TWM600659U - Wafer surface particle cleaning nozzle - Google Patents

Abstract

The present invention provides a wafer surface particle cleaning nozzle, which includes a liquid delivery pipe and an atomization device. The liquid delivery pipe is connected to the atomization device. The atomization device is used to atomize the cleaning liquid delivered by the liquid delivery pipe into a liquid. Droplets to directly act on the surface of the wafer. The above-mentioned atomization device atomizes the cleaning liquid transported by the above-mentioned liquid delivery pipe into droplets to directly act on the surface of the wafer, avoiding the use of droplet transport equipment, reducing the complexity of the equipment, and reducing the liquid The mutual combination occurs during the transfer process, which can ensure the size of the droplets, and the speed of the droplets can be adjusted by adjusting the hydraulic pressure in the liquid delivery pipe, and the adjustment of the droplet speed is accurate and convenient.

Description

Wafer surface particle cleaning nozzle

The model relates to the technical field of wafer cleaning, in particular to a nozzle for cleaning particles on the surface of a wafer.

Wafer cleaning is an important process in the field of wafer manufacturing, and the effect of wafer cleaning determines the yield of wafer manufacturing.

In the field of wafer manufacturing, the yield rate of wafers below 90nm has begun to decline, mainly because the particles on the wafers are difficult to clean. As the semiconductor process moves from 2D to 3D, the cleaning of patterned wafers is far more difficult than the cleaning of flat surface wafers. And as the line width decreases and the depth ratio increases, the difficulty of wafer cleaning increases greatly. In the prior art, there are two types of wafer cleaning nozzles. One is an ordinary wafer cleaning nozzle. This nozzle needs to be equipped with an atomizing device independent of the nozzle. However, the droplets are easily combined with each other during the transportation process, which causes the droplet size to change. Large, can not achieve the ideal cleaning effect; another wafer cleaning nozzle has a liquid conveying pipe and a gas conveying pipe. The inert gas conveyed by the gas conveying pipe atomizes the cleaning liquid conveyed by the liquid conveying pipe, but the droplet size is not easy to control , Can not achieve the ideal cleaning effect.

Therefore, it is necessary to provide a new type of wafer surface particle cleaning nozzle to solve the above-mentioned problems in the prior art.

The purpose of the present invention is to provide a nozzle for cleaning particles on the wafer surface, which facilitates the generation of droplets and the control of the droplet speed to ensure the cleaning effect.

In order to achieve the above purpose, the wafer surface particle cleaning nozzle of the present invention includes a liquid delivery tube and an atomization device, the liquid delivery tube is connected to the atomization device, and the atomization device is used to transport the cleaning liquid delivered by the liquid delivery tube. Atomized into droplets, and the droplets are directly applied to the wafer surface.

The beneficial effect of the present invention is that the above-mentioned wafer surface particle cleaning nozzle includes a liquid conveying pipe and an atomizing device, and the above-mentioned atomizing device atomizes the cleaning liquid conveyed by the liquid conveying pipe into droplets so as to directly act on the wafer. The surface avoids the use of droplet conveying equipment, reduces the complexity of the equipment, and at the same time reduces the mutual combination of liquids during the transfer process, can ensure the size of the droplets, and adjust the hydraulic pressure in the liquid delivery pipe. The droplet speed can be adjusted, and the droplet speed adjustment is accurate and convenient.

According to an embodiment, the wafer surface particle cleaning nozzle further includes a housing and a sealing part, the housing and the sealing part are connected to form a built-in space, the atomizing device is disposed in the built-in space, and the liquid delivery tube is disposed in the sealing part on. The beneficial effect is that the housing and the sealing portion are connected to form a built-in space, which can protect the atomization device and prevent damage due to collision.

According to another embodiment, a gas-liquid mixing guide portion and a gas-liquid mixing portion connected to each other are provided in the built-in space, a gas delivery pipe is further provided on the sealing portion, and the gas delivery pipe communicates with the gas guide portion. The guide part communicates with the gas-liquid mixing part, and the gas-liquid mixing part communicates with the outside of the housing. The beneficial effect is that it is convenient to further adjust the speed of the droplets by introducing inert gas.

According to another embodiment, the sealing portion includes an inner shell and an upper pressure block, and the upper pressure block is detachably connected to the inner shell. The beneficial effect is that the above-mentioned upper pressing block can fix the inner shell.

According to another embodiment, the inner shell is threadedly connected to the outer shell. The beneficial effect is that it is convenient to separate the inner shell and the outer shell to clean the inside.

According to another embodiment, a temporary liquid storage tank is provided on the inner shell, and the temporary liquid storage tank communicates with the liquid delivery pipe and the atomization device. The beneficial effect is that: the temporary liquid storage tank is connected with the atomization device, and the temporary liquid storage tank is only required to match the atomization device, and the liquid delivery tube does not need to be matched with the atomization device. , Can reduce the cross-sectional area of the above-mentioned liquid conveying pipe and save space.

According to another embodiment, the sealing portion is further provided with a loop portion, the loop portion includes a first loop portion and a second loop portion connected to each other, and a pipe valve is provided on one end of the first loop portion , One end of the second loop part is connected to the temporary liquid storage tank. The beneficial effect is that the above-mentioned loop part is convenient to discharge the foam or residual cleaning liquid generated by the above-mentioned atomization device in the above-mentioned temporary liquid storage tank.

According to another embodiment, the inner shell is further provided with a liquid delivery pipe sleeve and a gas delivery pipe sleeve, the liquid delivery pipe sleeve is sleeved outside the liquid delivery pipe, and the gas delivery pipe sleeve is sleeved outside the gas delivery pipe. . The beneficial effect is that it is convenient to fix the liquid conveying pipe and the gas conveying pipe separately, and prevent the liquid conveying pipe and the gas conveying pipe from shaking during use.

According to yet another embodiment, the gas-liquid mixing guide portion is provided with a droplet conveying pipe, and the droplet conveying pipe is connected to the atomization device and the gas-liquid mixing portion. The beneficial effect is that the cleaning liquid is atomized into liquid droplets before entering the gas-liquid mixing part, so that the speed of the liquid droplets can be adjusted in the gas-liquid mixing part.

According to another embodiment, x air inlets are provided on the gas-liquid mixing part, the air inlets are in communication with the gas-liquid mixing guide part, and x is a natural number greater than zero. The beneficial effect is that the x air inlets can allow the inert gas to enter the gas-liquid mixing section from multiple angles, and reduce the influence of the inner wall of the gas-liquid mixing section on the velocity of the inert gas.

According to another embodiment, the atomization device includes a perforated plate, the perforated plate is provided with n through holes, and n is a natural number greater than zero. The beneficial effect is that the size of the generated droplets is determined by the size of the above-mentioned through holes, which can meet the cleaning requirements of the particles on the wafer surface.

According to another embodiment, the size types of the through holes are m types, and the m is a natural number greater than zero. The beneficial effect is that droplets of different sizes can be generated according to the size of the through hole to clean the surface of a wafer with particles of various sizes.

According to another embodiment, the arrangement of the above-mentioned through holes is one of a circular arrangement, a circular arrangement or a linear arrangement.

According to another embodiment, the atomization device includes an arc-shaped plate, the arc-shaped plate is provided with n through holes, and the arrangement of the through holes is a honeycomb arrangement.

In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the present invention. Obviously, the embodiments described above are part of the present invention. Examples, not all examples. Based on the embodiments of the present invention, there are other embodiments obtained by those of ordinary skill in the art without making progressive work, which fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used here shall be the ordinary meanings understood by persons with general skills in the field of the new type. As used herein, "comprising" and other similar words mean that the elements or objects appearing before the word encompass the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

In view of the problems existing in the prior art, an embodiment of the present invention provides a wafer surface particle cleaning nozzle. Referring to FIG. 1, the wafer surface particle cleaning nozzle 10 includes a liquid delivery tube 17 and an atomizing device 14. The liquid delivery tube 17 Connected to the above-mentioned atomization device 14, the above-mentioned atomization device 14 is used to atomize the cleaning liquid delivered by the liquid delivery pipe 17 into droplets, and the droplets directly act on the wafer surface.

In some embodiments of the present invention, referring to FIG. 1, the above-mentioned wafer surface particle cleaning nozzle 10 further includes a housing 11, a gas-liquid mixing part 12, a gas-liquid mixing guide part 13, and a sealing part 15. The housing 11 and the sealing part 15 Connected to form a built-in space (not shown in the figure), the gas-liquid mixing portion 12, the gas-liquid mixing guide portion 13, and the atomizing device 14 are arranged in the built-in space, and the sealing portion 15 is provided with a liquid delivery pipe 16, and The liquid delivery pipe 16 is connected to the atomization device 14, the atomization device 14 is connected to the gas-liquid mixing part 12, the gas delivery pipe 17 is provided on the sealing part 15, and the gas delivery pipe 17 is mixed with the gas-liquid The guide portion 13 is connected, the gas-liquid mixing guide portion 13 is connected to the gas-liquid mixing portion 12, and the gas-liquid mixing portion 12 communicates with the outside of the housing 11.

In some embodiments of the present invention, referring to FIG. 1, the sealing portion 15 includes an inner shell 151 and an upper pressure block 152, and the upper pressure block 152 is detachably connected to the inner shell 151.

In some embodiments of the present invention, referring to FIG. 1, the sealing portion 15 is further provided with a nozzle mounting rod 18, and the nozzle mounting rod 18 is used to install the wafer surface particle cleaning nozzle 10 on a designated field as required.

In some embodiments of the present invention, referring to FIG. 1, the gas delivery pipe 17 is used to connect inert gas, and the inert gas enters the gas-liquid mixing guide 13 through the gas delivery pipe 17, and then enters the gas-liquid mixing In the section 12, the liquid delivery pipe 16 is used to connect the cleaning liquid, and the cleaning liquid enters the atomization device 14 through the liquid delivery pipe 16, and then passes through the atomization device 14 to produce liquid droplets with a certain initial velocity. The droplets at a high speed enter the gas-liquid mixing section 12 and mix with the inert gas. The inert gas also has a certain speed when injected. After the inert gas and the droplets of two speeds are mixed, the speed will be adjusted. effect.

Figure 2 is a schematic cross-sectional structure diagram of the housing in some embodiments of the new type. 1 and 2, the housing 11 includes a first mounting portion 111, a second mounting portion 112, and a third mounting portion 113 that are connected sequentially from bottom to top. The first mounting portion 111 has a conical groove inside. The second mounting portion 112 and the third mounting portion 113 are both cylindrical, and the first cone angle (not shown in the figure) of the conical groove faces downward. The lower side of the third mounting portion 113 is provided with a housing sealing ring recess 1131, the housing sealing ring recess 1131 is provided with a housing sealing ring 11311, and the lower side of the first mounting portion 111 is provided with an outer injection port 1111. The first installation portion 111 is fixedly connected or detachably connected to the gas-liquid mixing portion 12; the second installation portion 112 is fixedly connected or detachably connected to the gas-liquid mixing guide portion 13; the third installation portion 113 is connected to the inner The shell 151 is threaded.

FIG. 3 is a schematic diagram of the structure of the gas-liquid mixing part in some embodiments of the new type. 2 and 3, the gas-liquid mixing portion 12 includes a first tapered portion 121, a cylindrical portion 122, and a truncated cone portion 123 that are sequentially connected from bottom to top. The first tapered portion 121 is in the shape of a cone. The portion 122 has a cylindrical shape, and the truncated cone portion 123 has a circular cone shape. The cone angle (not shown in the figure) of the first tapered portion 121 faces downward, the first tapered portion 121 is installed in the conical groove of the first mounting portion 111, and the first tapered portion 121 The size of the cone is the same as that of the cone-shaped groove, and the cone angle is provided with an inner injection port 1211, the inner injection port 1211 communicates with the outer injection port 1111, and the first tapered portion The cross-sectional area of 121 is getting smaller and smaller from top to bottom, so as to gather the droplets mixed with inert gas and ensure the concentration of the droplets; the conical bottom surface (not marked in the figure) of the first tapered portion 121 is upwards, and The area of the bottom surface of the cone is the same as that of the bottom surface (not shown in the figure) of the cylindrical portion 122; the bottom surface (not shown in the figure) of the truncated cone portion 123 faces downward, and the area of the bottom bottom surface of the cone is the same as that of the cylindrical The area of the upper bottom surface (not indicated in the figure) of the cylinder of the part 122 is the same, and the area of the upper bottom surface (not indicated in the figure) of the truncated cone part 123 is smaller than the area of the lower bottom surface of the truncated cone part 123. The cross-sectional area is getting larger and larger from top to bottom, so as to prevent the liquid droplets just generated by the atomization device 14 from being combined and becoming larger, and to ensure the size of the liquid droplets. Specifically, the inside of the gas-liquid mixing part 12 is a cavity.

2 and 3, x air inlets 1231 are uniformly distributed on the side wall of the truncated cone 123, and x is a natural number greater than zero. The air inlet 1231 can allow the inert gas to enter the gas-liquid mixing section 12 from multiple angles, reducing the influence of the inner wall of the gas-liquid mixing section 12 on the velocity of the inert gas, and facilitating the velocity of the droplets through the inert gas. Make adjustments.

4A is a schematic cross-sectional structure diagram of a gas-liquid mixing guide part in some embodiments of the new type. 3 and 4A, the lower side of the gas-liquid mixing guide 13 is provided with a truncated cone 131, and the inner wall of the truncated cone 131 is provided with an air outlet (not shown in the figure) that matches the air inlet 1231. Mark), the size of the truncated truncated opening 131 matches the size of the truncated truncated section 123, so that the truncated truncated section 123 is installed in the truncated truncated opening 131, so that the side wall of the truncated truncated section 123 and the truncated truncated opening The inner wall of 131 is attached to each other, and the above-mentioned air outlets correspond to the above-mentioned air inlets 1231 one to one. Specifically, the gas-liquid mixing guide 13 is a cavity.

1 and 4A, the upper side of the gas-liquid mixing guide 13 is provided with a boss 132, the middle of the boss 132 is provided with an atomization device installation port 133, the atomization device 14 is installed in the atomization device installation port 133 Inside, a drip conveying pipe 134 is provided in the middle of the truncated cone 131, and the drip conveying pipe 134 communicates with the atomizing device 14 and the gas-liquid mixing part 12.

In some embodiments of the present invention, referring to FIG. 4A, an atomizing device gasket 135 is installed between the atomizing device 14 and the atomizing device installation opening 133, and the atomizing device gasket 135 is in a ring shape. The above-mentioned atomization device gasket 135 is a well-known technology in the art, and will not be repeated here.

Fig. 4B is a top view of Fig. 4A. 4B, the boss 132, the drip conveying pipe 134, and the atomizing device 14 are all cylindrical.

In some specific embodiments of the present invention, the above-mentioned atomization device is an ultrasonic atomization device.

In some other specific embodiments of the present invention, the above-mentioned atomization device is a vibrating diaphragm.

In some embodiments of the present invention, the atomization device includes a perforated plate and a driver, the driver is used to drive the perforated plate to vibrate, and the perforated plate has a planar structure. Specifically, the porous plate is provided with n through holes, n is a natural number greater than 0, and the actuator is piezoelectric ceramic. The size of the generated droplets is determined by the size of the above-mentioned through holes, which can meet the cleaning requirements of particles on the wafer surface.

In some embodiments of the present invention, the vibration frequency of the porous plate under the action of the driver is 20KHz-5MHz, and the injection pressure of the cleaning liquid is 0.02Mpa-1Mpa in order to match the vibration frequency of the porous plate.

In some embodiments of the present invention, the material of the porous plate is a material that does not chemically react with the cleaning liquid. According to another embodiment, the material of the porous plate is ceramic.

In some embodiments of the present invention, the size types of the through holes are m kinds, and the m is a natural number greater than zero. The droplets of different sizes can be generated according to the size of the through holes to clean the surface of wafers with particles of various sizes.

In some embodiments of the present invention, the arrangement of the above-mentioned through holes is one of a circular arrangement, a circular arrangement or a linear arrangement. The above-mentioned annular arrangement is conducive to dispersing the liquid droplets, the above-mentioned circular arrangement is conducive to making the liquid droplets more concentrated, and the above-mentioned linear arrangement is conducive to making the liquid droplets have a linear distribution.

In some embodiments of the present invention, the atomization device includes an arc plate, the arc plate is provided with n through holes, the arrangement of the through holes is honeycomb arrangement, and the middle of the arc plate is convex downward As a result, the through holes are distributed on the protrusions. Among them, the above honeycomb arrangement is beneficial to make the droplets denser.

In some embodiments of the present invention, the size of the through hole is 1 μm-250 μm.

In some specific embodiments of the present invention, the size of the through holes is one type, that is, the sizes of the n through holes on the porous plate are all the same.

Figure 5 is a schematic diagram of the structure of a porous plate in some embodiments of the new type. 5, the through hole 141 includes a first through hole 1412 and a second through hole 1413, the size of the first through hole 1412 is smaller than the size of the second through hole 1413, that is, the through hole 141 has two types of sizes .

Fig. 6 is a schematic cross-sectional structure diagram of the inner shell in some embodiments of the new type. 4A and 6, the lower side of the inner shell 151 is provided with a temporary storage tank 1511 and a matching boss 1512, the temporary storage tank 1511 is located in the middle of the matching boss 1512, the lower side of the matching boss 1512 is provided The liquid storage sealing ring groove 1513, the liquid storage sealing ring groove 1513 is annular and surrounds the temporary liquid storage tank 1511, the liquid storage sealing ring groove 1513 is provided with a liquid storage sealing ring 15131, the liquid storage sealing ring 1513 The ring 15131 surrounds the outside of the temporary liquid storage tank 1511. The inner shell 151 is located on the upper side of the gas-liquid mixing guide 13, and the mating boss 1512 corresponds to the boss 132 so that the temporary liquid storage tank 1511 communicates with the atomizing device 14 and the liquid delivery pipe 16. The temporary liquid storage tank 1511 is connected to the atomization device 14. It is only necessary to match the temporary liquid storage tank 1511 with the atomization device 14, and it is not necessary to match the liquid delivery pipe 16 with the atomization device 14. It is possible to reduce the cross-sectional area of the above-mentioned liquid delivery pipe 16 and save space.

1 and 6, the inner shell 151 is also provided with a liquid delivery pipe sleeve 1514, a gas delivery pipe sleeve 1515 and an annular groove 1516, and the liquid delivery pipe sleeve 1514 is located in the center of the annular groove 1516 Where, the liquid delivery tube sleeve 1514 is sleeved on the outside of the liquid delivery pipe 16 for fixing the liquid delivery pipe 16, and the gas delivery pipe sleeve 1515 is sleeved on the outer side of the gas delivery pipe 17 for fixing the gas delivery pipe 17.

FIG. 7 is a schematic cross-sectional structure diagram of the upper pressing portion in some embodiments of the new type. 6 and 7, the lower side of the upper pressing portion 152 is provided with an annular inlay portion 1521 and a gas delivery pipe sleeve crimping portion 1522. The middle of the annular inlay portion 1521 forms a liquid delivery pipe sleeve crimping portion 1523. The upper pressing portion 152 is installed on the upper side of the inner shell 151, so that the annular embedded portion 1521 is embedded in the annular groove 1516, so that the liquid conveying pipe sleeve crimping portion 1523 is pressed against the liquid conveying pipe sleeve On 1514, the gas delivery pipe sleeve crimping portion 1522 is pressed on the gas delivery pipe sleeve 1515.

1, 6 and 7, the upper pressure portion 152 is provided with a liquid delivery pipe extension pipe 1524 and a gas delivery pipe extension pipe 1525, and the liquid delivery pipe extension pipe 1524 is in communication with the liquid delivery pipe sleeve crimping portion 1523 , And the liquid delivery pipe 16 extends to the outside of the upper pressure portion 152 through the liquid delivery pipe extension pipe 1524, the gas delivery pipe extension pipe 1525 communicates with the gas delivery pipe sleeve clamping portion 1522, and the gas delivery pipe 17 The extension pipe 1525 extends to the outside of the upper pressure portion 152 through the gas delivery pipe extension.

FIG. 8 is a schematic cross-sectional structure view of a particle cleaning nozzle on a wafer surface in some embodiments of the new type from another angle. 8, the sealing portion 15 is further provided with a loop portion 153, the loop portion 153 includes a first loop portion 1531 and a second loop portion 1532 connected to each other, one end of the first loop portion 1531 A pipe valve 15311 is provided, and one end of the second loop portion 1532 is connected to the temporary liquid storage tank 1511. After the pipe valve 15311 is opened, the pressure in the temporary liquid storage tank 1511 will cause the foam or residual cleaning liquid generated by the atomization device 14 to be discharged through the loop part 153.

Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes fall within the scope and spirit of the above-mentioned invention in the claims. Moreover, the present invention described here may have other embodiments, and may be implemented or realized in various ways.

10: Wafer surface particle cleaning nozzle 11: shell 111: The first installation part 1111: Outer jet 112: The second installation part 113: Third Installation Department 1131: Notch of housing seal 11311: Shell seal 12: Gas-liquid mixing section 121: first cone 1211: inner jet 122: cylindrical part 123: round table 1231: air inlet 13: Gas-liquid mixing guide 131: Round Proscenium 132: Boss 133: Atomization device installation port 134: Dropping Pipe 135: Atomization device gasket 14: Atomization device 141: Through hole 1412: first through hole 1413: second through hole 15: Sealing part 151: Inner Shell 1511: Temporary reservoir 1512: mating boss 1513: Reservoir seal ring groove 1514: Liquid delivery pipe sleeve 1515: Gas delivery pipe sleeve 1516: ring groove 152: Upper pressure block 1521: Annular embedded part 1522: Gas delivery pipe sleeve crimping part 1523: Liquid conveying pipe sleeve crimping part 1524: Liquid delivery pipe extension pipe 1525: Gas delivery pipe extension pipe 153: Loop Department 1531: The first loop 15311: pipe valve 1532: second loop 16: Liquid delivery pipe 17: Gas delivery pipe 18: Nozzle mounting rod

1 is a schematic diagram of a cross-sectional structure of a wafer surface particle cleaning nozzle according to an embodiment of the new type; FIG. 2 is a schematic cross-sectional structure diagram of a housing of an embodiment of the new type; Figure 3 is a schematic diagram of the structure of a gas-liquid mixing part of an embodiment of the new type; 4A is a schematic cross-sectional structure diagram of a gas-liquid mixing guide part of an embodiment of the new type; Figure 4B is a top view of Figure 4A; Figure 5 is a schematic diagram of the structure of a perforated plate according to an embodiment of the new type; 6 is a schematic cross-sectional structure diagram of the inner shell of an embodiment of the new type; FIG. 7 is a schematic cross-sectional structure diagram of the upper pressing part of an embodiment of the new type; FIG. 8 is a schematic cross-sectional structure view from another angle of the wafer surface particle cleaning nozzle according to an embodiment of the new type.

10: Wafer surface particle cleaning nozzle

11: shell

12: Gas-liquid mixing section

13: Gas-liquid mixing guide

14: Atomization device

15: Sealing part

151: Inner Shell

152: Upper pressure block

16: Liquid delivery pipe

17: Liquid delivery pipe

18: Nozzle mounting rod

Claims (14)

A nozzle for cleaning particles on a wafer surface, comprising a liquid conveying pipe and an atomizing device, the liquid conveying pipe is connected to the atomizing device, and the atomizing device is used to atomize the cleaning liquid conveyed by the liquid conveying pipe into droplets, and The droplets act directly on the surface of the wafer. The wafer surface particle cleaning nozzle according to claim 1, further comprising a housing and a sealing part, the housing and the sealing part are connected to form a built-in space, the atomizing device is arranged in the built-in space, and the liquid delivery tube is arranged in the On the seal. According to the wafer surface particle cleaning nozzle of claim 2, the built-in space is further provided with a gas-liquid mixing guide portion and a gas-liquid mixing portion that are connected to each other, and the sealing portion is further provided with a gas delivery tube, and the gas delivery tube and The gas guide portion is in communication, the gas guide portion is in communication with the gas-liquid mixing portion, and the gas-liquid mixing portion is in communication with the outside of the housing. The wafer surface particle cleaning nozzle according to claim 2, wherein the sealing portion includes an inner shell and an upper pressure block, and the upper pressure block is detachably connected to the inner shell. The wafer surface particle cleaning nozzle according to claim 4, wherein the inner shell is threadedly connected with the outer shell. The wafer surface particle cleaning nozzle according to claim 4, wherein a temporary liquid storage tank is provided on the inner shell, and the temporary liquid storage tank communicates with the liquid delivery pipe and the atomization device. According to the wafer surface particle cleaning nozzle according to claim 2 or 6, the sealing portion is further provided with a loop portion, the loop portion includes a first loop portion and a second loop portion connected to each other, the first A pipe valve is arranged on one end of the loop part, and one end of the second loop part is connected with the temporary liquid storage tank. For the wafer surface particle cleaning nozzle described in claim 2 or 6, the inner shell is further provided with a liquid conveying pipe sleeve and a gas conveying pipe sleeve, the liquid conveying pipe sleeve is sleeved outside the liquid conveying pipe, and the gas The conveying pipe is sleeved on the outside of the gas conveying pipe. The wafer surface particle cleaning nozzle according to claim 3, wherein the gas-liquid mixing guide portion is provided with a droplet conveying pipe, and the droplet conveying pipe is connected with the atomizing device and the gas-liquid mixing portion. The wafer surface particle cleaning nozzle according to claim 3, wherein x air inlets are provided on the gas-liquid mixing part, the air inlets are in communication with the gas-liquid mixing guide part, and x is a natural number greater than 0. The wafer surface particle cleaning nozzle according to claim 1, wherein the atomization device includes a perforated plate provided with n through holes, and n is a natural number greater than 0. The wafer surface particle cleaning nozzle according to claim 11, wherein the size types of the through holes are m kinds, and the m is a natural number greater than zero. The wafer surface particle cleaning nozzle according to claim 11, wherein the arrangement of the through holes is one of a circular arrangement, a circular arrangement, or a linear arrangement. The wafer surface particle cleaning nozzle according to claim 1, wherein the atomization device includes an arc-shaped plate, the arc-shaped plate is provided with n through holes, and the through holes are arranged in a honeycomb arrangement.

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