TWM679124U - Interlocking tile flooring structure - Google Patents
Interlocking tile flooring structureInfo
- Publication number
- TWM679124U TWM679124U TW114209535U TW114209535U TWM679124U TW M679124 U TWM679124 U TW M679124U TW 114209535 U TW114209535 U TW 114209535U TW 114209535 U TW114209535 U TW 114209535U TW M679124 U TWM679124 U TW M679124U
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- tile
- wood panel
- tenon
- interlocking
- Prior art date
Links
Abstract
本創作主要係提供一種拼接式地磚地板結構,包含:一磁磚層;一木板層,係於一側面以水性膠塗佈形成一水性膠層後與該磁磚層貼合,並於常溫下經預設時間及預設重力加壓後,使各該磁磚層及木板層兩者緊密貼合,該木板層其四側邊於二鄰接之二側邊分別具有凸緣狀之一凸榫部,另二鄰接之二側邊分別具有凹槽狀之一凹榫部,該凸榫部係外露於各該磁磚層及木板層,各該凸榫部及凹榫部係可分別另一拼接式地磚地板之各該凹、凸榫部相嵌接;一隔音層,係於一側面以不乾膠塗佈形成一不乾膠層後與該木板層貼合,並於常溫下略微施予加壓後,使各該隔音層及木板層兩者緊密貼合;藉此,以各該磁磚層、木板層及隔音層等,並透過各該水性膠層及不乾膠層,於常溫中重壓貼合組設所形成多層疊加結構,配合於該木板層具有拼接卡榫結構之設計,可同時解決泥作鋪貼施工的相關問題,並能達到降噪、模組化、環保及熱絕緣的效果,又具有維修及更換簡單快速,且具良好的耐水性者。 This invention primarily provides a modular tile flooring structure, comprising: a tile layer; and a wood panel layer, which is formed by applying a water-based adhesive layer to one side of the tile layer and then bonding it to the tile layer. After being pressed under a predetermined pressure and for a predetermined time at room temperature, the tile layer and the wood panel layer are tightly bonded together. Each of the four sides of the wood panel layer has a flange-shaped tenon on two adjacent sides and a recess-shaped tenon on the other two adjacent sides. The tenons are exposed on both the tile and wood panels. Each tenon and tenon can be interlocked with the tenons and tenons of another modular tile flooring. A sound insulation layer is formed by applying a self-adhesive layer to one side of the wood panel and then bonding it to the wood panel layer. Slight pressure is applied at room temperature to ensure a tight bond between the sound insulation layer and the wood panel layer. This multi-layered structure, consisting of the tile layer, wood panel layer, and sound insulation layer, bonded together with water-based adhesive and self-adhesive layers under pressure at room temperature, combined with the interlocking mortise and tenon joint design of the wood panel layer, simultaneously solves related problems in masonry paving construction. It achieves noise reduction, modularity, environmental friendliness, and thermal insulation, while also offering easy and quick maintenance and replacement, and good water resistance.
Description
本創作係有關於一種地磚結構,尤其是指表面為硬質磁磚層,結合木質與塑性材質疊加之基層,且可相互拼接,所共同形成具隔音效果之多層式異材地磚技術。 This work relates to a floor tile structure, specifically a multi-layered, heterogeneous material floor tile technology consisting of a hard ceramic tile surface layer combined with a base layer of wood and plastic materials, which can be interlocked to form a sound-insulating structure.
於建築業領域中,地板為建材中不可或缺的存在,舉凡所有建築內部或外部空間,都會使用到地板,地板對於建築的重要性,宛如皮膚之於人體的關係,其牽涉到結構與安全、功能與用途、環境舒適度、美學與設計及心理與生活品質等等層面。 In the construction industry, flooring is an indispensable building material. It is used in all interior and exterior spaces of buildings. The importance of flooring to architecture is akin to the relationship between skin and the human body, involving structural and safety considerations, functionality and purpose, environmental comfort, aesthetics and design, and even psychological and quality-of-life aspects.
市面上常見的地板建材之材質,大致上可分為「硬質」及「軟質」兩大類,其中「硬質」材質如石材、陶瓷、磁磚、馬賽克磚、水泥地、磨石子等材質應用,所述石材部份包括大理石或花崗岩等;「軟質」材質則如原木、複合木、強化木、塑木、塑膠或竹地板等材質應用者;可依空間環境及使用需求的條件不同,依各材質的特性作不同的選擇。 Common flooring materials on the market can be broadly categorized into two types: "hard" and "soft." "Hard" materials include stone, ceramic, tiles, mosaic tiles, cement, and terrazzo, with stone including marble and granite. "Soft" materials include wood, composite wood, engineered wood, wood-plastic composite, plastic, and bamboo flooring. The choice of material depends on the specific space and usage requirements.
前述地板材質除了作為單一材質使用外,其中還包含利用多種材質以「層疊」或「混合」方式所形成的地板結構,主要為期望多材質的使用可以將各自的特性相加,而達到更佳的實用性,或解決單一材質本身所具有的某項缺點;此類以異材「層疊」方式所形成的地板技術,如複合木、或強化木等;以「混合」方式所形成的地板結構,如磨石子、塑木等。 The aforementioned flooring materials, besides being used as a single material, also include flooring structures formed by "layering" or "mixing" multiple materials. This is primarily to leverage the combined properties of various materials to achieve better practicality or to address a deficiency inherent in a single material. Examples of flooring technologies using layering include composite wood or engineered wood; examples of flooring structures using a "mixing" method include terrazzo and wood-plastic composites.
進一步分析地板施工方式,又可分為「鋪貼式」 (Tile-Setting)、「黏貼式」(Glue-Sown)、「釘固式」(Nail-Down)、「懸浮式」(Floating)、「卡扣式」(Click-Lock)及「直鋪式」(Loose Lay)等六五種方式,其中「鋪貼式」(Tile-Setting)、「黏貼式」(Glue-Sown)、「釘固式」(Nail-Down)屬於固定式的地板施工,顧名思義「釘固式」(Nail-Down)即指將地板直接釘入地面固定;「鋪貼式」(Tile-Setting)則是以泥漿預先塗佈地面後,再將地板黏貼固定;而「黏貼式」(Glue-Sown)以膠劑預先塗佈地面後,再將地板黏貼固定者。 Further analysis of flooring installation methods reveals several subcategories: Tile-Setting, Glue-Sown, Nail-Down, Floating, Click-Lock, and Loose. There are six or five methods, including "Tile-Setting," "Glue-Sown," and "Nail-Down." Among these, "Tile-Setting," "Glue-Sown," and "Nail-Down" are fixed flooring installation methods. As the names suggest, "Nail-Down" means the floorboards are directly nailed into the ground for fixation; "Tile-Setting" involves pre-applying mortar to the ground before gluing the floorboards in place; and "Glue-Sown" involves pre-applying adhesive to the ground before gluing the floorboards in place.
「懸浮式」(Floating)、「卡扣式」(Click-Lock)及「直鋪式」(Loose Lay)則屬於活動式的地板施工,其中「懸浮式」(Floating)、「卡扣式」(Click-Lock)均是在地板本身設有卡榫或扣合結構,再以拼接方式相互貼接的技術應用,兩者差異在於「懸浮式」(Floating)於地板拼接之接縫或卡損部位使用膠劑相互膠合,使拼接後整大片地板呈懸浮狀態置放於地面上,「卡扣式」(Click-Lock)則不使用膠劑將各片地板膠合,各片地板各自置放於地面上者;直鋪式」(Loose Lay)則直接一大片鋪設於地面上,此類常使用於塑膠地墊或地毯等施工方式。前述地板施工方式多會考量到地板本身材質、空間環境條件、或對於地板定位程度大小的使用需求,而採用適當的地板施工方式。 "Floating," "Click-Lock," and "Loose Lay" are all types of movable flooring installations. "Floating" and "Click-Lock" both use interlocking or snap-fit structures on the floorboards themselves, which are then glued together. The difference lies in the installation method: "Floating" uses adhesive to bond the joints or snap-fit areas, making the entire floorboard appear to float on the ground; "Click-Lock" does not use adhesive to bond the individual floorboards, which are placed separately on the ground. "Loose Lay"... Lay flooring involves laying a large area directly on the ground; this method is commonly used for installations like PVC mats or carpets. The aforementioned flooring installation methods are chosen based on factors such as the flooring's inherent properties, the available space, and the desired level of coverage and usage.
本創作主要針對「地磚地板」之技術研究,其多使用石材、大理石、花崗岩、陶瓷或瓷質等材料,經燒結加工而成的「硬質」之材質應用;於施工上多採用「鋪貼式」(Tile-Setting)之泥作工法固定於地面上;「地磚地板」之優點為防水防潮、耐磨耐刮、耐熱耐燃、耐候性佳、清潔容易、花色多變及使用壽命長等,缺點則是觸感冰冷、硬度高、接縫易藏污、安裝費用高及重量較重等;基於前述「地磚地板」的材質特性與施工方式的限制,因此「地磚地板」常使用於浴室、廚房、玄關、大廳、商業空間、陽台或戶外等空間。 This work primarily focuses on the technical research of "tile flooring," a type of hard material made from materials such as stone, marble, granite, ceramic, or porcelain through sintering. In terms of installation, it is mostly fixed to the ground using a "tile-setting" mortar method. The advantages of "tile flooring" include waterproofing, moisture resistance, wear and scratch resistance, heat and fire resistance, good weather resistance, easy cleaning, a wide variety of colors and patterns, and a long lifespan. Disadvantages include a cold feel, high hardness, easy accumulation of dirt in the seams, high installation costs, and relatively heavy weight. Due to the aforementioned material characteristics and installation limitations of "tile flooring," it is commonly used in bathrooms, kitchens, entryways, living rooms, commercial spaces, balconies, and outdoor spaces.
傳統「地磚地板」的施工方式因採取「鋪貼式」(Tile-Setting)之泥作工法,屬高技術性的施工,此類施工方法如大陸專利第CN115045464 號所揭露之「一種地板與石材或瓷磚的拼接鋪貼方法及結構」發明專利,以及國內第113111414號所揭露之「水泥磚及其施工方法」發明專利;由文獻內容可得知傳統「地磚地板」的泥作施工其涉及到水泥與填縫劑之混配比例、攪拌技術、於水泥乾涸前完成整體施作之速度要求、裁切地磚、拼貼工整及填縫等等作業,因此需要有經驗的施工人員進行,而近年來「地磚地板」鋪設相關技術人員缺乏,常常發生找不到施作人員的情形。另一方面,「地磚地板」的泥作施工往往產生許多廢棄垃圾,尤其是舊地磚翻新時,則必需先打除舊有地磚,接著整平地面後,再重鋪設新地磚,因此會產生如水泥袋、水泥塊、碎磚、灰塵、或建築廢料等大量廢棄物,清運成本高。 Traditional tile flooring installation involves a "tile-setting" method, which is a highly technical construction technique. Examples of this method include Chinese Patent No. CN115045464, "A Method and Structure for Splicing and Laying Flooring with Stone or Ceramic Tiles," and domestic Patent No. 113111414, "Cement Bricks and Their Construction Method." The invention patent, as documented, reveals that traditional tile flooring installation involves various tasks, including the mixing ratio of cement and grout, mixing techniques, the speed required to complete the entire installation before the cement dries, tile cutting, neat tiling, and grouting. Therefore, experienced installers are essential. However, in recent years, there has been a shortage of skilled personnel for tile flooring installation, often resulting in situations where installers cannot be found. Furthermore, tile flooring installation generates significant waste, especially when renovating old tiles. This requires removing the old tiles, leveling the surface, and then laying new tiles, resulting in large amounts of waste such as cement bags, cement blocks, broken bricks, dust, and construction debris, leading to high waste disposal costs.
另一方面,由於「地磚地板」質地堅硬,於物品掉落、踩踏行走或水滴聲等難免產生較大聲響,尤其是大樓建築上下層的樓地板相鄰接,容易將聲音傳導到下方樓層而產生噪音;加上國內相關建築法規修法規定,於15公分混凝土的樓地板必須達到降噪超過17分貝以上的隔音性能,以符合法規不得超過58分貝的規定;因此如要使用「地磚地板」則會因其本身相較其他材質而言,具較差的隔音降噪效果,必需進一步配合其他隔音技術來達到法規要求。 On the other hand, due to the hard texture of floor tiles, they inevitably generate significant noise from dropped objects, footsteps, or dripping water, especially in buildings where adjacent floors easily transmit sound to the floors below. Furthermore, amendments to domestic building regulations stipulate that 15cm thick concrete floors must achieve a noise reduction of over 17 decibels to comply with the legal limit of 58 decibels. Therefore, using floor tiles, due to their relatively poor sound insulation compared to other materials, necessitates the use of additional soundproofing technologies to meet regulatory requirements.
市面上具有隔音效果的地板,多應用各式「軟質」或「硬質」材料為表面層,再進一步貼設一隔音層,形成多層疊加的結構;其中隔音層多採用發泡材質或橡膠材質,使隔音效果更佳。而多層疊加結構則通常以膠合方式將不同材質相互貼合,尤其軟質材料常呈現可彎曲不平整的狀態,及有時表面層或隔音會採用熱塑性或熱固性的材料時,於膠合作業中常設定以高溫環境下施予適當壓力,利用熱壓技術使各層材料能穩固黏貼固定。 Most sound-insulating flooring on the market uses various "soft" or "hard" materials as the surface layer, followed by a sound-insulating layer, forming a multi-layered structure. The sound-insulating layer often uses foam or rubber materials for better sound insulation. This multi-layered structure is usually achieved by gluing the different materials together. Soft materials are often flexible and uneven, and when the surface layer or sound insulation uses thermoplastic or thermosetting materials, the gluing process often involves applying appropriate pressure under high temperature to firmly bond and fix the layers together using hot-pressing technology.
前述習知屬多層疊加結構之隔音地板技術,如國內第094222250號所揭露之「地磚新式結構」新型專利,其以削成薄片狀的薄板材為材料,配合貼組於地磚材表面,其特徵在於:將經浸潤上膠後的薄板 材,依其紋向做縱、橫紋向交織疊組排列,直接置裝於地磚材表面,經適當加溫加壓粘固使貼合成一硬實的地磚板狀,再經裁製修邊,使構成具防潮功效的木質地磚結構。 The aforementioned conventional soundproof flooring technology involves a multi-layered structure, such as the "Novel Tile Structure" patent disclosed in Domestic Patent No. 094222250. This technology uses thin, sheet-like boards as materials, which are then adhered to the surface of floor tiles. Its characteristic lies in the following: the thin boards, after being impregnated and glued, are arranged in a cross-grain pattern, placed directly on the floor tile surface, and bonded together with appropriate heat and pressure to form a solid tile board. After trimming and finishing, a moisture-proof wood-look tile structure is created.
另有一種習知屬多層疊加結構之隔音地板技術,如國內第111123153號所揭露之「環保塑膠地磚之製造配方、其加工方法與應用」發明專利,其加工步驟包含:提供如請求項1或2所述的塑膠地磚之環保製造配方;利用一雙螺桿押出機設定不同混煉溫度區段,該混煉溫度區段包含一餵料段、一塑化段與一壓縮段、一排氣段與一計量段將該塑膠地磚之環保製造配方配方進行高溫混煉;以及前述該雙螺桿押出機的末端連接一押出模頭將前述混煉段所得的該塑膠地磚之環保製造配方進行成型加工,該押出模頭具有水平方向延伸的一押出通道,該押出通道在水平方向設定複數個不同的成型溫度區段,該押出模頭將該塑膠地磚之環保製造配方加工為具有預設厚度的一扁平片狀芯材。 Another known technology for sound-insulating flooring is the multi-layered structure, such as the invention patent disclosed in domestic patent No. 111123153, "Manufacturing Formula, Processing Method and Application of Environmentally Friendly Plastic Floor Tiles". Its processing steps include: providing an environmentally friendly manufacturing formula for plastic floor tiles as described in claims 1 or 2; and using a twin-screw extruder to set different mixing temperature zones, which include a feeding zone, a plasticizing zone, a compression zone, an exhaust zone, and a metering zone. The environmentally friendly manufacturing formula for the plastic floor tile is subjected to high-temperature mixing; and an extrusion die connected to the end of the aforementioned twin-screw extruder is used to mold the environmentally friendly manufacturing formula for the plastic floor tile obtained in the aforementioned mixing stage. The extrusion die has a horizontally extending extrusion channel, which is set with a plurality of different molding temperature zones in the horizontal direction. The extrusion die processes the environmentally friendly manufacturing formula for the plastic floor tile into a flat sheet core material with a predetermined thickness.
另有一種習知屬多層疊加結構之隔音地板技術,如國內第108112050號所揭露之「人工地板」發明專利,其包括一板體,該板體的一表面具有一襯墊部,其中該襯墊部經過多次的電子架橋發泡,該板體鋪設於一底層地板上時,該襯墊部與該底層地板接觸,該表面部與該襯墊部通過加熱貼合或黏膠黏合。 Another known technology for sound-insulating flooring is the multi-layered structure, such as the "Artificial Flooring" invention patent disclosed in Domestic Patent No. 108112050. This technology includes a board with a padding portion on one surface. The padding portion undergoes multiple electronic cross-linking foaming processes. When the board is laid on a base floor, the padding portion contacts the base floor, and the surface portion is bonded to the padding portion by heat or adhesive.
進一步針對上述習知地磚地板,於進行泥作鋪設地板施工時,除前述技術難度高、專業人力缺乏、產生大量廢棄物及清運成本高等問題外,因多應用石材、大理石、花崗岩、陶瓷或瓷質等材料,其通常具有相當厚度及重量,搬運不易。 Furthermore, regarding the aforementioned conventional tile flooring, in addition to the problems of high technical difficulty, lack of professional manpower, large amount of waste generation, and high disposal costs during tiling installation, the use of materials such as stone, marble, granite, ceramic, or porcelain often results in considerable thickness and weight, making them difficult to transport.
再細究有關上述習知地磚地板之隔音問題,因採取異材多層貼合結構,為使不同材質的薄板可與隔音層相貼設,其製造過程中多在高溫加熱的環境下進行加壓貼合,在等待膠劑冷卻凝固,製程上需要額外使 用加熱裝置及其夾具;此外,加熱裝置亦是相當耗用電能的設備,增加碳排放而產生較高的碳稅成本;加熱過程中常會使塑性材質或有機溶劑膠劑產生毒氣揮發,導致工作人員中毒的情形發生;再者,習知以發泡材料作為隔音層者,單單於隔音層製造過程中亦同樣有前述貼合製程中的問題;另一方面,習知多層結構之隔音地板,常見有在地板側邊設有卡榫拼接結構設計,以解決水泥鋪貼施工的部份問題,然而其卡榫結構僅設於相對應兩側邊上,未四邊皆設置卡榫結構,使得拼接後穩固性不佳。 Further examination of the sound insulation issues of the aforementioned common floor tile flooring reveals that due to its multi-layered, non-material bonding structure, the manufacturing process often involves high-temperature, pressurized bonding of thin sheets of different materials with the sound insulation layer. While waiting for the adhesive to cool and solidify, the process requires additional heating devices and fixtures. Furthermore, these heating devices are also highly energy-intensive, increasing carbon emissions and resulting in higher carbon tax costs. The heating process often causes plastic materials or organic solvent adhesives to... The release of toxic fumes has led to worker poisoning. Furthermore, even with foamed materials commonly used as sound insulation layers, the same bonding issues arise during the manufacturing process of the sound insulation layer itself. On the other hand, while multi-layered soundproofing flooring often features interlocking joints on the sides to address issues during cement installation, these interlocking joints are only present on two corresponding sides, not on all four sides, resulting in poor stability after assembly.
有鑑於前述習知「地磚地板」以泥作施工及多層結構製程上及卡損上之相關問題,本案發明人提出一可同時解決前述習知問題之拼接式地磚地板結構及其製造方法,同時可增進其他效能,並具有其他新功效之地磚地板技術者。 In view of the aforementioned problems with conventional "tile flooring" due to its mortar installation, multi-layer structure, and wear and tear, the inventor of this invention proposes a modular tile flooring structure and its manufacturing method that simultaneously solves these conventional problems, while also enhancing other functions and providing other new features.
有鑑於此,本創作所揭露之拼接式地磚地板結構,其包含有:一磁磚層;一木板層,係於一側面以水性膠塗佈形成一水性膠層後與該磁磚層貼合,並於常溫下經預設時間及預設重力加壓後,使各該磁磚層及木板層兩者緊密貼合,該木板層其四側邊於二鄰接之二側邊分別具有凸緣狀之一凸榫部,另二鄰接之二側邊分別具有凹槽狀之一凹榫部,該凸榫部係外露於各該磁磚層及木板層,各該凸榫部及凹榫部係可分別另一拼接式地磚地板之各該凹、凸榫部相嵌接;一隔音層,係於一側面以不乾膠塗佈形成一不乾膠層後與該木板層貼合,並於常溫下略微施予加壓後,使各該隔音層及木板層兩者緊密貼合;藉由上述構件,以各該磁磚層、木板層及隔音層等,並透過各該水性膠層及不乾膠層,於常溫中重壓貼合組設所形成多層疊加結構,配合於該木板層具有拼接卡榫結構之設計,可同時解決泥作鋪貼施工的相關問題,並能達到降噪、模組化、環保及熱絕緣的效果,又具有維修及更換簡單快速,且具良好的耐水性,故整體結構可達便利實用性者。 In view of this, the interlocking tile floor structure disclosed in this invention includes: a tile layer; and a wood panel layer, which is formed by applying a water-based adhesive layer to one side of the tile layer and then bonding it to the tile layer. After being pressed under a predetermined pressure and for a predetermined time at room temperature, the tile layer and the wood panel layer are tightly bonded together. Each of the four sides of the tile layer has a flange-shaped tenon on two adjacent sides and a groove-shaped tenon on two other adjacent sides. The tenons are exposed on each of the tile and wood flooring layers. Each tenon and tenon can be interlocked with the tenons and tenons of another interlocking tile flooring; a sound insulation layer... The sound insulation layer is formed by applying a self-adhesive layer to one side and then bonding it to the wood panel layer. Slight pressure is applied at room temperature to ensure a tight bond between the sound insulation layer and the wood panel layer. This multi-layered structure is formed by bonding the tile layer, wood panel layer, and sound insulation layer together with water-based adhesive and self-adhesive layers under heavy pressure at room temperature. Combined with the interlocking design of the wood panel layer, this design can simultaneously solve related problems in masonry paving construction and achieve noise reduction, modularization, environmental protection, and thermal insulation effects. It is also easy and quick to maintain and replace, and has good water resistance, making the overall structure convenient and practical.
本創作之主要目的即在提供一種拼接式地磚地板結構,係以磁磚層、 木板層及隔音層,相互透過水性膠層及不乾膠層貼合,所形成之多層疊加結構,並於木板層四側邊分別設有卡榫之拼接構設計,可省去水泥鋪貼施工及其相關問題,同時提升地磚拼接之穩固性,及強化貼合之服貼性。 The main purpose of this creation is to provide a multi-layered tile flooring structure, consisting of tile layers, wood flooring layers, and sound insulation layers, bonded together with water-based adhesive and self-adhesive layers. The wood flooring layers feature interlocking tenons on all four sides, eliminating the need for cement paving and related problems, while simultaneously improving the stability of the tile joints and enhancing the adhesion.
本創作之次一目的即在提供一種拼接式地磚地板結構,其透過各該膠劑層及不乾膠層,於常溫中重壓貼合組設所形成多層疊加結構,使各磁磚層、木板層及隔音層相互穩固貼合,貼合組設中無需進行加熱,可解決熱壓製程中所產生的相關問題,且過程中無有機毒性揮發,可預防工作人員中毒。 A secondary objective of this invention is to provide a multi-layered structure for interlocking tile flooring. This structure is achieved by bonding various adhesive and self-adhesive layers under heavy pressure at room temperature. This ensures a stable bond between the tile layers, wood layers, and sound insulation layer. No heating is required during the bonding process, thus solving problems associated with hot-pressing. Furthermore, no organic toxic substances are released during the process, preventing worker poisoning.
本創作之再一目的即在提供一種拼接式地磚地板結構,係以磁磚層、木板層及隔音層多層疊加結構及拼接卡榫結構之設計,藉以除了能達到隔音降噪之功能外,並使整體結構予以模組化以利於大量生產。 Another objective of this creation is to provide a modular tile flooring structure, which employs a multi-layered design of tile layers, wood panels, and sound insulation layers, along with a mortise and tenon joint system. This design not only achieves sound insulation and noise reduction but also modularizes the overall structure for mass production.
本創作之更一目的即在提供一種拼接式地磚地板結構,其隔音層係使用非發泡材質,如橡膠、軟木、甘蔗纖維、熱塑性(EVA)或其混合等材質,為利用回收或可再生之塑料或天然材料應用,極具環保的效益,同時具有熱絕緣功能。 Another objective of this invention is to provide a modular tile flooring structure whose sound insulation layer uses non-foamed materials such as rubber, cork, sugarcane fiber, thermoplastic (EVA), or mixtures thereof. This utilizes recycled or renewable plastics or natural materials, offering significant environmental benefits while also providing thermal insulation.
[本創作] [this creation]
(10):磁磚層 (10): Tile layer
(20):水性膠層 (20): Water-based adhesive layer
(30):木板層 (30): Wood-based layer
(31):凸榫部 (31): Tenon section Tenon section
(32):凹榫部 (32): Tenon/Recess
(40):不乾膠層 (40): Adhesive layer
(50):隔音層 (50): Sound insulation layer
(d1):外凸尺寸 (d1): Outer convexity dimension
(d2):內凹尺寸 (d2): Concave dimension
(D):縫隙 (D): Gap
(A):第一片 (A): First piece
(B):第二片 (B): Second piece
(C):第三片 (C): The third piece
(F):第四片 (F): Fourth piece
(E):第五片 (E): The fifth piece
(X):凸角部位 (X): Convex corner area
(Y):凹角部位 (Y): Concave corner area
圖1為本創作一較佳實施例之立體外觀示意圖。 Figure 1 is a three-dimensional schematic diagram of a preferred embodiment of the invention.
圖2為本創作一較佳實施例之立體局部剖視示意圖。 Figure 2 is a partial sectional view of a preferred embodiment of this invention.
圖3為本創作一較佳實施例之平面外觀示意圖一。 Figure 3 is a schematic plan view of a preferred embodiment of this invention.
圖4為本創作一較佳實施例之平面外觀示意圖二。 Figure 4 is a schematic plan view of a preferred embodiment of this invention.
圖5為本創作一較佳實施例之平面剖視示意圖。 Figure 5 is a schematic planar sectional view of a preferred embodiment of this invention.
圖6為本創作一較佳實施例之拼接施工示意圖一。 Figure 6 is a schematic diagram of the splicing construction of a preferred embodiment of this invention.
圖7為本創作一較佳實施例之拼接施工示意圖二。 Figure 7 is a schematic diagram of the splicing construction of a preferred embodiment of this invention.
圖8為本創作一較佳實施例之拼接施工示意圖三。 Figure 8 is a schematic diagram of the splicing construction of a preferred embodiment of this creation.
圖9為本創作一較佳實施例之拼接施工示意圖四。 Figure 9 is a schematic diagram of the splicing construction of a preferred embodiment of this creation.
圖10為本創作一較佳實施例之拆除施工示意圖。 Figure 10 is a schematic diagram of the demolition construction process in a preferred embodiment of this invention.
首先請參照圖1~圖5,本創作所提供之一種拼接式地磚地板結構,其包括:一磁磚層(10),及以該磁磚層之一面依序貼設形成之一水性膠層(20)、一木板層(30)、一不乾膠層(40)及一隔音層(50)。 First, please refer to Figures 1-5. The interlocking tile flooring structure provided in this invention includes: a tile layer (10), and a water-based adhesive layer (20), a wood panel layer (30), a self-adhesive layer (40), and a sound insulation layer (50) sequentially attached to one side of the tile layer.
該磁磚層(10),為具有預設厚度及預設長寬尺寸之板狀。 The tile layer (10) is a plate with a predetermined thickness and predetermined length and width dimensions.
該木板層(30),係於一側面以水性膠塗佈形成該水性膠層(20)後與該磁磚層(10)貼合,並於常溫下經預設時間及預設重力加壓後,使各該磁磚層(10)及木板層(30)兩者緊密貼合;該木板層(30)其四側邊於二鄰接之二側邊分別具有凸緣狀之一凸榫部(31),另二鄰接之二側邊分別具有凹槽狀之一凹榫部(32),該凸榫部(31)係外露於各該磁磚層(10)及木板層(30);各該凸榫部(31)及凹榫部(32)係可分別另一拼接式地磚地板之各該凹、凸榫部(31)(32)相嵌接。 The wood panel layer (30) is formed by applying a water-based adhesive layer (20) to one side and then bonding it to the tile layer (10). After being pressed under a preset time and pressure at room temperature, the tile layer (10) and the wood panel layer (30) are tightly bonded together. The wood panel layer (30) has flanges on two adjacent sides on each of its four sides. One of the tenons (31) has a protruding tenon, and the other two adjacent sides each have a recessed tenon (32). The protruding tenon (31) is exposed on each of the tile layers (10) and the wood panel layer (30). Each protruding tenon (31) and recessed tenon (32) can be interlocked with the recessed and protruding tenons (31)(32) of another interlocking tile floor.
該隔音層(50),係於一側面以不乾膠塗佈形成該不乾膠層(40)後與該木板層(30)貼合,並於常溫下略微施予加壓後,使各該隔音層(50)及木板層(30)兩者緊密貼合。 The sound insulation layer (50) is formed by applying an adhesive layer (40) to one side and then bonding it to the wood panel layer (30). Slight pressure is applied at room temperature to ensure a tight bond between the sound insulation layer (50) and the wood panel layer (30).
藉由上述構件,以各該磁磚層(10)、木板層(30)及隔音層(50)等,並透過各該水性膠層(20)及不乾膠層(40),於常溫中重壓貼合組設所形成多層疊加結構,配合於該木板層(30)具有拼接卡榫結構之設計,可同時解決泥作鋪貼施工的相關問題,並能達到降噪、模組化、環保及熱絕緣的效果,又具有維修及更換簡單快速,且具良好的耐水性,故整體結構可達便利實用性者。 By employing the aforementioned components, including the tile layer (10), wood panel layer (30), and sound insulation layer (50), and bonded together with the water-based adhesive layer (20) and self-adhesive layer (40) under heavy pressure at room temperature, a multi-layered structure is formed. Combined with the interlocking tenon and mortise design of the wood panel layer (30), this system simultaneously solves related problems in masonry paving construction, achieving noise reduction, modularity, environmental friendliness, and thermal insulation. It also offers simple and quick maintenance and replacement, along with good water resistance, making the overall structure convenient and practical.
為供進一步瞭解本創作構造特徵、運用技術手段及所預期達成之功效,茲將本創作使用方式加以敘述如下: 本創作之該磁磚層(10)可為石材、大理石、花崗岩、陶瓷、瓷性材質等其中一種材質應用;該木板層(30)可為原木、聚胺脂膠合板、複合木等材質其中一種材質應用;該水性膠層(20)為水性聚胺脂膠或水性環氧脂膠等其中一種膠劑;該不乾膠層(40)為聚氯乙烯(PVC)、聚丙烯酸酯(PAA)、聚醋酸乙烯酯(PVAc)、聚氨酯(PU)、矽基膠(Silicone Adhesives)或前述成份混合等其中一種所形成之膠劑。 To further understand the structural features, technical means, and expected effects of this creation, the usage of this creation is described as follows: The tile layer (10) of this creation can be made of one of the following materials: stone, marble, granite, ceramic, porcelain, etc.; the wood board layer (30) can be made of one of the following materials: log, polyurethane plywood, composite wood, etc.; the water-based adhesive layer (20) is one of the following adhesives: water-based polyurethane adhesive or water-based epoxy adhesive; the self-adhesive layer (40) is an adhesive formed by one of the following: polyvinyl chloride (PVC), polyacrylate (PAA), polyvinyl acetate (PVAc), polyurethane (PU), silicone adhesive, or a mixture of the above components.
本創作於進行多層貼合組設,其中各該磁磚層(10)與木板層(30)以重力加壓貼合時,其作業環境之常溫數值為25℃上下,其作業環境之濕度數值為60-70%。本創作於貼合組設各該木板層(30)及隔音層(50)時,係略微施予加壓貼合兩者時,其作業環境之常溫數值為25℃上下,其作業環境之濕度數值為60-70%。 In this invention, when multiple layers are bonded together, with each tile layer (10) and wood panel layer (30) bonded under gravity, the ambient temperature is around 25°C and the humidity is 60-70%. When bonding the wood panel layer (30) and sound insulation layer (50) together, with slight pressure applied, the ambient temperature is around 25°C and the humidity is 60-70%.
本創作之該隔音層(50)可為橡膠、軟木、甘蔗渣、熱塑性(EVA)或其混合等材質其中一種材質應用,係可單獨材料使用,亦可混合二種以上材料使用;其混合部份可將橡膠及軟木混合之材質應用,其橡膠佔比數值範圍為80-90%,該軟木佔比為10-20%;其中以橡膠佔比為85%,該軟木佔比為15%最佳。 The sound insulation layer (50) of this invention can be made of one of the following materials: rubber, cork, bagasse, thermoplastic (EVA), or a mixture thereof. It can be used alone or in combination with two or more materials. The mixed portion can be a combination of rubber and cork, with the rubber percentage ranging from 80-90% and the cork percentage from 10-20%. Ideally, the rubber percentage should be 85% and the cork percentage 15%.
本創作之拼接式地磚地板結構成品,該磁磚層(10)厚尺寸為6mm以下;該木板層(30)厚度尺寸為6-8mm;該隔音層(50)厚度尺寸為2-5mm。 The finished interlocking tile floor structure of this creation has the following characteristics: the tile layer (10) is less than 6mm thick; the wood panel layer (30) is 6-8mm thick; and the sound insulation layer (50) is 2-5mm thick.
本創作之拼接結構設計,請參照圖3至圖5,係以其二相鄰之側邊設為凸榫部(31),各該凸榫部(31)之外凸尺寸設為(d1);另二相鄰之側邊設為凹榫部(32),各該凹榫部(32)之內凹尺寸設為(d2);本創作該外凸尺寸(d1)之數值設定係大於或等於該內凹尺寸(d2),以該外凸尺寸(d1)略大於該內凹尺寸(d2)為最佳,差異約0.01~0.5mm數值範圍內。請參照圖8,當該外凸尺寸(d1)略大於該內凹尺寸(d2)時,於兩片各該地磚地板(A)(B)成品拼接後,可使各該地磚地板彼此間產生一縫隙(D),該縫隙(D)可進一步填補填縫劑,以防止灰塵或水份進入卡榫結構內;或提供熱脹冷縮的彈性空間。 The splicing structure design of this creation is shown in Figures 3 to 5. Two adjacent sides are provided as protruding tenons (31), and the outward protrusion dimension of each protruding tenon (31) is set as (d1). The other two adjacent sides are provided as concave tenons (32), and the inward concave dimension of each concave tenon (32) is set as (d2). The value of the outward protrusion dimension (d1) in this creation is set to be greater than or equal to the inward concave dimension (d2). It is best if the outward protrusion dimension (d1) is slightly larger than the inward concave dimension (d2), with the difference being within the range of approximately 0.01~0.5mm. Referring to Figure 8, when the convex dimension (d1) is slightly larger than the concave dimension (d2), after the two finished floor tiles (A) and (B) are joined together, a gap (D) will be created between them. This gap (D) can be further filled with grout to prevent dust or moisture from entering the interlocking structure; or to provide elastic space for thermal expansion and contraction.
本創作之拼接式地磚地板於進行拼接鋪設時,請參照圖6至圖10,係第一片(A)本創作之該地磚地板置於地面上,再將第二片(B)該地磚地板以其凹榫部(32)對其第一片(A)該地磚地板之凸榫部(31)後,使兩各該凹榫部(32)及凸榫部(31)相互嵌卡,即完成第一片(A)及第二片(B)的拼接。再將第三片(C)該地磚地板之以其凸榫部(31)對其第一片(A)該地磚地板之凹榫部(32)後,使兩各該凹榫部(32)及凸榫部(31)相互嵌卡,即完成第一片(A)及第三片(C)的拼接。另接續拼接第四片(F)該地磚地板時,則會以該第四片之凹榫部(32)對其第一片(A)該地磚地板之凸榫部(32)後,使兩各該凹榫部(32)及凸榫部(31)相互嵌卡,即完成第一片(A)及第四片(F)之拼接;接著將第五片(E)該地磚地板之以其凸榫部(31)對其第一片(A)該地磚地板之凹榫部(32)後,使兩各該凹榫部(32)及凸榫部(31)相互嵌卡,即完成第一片(A)及第五片(E)的拼接;再接續拼接其他地磚地板直至鋪設整個地面完成。 When laying this interlocking floor tile, please refer to Figures 6 to 10. First, place the first tile (A) on the ground. Then, place the second tile (B) with its tongue-and-groove (32) against the tongue-and-groove (31) of the first tile (A), so that the two tongue-and-groove (32) and tongue-and-groove (31) interlock, thus completing the splicing of the first tile (A) and the second tile (B). Next, place the third tile (C) with its tongue-and-groove (31) against the tongue-and-groove (32) of the first tile (A), so that the two tongue-and-groove (32) and tongue-and-groove (31) interlock, thus completing the splicing of the first tile (A) and the third tile (C). When assembling the fourth tile (F), the tongue and groove (32) of the fourth tile is aligned with the tenon (32) of the first tile (A), so that the two tongues (32) and tenons (31) interlock, thus completing the assembly of the first tile (A) and the fourth tile (F). Next, the tenon (31) of the fifth tile (E) is aligned with the tongue and groove (32) of the first tile (A), so that the two tongues (32) and tenons (31) interlock, thus completing the assembly of the first tile (A) and the fifth tile (E). This process is repeated until the entire floor is laid.
值得一提,本創作之地磚地板除了可平鋪於地面上外,亦可應用於具有高度之高架型地磚鋪設,使用上極具實用性。 It's worth mentioning that this creative floor tile can be laid flat on the ground or used for raised floor installations, making it extremely practical.
本創作透過各該水性膠層(20)及不乾膠層(40),將各該磁磚層(10)、木板層(30)及隔音層(50)等貼合所共同形成之多層疊加結構,配合於該木板層(30)四側邊設有各該凹、凸榫部(32)(31)之結構設計,整體技術具有下列功效: This invention utilizes water-based adhesive layers (20) and self-adhesive layers (40) to bond together the tile layer (10), wood panel layer (30), and sound insulation layer (50) to form a multi-layered structure. Combined with the design of tongue and groove joints (32)(31) on the four sides of the wood panel layer (30), the overall technology achieves the following effects:
一、本創作之地磚地板為具有各該凹、凸榫部(32)(31)之拼接結構,配合以多層疊加結構並使表面層該磁磚層(10)為硬質之地磚材質,整體結構設計以拼接鋪設取代傳統水泥施工定位之鋪設方式,故可省去水泥鋪貼施工,並解決地磚地板因泥作施工所產生之需具有專業技術性、缺工、大量廢棄物及高清運成本等問題。 I. The floor tile system of this invention features a splicing structure with tongue and groove joints (32) and (31), combined with a multi-layered structure. The surface layer (10) is made of hard floor tile material. The overall structural design replaces the traditional cement-laying method with splicing, thus eliminating the need for cement paving and solving the problems associated with traditional mortar flooring construction, such as the need for specialized skills, labor shortages, large amounts of waste, and high transportation costs.
二、利用各該凹、凸榫部(32)(31)之拼接結構,其以模組化設計除可大量生產外,其拼接作業簡單,故提供一般非技術性使用者可自行拼接鋪設施工的功效;當水泥施工人員缺工時,木板工人亦可施作,或任何人均可DIY進行拼接鋪設施工,達到解決習知水泥技術人員常常缺工的 問題。 II. Utilizing the splicing structure of the concave and convex tenons (32)(31), its modular design allows for mass production and simplifies the splicing process, thus enabling non-technical users to assemble and lay the cement themselves. When cement workers are short-staffed, woodworking workers can also perform the work, or anyone can DIY the splicing and laying process, thereby solving the problem of frequent labor shortages among experienced cement technicians.
三、本創作之多層疊加結構具有該隔音層(50),可達到隔音、減震及降噪之效果。 Third, the multi-layered structure of this creation includes the sound insulation layer (50), achieving sound insulation, vibration damping, and noise reduction effects.
四、本創作之該隔音層(50)為非發泡材質,主要以橡膠、軟木或甘蔗渣等材質應用為最佳,其中橡膠可利用回收或再生橡膠,軟密及甘蔗渣等為天然材料之應用,故具有環保功效,解決習知發泡材質多以重新塑造墊體,於製程中會產生有毒氣體外,又需耗費相當大的電能,不具環保等問題。 IV. The sound insulation layer (50) of this invention is made of non-foamed material, with rubber, cork, or bagasse being the best materials. Recycled or recycled rubber can be used, while cork and bagasse are natural materials, thus offering environmental benefits. This addresses the problems of conventional foamed materials, which often involve reshaping the cushion, generating toxic gases during the manufacturing process, and consuming considerable electrical energy, thus lacking environmental friendliness.
五、利用該隔音層(50)為橡膠、軟木或甘蔗渣等材質應用之非發泡材質應用,使本創作之地磚地板進一步具有良好的熱絕緣性,而達到隔熱效果。 5. By utilizing the sound insulation layer (50) as a non-foamed material such as rubber, cork, or bagasse, the tile flooring of this invention further enhances its thermal insulation properties, thereby achieving a heat insulation effect.
六、本創作之地磚地板各層之貼合組設,係採取長時間重壓方式使各磁磚層(10)、木板層(30)及隔音層(50)相互穩固貼合,貼合組設過程中無需進行加熱,可解決習知貼合作業中因熱壓作業中所產生的電能消耗、碳排放、有機溶劑毒氣等相關問題。 VI. The bonding and assembly of the various layers of the tile flooring in this invention employs a long-term heavy pressure method to ensure a stable bond between the tile layers (10), the wood panel layer (30), and the sound insulation layer (50). No heating is required during the bonding and assembly process, thus solving the problems associated with conventional hot-pressing processes, such as energy consumption, carbon emissions, and toxic organic solvent gases.
七、本創作以水性膠劑及不乾膠等作為各該磁磚層(10)、木板層(30)及隔音層(50)相互貼合之膠劑,其貼合組設過程中於常溫下進行即可,無須加熱,過程中無有機毒性揮發,可預防工作人員中毒,故貼合製程中可達到無毒且環保的功效。 VII. This invention uses water-based adhesives and self-adhesives as the bonding agents for the various tile layers (10), wood panel layers (30), and sound insulation layers (50). The bonding process can be carried out at room temperature without heating, and no organic toxic substances are released during the process, preventing worker poisoning. Therefore, the bonding process achieves a non-toxic and environmentally friendly effect.
八、本創作各該磁磚層(10)、木板層(30)及隔音層(50)相互貼合之膠劑,採用水性膠劑及不乾膠所形成之各該水性膠層(20)及不乾膠層(40),其具有吸水率抵之高耐水特性,同時延展性及黏著力強。 8. The adhesive used to bond the tile layer (10), wood panel layer (30), and sound insulation layer (50) together is a water-based adhesive. The water-based adhesive layer (20) and the self-adhesive layer (40) are formed using water-based adhesive and self-adhesive, possessing high water resistance with low water absorption, as well as strong extensibility and adhesion.
九、各該木板層(30)及隔音層(50)間之貼合採用不乾膠劑,其非屬固化之膠劑,其使該不乾膠層(40)具有可彎曲、延展的彈性,可使各該木板層及隔音層兩者貼接更為服貼,亦能降低地板產生龜裂的情形。 9. A self-adhesive adhesive is used for bonding the wood panel layer (30) and the sound insulation layer (50). This adhesive is not a curing adhesive, but rather gives the self-adhesive layer (40) flexibility, allowing for a more seamless bond between the wood panel layer and the sound insulation layer, and reducing the likelihood of cracking in the flooring.
十、本創作之該磁磚層(10)其厚度可減少至6mm以下,配合各該木板層(30)及隔音層(50)之支撐,相較於習知厚度較厚的整塊地磚板, 本創作除了可達到與習知相同的支撐性外,又可大大減輕整片地板的重量,以方便搬運及施工。 10. The thickness of the tile layer (10) in this invention can be reduced to less than 6mm. Combined with the support of the wood panel layers (30) and the sound insulation layer (50), compared to conventionally thicker solid floor tiles, this invention not only achieves the same support as conventional methods, but also significantly reduces the weight of the entire floor, facilitating transportation and installation.
十一、本創作之地磚地板以四側邊均設有各該凹、凸榫部(32)(31),可使拼接後之地板的四周邊皆予以穩固卡制,相較習知地板僅以相對應之兩側設置卡榫結構者,故本創作具有較優的穩固性,可降低地板間產生凸起、或隆起的情形。 XI. The tile flooring of this invention features tongue and groove joints (32)(31) on all four sides, ensuring a secure fit around the assembled floorboards. Compared to conventional flooring with tongue and groove joints on only two corresponding sides, this design offers superior stability and reduces the likelihood of bulges or protrusions between floorboards.
十二、利用各該凹、凸榫部(32)(31)係以其二相鄰之側邊呈凸狀之凸榫部(31),另兩相鄰之側邊則呈凹狀之凹榫部(32)之結構設計,於拼接施工時,請參照圖7,地磚地板其一凸角部位(X),於對準另二已拼接之地磚地板其所形成之一凹角部位(Y)後,以側向移動使各該凸榫部(31)分別進入各該凹榫部(32)而進一步嵌卡,只要瞄準單一位置,無需如習知兩側對襯卡榫結構,其拼接時必須同時對準地板相對應的兩側位置,大大減少對準嵌卡時間,故其施工動作簡單,快速且方便。 12. Utilizing the structural design where each of the concave and convex tenons (32) and (31) has two adjacent convex tenons (31) and two adjacent concave tenons (32), during splicing, please refer to Figure 7. Align one convex corner (X) of the floor tile with one concave corner (Y) formed by the other two already spliced floor tiles, and then move it laterally to allow each convex tenon (31) to enter each concave tenon (32) for further locking. By aiming at a single position, unlike the familiar two-sided interlocking tenon structure, which requires simultaneous alignment of both sides of the floor tile during splicing, the alignment and locking time is greatly reduced. Therefore, the construction is simple, fast, and convenient.
十三、各該相鄰狀態之各該凹、凸榫部(32)(31)之結構設計,係於拆除地磚地板之拼接狀態時,請參照圖10,係一邊輕敲各該凸榫部(31)之相鄰角部位,一邊朝各該凹榫部(32)之相鄰角部位的外側外移,即可拆離拼接狀態,拆除作業簡單、快速且方便,故可將單片龜裂之地磚地板,進行維修更換的作業,無需拆除所有地磚全部更換。 Thirteen, the structural design of the concave and convex tenons (32) and (31) of each adjacent tile is such that, when removing the tile floor from its spliced state, please refer to Figure 10. While gently tapping the adjacent corner of each convex tenon (31), move it outwards towards the outer corner of each adjacent concave tenon (32). This allows for easy, quick, and convenient removal, enabling the repair and replacement of individual cracked tile flooring without the need to remove and replace all tiles.
綜合上述,本創作所揭露之「拼接式地磚地板結構」,係提供一具隔音且方便拼接之地磚地板結構,其各該磁磚層、木板層及隔音層等,並透過各該膠劑層及不乾膠層,於常溫中重壓貼合組設所形成多層疊加結構,配合於該木板層具有拼接卡榫結構之設計,可同時解決泥作鋪貼施工的相關問題,並能達到降噪、模組化、環保及熱絕緣的效果,又具有維修及更換簡單快速,且具良好的耐水性,俾使整體確具產業實用性及成本效益,且其構成結構又未曾見於諸書刊或公開使用,誠符合新型專利申請要件,懇請 鈞局明鑑,早日准予專利,至為感禱。 In summary, the "interlocking tile flooring structure" disclosed in this invention provides a sound-insulating and easily interlocking tile flooring structure. The tile layers, wood panels, and sound-insulating layers are bonded together under heavy pressure at room temperature through adhesive and self-adhesive layers to form a multi-layered structure. The wood panel layer features a mortise and tenon joint design, which simultaneously solves related problems in masonry paving construction and achieves noise reduction, modularity, environmental friendliness, and thermal insulation. It also offers simple and quick maintenance and replacement, and good water resistance, making the overall design truly industrially practical and cost-effective. Furthermore, its structural composition has not been seen in any books or publicly available information, thus meeting the requirements for a utility model patent application. We respectfully request... We are deeply grateful to the Bureau for its wise judgment and for granting the patent soon.
需陳明者,以上所述乃是本創作之具體實施例及所運用之技 術原理,若依本創作之構想所作之改變,其所產生之功能作用仍未超出說明書及圖式所涵蓋之精神時,均應在本創作之範圍內,合予陳明。 It should be stated that the above description constitutes a specific embodiment of this invention and the technical principles employed. Any modifications made to the concept of this invention that do not exceed the scope of the instructions and drawings should also be stated within the scope of this invention.
(10):磁磚層 (10): Tile layer
(31):凸榫部 (31): Tenon section Tenon section
(32):凹榫部 (32): Tenon/Recess
(50):隔音層 (50): Sound insulation layer
Claims (13)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM679124U true TWM679124U (en) | 2026-01-11 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1812873B (en) | Facing brick and method for hard facing engineering | |
| RU2676345C2 (en) | Waterproof composite finish plank (options) | |
| CA3048728C (en) | Cladding panel | |
| WO2017013501A1 (en) | Prefabricated element for flooring | |
| US12252888B2 (en) | Field-assembled water control flooring systems | |
| US11680416B2 (en) | Field-assembled flooring systems with mold-resistant isolation boards | |
| US11851893B2 (en) | Field-assembled wall and flooring systems | |
| KR100486439B1 (en) | Multidirectional Panels | |
| TWM679124U (en) | Interlocking tile flooring structure | |
| CN220539104U (en) | Composite facing block material with floating system | |
| AU2010100181A4 (en) | Wall lining panel | |
| CN201133046Y (en) | External heat preservation wall for anchoring cement based lightweight board external wall | |
| WO2023037149A1 (en) | Floor covering | |
| RU81982U1 (en) | FLOOR | |
| KR200299982Y1 (en) | Panel Structure of Dry Ondol | |
| AU760628B2 (en) | Interconnecting disengageable flooring system | |
| WO2017203325A1 (en) | Flooring loose lay element | |
| RU96591U1 (en) | COATING MODULE | |
| Kaufmann et al. | Construction Systems | |
| NZ511336A (en) | Interconnecting disengageable flooring system | |
| HK1153703A (en) | Insulation board, adhesive mortar for attaching an insulation board to a wall or a ceiling of a building and assembly, comprising an insulation board and an adhesive mortar |