TWM605707U - Wafer carrier having vacuum moving apparatus - Google Patents

Abstract

This model relates to a wafer carrier vacuum moving device. The main structure includes a first vacuum housing. The first vacuum housing is provided with a cover, and the first vacuum housing is provided with a carrier carrier and a gas suction The gas suction component includes an inert gas supplement component and a vacuum exhaust component. A second vacuum housing is provided on the side of the first vacuum housing, and a wafer extraction component is provided in the second vacuum housing. The vacuum shell and the second vacuum shell system are connected through a communicating opening. A movable sealing door is provided at the communicating opening, and a cover opening element is provided on the movable sealing door, whereby the user can suck gas through The component extracts the first vacuum housing and the wafer carrier to a vacuum state, so that the first vacuum housing and the second vacuum housing are connected in a vacuum state, so that the wafer extraction component can be extracted or Place the wafers, and finally add gas through the gas suction component to enter the wafer carrier and the first vacuum housing to improve convenience and enhance the preservation effect.

Description

Wafer carrier vacuum moving device

The invention provides a vacuum moving device for a wafer carrier, in particular to a vacuum moving device for a wafer carrier that improves the convenience of use and increases the preservation effect.

Press, wafer (English: Wafer) refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer. Wafer is the carrier used for the production of integrated circuits, and the general wafer output is mostly single crystal silicon wafers.

Since the wafer itself is quite fine, it is necessary to pay more attention when manufacturing and shipping. If the wafer is oxidized, it will cause considerable loss. Therefore, most of the wafers will be pumped in the carrier. The vacuum action removes moisture and oxygen in the air, and some wafer carriers are supplemented with inert gas to reduce the activity of the wafer, thereby greatly reducing the oxidation or other chemical reactions of the wafer opportunity.

However, ordinary wafer carriers will only perform pumping or replenishment of inert gas inside. Therefore, when the wafer is extracted, there is still the possibility of oxidation, which is troublesome in operation and has poor preservation effect.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the applicants of this new model and related manufacturers engaged in this industry urgently want to study and improve.

Therefore, in view of the above-mentioned deficiencies, the applicant of the present model has collected relevant information, evaluated and considered by multiple parties, and has accumulated years of experience in this industry, through continuous trials and modifications, to design such a more convenient use. It is also the patentee of a new type of wafer carrier vacuum moving device that increases the preservation effect.

The main purpose of this model is to extract gas or supplement inertness through gas suction components The natural gas enters the wafer carrier and the first vacuum housing to increase the convenience of use and enhance the preservation effect.

To achieve the above objective, the main structure of the present invention includes: a first vacuum housing, a cover provided on the first vacuum housing, a carrier carrier movably provided in the first vacuum housing, and The gas suction component in the first vacuum housing, a second vacuum housing provided at the side of the first vacuum housing, a communication opening provided between the first vacuum housing and the second vacuum housing, a device A movable sealing door at the communicating opening, an opening element arranged on the movable sealing door, and a wafer extraction element arranged in the second vacuum housing, wherein the gas suction assembly includes an inert gas supplement Components, and a vacuum pumping component.

With the above structure, when the user needs to put the wafer into or take out the wafer carrier, the cover can be opened first to put the wafer carrier into the first vacuum housing and set it on the carrier carrier After that, cover the cover so that the inside of the first vacuum housing will not communicate with the outside. At this time, the air in the first vacuum housing and the wafer carrier will be first extracted through the vacuum pumping element in the gas pumping assembly , And will continue to be extracted to a vacuum state, then the carrier carrier will drive the wafer carrier to move in the direction of the movable sealed door, and the wafer carrier will be opened through the opening element and the movable sealed door, and the movable sealed door When moving, the communication opening is opened, so that the first vacuum housing and the second vacuum housing are connected through the communication opening, so that the wafer extraction element in the second vacuum housing can pick and place the wafers in the wafer carrier. Since the second vacuum housing will normally maintain the vacuum state, and the first vacuum housing will be drawn to the vacuum state before being connected to the second vacuum housing through the communication opening, so that the wafers in the wafer carrier It can pick and place the components through wafer extraction in a completely vacuum state.

When the wafer extraction component completes the pick-and-place action, the movable sealing door will drive the lid-opening component to close the wafer carrier and close the communication opening so that the first vacuum housing and the second vacuum housing no longer communicate. , The inert gas supplement element in the gas suction assembly will supplement the inert gas into the first vacuum housing and the wafer carrier, so that the wafer carrier is filled with inert gas, so as to reduce the generation of wafers in the wafer carrier After the opportunity of oxidation, the user can open the cover to take out the wafer carrier.

With the above-mentioned technology, a breakthrough can be made to solve the problem of poor operation and storage of conventional wafer carriers, and the practical progress of the above-mentioned advantages can be achieved.

1.1a: The first vacuum shell

11, 11a, 11b: cover

111a: Cover sealing element

112b: cover drive element

12: Vehicle carrier

13: Carrying mobile components

131: Slide

132: Servo motor

2: Gas suction components

21: Inert gas supplementary components

22: Vacuum pumping element

23: Solenoid valve

3.3a: The second vacuum shell

31: Connecting opening

4: Movable sealed door

41: Door sealing element

42: Open cover element

5, 5a: Wafer extraction components

6: Wafer carrier

61: Vehicle Cover

62: Piercing

63: Elastic plug body

7a: processing space

The first figure is a perspective view of a preferred embodiment of the new model.

The second figure is a cross-sectional view taken along line A-A of the first figure of the preferred embodiment of the new invention.

The third figure is a schematic diagram of the placement of the new preferred embodiment.

The fourth figure is a schematic diagram of air extraction in a preferred embodiment of the new invention.

The fifth figure is a schematic diagram of the movement of the preferred embodiment of the new invention.

The sixth figure is an opening diagram of the preferred embodiment of the new invention.

The seventh figure is a schematic diagram of the pick and place of the preferred embodiment of the new type.

The eighth figure is a closed schematic diagram of the preferred embodiment of the new invention.

The ninth figure is a schematic diagram of the air supplement of the preferred embodiment of the new type.

The tenth figure is a perspective view of another preferred embodiment of the new model.

Figure 11 is a cross-sectional view taken along line B-B in Figure 10 of another preferred embodiment of the present invention.

Figure 12 is a three-dimensional view of another preferred embodiment of the new model.

Figure 13 is an opening diagram of another preferred embodiment of the new invention.

In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are drawn to illustrate the characteristics and functions of the preferred embodiment of the present invention in detail as follows, so as to fully understand.

Please refer to the first to ninth figures, which are the three-dimensional perspective view to the air supplement schematic diagram of the preferred embodiment of the new model. It can be clearly seen from the figures that the present model includes:

A first vacuum housing 1;

A cover 11 arranged on the first vacuum housing 1;

A carrier carrier 12 movably arranged in the first vacuum housing 1 is provided with a carrier moving component 13 on the carrier carrier 12, and the carrier carrier 12 is driven in the first vacuum housing by the carrier moving component 13 1. In this embodiment, the carrier moving assembly 13 includes a plurality of slide rails 131 and a servo motor 132 that drives the carrier 12 to move on the slide rail 131;

A gas suction component 2 is provided in the first vacuum housing 1. The gas suction component 2 includes an inert gas supplementing element 21 and a vacuum pumping component 22. In this embodiment, the inert gas supplementing element 21 is It is a nitrogen supplement motor connected to the first vacuum housing 1, and the vacuum pumping element 22 is a pumping motor connected to the first vacuum housing 1, and the gas pumping assembly 2 in this embodiment, It is set on the carrier 12 and controlled by a solenoid valve 23;

A second vacuum housing 3 is provided at the side of the first vacuum housing 1. In this embodiment, both the first vacuum housing 1 and the second vacuum housing 3 use a plastic shell as an example, but there is no Limit, and the inside of the second vacuum housing 3 will be normally kept in a vacuum state;

A communication opening 31 provided between the first vacuum housing 1 and the second vacuum housing 3, so that the first vacuum housing 1 and the second vacuum housing 3 are connected through the communication opening 31;

A movable sealed door body 4 arranged at the side of the communicating opening 31. In this embodiment, a door body sealing element 41 is provided on the movable sealed door body 4, and the door body sealing element 41 seals the communicating opening 31, Moreover, the movable sealed door body 4 can leave the communication opening 31 as required to control the communication effect between the first vacuum housing 1 and the second vacuum housing 3;

A cover opening element 42 provided on the movable sealed door body 4. In this embodiment, the cover opening element 42 is taken as an example with a suction nozzle and an engaging element; and

A wafer extraction element 5 is arranged in the second vacuum housing 3, and the wafer extraction element 5 is a vacuum robot arm that can take and place wafers as an example.

Through the above description, we can understand the structure of this technology, and according to the corresponding cooperation of this structure, you can have the advantages of enhancing the convenience of use and improving the effect of wafer storage. The detailed explanation will be explained in the following .

The user can open the cover 11 as shown in the third and fourth figures (in this embodiment, manual opening is used as an example, but it is not limited) so that the user can put the wafer carrier 6 into the first In the vacuum housing 1, the wafer carrier 6 is placed on the carrier carrier 12. In this embodiment, the wafer carrier 6 will have a through hole 62, and the through hole 62 will usually pass through an elastic plug The body 63 is closed. When the wafer carrier 6 is set on the carrier carrier 12, the elastic plug body 63 will be lifted up to allow the inside of the wafer carrier 6 to communicate with the gas suction assembly 2.

When the wafer carrier 6 is set on the carrier carrier 12, the vacuum exhaust element 22 is connected to the first vacuum housing 1 and the wafer carrier 6 through the solenoid valve 23, and the vacuum exhaust element 22 is exhausted. The action of air to extract the wafer carrier 6 and the first vacuum housing 1 to a vacuum state, and then can be matched with the first, fifth, and sixth diagrams through the servo in the carrier moving assembly The motor 132 drives the carrier carrier 12 to move on the slide rail 131, so that the carrier cover 61 of the wafer carrier 6 is connected to the lid opening element 42, and the movable sealing door 4 drives the lid opening element 42 to move , Thereby separating the carrier cover 61 of the wafer carrier 6 from the wafer carrier 6, and since the movable sealing door 4 will leave the communicating opening 31, the first vacuum housing 1 and the second vacuum housing 3 connected through.

Then you can control the wafer extraction element 5 to pick and place the wafers in the wafer carrier 6 in conjunction with the seventh figure. This control method is not limited, and it can be computer control, remote control, or handle control. However, since the first vacuum housing 1 will be extracted to a vacuum state, and the second vacuum housing 3 will be normally in a vacuum state, so when they communicate with each other, the whole can be in a vacuum state, thereby allowing the crystal The circle extraction element 5 is operated in a vacuum state.

When the processing is completed, the movable sealed door body 4 will drive the carrier cover 61 to re-close the wafer carrier 6 as shown in Figure 8. At the same time, the movable sealed door body 4 will cooperate with the door body sealing element 41 closes the communication opening 31, so that the first vacuum housing 1 and the second vacuum housing 3 are no longer in communication, and then can cooperate with the ninth figure, the solenoid valve 23 will control the inert gas supplement element 21 and the wafer carrier 6 Is connected to the first vacuum housing 1 and allows the inert gas supplementing element 21 to replenish the inert gas into the wafer carrier 6 and the first vacuum housing 1. In this embodiment, nitrogen is used as an example. The vacuuming and nitrogen replenishment actions are performed in the first vacuum housing 1 and the wafer carrier 6 at the same time, which is more effective than vacuuming or replenishing the nitrogen gas inside the wafer carrier 6 alone. The nitrogen gas in the wafer carrier 6 is more complete, thereby improving the preservation effect of the wafer and reducing the chance of oxidation.

Please also refer to the tenth and eleventh figures, which are a three-dimensional perspective view of another preferred embodiment of the new model and a cross-sectional view taken along line BB in figure ten. It can be clearly seen from the figure that this embodiment Similar to the above-mentioned embodiment, in this embodiment, a cover sealing element 111a is provided on the cover 11a to increase the sealing effect of the cover 11a, and the number of the first vacuum housing 1a is two as an example. This means that the number is not limited, multiple wafer carriers can be placed at the same time, and the second vacuum housing 3a will be connected to a processing space 7a, and the processing space 7a will also be in a normal vacuum state to allow passage The wafer extracted by the wafer extraction element 5a can be transported to the processing space 7a for processing.

Please also refer to Figures 12 and 13 at the same time, which are a three-dimensional view and an opening schematic diagram of another preferred embodiment of the new model. It can be clearly seen from the figure that this embodiment is similar to the above embodiment. In this embodiment, a cover driving element 112b is provided on the cover 11b, whereby the cover driving element 112b is used to drive the cover 11b to move, and the cover driving element 112b is driven by a cylinder or a pneumatic motor. However, the power source is not limited, thereby achieving the function of automatically opening or closing the cover 11b.

However, the above descriptions are only the preferred embodiments of the present model, and are not limited to the patent scope of the present model. Therefore, all simple modifications and equivalent structural changes made by using the present model description and schematic content should be the same. It is included in the scope of the patent of this new model and is combined to Chen Ming.

In summary, the wafer carrier vacuum moving device of the present invention can indeed achieve its effects and purposes when used. Therefore, the present invention is a new model with excellent practicability. In order to meet the requirements of a new patent application, it is proposed in accordance with the law. For the application, I hope that the review committee will grant this new model as soon as possible to protect the applicant’s hard work. If the review committee has any doubts, please feel free to write instructions. The applicant will do our best to cooperate and feel good.

1: The first vacuum shell

11: Lid

12: Vehicle carrier

13: Carrying mobile components

131: Slide

132: Servo motor

3: The second vacuum shell

4: Movable sealed door

42: Open cover element

5: Wafer extraction components

Claims (5)

A vacuum moving device for a wafer carrier, which mainly includes: A first vacuum housing; A cover, the cover is arranged on the first vacuum housing; A carrier carrier, the carrier carrier is movably arranged in the first vacuum housing for carrying a wafer carrier; A gas suction component, the gas suction component is arranged in the first vacuum housing, and the gas suction component includes an inert gas supplement element connected with the first vacuum housing, and a first vacuum A vacuum exhaust element connected in the housing, the vacuum exhaust element is used to extract air in the first vacuum housing and the wafer carrier, and the inert gas supplement element is used to supplement inert gas into the first vacuum shell Body and the wafer carrier; A second vacuum housing, the second vacuum housing is arranged at a side of the first vacuum housing, and the inside of the second vacuum housing is kept in a vacuum state in a normal manner; A communicating opening, the communicating opening is provided between the first vacuum housing and the second vacuum housing for allowing the first vacuum housing and the second vacuum housing to communicate through the communicating opening; A movable sealed door body, the movable sealed door body is arranged at the communicating opening for closing or opening the communicating opening; An opening element, the opening element being arranged on the movable sealing door for opening the wafer carrier; and A wafer extraction element, the wafer extraction element is arranged in the second vacuum housing for extracting wafers in the wafer carrier. In the wafer carrier vacuum moving device described in item 1 of the scope of patent application, a door sealing element is provided on the movable sealing door. In the wafer carrier vacuum moving device described in item 1 of the scope of patent application, a cover sealing element is provided on the cover. The wafer carrier vacuum moving device described in the first item of the scope of patent application, wherein the second vacuum shell system is connected to a processing space. The wafer carrier vacuum moving device described in the first item of the scope of patent application, wherein a carrier moving component is provided on the carrier carrier to drive the carrier carrier to move in the first vacuum housing .

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