TWM604874U - Cooling module with multiple heat pipes arranged in parallel - Google Patents

Abstract

A side-by-side heat dissipation module with multiple heat pipes includes a carrier and a plurality of heat pipes. The carrier has a plurality of grooves side by side; each heat pipe is placed in each groove and has an upper part, a lower part and two side parts. Each lower part is located in each groove, and each upper part is deformed into a plurality of deformed upper parts by pressing down. The two sides between the two adjacent heat pipes are also deformed into two deformed sides that are seamlessly connected to each other, and each deformed upper part together forms a bonding plane directly attached to the heat source. In this way, the effect of rapid heat conduction and the effect of evenly dissipating heat can be achieved at the same time.

Description

Multi-heat pipe side-by-side cooling module

The new type relates to a heat dissipation module, in particular to a heat dissipation module with multiple heat pipes side by side.

As the performance requirements of today's electronic devices are getting higher and higher, the heat generated by the electronic heating element (heat source) is also getting higher and higher. Therefore, the heat dissipation efficiency of the heat dissipation module for heat dissipation is extremely important. Existing heat dissipation modules include heat pipe contact type heat dissipation modules and copper plate contact type heat dissipation modules.

Among them, the heat pipe contact type heat dissipation module has the advantage of allowing most heat pipes to directly contact the heat source, so there is no thermal resistance of the copper plate and can quickly conduct heat to the heat dissipation fins for heat dissipation; but the disadvantage is that the heat pipes are uneven and have gaps. The heat of the heat source cannot be evenly distributed to the heat pipes, that is, the temperature equalization effect of the uniform temperature plate is lacking.

The copper plate contact type heat dissipation module has the advantage of allowing the copper plate to directly contact the heat source, so the heat of the heat source will be evenly distributed to the copper plate, and then the heat can be evenly conducted to the heat pipes to dissipate the heat evenly, that is, it has a uniform temperature The temperature equalization effect of the board; but the disadvantage is that the thermal resistance of the copper board is increased.

In other words, the existing heat pipe contact type heat dissipation module and copper plate contact type heat dissipation module cannot meet the increasingly high heat dissipation efficiency required by today.

The purpose of the present invention is to provide a side-by-side heat dissipation module with multiple heat pipes, which can directly form a bonding plane with the effect of a uniform temperature plate by the joining sections of most heat pipes, thereby improving the heat dissipation efficiency.

In order to achieve the above objective, the present invention provides a multi-heat pipe side-by-side heat dissipation module, including: a carrier with a plurality of grooves side by side with each other, each groove has a recess; and a plurality of heat pipes, each of the heat pipes has a surrounding each other The upper part, the lower part and the two side parts of each heat pipe are respectively inserted into the grooves, the lower part of each heat pipe is located in the concave part of each groove, and the upper part of each heat pipe is pressed down A plurality of deformed upper parts are formed, and two adjacent sides of any two adjacent heat pipes also form two deformed side parts that are seamlessly connected to each other, and each deformed upper part also forms a bonding plane together.

The present model further provides a side-by-side heat dissipation module with multiple heat pipes, which is used for dissipating heat from a heat source and includes: a carrier having a plurality of grooves side by side with each other, each groove having a recess; and a plurality of heat pipes, each of the heat pipes It has an upper part, a lower part and two side parts surrounding each other, each of the heat pipes is inserted into each of the grooves, the lower part of each heat pipe is located in the recess of each groove, and the upper part of each heat pipe passes through Press down to form a plurality of deformed upper parts, and any two adjacent sides of the heat pipes that are adjacent to each other also form two deformed sides that are seamlessly connected to each other. Each deformed upper part also forms a bonding plane together. The plane is directly attached to the heat source.

Compared with the prior art, the present invention has the following effects: by directly attaching the heat source to the attaching plane on each heat pipe, it has the effect of fast heat conduction; and the attaching plane formed by each heat pipe can also have The temperature equalization effect of the temperature equalization plate therefore meets the increasingly high heat dissipation efficiency required by today.

The detailed description and technical content of the present invention are described as follows in conjunction with the drawings. However, the drawings are only for reference and explanation, and are not intended to limit the present invention.

The present invention provides a side-by-side heat dissipation module with multiple heat pipes for dissipating heat from a heat source (not shown in the figure). Figures 1 to 4 show the first embodiment of the new type, as shown in Figures 5 to 7 This is the second embodiment of the new type, and as shown in Figs. 8 to 10, it is the third embodiment of the new type.

As shown in FIGS. 1 to 3, the multiple heat pipe side-by-side heat dissipation module (hereinafter referred to as the heat dissipation module) 100 of the present invention includes: a carrier 1 and a plurality of heat pipes 3 a, and preferably also includes a fixing layer 5.

The carrier 1 can be any object that can be used in combination with the heat pipe 3a. In this embodiment, a metal object is used as an example for description, such as an aluminum object. In addition, the present invention does not limit the shape of the carrier 1, as long as the heat pipes 3a can be combined on the carrier 1 side by side. Specifically, the carrier 1 has a plurality of grooves 11 a side by side with each other, any two adjacent grooves 11 a have a spacer rib 13 between them, and each groove 11 a has a recess 111.

Preferably, the carrier 1 further has a plurality of retaining walls 12, the retaining wall 12 has a wall side 121 and a wall inner surface 122, and the wall side 121 of each retaining wall 12 is higher than each groove 11a. The present invention does not limit the number of retaining walls 12. In this embodiment, two retaining walls 12 facing each other are taken as an example for description, and the two retaining walls 12 are respectively located on opposite sides of all grooves 11a, so that each groove There are two outermost grooves 11a adjacent to the two retaining walls 12 in 11a, and there is a spacer rib 13 between the outermost two grooves 11a and the inner surface 122 of the wall.

The heat pipe 3a has a coupling section 30 for coupling to the groove 11a. The joining section 30 has an upper portion 31, a lower portion 32 and two side portions surrounding each other, and the two side portions include a first side portion 33 and a second side portion 34. The cross section of the coupling section 30 can be in various shapes, for example, a lateral ellipse, a flat ellipse, or a circular shape. The heat pipe 3a in this embodiment is described with a lateral ellipse as an example. As for the groove The groove 11a is provided in a shape corresponding to the lower portion 32.

As shown in FIGS. 2 and 3, each heat pipe 3a is placed in each groove 11a, so that the lower part 32 of each heat pipe 3a is located in the recess 111 of each groove 11a. At this time, the inserted heat pipes 3a will follow the grooves 11a and line up with each other; furthermore, between any two adjacent heat pipes 3a and between the outermost two heat pipes 3a and the inner surface 122 of the two walls, there are the aforementioned spacer ribs. 13 are separated from each other and adjacent to each other at intervals, so gaps G as shown in FIG. 3 are respectively formed; for the three, the upper part 31 of each heat pipe 3a is higher than the wall 121 of each retaining wall 12.

As shown in Figures 3 and 4, the upper part 31 of the plurality of heat pipes 3a is pressed down and deformed to form a plurality of deformed upper parts 35, and at the same time, the first side part 33 and the second part between any two adjacent heat pipes 3a The two side portions 34 are also deformed into a first deformed side portion 37 and a second deformed side portion 38 that are seamlessly connected to each other due to this depression, and even the lower portion 32 of each heat pipe 3a is also pushed down due to this. Then it deforms into a deformed lower part 36. It should be noted that each heat pipe 3a fills the aforementioned gaps G through deformation by pressing down.

As a result, as shown in Figs. 3 and 4, each deformed upper part 35 can also jointly form a bonding plane F due to this pressing, so the heat source can directly bond to the bonding plane F on each heat pipe 3a, And it is flat-to-plane bonding or seamless bonding, so it can directly conduct heat directly with the heat pipe 3a, but also has the effect of a uniform temperature plate, so it meets the requirements of today's increasingly high heat dissipation efficiency. In short, this The new heat dissipation module 100 can directly use the joining sections 30 of a plurality of heat pipes 3a to jointly form a bonding plane F with a uniform temperature plate effect; furthermore, since each heat pipe 3a directly contacts the heat source and has a uniform temperature plate effect, this The new heat dissipation module 100 has neither an aluminum base plate nor the thermal resistance of a copper plate, so it can quickly conduct heat from the heat source to the heat dissipation fins (not shown in the figure) for heat dissipation. Preferably, through this depression, the first side 33 and the second side 34 of the outermost two heat pipes 3a are deformed into a first deformed side 370 and a second deformed side 380, respectively, so that the first deformed The side portion 370 and the second deformed side portion 380 are respectively filled in the gap G between the outermost two heat pipes 3a and the inner surface 122 of the second wall. As a result, the first deformed side portion 370 and the second deformed side portion 380 and the two The inner walls 122 will also be seamlessly connected to each other.

The aforementioned pressing process can be any process that can deform the heat pipe 3a by pressing down. In this embodiment, rolling (or rolling) is taken as an example for description. It should be noted that, as shown in FIG. 1, the joint section 30 of the heat pipe 3a has a length direction D, and the joint sections 30 are arranged side by side along the length direction D. The rolling direction of the aforementioned rolling process is along the length direction D. Proceed to smoothly roll out the aforementioned bonding plane F. Furthermore, by sticking to the edge 121 of the two walls during rolling, the aforementioned bonding plane F can also be flush with the edge 121 of the two walls, thereby facilitating the attachment of heat sources.

It should be particularly noted that even after the aforementioned press processing of each heat pipe 3a, the deformation upper part 35, the deformed lower part 36, the first deformed side 37 (370) and the second deformed side 38 (380) of each heat pipe 3a There is a fluid channel C in between, so that the working fluid (not shown in the figure) can still flow through the fluid channel C in each heat pipe 3a.

In addition, as shown in FIG. 3 and FIG. 4, the heat dissipation module 100 of the present invention preferably further includes a fixing layer 5. The fixing layer 5 can be first arranged in the recess 111 of each groove 11a, so that the fixing layer 5 can be fixed between each recess 111 and the lower part 32 of each heat pipe 3a, thereby ensuring that the lower part 32 of each heat pipe 3a is pressed down. Will not shift. The present invention does not limit the type of the fixing layer 5, as long as the lower part 32 of the heat pipe 3a can be fixed in the recess 111 of the groove 11a. The fixing layer 5 in this embodiment is described by using solder paste as an example .

As shown in FIGS. 5 to 7 are the second embodiment of the new heat dissipation module 100. This second embodiment is roughly the same as the aforementioned first embodiment, except that the cross-sectional shape of each heat pipe 3b at the joining section is different, and the spacer rib 13 of the second embodiment only exists between any two adjacent grooves 11b .

In the second embodiment, the cross section of each heat pipe 3b at the joining section is a flat ellipse, and the groove 11b of the carrier 1 is also set in a shape corresponding to the lower part 32 to facilitate the placement of the lower part 32 of the heat pipe 3b In the recess 111 of the groove 11b. It should be noted that there may still be a gap between the first side 33 and the second side 34 of any two adjacent heat pipes 3b before being pressed down, but the gap is too small to be shown in FIG. 6.

Moreover, the effect that can be achieved by the second embodiment is also the same as that of the aforementioned first embodiment.

As shown in FIG. 8 to FIG. 10, it is the third embodiment of the new heat dissipation module 100. This third embodiment is roughly the same as the aforementioned first embodiment, except that the cross-sectional shape of each heat pipe 3c at the joining section is different, and the spacer rib 13 of the third embodiment also exists only between any two adjacent grooves 11c. between.

In the third embodiment, the cross section of each heat pipe 3c at the joining section is circular, and the groove 11c of the carrier 1 is also set in a shape corresponding to the lower part 32, so as to facilitate the placement of the lower part 32 of the heat pipe 3c into the groove 11c in the recess 111.

Moreover, the effects that can be achieved by the third embodiment are also the same as those of the aforementioned first embodiment.

In summary, this new type of multi-heat pipe side-by-side heat dissipation module can indeed achieve the expected use purpose and solve the deficiencies of the previous technology. It fully meets the requirements of a new patent application. The application is filed in accordance with the patent law. Please check and give Approval of the patent in this case to protect the rights of the creator of the new type.

The above are only the preferred and feasible embodiments of the present model, and the scope of the patent of the present model is not limited as a result. Any equivalent structural changes made by using the description of the model and the contents of the drawings shall be included in the present model. Within the scope of the rights, he shall be Chen Ming.

100: cooling module

1: carrier

11a, 11b, 11c: groove

111: recess

12: retaining wall

121: On the Wall

122: Inside the wall

13: Spacer rib

3a, 3b, 3c: heat pipe

30: combined segment

31: Upper

32: lower part

33: first side

34: second side

35: deformed upper part

36: Deformed lower part

37: first deformed side

370: first deformed side

38: second deformed side

380: second deformed side

5: Fixed layer

C: fluid channel

D: length direction

F: bonding plane

G: gap

Fig. 1 is a perspective exploded view of the first embodiment of the novel heat dissipation module.

Figure 2 is a cross-sectional view of the new model based on Figure 1;

3 is a cross-sectional view of the first embodiment of the new heat dissipation module after assembly (before pressing down).

Figure 4 is a cross-sectional view of the new model after pressing down according to Figure 3.

Fig. 5 is a cross-sectional exploded view of the second embodiment of the new heat dissipation module.

Figure 6 is a partial cross-sectional view of the second embodiment of the new heat dissipation module after assembly (before pressing down).

Fig. 7 is a cross-sectional view of the new model after pressing down according to Fig. 6.

FIG. 8 is a cross-sectional exploded view of the third embodiment of the novel heat dissipation module.

Figure 9 is a cross-sectional view of the third embodiment of the new heat dissipation module after assembly (before pressing down).

Fig. 10 is a cross-sectional view of the new model after pressing down according to Fig. 9.

100: cooling module

1: carrier

11a: groove

12: retaining wall

121: On the Wall

122: Inside the wall

13: Spacer rib

3a: Heat pipe

35: deformed upper part

36: Deformed lower part

37: first deformed side

370: first deformed side

38: second deformed side

380: second deformed side

5: Fixed layer

C: fluid channel

F: bonding plane

Claims (11)

A side-by-side heat dissipation module with multiple heat pipes includes: A carrier having a plurality of grooves side by side with each other, each groove having a recess; and For most heat pipes, each heat pipe has an upper part, a lower part and two side parts surrounding each other, each heat pipe is respectively placed in each groove, and the lower part of each heat pipe is located in the recess of each groove, The upper part of each heat pipe is pressed down to form a plurality of deformed upper parts, and the two adjacent sides of any two adjacent heat pipes also form two deformed side parts that are seamlessly connected to each other, and each deformed upper part also forms a joint Attach the plane. A side-by-side heat dissipation module with multiple heat pipes is used for dissipating heat from a heat source and includes: A carrier having a plurality of grooves side by side with each other, each groove having a recess; and For most heat pipes, each heat pipe has an upper part, a lower part and two side parts surrounding each other, each heat pipe is respectively placed in each groove, and the lower part of each heat pipe is located in the recess of each groove, The upper part of each heat pipe is pressed down to form a plurality of deformed upper parts, and the two adjacent sides of any two adjacent heat pipes also form two deformed side parts that are seamlessly connected to each other, and each deformed upper part also forms a joint The attachment plane is directly attached to the heat source. The multi-heat pipe side-by-side heat dissipation module according to claim 1 or 2, further comprising a fixing layer, which is fixed between each of the recesses and each of the lower portions. The multiple heat pipe side-by-side heat dissipation module according to claim 1 or 2, wherein the upper part of each heat pipe is rolled or rolled to form the plurality of deformed upper parts. The multiple heat pipe side-by-side heat dissipation module according to claim 4, wherein the rolling or rolling direction is along the length direction of each heat pipe. The side-by-side heat dissipation module with multiple heat pipes according to claim 1 or 2, wherein the side portions of any two adjacent heat pipes are spaced apart from each other with a gap, and each deformed upper part and each deformed side part are filled in each of the Within the gap. The multi-heat pipe side-by-side heat dissipation module according to claim 1 or 2, wherein the carrier further has a plurality of retaining walls, each retaining wall has a wall edge, and the wall edge of each retaining wall is higher than each of the retaining walls. The groove and the upper part of each heat pipe are higher than the wall of each retaining wall. The multi-heat pipe side-by-side heat dissipation module according to claim 7, wherein the attachment plane is flush with the side of each retaining wall. The multi-heat pipe side-by-side heat dissipation module according to claim 7, wherein each of the retaining walls has a wall inner surface, and the side portions of each of the heat pipes adjacent to each of the retaining walls and each of the walls of the plurality of heat pipes The inner surfaces are spaced and adjacent to each other to form a gap, and the deformed upper part and the deformed side part of each of the heat pipes adjacent to each of the retaining walls of the plurality of heat pipes are filled into the gaps. The multiple heat pipe side-by-side heat dissipation module according to claim 7, wherein each of the retaining walls has an inner wall, and the side portions of the heat pipes adjacent to each of the plurality of heat pipes are also formed respectively A deformed side portion, and each deformed side portion and the inner surface of the retaining wall are seamlessly connected to each other. The multiple heat pipe side-by-side heat dissipation module according to claim 1 or 2, wherein the deformed upper part, the two deformed side parts and a deformed lower part formed by pressing down each heat pipe still have a fluid channel.

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