TWM606856U - Vapor chamber - Google Patents

Abstract

The disclosure provides a vapor chamber, comprising: a first substrate; a diversion layer disposed on the first substrate; a second substrate disposed above the diversion layer; and at least one copper layer formed on a surface of the first substrate or the second substrate. The vapor chamber of the disclosure can have higher strength and lower costs and can prevent oxidative stain on its surfaces.

Description

Temperature plate

This creation relates to the field of heat dissipation, especially a kind of uniform temperature plate.

In response to modernization needs, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in the process, heat dissipation problems caused by high-performance hardware have also followed. Generally speaking, computers and various electronic devices usually use heat-dissipating components to dissipate heat. For example, heat-dissipating paste or heat sinks are used to attach heat to the electronic components to be dissipated to absorb and dissipate heat. However, the effect of this heat dissipation method is limited, so a heat dissipation element that uses the phase change of the working fluid to promote heat conduction has been developed.

However, the above-mentioned heat-dissipating components, such as the temperature equalizing plate including the upper plate and the lower plate, must be thinner in order to be applied to the mobile device, and the upper plate and the lower plate are often made of copper alloy. After the copper alloy upper and lower plates are heated through high-temperature sintering capillary structure or welding, the copper alloy must be fully annealed, which will cause the upper and lower plates to soften and reduce the strength. If the material of the upper and lower plates is changed to steel, the environment required for sintering must be changed to high vacuum or argon protection, and the temperature required for sintering exceeds one thousand degrees, which leads to increased process difficulty and cost.

Therefore, how to provide a temperature equalizing plate that can solve the above-mentioned problems is one of the problems that the industry urgently needs to overcome.

The main purpose of this creation is to provide a uniform temperature plate, which includes: a first substrate; an air guiding layer arranged on the first substrate; a second substrate arranged above the air guiding layer; and at least one copper layer formed on the On the inner surface or outer surface of the first substrate and/or the second substrate.

In the above-mentioned uniform temperature plate, the copper layer is formed on the inner surface of the first substrate and/or the second substrate facing the air guiding layer.

In the above-mentioned uniform temperature plate, the copper layer is formed on the outer surface of the first substrate and/or the second substrate relative to the inner surface.

In the above-mentioned uniform temperature plate, a nickel layer is further formed on the copper layer formed on the outer surface of the first substrate and/or the second substrate.

In the above-mentioned uniform temperature plate, the material constituting the first substrate and the second substrate is stainless steel, titanium or titanium alloy.

In the above-mentioned uniform temperature plate, the flow guiding layer is a granular sintered body, a mesh body, a fiber or a combination thereof.

In the above-mentioned uniform temperature plate, a plurality of liquid channels are further formed between the first substrate and the flow guiding layer, and the plurality of liquid channels are particle sintered bodies, mesh bodies, fibers, grooves or combinations thereof.

In the above-mentioned uniform temperature plate, the groove is recessed on the inner surface of the first substrate, and the copper layer is formed on the groove.

In the above-mentioned uniform temperature plate, the guide layer is a metal layer with perforations.

In the above-mentioned uniform temperature board, the edges between the first substrate and the second substrate are sealed by welding.

1: uniform temperature board

11: The first substrate

111, 112: Copper layer

113: Nickel layer

114: Liquid channel

115: cylinder

12: Diversion layer

13: second substrate

131, 132: Copper layer

133: Nickel layer

134: Airflow Channel

135: support column

Figure 1 is a schematic cross-sectional view of the first embodiment of the creation of a temperature equalizing plate.

FIG. 2 is a schematic cross-sectional view of another embodiment of the uniform temperature plate of FIG. 1. FIG.

FIG. 3 is a schematic cross-sectional view of another embodiment of the uniform temperature plate of FIG. 2.

Fig. 4 is a schematic cross-sectional view of the second embodiment of the creative uniform temperature plate.

FIG. 5 is a schematic cross-sectional view of another embodiment of the uniform temperature plate of FIG. 4.

6 is a schematic cross-sectional view of still another embodiment of the temperature equalizing plate of FIG. 5.

The following specific examples are used to illustrate the implementation of this creation. Those familiar with this technology can easily understand the other advantages and effects of this creation from the content disclosed in this specification, and can also use other different specific embodiments. To implement or apply.

Please refer to FIG. 1, the uniform temperature plate 1 of the present creation includes a first substrate 11, an air guiding layer 12, and a second substrate 13, wherein the air guiding layer 12 is provided on the first substrate 11, and the second substrate 13 is provided on the guiding Above the flow layer 12. In this embodiment, the temperature equalizing plate 1 of the present invention further has at least one copper layer 111, 131 formed on the surface of the first substrate 11 or the second substrate 13, for example, the first substrate 11 faces inside the flow guide layer 12. A copper layer 111 is formed on the surface, and a copper layer 131 is formed on the inner surface of the second substrate 13 facing the flow guide layer 12.

In one embodiment, the inner surface of the second substrate 13 is recessed and formed with a plurality of supporting pillars 135, and an air flow channel 134 can be formed between the plurality of supporting pillars 135. In addition, the copper layer 131 can be formed on the surface of the support pillar 135 at the same time. In addition, after the first substrate 11 is connected to the second substrate 13, the supporting column 135 can abut the air guiding layer 12, so that the supporting column 135 has the function of supporting the air flow channel 134.

In one embodiment, the copper layers 111 and 131 may be formed on the inner surface of the first substrate 11 or the second substrate 13 by using a hot melt pressing, electroplating or sputtering process. In this embodiment, the copper layers 111 and 131 are thick The degree range is between 1 micron and 100 microns, more preferably between 8 microns and 20 microns, but this creation is not limited to this.

In one embodiment, the first substrate 11 and the second substrate 13 can be made of stainless steel, titanium or titanium alloy, and the flow guiding layer 12 can be a sintered particle, a mesh, a fiber, or a combination thereof. Creation is not limited to this.

In other embodiments, as shown in FIG. 4, a plurality of liquid channels 114 are further formed between the first substrate 11 and the flow guiding layer 12, and the plurality of liquid channels 114 are sintered particles, meshes, fibers, and grooves. Or a combination. Among them, the particle sintered body refers to a structure or structure with multiple capillary pores or connected through holes formed by sintering metal powder, the mesh body refers to a woven mesh with multiple meshes woven by metal, and the fiber refers to a continuous Or composed of discontinuous metal filaments, and the copper layer 111 can be formed on a structure such as a particle sintered body, a mesh body, and a fiber. It should be noted that FIG. 4 is drawn by taking a trench as an example. The trench refers to the use of an etching process on the surface of the first substrate 11 to etch a plurality of pillars 115 recessed on the inner surface of the first substrate 11. The gaps between the plurality of pillars 115 can form a plurality of grooves communicating with each other. In this embodiment, the copper layer 111 may be formed on the surface of the plurality of pillars 115 (or trenches). In addition, in this embodiment, the flow guide layer 12 is a metal layer with perforations (for example, copper).

In one embodiment, after the first substrate 11 and the second substrate 13 are covered together, a flat-type uniform temperature plate can be formed, and it can be sealed by diffusion welding, brazing or laser welding. side.

It can be seen from the above that the first substrate 11 and the second substrate 13 in the uniform temperature plate 1 of this creation can be made of stainless steel, titanium or titanium alloy, and copper layers 111 and 131 are formed on the inner surfaces of the first substrate 11 and the second substrate 13. When high-temperature sintering is performed, a nitrogen protection furnace (can add a small amount of hydrogen) can be used instead of a high vacuum or argon protection furnace. In addition to lowering the process and material costs, the overall strength of the uniform temperature plate 1 can be higher in Conventionally, a copper alloy is used to make a uniform temperature plate combined with the upper plate and the lower plate. Although the copper layers 111 and 131 are not formed on the outer surfaces of the first substrate 11 and the second substrate 13, which may cause oxidation and discoloration on the outer surfaces of the first substrate 11 and the second substrate 13, the process can be controlled so that only the surface Oxidation and discoloration, without affecting the overall performance and reliability, can be pickled to remove the oxidized part afterwards.

Please refer to another embodiment of the creative temperature equalizing plate 1 disclosed in FIG. 2. The following only describes the difference between this embodiment and the foregoing embodiment, and the same is not repeated here. In this embodiment, copper layers 112 and 132 may be further formed on the outer surface of the first substrate 11 or the second substrate 13 not facing the flow guide layer 12. The formation of the copper layers 112 and 132 can prevent the oxidation and discoloration of the surface of the stainless steel, titanium or titanium alloy caused by the heating of the nitrogen protection furnace. Similarly, in other embodiments of the uniform temperature plate 1 disclosed in FIG. 5, copper layers 112 and 132 may be further formed on the outer surface of the first substrate 11 or the second substrate 13 that is not facing the guide layer 12.

Please refer to still another embodiment of the creative temperature equalizing plate 1 disclosed in FIG. 3. The following only describes the difference between this embodiment and the previous embodiment, and the same is not repeated here. In this embodiment, nickel layers 113, 133 may be further formed on the copper layers 112, 132 formed on the outer surface of the first substrate 11 or the second substrate 13, for example, by hot melt pressing, electroplating or sputtering. Formed, and the nickel layers 113 and 113 can make the uniform temperature plate 1 more beautiful and have the effect of preventing oxidation. Similarly, in other embodiments of the uniform temperature plate 1 disclosed in FIG. 6, nickel layers 113 and 133 may be further formed on the copper layers 112 and 132 formed on the outer surface of the first substrate 11 or the second substrate 13.

In summary, stainless steel, titanium or titanium alloy can be used as the base plate of the temperature equalizing plate in this creation to improve the overall strength of the equalizing plate. A copper layer can be formed on the inner surface of the substrate, and a high-cost high vacuum furnace or an argon gas protection furnace is not required during high-temperature sintering, and only a nitrogen gas protection furnace is needed, and the production cost is low. In addition, a copper layer can be formed on the outer surface of the substrate, or a nickel layer can be formed on the copper layer, which can prevent oxidation and discoloration on the surface of the substrate and is more beautiful.

The above implementation forms are merely illustrative of the technical principles, features and effects of this creation, and are not intended to limit the scope of implementation of this creation. Anyone familiar with this technology can do the same without violating the spirit and scope of this creation. The above embodiments are modified and changed. However, any equivalent modifications and changes made using the content taught in this creation should still be covered by the scope of the patent application. The scope of protection of the rights of this creation should be listed in the following patent scope.

1: uniform temperature board

11: The first substrate

111: Copper layer

12: Diversion layer

13: second substrate

131: Copper layer

134: Airflow Channel

135: support column

Claims (10)

A uniform temperature plate, including: First substrate The flow guide layer is arranged on the first substrate; The second substrate is arranged above the flow guide layer; and At least one copper layer is formed on the inner surface or the outer surface of the first substrate and/or the second substrate. The uniform temperature plate according to claim 1, wherein the copper layer is formed on the inner surface of the first substrate and/or the second substrate facing the air guiding layer. The uniform temperature board according to claim 2, wherein the copper layer is formed on the outer surface of the first substrate and/or the second substrate relative to the inner surface. The uniform temperature board according to claim 3, wherein a nickel layer is further formed on the copper layer formed on the outer surface of the first substrate and/or the second substrate. The uniform temperature plate according to claim 1, wherein the material constituting the first substrate and the second substrate is stainless steel, titanium or titanium alloy. The temperature equalization plate according to claim 1, wherein the flow guiding layer is a particle sintered body, a mesh body, a fiber or a combination thereof. The temperature equalization plate according to claim 1, wherein a plurality of liquid channels are further formed between the first substrate and the flow guide layer, and the plurality of liquid channels are sintered particles, meshes, fibers, grooves, or Its combination. The uniform temperature plate according to claim 7, wherein the groove is recessed on the inner surface of the first substrate, and the copper layer is formed on the groove. The temperature equalization plate according to claim 8, wherein the guide layer is a metal layer with perforations. The uniform temperature board according to claim 1, wherein the first substrate and the second substrate are sealed by welding.

Images