TWM611272U - Electronic device - Google Patents

Abstract

An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid and a second colloid. The substrate includes a first side and a second side. The first side is opposite to a second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with conductive glue. There is a gap between the flexible circuit board and the polarizer. The first transparent glue layer is disposed on the second side of the substrate. The first colloid is used to bond at least two of the substrate, the polarizer and the flexible printed circuit board. The second colloid is used to bond at least two of the substrate, the flexible printed circuit board and the first transparent glue layer. The first colloid is not in contact with the second colloid.

Description

Electronic device

This case involves an electronic device. In detail, this case relates to an electronic device in the field of touch technology.

Existing touch panels do not have enough support up and down at the edges of the bonding area. In the process of assembling the touch panel, a bending test (bending) is required to confirm the stress load of the product, which will enable ultra-thin flexible substrates and flexible circuits in the future. The application of the joints of the boards is prone to cracks. For example, the prior art CN106444121B only uses an adhesive layer on one side of the substrate, which cannot meet the stress bonding support of ultra-thin flexible substrates in the future.

Therefore, the above-mentioned technology still has many shortcomings, and it is awaited for practitioners in the field to develop other suitable joining methods.

One aspect of this case involves an electronic device. The electronic device includes a substrate, a polarizing plate, a flexible circuit board, a first transparent glue layer, a first glue and a second glue. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizing plate is arranged on the first side of the substrate. The flexible circuit board is connected to the first side of the substrate with conductive glue. There is a gap between the flexible circuit board and the polarizing plate. The first transparent adhesive layer is disposed on the second side of the substrate. The first glue is bonded to at least two of the substrate, the polarizing plate and the flexible circuit board. The second glue is bonded to at least two of the substrate, the flexible circuit board and the first transparent glue layer. The first colloid is not in contact with the second colloid.

In some embodiments, the thickness of the first gel on the first side of the substrate is 2 to 5 times the thickness of the substrate.

In some embodiments, the thickness of the substrate is less than or equal to 50 microns.

In some embodiments, the first colloid and the second colloid are of the same material or different materials.

In some embodiments, the first colloid and the second colloid are one of acrylic type and silicone type.

In some embodiments, the electronic device further includes a second transparent glue layer. The second transparent glue layer is arranged on the polarizing plate and partially overlaps or does not overlap with the first glue.

In some embodiments, the thickness of the second colloid does not exceed 100 microns.

In some embodiments, the width of the second gel does not exceed 0.4 mm.

In some embodiments, the first glue joints the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer. The second glue joints the substrate, the flexible circuit board and the first transparent glue layer.

In some embodiments, the first glue is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent glue layer. The second glue joints the substrate, the flexible circuit board and the first transparent glue layer.

In some embodiments, the first glue joints the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer. The second glue joins the substrate and the flexible circuit board.

In some embodiments, the first glue joints the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer. The second glue connects the substrate and the first transparent glue layer.

In some embodiments, the first glue is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent glue layer. The second glue connects the substrate and the first transparent glue layer.

In some embodiments, the first glue is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent glue layer. The second glue joins the substrate and the flexible circuit board.

In summary, this case provides an electronic device to improve the problem of cracks during the bending test.

The above description is only used to explain the problem to be solved in this case, the technical means to solve the problem, and the effects produced by it, etc. The specific details of this case will be described in detail in the following embodiments and related drawings.

The following will clearly illustrate the spirit of this case with diagrams and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can change and modify the technology taught in this case without departing from the scope of this case. Spirit and scope.

The terms used herein are only to describe specific embodiments, and are not intended to limit the present application. Singular forms such as "a", "this", "this", "本" and "this", as used herein, also include plural forms.

Regarding the "include", "include", "have", "contain", etc. used in this article, they are all open terms, which means including but not limited to.

Regarding the terms used in this article, unless otherwise specified, each term usually has the usual meaning when used in this field, in the content of this case, and in the special content. Some terms used to describe the case will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the case.

FIG. 1A is a partial structure diagram of an electronic device according to some embodiments of the present application. In some embodiments, referring to FIG. 1A, the electronic device 100 includes a substrate 110, a polarizer 120, a flexible circuit board 130, a first transparent adhesive layer 140, a first gel 150 and a second gel 160. In some embodiments, the electronic device 100 further includes a second transparent adhesive layer 170 and a cover plate 180.

In some embodiments, the substrate 110 includes a first side and a second side. The first side is above the substrate 110 in FIG. 1A. The second side is below the substrate 110 in FIG. 1A. The first side is opposite to the second side. It should be noted that, in Figure 1A, although the first side and the second side are shown above and below in the figure, in practice, the first side and the second side are not limited to above and below. In some embodiments, the substrate 110 is a one-piece glass touch panel (One Glass Solution, OGS) structure. It should be noted that this single-chip touch panel is also more susceptible to breakage when dropped or impacted. However, since the substrate 110 in this case uses plastics such as CPI (Colorless Polyimide), PI (Polyimide), or PET (polyethylene terephthalate), the substrate 110 slightly reduces the impact force and withstands a certain range of bending when dropped or impacted.

In addition, the polarizing plate 120 is disposed on the first side of the substrate 110. The flexible circuit board 130 is connected to the first side of the substrate 110 with a conductive adhesive C. In some embodiments, the thickness H1 of the substrate 110 is less than or equal to 50 microns. In some embodiments, the conductive adhesive C is anisotropic conductive adhesive.

In some embodiments, there is a gap G between the flexible circuit board 130 and the polarizing plate 120. The first transparent adhesive layer 140 is disposed on the second side of the substrate 110. The first glue 150 is bonded to at least two of the substrate 110, the polarizing plate 120 and the flexible circuit board 130. The second glue 160 joins at least two of the substrate 110, the flexible circuit board 130 and the first transparent glue layer 140. The first colloid 150 is not in contact with the second colloid 160. In some embodiments, the width D1 of the gap G ranges from 0.5 mm to 1.5 mm. When the first glue 150 fills the gap G, the width of the first glue 150 is the same as the gap G. In some embodiments, the shape and size of the first colloid 150 and the second colloid 160 are not limited by the drawings.

In some embodiments, the thickness H3 of the first transparent adhesive layer 140 is 100 microns. The thickness H6 of the second transparent adhesive layer 170 is 50 microns. The thickness H7 of the cover plate 180 is 60 microns. It should be noted that the first transparent adhesive layer 140 and the second transparent adhesive layer 170 are elastic and can absorb most of the external force, reducing the influence of the external force on the substrate 110.

In some embodiments, the first gel 150 and the second gel 160 are made of the same material or different materials. In some embodiments, the material of the first gel 150 and the second gel 160 can be one of acrylic gel and silicone gel. In some embodiments, the acrylic adhesive system can be one of Hysol-PC40-UMF, PERTEX-8106, Henkel-3319M, etc., but is not limited thereto. In some embodiments, the silicone system can be Wacker-Lumi100 and Momentive-OP2012L. It should be noted that the first colloid 150 and the second colloid 160 in this case are a kind of curing glue and used to strengthen and consolidate the joint structure of the substrate 110 and the flexible circuit board 130 of the case, and make the joint structure bend dozens of times and the rear panel will not Cracks are generated.

In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and partially overlaps the second transparent glue layer 170. The second glue joints the substrate 110, the flexible circuit board 130 and the first transparent glue layer 140.

FIG. 1B is a partial structural diagram of an electronic device according to some embodiments of the present application. In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and does not overlap the second transparent glue layer 170. The second glue 150 joins the substrate 110, the flexible circuit board 130 and the first transparent glue layer 140.

FIG. 1C is a partial structural diagram of an electronic device according to some embodiments of the present application. In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and partially overlaps the second transparent glue layer 170. The second glue 160 joins the substrate 110 and the flexible circuit board 130.

FIG. 1D is a partial structural diagram of an electronic device according to some embodiments of the present application. In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and partially overlaps the second transparent glue layer 170. The second glue 160A joins the substrate 110 and the first transparent glue layer 140. It should be noted that the second glue 160A includes a thickness H8 and a width D3. The second glue 160A determines the dispensing range according to the structure and the shape and size are not limited by the drawing.

FIG. 1E is a partial structural diagram of an electronic device according to some embodiments of the present application. In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and does not overlap the second transparent glue layer 170. The second glue 160B joins the substrate 110 and the first transparent glue layer 140. It should be noted that the second colloid 160B includes a thickness H9 and a width D4, and the second colloid 160B determines the dispensing range and the shape and size are not limited by the diagram.

FIG. 1F is a partial structural diagram of an electronic device according to some embodiments of the present application. In some embodiments, the first glue 150 joins the polarizer 120 and the flexible circuit board 130 and does not overlap the second transparent glue layer 170. The second glue 160 joins the substrate 110 and the flexible circuit board 130. The first transparent glue layer 140 may not contact the second glue 160. The structures of the first transparent adhesive layer 140 and the second transparent adhesive layer 170 can be designed according to actual requirements, and are not limited to FIGS. 1A to 1F.

In some embodiments, in order to make the structure of the electronic device 100 in this case easy to understand, please refer to FIG. 1A, FIG. 2 and FIG. 3 together. FIG. 2 is a partial structural side view of the electronic device according to some embodiments of the present application. FIG. 3 is a top view of a partial structure of the electronic device shown in FIG. 2 according to some embodiments of the present application. It should be noted that part of the structure in FIG. 2 and FIG. 3 only shows the substrate 110, the polarizing plate 120, the flexible circuit board 130 and the first glue 150.

In some embodiments, referring to FIG. 2, the first glue 150 is on the substrate 110, and the first glue 150 must fill the gap G. In addition, the thickness H4 of the first colloid 150 is between 70 μm and 110 μm. The thickness H41 of the partial layer structure 152 of the first glue 150 on the flexible circuit board 130 is between 20 and 60 microns.

In some embodiments, the thickness H6 of the first gel 150 on the first side of the substrate 110 is 2 to 5 times the thickness H1 of the substrate 110. In some embodiments, the thickness H41 of the partial layer structure 152 of the first glue 150 on the flexible circuit board 130 is 0.8 to 2.4 times the thickness H1 of the substrate 110.

In some embodiments, please refer to Fig. 3, there is a gap G between the flexible circuit board 130 and the polarizing plate 120, as shown in Fig. 3, the first glue 150 fills the joint between the flexible circuit board 130 and the substrate 110 , And join the polarizing plate 120. In some embodiments, the thickness H2 of the polarizer 120 is 66 microns.

In some embodiments, the first colloid 150 and the second colloid 160 are not in contact, and therefore, from a top view, the second colloid 160 cannot be seen.

In some embodiments, the second transparent glue layer 170 is disposed on the polarizing plate 120 and partially overlaps or does not overlap with the first glue 150.

FIG. 4 is a partial structural side view of the electronic device according to some embodiments of the present application. It should be noted that, compared to FIG. 2, FIG. 4 is a side view of adding a second gel 160.

In some embodiments, referring to FIG. 4, the thickness H5 of the second colloid 160 does not exceed 100 μm, and the second colloid 160 is about 4 times the thickness of the substrate 110. The thickness H4 of the first colloid 150 is approximately 0.7 to 1.1 times the thickness H5 of the second colloid 160.

FIG. 5 is a top view of a partial structure of the electronic device shown in FIG. 4 according to some embodiments of the present application. FIG. 6 is a bottom view of a partial structure of the electronic device shown in FIG. 4 according to some embodiments of the present application.

In some embodiments, referring to FIGS. 4 and 6, the width D2 of the second glue 160 to the flexible circuit board 130 based on the substrate 110 does not exceed 0.4 mm, and the second glue 160 spilling on the substrate 110 may not Take control.

According to the foregoing embodiment, the present application provides an electronic device to improve the problem of cracks during the bending test of the ultra-thin flexible substrate and strengthen the joint structure.

Although this case is disclosed as above with detailed embodiments, this case does not exclude other feasible implementation aspects. Therefore, the scope of protection of this case shall be determined by the scope of the attached patent application, and shall not be restricted by the foregoing embodiments.

For those skilled in the art, without departing from the spirit and scope of the case, various changes and modifications can be made to the case. Based on the foregoing embodiment, all changes and modifications made to this case are also covered by the scope of protection of this case.

100: electronic device 110: substrate 120: Polarizing plate 130: flexible circuit board 140: The first transparent glue layer 150, 152: the first colloid 160~160B: second colloid 170: The second transparent glue layer 180: cover H1~H9, H41: Thickness D1, D4: width G: gap C: conductive adhesive

With reference to the implementation in the subsequent paragraphs and the following diagrams, you can better understand the content of this case: FIG. 1A is a partial structure diagram of an electronic device according to some embodiments of the present case; FIG. 1B is a partial structure diagram of an electronic device according to some embodiments of the present case; FIG. 1C is a partial structural diagram of an electronic device according to some embodiments of the present case; Figure 1D is a partial structural diagram of an electronic device according to some embodiments of the present case; FIG. 1E is a partial structural diagram of an electronic device according to some embodiments of the present case; Figure 1F is a partial structural diagram of an electronic device according to some embodiments of the present case; Figure 2 is a top view of a partial structure of an electronic device according to some embodiments of the present case; Figure 3 is a partial structural side view of an electronic device according to some embodiments of the present case; Figure 4 is a top view of a part of the structure of the electronic device according to some embodiments of the present case; Figure 5 is a partial structural side view of the electronic device according to some embodiments of the present case; and FIG. 6 is a bottom view of a partial structure of an electronic device according to some embodiments of the present application.

100: electronic device

110: substrate

120: Polarizing plate

130: flexible circuit board

140: The first transparent glue layer

150: The first colloid

160: second colloid

170: The second transparent glue layer

180: cover

H1~H7: Thickness

D1, D2: width

G: gap

C: conductive adhesive

Claims (14)

An electronic device including: A substrate including a first side and a second side, wherein the first side is opposite to the second side; A polarizing plate arranged on the first side of the substrate; A flexible circuit board connected to the first side of the substrate with a conductive glue, wherein there is a gap between the flexible circuit board and the polarizing plate; A first transparent adhesive layer disposed on the second side of the substrate; A first glue for bonding at least two of the substrate, the polarizing plate and the flexible circuit board; and A second glue is used to join at least two of the substrate, the flexible circuit board and the first transparent glue layer, wherein the first glue does not contact the second glue. The electronic device according to claim 1, wherein the thickness of the first gel on the first side of the substrate is 2 to 5 times the thickness of the substrate. The electronic device according to claim 1, wherein the thickness of the substrate is less than or equal to 50 microns. The electronic device according to claim 1, wherein the first colloid and the second colloid are made of the same material or different materials. The electronic device according to claim 4, wherein the first gel and the second gel include one of an acrylic gel and a silicone gel. The electronic device described in claim 1, further comprising: A second transparent glue layer is arranged on the polarizing plate and partially overlaps or does not overlap with the first glue. The electronic device according to claim 1, wherein the thickness of the second gel does not exceed 100 microns. The electronic device according to claim 1, wherein the width of the second gel does not exceed 0.4 mm. The electronic device according to claim 6, wherein the first glue is joined to the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer, and the second glue is joined to the substrate, the flexible circuit board and the The first transparent adhesive layer. The electronic device according to claim 6, wherein the first glue is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent glue layer, and the second glue is bonded to the substrate, the flexible circuit board and the The first transparent adhesive layer. The electronic device according to claim 6, wherein the first glue joins the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer, and the second glue joins the substrate and the flexible circuit board. The electronic device according to claim 6, wherein the first glue joins the polarizing plate and the flexible circuit board and partially overlaps the second transparent glue layer, wherein the second glue joins the substrate and the first transparent glue layer . The electronic device according to claim 6, wherein the first glue is bonded to the polarizing plate and the flexible circuit board and does not overlap with the second transparent glue layer, wherein the second glue is bonded to the substrate and the first transparent glue layer . The electronic device according to claim 6, wherein the first glue is bonded to the polarizing plate and the flexible circuit board without overlapping with the second transparent glue layer, and the second glue is bonded to the substrate and the flexible circuit board.

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