metal substrate 200 includes a substrate 210 and an anodized layer 220, and in step S10, a thermal barrier layer 120 is formed on the anodized layer 220 of the metal substrate 200, and the thermal barrier layer The thermal conductivity of the anodized layer is less than one-half of the thermal conductivity.

Further, in step S10, the thermal barrier layer 120 (Thermal Barrier Coating, TBC) is deposited by electron gun evaporation (e-gun evaporation), physical vapor deposition (PVD), chemical weather deposition (CVD), plasma spraying Or the ion beam assisted electron gun evaporation (Ion Assisted Deposition, IAD) method is laminated and formed on the metal substrate 200. And the material of the thermal barrier layer 120 is selected from the group consisting of yttrium (Y), gamma (Gd), and ytterbium (Yb) oxides and niobium (Nb), zirconium (Zr), aluminum (Al), hafnium (Hf) ) A group of oxides.

In a preferred embodiment, in step S10, yttrium stabilized zirconia (8YSZ) is selected as the material, and the thermal barrier layer 120 is formed by stacking by the ion beam assisted electron gun evaporation (IAD) method. When performing ion beam assisted electron gun evaporation, the average evaporation rate of the material is 3A/s, and the temperature is kept at room temperature during the process to prevent thermal stress. The ion source is supplied with argon (Ar) and oxygen (O2) as plasma ion sources during the process, and ion beam evaporation is carried out with an ion beam intensity of at least 600V/600mA to form a thickness of 10um to 20um and an amorphous structure The thermal barrier layer 120.

After the thermal barrier layer 120 is formed, a plasma corrosion resistant layer 110 is formed on the thermal barrier layer 120 (step S20). The plasma corrosion resistant layer 110 is formed by e-gun evaporation, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma spraying, and the like. And the material of the plasma corrosion resistant layer 110 is selected from aluminum (Al), yttrium (Y), erbium (Er), rhodium (Rh) oxides and lanthanide oxides, nitrides, borides, and fluorides. 'S group. In a preferred embodiment, in step S20, yttrium oxide (Y ₂ O ₃ ) material is selected and deposited by plasma spraying to form the plasma corrosion resistant layer 110. In addition, the thermal conductivity of the thermal barrier layer 120 is less than half of the thermal conductivity of the plasma corrosion resistant layer 110.

The plasma corrosion resistant protective layer and its forming method provided by this creation are to form a thermal barrier layer 120 between the metal substrate 200 and the plasma corrosion resistant layer 110. The low thermal conductivity of the thermal barrier layer 120 is used to reduce the metal substrate. The phenomenon of thermal expansion of 200 reduces the chance of corrosion of the metal substrate 200. In addition, the thermal barrier layer 120 also has the characteristics of low porosity, which can further reduce the chance that the plasma passes through the thermal barrier layer 120 to corrode the metal substrate 200, and can increase the stability of the protective layer. Therefore, the plasma corrosion-resistant protective layer of this invention can improve the corrosion resistance of the plasma corrosion layer of the parts in the plasma process, and reduce the frequency of machine maintenance.

This creation is illustrated above with examples, but they are not used to limit the scope of the patent rights claimed by this creation. The scope of its patent protection shall be determined by the scope of the attached patent application and its equivalent fields. Any person with ordinary knowledge in the field, without departing from the spirit or scope of this patent, makes changes or modifications that are equivalent changes or designs completed under the spirit of this creation, and should be included in the scope of the following patent application Inside.

100: Protective layer resistant to plasma corrosion

110: Plasma corrosion resistant layer

120: Thermal barrier layer

200: Metal substrate

210: substrate

220: Anodized layer

Claims (9)

A protective layer resistant to plasma corrosion is formed on a metal substrate. The protective layer resistant to plasma corrosion includes: a thermal barrier layer disposed on the metal substrate; and a plasma resistant layer disposed on the thermal barrier Layer up. The plasma corrosion resistant protective layer according to claim 1, wherein the metal substrate further includes an anodized layer, and the thermal barrier layer is disposed on the anodized layer. The plasma corrosion resistant protective layer according to claim 2, wherein the thermal conductivity of the thermal barrier layer is less than half of the thermal conductivity of the anodized layer. The plasma corrosion resistant protective layer according to claim 1, wherein the thermal conductivity coefficient of the thermal barrier layer is less than half of the thermal conductivity coefficient of the plasma corrosion resistant layer. The protective layer resistant to plasma corrosion according to claim 1, wherein the thermal barrier layer has an amorphous structure. The plasma corrosion resistant protective layer according to claim 1, wherein the thermal barrier layer is selected from the group consisting of yttrium (Y), gamma (Gd), ytterbium (Yb) oxide and niobium (Nb) , Zirconium (Zr), Aluminum (Al), Hafnium (Hf) oxides. The plasma corrosion resistant protective layer according to claim 1, wherein the plasma corrosion resistant layer is selected from oxides of aluminum (Al), yttrium (Y), erbium (Er), rhodium (Rh), and lanthanides The group consisting of oxides, nitrides, borides, and fluorides. The protective layer resistant to plasma corrosion according to claim 1, wherein the thermal barrier layer is deposited by ion beam assisted electron gun evaporation (Ion Assisted Deposition, IAD) technology. The plasma corrosion resistant protective layer according to claim 1, wherein the plasma corrosion resistant layer is deposited and formed by plasma spraying.

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