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TWM673605U - Connection interface compatible with type c universal serial bus hardware specifications - Google Patents

Connection interface compatible with type c universal serial bus hardware specifications

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Publication number
TWM673605U
TWM673605U TW114203511U TW114203511U TWM673605U TW M673605 U TWM673605 U TW M673605U TW 114203511 U TW114203511 U TW 114203511U TW 114203511 U TW114203511 U TW 114203511U TW M673605 U TWM673605 U TW M673605U
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TW
Taiwan
Prior art keywords
connection interface
docking
metal
signal transmission
structures
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TW114203511U
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Chinese (zh)
Inventor
林子祥
朱冠威
花明熙
廖士傑
魏嘉濠
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致伸科技股份有限公司
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Priority to TW114203511U priority Critical patent/TWM673605U/en
Publication of TWM673605U publication Critical patent/TWM673605U/en

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Abstract

This present invention is related to a connection interface that is compatible with the hardware specifications of the Type C Universal Serial Bus, including: a hardware structure of a connection interface that is compatible with the hardware specifications of a Type C Universal Serial Bus; wherein the connection interface includes any one of a male connection interface and a female connection interface that is compatible with the Type C Universal Serial Bus; and 24 metal docking structures, which are symmetrically distributed in the connection interface in the form of two groups of 12 metal docking structures; wherein, these metal docking structures can support two sets of Universal Serial Bus (USB) 2.0 standard signal transmission operations at the same time.

Description

一種相容於Type C通用序列匯流排之硬體規格的連接介面A connection interface compatible with the Type-C universal serial bus hardware specification

本案是有關於一種通用序列匯流排(USB)之連接介面,尤指一種相容於Type C通用序列匯流排(Type C Universal Serial Bus,USB-C)之硬體規格的連接介面。 This case relates to a Universal Serial Bus (USB) connection interface, specifically a connection interface compatible with the Type C Universal Serial Bus (USB-C) hardware specification.

對於現代人而言,諸如電腦、手機等類的智慧型電子產品,已成為生活中不可或缺的產品;其中,為支援上述智慧型電子產品,許多電子周邊設備即因應而生,例如,為備份資料之用的行動硬碟、為提供充電電源的有線或無線充電器、以及為能讀取各式不同儲存規格(例如,SD或CF規格)之資料儲存卡的讀卡機等等,然而,由於此些電子周邊設備彼此之間通常是相互獨立而無法相互進行傳輸或溝通,即使是透過某一主機(例如,電腦)以各別與不同的電子周邊設備進行傳輸或溝通,也往往需要藉由各式各樣不同規格的信號傳輸線材才得以順利完成,換言之,現代人為滿足 不同的使用需求,卻因而使得身邊充斥著太多且太複雜的電子周邊設備及信號傳輸線材,並且造成使用與生活上不小的困擾。 For modern people, smart electronic products such as computers and mobile phones have become indispensable products in life. In order to support the above smart electronic products, many electronic peripheral devices have been developed, such as mobile hard drives for data backup, wired or wireless chargers for charging, and card readers that can read data storage cards of various storage specifications (such as SD or CF specifications). However, due to the differences between these electronic peripheral devices, These devices are typically independent of each other and unable to transmit or communicate with each other. Even if a host computer (for example, a computer) is used to transmit or communicate with different electronic peripherals, it often requires a variety of signal transmission cables of different specifications to complete the communication. In other words, to meet the diverse needs of modern people, they are surrounded by too many and too complex electronic peripherals and signal transmission cables, causing considerable trouble in their use and daily life.

為滿足上述眾多使用者的各種不同的應用需求,且降低不同電子周邊設備之間的使用複雜度,一種可提供使用的彈性與簡化不同裝置之間連接方式的連接介面,即有必要被提出,而此正是本案所極欲解決的技術課題。 To meet the diverse application needs of these numerous users and reduce the complexity of using different electronic peripherals, a connection interface that provides flexibility and simplifies the connection between different devices is necessary. This is precisely the technical issue that this project aims to address.

本案之主要目的,在於提供一種可相容於Type C通用序列匯流排之硬體規格的連接介面。 The main purpose of this project is to provide a connection interface that is compatible with the Type-C universal serial bus hardware specifications.

本案之另一目的,在於提供一種將相容於Type C通用序列匯流排之硬體規格的連接介面,應用於由一主機與至少一擴充單元所共同組成之一模組化周邊裝置中,以使該主機與該至少一擴充單元之間進行模組化連接之應用實例。 Another object of this invention is to provide an application example in which a connection interface compatible with the hardware specification of the Type-C universal serial bus is applied to a modular peripheral device composed of a host computer and at least one expansion unit, thereby enabling a modular connection between the host computer and the at least one expansion unit.

本案之一較佳做法,係關於一種相容於Type C通用序列匯流排之硬體規格的連接介面,包括:一連接介面之硬體結構,相容於一Type C通用序列匯流排之硬體規格;其中,該連接介面包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者;以及24支金屬對接結構,其以兩組各12支金屬對接結構之方式,對稱分布於該連接介面中;其中,該些金屬對接結構可於同一時間支援兩組通用序列匯流排(USB)2.0規格之信號傳輸運作。 One preferred embodiment of the present invention relates to a connection interface compatible with the hardware specification of the Type-C universal serial bus, comprising: a connection interface hardware structure compatible with the hardware specification of the Type-C universal serial bus; wherein the connection interface includes either a male connector or a female connector compatible with the Type-C universal serial bus; and 24 metal docking structures symmetrically distributed within the connection interface in two groups of 12 metal docking structures each; wherein the metal docking structures can simultaneously support signal transmission operations compliant with two sets of the Universal Serial Bus (USB) 2.0 specification.

較佳之做法,其中用以支援該兩組USB 2.0規格中任一組通用序列匯流排之4支金屬對接結構,可搭配其他5支金 屬對接結構,以形成可支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。 Preferably, the four metal connectors supporting either USB 2.0 standard can be combined with the other five metal connectors to form a nine-metal connector structure supporting signal transmission operations for a single USB 3.0 standard.

較佳之做法,其中於該些金屬對接結構中,至少具有可支援一積體匯流排電路(I2C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。 Preferably, the metal bonding structures include at least two metal bonding structures that support signal transmission operations according to an integrated circuit ( I2C ) specification, or at least four metal bonding structures that support signal transmission operations according to a general-purpose input/output (GPIO) specification, or at least two metal bonding structures that provide a fixed 3.3V power signal transmission operation, or at least four metal bonding structures that provide a fast-charging power signal transmission operation, or at least four metal bonding structures that provide a grounding function.

較佳之做法,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。 Preferably, the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least one of 5V, 9V, 15V, 19V, 24V, 40V, or 48V.

較佳之做法,其中該連接介面可與一限位對接結構進行結合,以限定任兩連接介面僅能進行單向對接而無法進行雙向對接。 Preferably, the connection interface can be combined with a position-limiting docking structure to restrict any two connection interfaces to only one-way docking and prevent bidirectional docking.

較佳之做法,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。 Preferably, the position-limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure.

較佳之做法,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。 Preferably, the position-limiting docking structure includes at least one of a position-limiting groove and a position-limiting column.

較佳之做法,其中該連接介面用以設置於由一主機與至少一擴充單元所共同組成之一模組化周邊裝置中,以提供該主機與該至少一擴充單元之間進行模組化連接。 In a preferred embodiment, the connection interface is provided in a modular peripheral device composed of a host computer and at least one expansion unit to provide a modular connection between the host computer and the at least one expansion unit.

較佳之做法,其中該模組化周邊裝置至少包括:一Wi-Fi模組、至少一記憶儲存單元與一無線充電電路中之至少一者、 一第一USB介面裝置、一第二USB介面裝置以及一電源電路。 Preferably, the modular peripheral device includes at least: a Wi-Fi module, at least one of at least one memory storage unit and a wireless charging circuit, a first USB interface device, a second USB interface device, and a power circuit.

較佳之做法,其中該第一USB介面裝置電連接於支援該兩組USB2.0規格中任一組通用序列匯流排之4支金屬對接結構,以支援USB2.0規格之信號傳輸運作,及/或該任一組通用序列匯流排之4支金屬對接結構可再搭配其他5支金屬對接結構,以支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作。 Preferably, the first USB interface device is electrically connected to a four-wire metal docking structure supporting either of the two USB 2.0 standards to support signal transmission operations of the USB 2.0 standard, and/or the four-wire metal docking structure of either USB 2.0 standard can be combined with another five-wire metal docking structure to support signal transmission operations of a single USB 3.0 standard.

較佳之做法,其中該第一USB介面裝置具有一USB2.0/USB3.0共用連接埠,抑或同時具有一USB2.0連接埠以及一USB3.0連接埠。 Preferably, the first USB interface device has a USB 2.0/USB 3.0 shared port, or has both a USB 2.0 port and a USB 3.0 port.

較佳之做法,其中該第二USB介面裝置電接該兩組USB2.0規格中另一組通用序列匯流排之4支金屬對接結構,以支援USB2.0規格之信號傳輸運作。 Preferably, the second USB interface device is electrically connected to the four metal docking structures of the other of the two USB 2.0 standard universal serial buses to support USB 2.0 standard signal transmission operations.

較佳之做法,其中該第二USB介面裝置具有一USB2.0連接埠。 Preferably, the second USB interface device has a USB 2.0 port.

較佳之做法,其中該電源電路係電連接於提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、及/或電連接於提供一電源快充信號傳輸運作之4支金屬對接結構。 Preferably, the power circuit is electrically connected to two metal docking structures that provide a fixed 3.3 volt power signal transmission operation, and/or electrically connected to four metal docking structures that provide a power fast charging signal transmission operation.

本案之另一較佳做法,係關於一種相容於Type C通用序列匯流排之硬體規格的連接介面,包括:一連接介面之硬體結構,相容於一Type C通用序列匯流排之硬體規格;其中,該連接介面包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者;以及24支金屬對接結構,分布於該連接介面中,且該些金屬對接結構僅能進行單向對接而未提供雙向對接;其中,於該些金屬對接結構中,至少具有可支援一通用序 列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構、用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構,以及該4支金屬對接結構可搭配其他5支金屬對接結構,以形成可支援一通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。 Another preferred embodiment of the present invention relates to a connection interface compatible with the hardware specification of a Type-C universal serial bus, comprising: a connection interface hardware structure compatible with the hardware specification of a Type-C universal serial bus; wherein the connection interface includes either a male connector interface or a female connector interface compatible with the Type-C universal serial bus; and 24 metal docking structures distributed within the connection interface, wherein the metal docking structures are capable of only unidirectional docking and do not provide bidirectional docking; wherein at least four of the metal docking structures support signal transmission operations compliant with the USB 2.0 specification, and at least four support signal transmission operations compliant with another USB 2.0 specification. 2.0 specification, and these four metal docking structures can be combined with five other metal docking structures to form a nine-metal docking structure that supports signal transmission operations of the Universal Serial Bus (USB) 3.0 specification.

較佳之做法,其中於該些金屬對接結構中,至少具有可支援一積體匯流排電路(I2C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。 Preferably, the metal bonding structures include at least two metal bonding structures that support signal transmission operations according to an integrated circuit ( I2C ) specification, or at least four metal bonding structures that support signal transmission operations according to a general-purpose input/output (GPIO) specification, or at least two metal bonding structures that provide a fixed 3.3V power signal transmission operation, or at least four metal bonding structures that provide a fast-charging power signal transmission operation, or at least four metal bonding structures that provide a grounding function.

較佳之做法,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。 Preferably, the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least one of 5V, 9V, 15V, 19V, 24V, 40V, or 48V.

較佳之做法,其中於該些金屬對接結構中,具有可提供一接地功能之4支金屬對接結構。 A preferred approach is to include four metal joint structures among the metal joint structures that can provide a grounding function.

較佳之做法,其中該連接介面可與一限位對接結構進行結合,以限定任兩連接介面僅能進行單向對接而無法進行雙向對接。 Preferably, the connection interface can be combined with a position-limiting docking structure to restrict any two connection interfaces to only one-way docking and prevent bidirectional docking.

較佳之做法,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。 Preferably, the position-limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure.

較佳之做法,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。 Preferably, the position-limiting docking structure includes at least one of a position-limiting groove and a position-limiting column.

較佳之做法,其中該連接介面用以設置於由一主機與至少一擴充單元所共同組成之一模組化周邊裝置中,以提供該主機與該至少一擴充單元之間進行模組化連接。 In a preferred embodiment, the connection interface is provided in a modular peripheral device composed of a host computer and at least one expansion unit to provide a modular connection between the host computer and the at least one expansion unit.

本案之又一較佳做法,係關於一種相容於Type C通用序列匯流排之硬體規格的連接介面,應用於一至少具有一第一裝置與一第二裝置之一系統中,該連接介面至少包括:具有24支金屬對接結構之一第一連接介面之硬體結構,設置於該第一裝置中;以及具有另一24支金屬對接結構之一第二連接介面之硬體結構,設置於該第二裝置中,且該第二連接介面之硬體結構用以與該第一連接介面之硬體結構進行單向對接;其中,該第一連接介面之硬體結構或該第二連接介面之硬體結構皆相容於一Type C通用序列匯流排之硬體規格,且於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,皆可於同一時間支援兩組通用序列匯流排(USB)2.0規格之信號傳輸運作。 Another preferred embodiment of the present invention relates to a connection interface compatible with the hardware specification of the Type C universal serial bus, which is applied to a system having at least a first device and a second device, wherein the connection interface comprises at least: a hardware structure of a first connection interface having 24 metal docking structures, which is disposed in the first device; and a hardware structure of a second connection interface having another 24 metal docking structures, which is disposed in the second device, and the hardware structure of the second connection interface is used to perform unidirectional docking with the hardware structure of the first connection interface; wherein the hardware structure of the first connection interface or the hardware structure of the second connection interface is compatible with a Type C universal serial bus. C Universal Serial Bus hardware specifications, and both the 24 metal docking structures and any of the other 24 metal docking structures can simultaneously support two sets of Universal Serial Bus (USB) 2.0 specification signal transmission operations.

較佳之做法,其中該第一連接介面之硬體結構或該第二連接介面之硬體結構皆包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者。 Preferably, the hardware structure of the first connection interface or the hardware structure of the second connection interface includes either a male connection interface or a female connection interface compatible with the Type-C universal serial bus.

較佳之做法,其中於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,至少具有可支援一通用序列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構、用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構,以及該4支金屬對接結構可搭配其他5支金屬對接結構,以形成可支援一通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。 Preferably, the 24 metal docking structures and any of the other 24 metal docking structures include at least four metal docking structures capable of supporting signal transmission operations compliant with the USB 2.0 specification, another four metal docking structures capable of supporting signal transmission operations compliant with another USB 2.0 specification, and the four metal docking structures can be combined with five other metal docking structures to form nine metal docking structures capable of supporting signal transmission operations compliant with the USB 3.0 specification.

較佳之做法,其中於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,至少具有可支援一積體匯流排電路(I2C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。 Preferably, the 24 metal bonding structures and any of the other 24 metal bonding structures include at least two metal bonding structures that support signal transmission operations according to an integrated circuit ( I2C ) specification, or at least four metal bonding structures that support signal transmission operations according to a general-purpose input/output (GPIO) specification, or at least two metal bonding structures that provide fixed 3.3V power signal transmission operations, or at least four metal bonding structures that provide power fast charging signal transmission operations, or at least four metal bonding structures that provide a grounding function.

較佳之做法,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。 Preferably, the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least one of 5V, 9V, 15V, 19V, 24V, 40V, or 48V.

較佳之做法,其中該第一連接介面與該第二連接介面中之任一者皆可與一限位對接結構進行結合,以限定該第一連接介面與該第二連接介面僅能進行單向對接而無法進行雙向對接。 Preferably, either the first connection interface or the second connection interface can be combined with a position-limiting docking structure to restrict the first connection interface and the second connection interface to only one-way docking and prevent bidirectional docking.

較佳之做法,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。 Preferably, the position-limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure.

較佳之做法,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。 Preferably, the position-limiting docking structure includes at least one of a position-limiting groove and a position-limiting column.

較佳之做法,其中該第一裝置可為一主機,該第二裝置可為至少一擴充單元,且該系統可為由該主機與該至少一擴充單元之間進行模組化連接而所組成之一模組化周邊裝置。 In a preferred embodiment, the first device may be a host computer, the second device may be at least one expansion unit, and the system may be a modular peripheral device formed by modularly connecting the host computer and the at least one expansion unit.

為了對本案之上述及其他方面有更佳的瞭解,下文特舉實施例並配合所附圖式進行詳細說明。 To provide a better understanding of the above and other aspects of this case, the following provides a detailed description with reference to specific embodiments and accompanying drawings.

TC0:習知Type C通用序列匯流排之公頭連接介面 TC0: Learn about the Type C Universal Serial Bus male connector interface.

TC:本案Type C通用序列匯流排之公頭連接介面 TC: This case shows the Type C universal serial bus male connector interface.

A1~A12、B1~B12:金屬對接結構 A1~A12, B1~B12: Metal butt joint structure

11:主機 11: Host

111:主控制及介面處理單元 111: Main control and interface processing unit

112:電源模組 112: Power module

114:凸部對接結構 114: Protrusion docking structure

1141:限位槽 1141: Limiting slot

12:擴充單元 12: Expansion Unit

121:第一USB介面裝置 121: First USB interface device

122:第二USB介面裝置 122: Second USB interface device

123:控制及GPIO處理單元 123: Control and GPIO processing unit

124:電源電路 124: Power circuit

125:無線充電電路 125: Wireless charging circuit

126:記憶儲存單元 126: Memory storage unit

127:凹槽對接結構 127: Groove docking structure

1271:限位柱 1271: Limiting column

128:Wi-Fi模組 128: Wi-Fi module

21:主機 21: Host

211:主控制及介面處理單元 211: Main control and interface processing unit

212:電源模組 212: Power module

213:第一記憶儲存單元 213: First memory storage unit

22:第一擴充單元 22: First expansion unit

221:第一USB介面裝置 221: First USB interface device

222:第二USB介面裝置 222: Second USB interface device

223:控制及GPIO處理單元 223: Control and GPIO processing unit

224:電源電路 224: Power circuit

225:Wi-Fi模組 225: Wi-Fi module

23:第二擴充單元 23: Second expansion unit

231:控制及GPIO處理單元 231: Control and GPIO processing unit

232:記憶儲存單元 232: Memory storage unit

233:無線充電電路 233: Wireless charging circuit

P:向下組裝動作 P: Downward assembly action

USB2-1、USB2-2:通用序列匯流排(USB)2.0規格中之資料信號傳輸線 USB2-1, USB2-2: Data signal transmission lines in the Universal Serial Bus (USB) 2.0 specification

PD:電源快充信號 PD: Power fast charging signal

SCL:I2C積體匯流排電路規格之串列時脈信號 SCL: I 2 C integrated bus circuit specifications serial clock signal

SDA:I2C積體匯流排電路規格之串列資料信號 SDA: I 2 C integrated bus circuit specification serial data signal

GPIO1~GPIO4:第一組~第四組通用型之輸入輸出信號 GPIO1~GPIO4: The first to fourth groups of general-purpose input and output signals

〔圖1〕為習知Type C通用序列匯流排之硬體規格的公頭(Plug)連接介面之概念示意圖。 Figure 1 is a conceptual diagram of the male plug connection interface of the Type-C universal serial bus hardware specification.

〔圖2〕為本案提供可相容於Type C通用序列匯流排之硬體規格的公頭(Plug)連接介面之一較佳實施概念示意圖。 Figure 2 shows a schematic diagram of a preferred implementation concept for a male plug connection interface compatible with the Type C universal serial bus hardware specification.

〔圖3〕為將本案所提出之相容於Type C通用序列匯流排之硬體規格的連接介面應用於一模組化周邊裝置的一較佳實施概念示意圖。 Figure 3 is a schematic diagram showing a preferred implementation concept of applying the proposed connection interface, which is compatible with the Type C universal serial bus hardware specification, to a modular peripheral device.

〔圖4A及圖4B〕為本案圖3中該模組化周邊裝置於運用本案多個連接介面以實現模組化對接時,結合運用一限位對接結構之具體組裝及底部實施結構示意圖。 Figures 4A and 4B illustrate the specific assembly and bottom implementation structure of the modular peripheral device shown in Figure 3 of this case, combined with a position-limiting docking structure when utilizing multiple connection interfaces of this case to achieve modular docking.

〔圖5〕為將本案所提出之相容於Type C通用序列匯流排之硬體規格的連接介面應用於另一模組化周邊裝置的一較佳實施概念示意圖。 Figure 5 is a schematic diagram showing a preferred implementation concept for applying the proposed connection interface, which is compatible with the Type-C universal serial bus hardware specification, to another modular peripheral device.

以下係提出實施例進行詳細說明,實施例僅用以作為範例說明,並不會限縮本案欲保護之範圍。此外,實施例中之圖式係省略不必要或以通常技術即可完成之元件,以清楚顯示本案之技術特點。 The following detailed description is based on examples. These examples are provided for illustrative purposes only and are not intended to limit the scope of protection sought by this application. Furthermore, the figures in the examples omit unnecessary elements or elements that can be implemented using conventional techniques to clearly illustrate the technical features of this application.

為達到能解決習知技術問題而必需提供一種具有使用彈性與可簡化不同裝置之間連接方式的連接介面之設計目的,本案選擇利用習知Type C通用序列匯流排(Type C Universal Serial Bus,USB-C)之連接介面之硬體規格,來做為不同電子裝置之間的對接結構,同時重新定義其中一些傳輸信號內容,以達到不但可充分利用既有的線材硬體規格而大幅節省連接介面的硬體開發成本之外,同時又能滿足且符合不同電子周邊裝置之間信號傳輸的模組化組裝需求與應用彈性。 To address the challenges of known technologies, a flexible and simplified interface design was necessary. This design utilizes the USB-C (Type C Universal Serial Bus) hardware specification as the interface between various electronic devices. By redefining some of the transmission signaling, the design not only fully utilizes existing cable hardware specifications, significantly reducing interface hardware development costs, but also meets the modular assembly requirements and application flexibility required for signal transmission between various electronic peripherals.

申言之,以下將先列舉習知Type C通用序列匯流排之公頭(Plug)連接介面之硬體規格的對接信號規劃,以方便後續本案的連接介面進行對接信號規劃變更的實施例與應用實例之相關說明。 In other words, the following will first illustrate the signal layout of the Type-C universal serial bus male plug interface hardware specification, to facilitate the subsequent description of the implementation and application examples of the signal layout changes for the connection interface in this case.

請先參考圖1所示習知Type C通用序列匯流排之公頭(Plug)連接介面TC0之硬體規格的對接信號規劃,並請配合下列表格有關其中對接信號之相關說明: Please refer to Figure 1 for the Type-C Universal Serial Bus male connector (TC0) hardware specification for the signal layout and the table below for the relevant information about the signal layout:

於參考圖1後應即可知,習知Type C通用序列匯流排(USB-C)之公頭(Plug)連接介面TC0之硬體規格,係具有24支金屬對接結構(A1~A12、B1~B12),且係以兩組各12支金屬對接結構之方式對稱分布於連接介面中。 As Figure 1 indicates, the USB-C male connector (TC0) hardware specifications show that it has 24 metal connectors (A1-A12, B1-B12), arranged symmetrically across the connector in two groups of 12 each.

再則,由於本案規劃的連接介面TC(如圖2所示),並不需要進行雙向對接的功能,且僅提供單向對接的功能,因此,針對圖1中一些金屬對接結構的既有USB-C的對接信號規劃,因已不需要達到雙向對接功能而閒置的關係,本案便可加以利用並進行變更,以便將閒置的金屬對接結構重新定義及規劃後,用以支援另一組USB2.0、積體匯流排電路(Inter-Integrated Circuit,I2C)、3.3V電源、多組電源快充信號(Power Delivery,PD)以及通用型之輸入輸出(General-Purpose Input/Output,GPIO)等規格,以達到利用本案新設計的連接介面,可同時提供一組USB3.0、兩組USB2.0、I2C、3.3V電源、多組電源快充信號PD及GPIO等功能的連接及傳輸。 Furthermore, since the connection interface TC (as shown in FIG2 ) planned in this case does not need to perform bidirectional docking and only provides unidirectional docking, the existing USB-C docking signal planning of some metal docking structures in FIG1 is idle because it no longer needs to achieve the bidirectional docking function. This case can utilize and modify them so that the idle metal docking structures can be redefined and planned to support another set of USB2.0, integrated bus circuit (Inter-Integrated Circuit, I 2 C), 3.3V power, multiple sets of power delivery (PD) signals and general-purpose input and output (GPIO). The newly designed interface can simultaneously provide one USB 3.0, two USB 2.0, I 2 C, 3.3V power, multiple power supply fast charging signals (PD), and GPIO.

亦即,請參閱圖2以及下例表格所示者,其分別為 本案提供可相容於Type C通用序列匯流排之硬體規格的公頭(Plug)連接介面TC之一較佳實施概念示意圖與其中對接信號之相關表格說明;其中,經過重新定義及規劃的金屬對接結構,於表格中有額外加上底線,以方便參閱與理解: Specifically, please refer to Figure 2 and the table below, which provide a schematic diagram of a preferred implementation concept for a male plug connector TC compatible with the Type-C universal serial bus hardware specification and a table illustrating the corresponding interconnection signals. The redefined and redesigned metal interconnection structure is underlined in the table for easier reference and understanding:

當然,針對習知Type C通用序列匯流排之母座(Receptacle)連接介面之硬體規格的對接信號規劃,也可比照本案圖2實施例所示方式進行相同或類似的變更規畫,在此即不再予以贅述。 Of course, the signal planning for the connection of the Type-C universal serial bus receptacle interface hardware specifications can also be modified in the same or similar manner as shown in the embodiment of FIG. 2 of this invention, and will not be further elaborated here.

再則,自前述表格與圖2中可知,其中,於該些金屬對接結構(A1~A12、B1~B12)中,至少具有可支援一通用序列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構(A1、A4、A6、A7);其中,該些金屬對接結構(A6、A7)組成該通用序列匯流排(USB)2.0規格中之資料信號傳輸線USB2-1。 Furthermore, as can be seen from the aforementioned table and Figure 2, the metal docking structures (A1-A12, B1-B12) include at least four metal docking structures (A1, A4, A6, and A7) that support signal transmission operations compliant with the Universal Serial Bus (USB) 2.0 specification. These metal docking structures (A6 and A7) constitute the data signal transmission line USB2-1 compliant with the USB 2.0 specification.

同時,於該些金屬對接結構(A1~A12、B1~B12)中,亦包括用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構(B6、B7、B9、B12);其中,該些金屬對接結構(B6、B7)組成該另一通用序列匯流排(USB)2.0規格中之另一資料信號傳輸線USB2-2。 At the same time, these metal docking structures (A1-A12, B1-B12) also include another four metal docking structures (B6, B7, B9, B12) for supporting signal transmission operations of another USB 2.0 standard. These metal docking structures (B6, B7) constitute another data signal transmission line USB2-2 in the other Universal Serial Bus (USB) 2.0 standard.

如此一來,透過本案新設計的連接介面TC,用以支援該通用序列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構(A1、A4、A6、A7),以及用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構(B6、B7、B9、B12),於必要時即可以同一時間提供兩組通用序列匯流排(USB)2.0規格之信號分別進行傳輸運作。 Thus, the newly designed connection interface TC in this case supports the signal transmission operation of the USB 2.0 specification through four metal docking structures (A1, A4, A6, and A7), and supports the signal transmission operation of another USB 2.0 specification through another four metal docking structures (B6, B7, B9, and B12). When necessary, two sets of USB 2.0 standard signals can be provided for transmission operation simultaneously.

又,前述該4支金屬對接結構(A1、A4、A6、A7)可再搭配其他5支金屬對接結構(A2、A3、B10、B11、B1),以形成可支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。 Furthermore, the aforementioned four metal docking structures (A1, A4, A6, and A7) can be combined with five other metal docking structures (A2, A3, B10, B11, and B1) to form a total of nine metal docking structures that support signal transmission operations compliant with a single Universal Serial Bus (USB) 3.0 specification.

另外,於該些金屬對接結構(A1~A12、B1~B12)中,具有可支援一積體匯流排電路(I2C)規格之信號傳輸運作之兩支金屬對接結構(A10、A11),以及具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構(B2、B3、B5、 A5)。 In addition, among these metal docking structures (A1-A12, B1-B12), there are two metal docking structures (A10, A11) that can support signal transmission operations of an integrated circuit ( I2C ) specification, and four metal docking structures (B2, B3, B5, A5) that can support signal transmission operations of a general-purpose input and output (GPIO) specification.

再則,於該些金屬對接結構(A1~A12、B1~B12)中,至少包括可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構(A8、B8)、以及可提供一電源快充信號PD傳輸運作之4支金屬對接結構(A4、A9、B4、B9);其中,本案針對該電源快充信號PD傳輸運作,可以視實際應用狀況而透過該4支金屬對接結構(A4、A9、B9、B4)提供更多不同的電壓運作選擇範圍,例如,可提供至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。 Furthermore, the metal bonding structures (A1-A12, B1-B12) include at least two metal bonding structures (A8, B8) that can provide a fixed 3.3V power signal transmission operation, and four metal bonding structures (A4, A9, B4, B9) that can provide a fast power charging signal (PD) transmission operation. Specifically, for the fast power charging signal (PD) transmission operation, the present invention can provide a wider range of voltage operation options through the four metal bonding structures (A4, A9, B9, B4) depending on the actual application conditions. For example, it can provide a power signal transmission operation of at least 5V, 9V, 15V, 19V, 24V, 40V, or 48V.

當然,其中於該些金屬對接結構(A1~A12、B1~B12)中,具有可提供一接地功能之4支金屬對接結構(A1、A12、B1、B12)。 Of course, among these metal connecting structures (A1-A12, B1-B12), there are four metal connecting structures (A1, A12, B1, B12) that can provide a grounding function.

針對本案所提出一種可提供使用的彈性與簡化不同裝置之間連接方式的新款連接介面TC,其較佳應用實例之一,係可請參閱圖3,其即為將本案所提出之相容於Type C通用序列匯流排之硬體規格的連接介面TC應用於一模組化周邊裝置的一較佳實施概念示意圖。 For a preferred application example of the new connection interface TC proposed in this case, which provides flexibility and simplifies the connection between different devices, please refer to Figure 3, which is a schematic diagram of a preferred implementation concept of applying the proposed connection interface TC, which is compatible with the Type-C universal serial bus hardware specification, to a modular peripheral device.

於圖3中,本案新款連接介面TC用以設置於由一主機11與一擴充單元12所共同組成之一模組化周邊裝置中,以提供該主機11與該擴充單元12之間進行模組化連接。其中,該主機11與該擴充單元12之間除採用USB2.0/USB3.0規格進行信號傳輸運作之外,亦可針對該擴充單元12中之部分功能採用主/從架構之積體匯流排電路(I2C)規格進行信號傳輸運作。 In Figure 3, the new connection interface TC of this invention is installed in a modular peripheral device composed of a host computer 11 and an expansion unit 12, providing a modular connection between the host computer 11 and the expansion unit 12. In addition to utilizing USB 2.0/USB 3.0 standards for signal transmission between the host computer 11 and the expansion unit 12, signal transmission using the master/slave integrated circuit (I 2 C) standard can also be used for some functions within the expansion unit 12.

其中,該主機11至少包括:一主控制及介面處理單 元111以及一電源模組112;而該擴充單元12至少包括:一第一USB介面裝置121、一第二USB介面裝置122、一控制及GPIO處理單元123、一電源電路124、一無線充電電路125、一記憶儲存單元126以及一Wi-Fi模組128。 The host computer 11 includes at least a main control and interface processing unit 111 and a power module 112. The expansion unit 12 includes at least a first USB interface device 121, a second USB interface device 122, a control and GPIO processing unit 123, a power circuit 124, a wireless charging circuit 125, a memory storage unit 126, and a Wi-Fi module 128.

其中,該主機11及該擴充單元12中各自設有一連接介面TC,例如,其中一者為Type C之公頭硬體規格,另一者即為Type C之母座硬體規格,抑或兩者皆為Type C之母座硬體規格,並運用兩端皆為Type C之公頭硬體規格之傳輸線進行對接,本案並不予以設限;當然,任一連接介面TC皆設有24支金屬對接結構(A1~A12、B1~B12)。 The host computer 11 and the expansion unit 12 each have a connection interface TC. For example, one may have a Type C male connector and the other a Type C female connector, or both may have a Type C female connector and be connected using a transmission cable with Type C male connectors at both ends. This is not a limitation in this case. Of course, each connection interface TC has 24 metal connection structures (A1-A12, B1-B12).

其中,該第一USB介面裝置121電連接於支援兩組USB2.0規格中之一組通用序列匯流排之4支金屬對接結構(A1、A4、A6、A7),以支援USB2.0規格之信號傳輸運作,且該組通用序列匯流排之4支金屬對接結構(A1、A4、A6、A7)可再搭配其他5支金屬對接結構(A2、A3、B10、B11、B1),以支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作。 The first USB interface device 121 is electrically connected to four metal docking structures (A1, A4, A6, and A7) supporting one of the two USB 2.0 standards to support signal transmission operations of the USB 2.0 standard. Furthermore, the four metal docking structures (A1, A4, A6, and A7) of the USB 2.0 standard can be combined with five other metal docking structures (A2, A3, B10, B11, and B1) to support signal transmission operations of a single USB 3.0 standard.

較佳者,該第一USB介面裝置121具有一USB2.0/USB3.0共用連接埠(圖未示出),抑或同時具有一USB2.0連接埠(圖未示出)以及一USB3.0連接埠(圖未示出),以供與具有USB2.0/USB3.0規格之電子周邊裝置(圖未示出)進行對接。 Preferably, the first USB interface device 121 has a USB 2.0/USB 3.0 shared port (not shown), or has both a USB 2.0 port (not shown) and a USB 3.0 port (not shown), for connecting to an electronic peripheral device (not shown) that complies with the USB 2.0/USB 3.0 standard.

另外,該第二USB介面裝置122電接該兩組USB2.0規格中另一組通用序列匯流排之4支金屬對接結構(B6、B7、B9、B12),以支援USB2.0規格之信號傳輸運作,以供與亦具有USB2.0規格之另一電子周邊裝置(圖未示出)進行對接。 Furthermore, the second USB interface device 122 is electrically connected to the four metal docking structures (B6, B7, B9, and B12) of the other of the two USB 2.0 standard Universal Serial Buses to support USB 2.0 standard signal transmission operations and facilitate docking with another electronic peripheral device (not shown) also conforming to the USB 2.0 standard.

其中,該第二USB介面裝置122具有一USB2.0連接埠(圖未示出)。 The second USB interface device 122 has a USB 2.0 port (not shown).

自上述說明可知,該擴充單元12除本身已提供一些周邊應用功能(例如,該無線充電電路125可提供一無線充電功能,抑或該記憶儲存單元126可提供一資料儲存功能),並方便與該主機11進行模組化組裝之外,亦可透過例如該第一USB介面裝置121或該第二USB介面裝置122,而與其他電子周邊裝置(圖未示出)進行擴充連接。當然,該擴充單元12亦提供可由使用者透過該Wi-Fi模組128進行整體或部分的信號控制。 As can be seen from the above description, the expansion unit 12 not only provides some peripheral application functions (for example, the wireless charging circuit 125 can provide wireless charging, or the memory storage unit 126 can provide data storage) and facilitates modular assembly with the host 11, but also allows for expansion connections with other electronic peripheral devices (not shown) through, for example, the first USB interface device 121 or the second USB interface device 122. Of course, the expansion unit 12 also allows for full or partial signal control by the user via the Wi-Fi module 128.

又,該擴充單元12所包括之該電源電路124,其係電連接於提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構(A8、B8)、及/或電連接於提供一電源快充信號PD傳輸運作之4支金屬對接結構(A4、A9、B4、B9)。 Furthermore, the power circuit 124 included in the expansion unit 12 is electrically connected to two metal docking structures (A8, B8) that provide a fixed 3.3V power signal transmission operation, and/or to four metal docking structures (A4, A9, B4, B9) that provide a power fast charging signal PD transmission operation.

其中,本案針對該電源快充信號PD規格之電源信號傳輸運作,可以視該擴充單元12或其他電子周邊裝置(圖未示出)之實際應用狀況,而透過該4支金屬對接結構(A4、A9、B9、B4)提供更多不同的電壓運作選擇範圍,例如,可提供至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。 Specifically, this invention addresses the power signal transmission operation of the power fast charging signal PD specification. Depending on the actual application of the expansion unit 12 or other electronic peripheral devices (not shown), the four metal docking structures (A4, A9, B9, B4) can provide a wider range of voltage operating options. For example, power signal transmission operation can be provided for at least one of 5V, 9V, 15V, 19V, 24V, 40V, or 48V.

再者,於該主機11中之該主控制及介面處理單元111,與該擴充單元12中之該控制及GPIO處理單元123之間,可安排具有可支援一積體匯流排電路(I2C)規格之信號傳輸運作之兩支金屬對接結構(A10、A11),以及具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構(B2、B3、B5、 A5);其中,本案規劃多支金屬對接結構(B2、B3、B5、A5)用以支援該通用型之輸入輸出(GPIO)規格之信號傳輸運作,其目的之一,是為了在將本案新設計的連接介面TC應用至該模組化周邊裝置時,可以透過該些GPIO信號做為針對欲組裝至該模組化周邊裝置中之任一擴充單元是否同屬於同一系列產品之組裝判斷依據。 Furthermore, between the main control and interface processing unit 111 in the host 11 and the control and GPIO processing unit 123 in the expansion unit 12, two metal connection structures (A10, A11) supporting signal transmission operations of an integrated bus circuit ( I2C ) specification and four metal connection structures (B2, B3, B5, B6) supporting signal transmission operations of a general purpose input and output (GPIO) specification can be arranged. A5); Specifically, this case plans multiple metal docking structures (B2, B3, B5, A5) to support the signal transmission operation of the general purpose input and output (GPIO) specification. One of the purposes is to use these GPIO signals as a basis for determining whether any expansion unit to be assembled into the modular peripheral device belongs to the same series of products when the newly designed connection interface TC of this case is applied to the modular peripheral device.

當然,該主機11除本身對於該擴充單元12進行信號控制之外,亦可與一電腦(圖未示出)進行連線,以由該電腦進行整體或部分的信號控制。 Of course, in addition to controlling the signals of the expansion unit 12, the host computer 11 can also be connected to a computer (not shown) to allow the computer to control the entire or partial signals.

為進一步說明圖3中該主機11與該擴充單元12之模組化組裝動作,且基於本案的連接介面TC不提供雙向對接功能,因此勢必要有一些對接防呆機制之設計考量,其中一較佳作法,可請參考圖4A及圖4B所示者,其係為本案圖3中該模組化周邊裝置於運用本案兩個連接介面TC以實現模組化對接時,結合運用一限位對接結構之具體組裝及底部實施結構示意圖。 To further illustrate the modular assembly of the host computer 11 and the expansion unit 12 in Figure 3 , and given that the connection interface TC in this case does not provide bidirectional docking functionality, some design considerations for a docking prevention mechanism are necessary. A preferred approach is shown in Figures 4A and 4B , which illustrate the specific assembly and bottom implementation structure of the modular peripheral device in Figure 3 , combined with a position-limiting docking structure, when using the two connection interfaces TC in this case to achieve modular docking.

於圖4A及圖4B中,該主機11與該擴充單元12之間係以上/下堆疊之方式進行模組化組裝,亦即,該擴充單元12之底部以一向下組裝動作P,設置於該主機11之頂部。 In Figures 4A and 4B, the main unit 11 and the expansion unit 12 are modularly assembled in an up/down stacking manner. That is, the bottom of the expansion unit 12 is placed on top of the main unit 11 in a downward assembly motion P.

其中,該主機11中連接介面TC之周圍設有一限位對接結構(例如,可為一凸部對接結構114),以與該擴充單元12中連接介面TC之周圍設置的另一限位對接結構(例如,可為一凹槽對接結構127)進行結合,俾限定任兩連接介面TC僅能進行單向對接而無法進行雙向對接,以達到對接防呆的設計目的。 A position-limiting docking structure (e.g., a protruding docking structure 114) is provided around the connection interface TC in the main unit 11. This structure mates with another position-limiting docking structure (e.g., a recessed docking structure 127) provided around the connection interface TC in the expansion unit 12. This restricts any two connection interfaces TC to one-way docking, preventing bidirectional docking. This achieves a foolproof docking design.

另外,為避免該主機11中之連接介面TC,與該擴充單元12中之連接介面TC於進行對接時產生不穩固的情況,本 案可進一步藉由於該凸部對接結構114處增加設置一限位槽1141,且同時於該凹槽對接結構127處相對應增加設置一限位柱1271,以透過該限位槽1141與該限位柱1271之限位對接,而可有效提高該主機11與該擴充單元12對接的穩定性。 Furthermore, to prevent instability during docking between the connection interface TC in the main unit 11 and the connection interface TC in the expansion unit 12, the present invention further provides a retaining groove 1141 on the protruding docking structure 114 and a corresponding retaining post 1271 on the recessed docking structure 127. The retaining groove 1141 and retaining post 1271 effectively enhance the stability of the docking between the main unit 11 and the expansion unit 12 through the retaining engagement between the retaining groove 1141 and the retaining post 1271.

再請參閱圖5,其為將本案所提出之相容於Type C通用序列匯流排之硬體規格的連接介面TC應用於另一模組化周邊裝置的一較佳實施概念示意圖。 Please refer to Figure 5, which is a schematic diagram of a preferred implementation concept of applying the connection interface TC proposed in this case, which is compatible with the Type C universal serial bus hardware specification, to another modular peripheral device.

圖5之基本運作原理係與圖3類似,圖5中主要是增加擴充單元的數量,以及變更一些周邊裝置功能的具體設置位置,藉以說明本案的新款連接介面可以應用於與各種不同的周邊裝置進行模組化對接,藉以呈現本案的新款連接介面的使用彈性與便利性。 The basic operating principle of Figure 5 is similar to that of Figure 3. Figure 5 primarily increases the number of expansion units and changes the specific placement of some peripheral device functions. This illustrates how the new connection interface can be used for modular docking with various peripheral devices, demonstrating its flexibility and convenience.

亦即,於圖5中,本案新款連接介面TC用以分別設置於由一主機21與一第一擴充單元22、一第二擴充單元23共同組成之另一模組化周邊裝置中,以分別提供該主機21與該第一擴充單元22、該第二擴充單元23之間進行模組化連接。其中,該主機21與該第一擴充單元22、該第二擴充單元23之間除採用USB2.0/USB3.0規格進行信號傳輸運作之外,亦可針對該擴充單元12中之部分功能採用主/從架構之積體匯流排電路(I2C)規格進行信號傳輸運作。 Specifically, as shown in Figure 5, the new connection interface TC of this invention is installed in another modular peripheral device composed of a host computer 21, a first expansion unit 22, and a second expansion unit 23, respectively, to provide modular connections between the host computer 21 and the first expansion unit 22 and the second expansion unit 23. In addition to utilizing USB 2.0/USB 3.0 standards for signal transmission between the host computer 21 and the first expansion unit 22 and the second expansion unit 23, signal transmission using the master/slave integrated circuit (I 2 C) standard can also be used for signal transmission between some functions within the expansion unit 12.

其中,該主機21至少包括:一主控制及介面處理單元211、一電源模組212以及一第一記憶儲存單元213;而該第一擴充單元22至少包括:一第一USB介面裝置221、一第二USB介面裝置222、一控制及GPIO處理單元223、一電源電路224以 及Wi-Fi模組225;另外,該第二擴充單元23至少包括:一控制及GPIO處理單元231、一第二記憶儲存單元232以及一無線充電電路233。 The host computer 21 includes at least a main control and interface processing unit 211, a power module 212, and a first memory storage unit 213. The first expansion unit 22 includes at least a first USB interface device 221, a second USB interface device 222, a control and GPIO processing unit 223, a power circuit 224, and a Wi-Fi module 225. Furthermore, the second expansion unit 23 includes at least a control and GPIO processing unit 231, a second memory storage unit 232, and a wireless charging circuit 233.

當然,該主機21與該第一擴充單元22、該第二擴充單元23中任一連接介面TC皆設有24支金屬對接結構(A1~A12、B1~B12)。 Of course, the connection interface TC between the host computer 21 and either the first expansion unit 22 or the second expansion unit 23 is equipped with 24 metal docking structures (A1-A12, B1-B12).

綜上所述,本案藉由利用習知Type C通用序列匯流排(Type C Universal Serial Bus,USB-C)之連接介面之硬體規格,來做為不同電子裝置之間的對接結構,同時重新定義其中一些傳輸信號內容,以達到不但可充分利用既有的線材硬體規格而大幅節省連接介面的硬體開發成本之外,同時又能滿足且符合不同電子周邊裝置之間信號傳輸的模組化組裝需求與應用彈性;故本案實為一極具產業價值之作。 In summary, this design leverages the hardware specifications of the USB-C (Type C Universal Serial Bus) interface as a connection structure between various electronic devices. It also redefines some of the transmission signal content. This not only fully utilizes existing cable hardware specifications, significantly saving hardware development costs for the connection interface, but also meets the modular assembly requirements and application flexibility required for signal transmission between various electronic peripherals. Therefore, this design is a product of great industrial value.

雖然本案已以實施例揭露如上,然其並非用以限定本案。本案所屬技術領域中具有通常知識者,在不脫離本案之精神和範圍內,當可作各種之更動與潤飾。因此,本案之保護範圍當視後附之申請專利範圍所界定者為準。 Although this invention has been disclosed above through embodiments, they are not intended to limit this invention. Those skilled in the art will readily appreciate that various modifications and enhancements can be made to this invention without departing from the spirit and scope of this invention. Therefore, the scope of protection for this invention shall be determined by the scope of the patent application attached hereto.

TC:本案Type C通用序列匯流排之公頭(Plug)連接介面 TC: This case shows the Type C universal serial bus male connector (plug) interface.

A1~A12、B1~B12:金屬對接結構 A1~A12, B1~B12: Metal butt joint structure

USB2-1、USB2-2:通用序列匯流排(USB)2.0規格中之資料信號傳輸線 USB2-1, USB2-2: Data signal transmission lines in the Universal Serial Bus (USB) 2.0 specification

PD:電源快充信號 PD: Power fast charging signal

SCL:I2C積體匯流排電路規格之串列時脈信號 SCL: I 2 C integrated bus circuit specifications serial clock signal

SDA:I2C積體匯流排電路規格之串列資料信號 SDA: I 2 C integrated bus circuit specification serial data signal

GPIO1~GPIO4:第一組~第四組通用型之輸入輸出信號 GPIO1~GPIO4: The first to fourth groups of general-purpose input and output signals

Claims (30)

一種相容於Type C通用序列匯流排之硬體規格的連接介面,包括:一連接介面之硬體結構,相容於一Type C通用序列匯流排之硬體規格;其中,該連接介面包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者;以及24支金屬對接結構,其以兩組各12支金屬對接結構之方式,對稱分布於該連接介面中;其中,該些金屬對接結構可於同一時間支援兩組通用序列匯流排(USB)2.0規格之信號傳輸運作。A connection interface compatible with the hardware specifications of the Type C universal serial bus includes: a connection interface hardware structure compatible with the hardware specifications of a Type C universal serial bus; wherein the connection interface includes either a male connection interface or a female connection interface compatible with the Type C universal serial bus; and 24 metal docking structures symmetrically distributed in the connection interface in the form of two groups of 12 metal docking structures each; wherein the metal docking structures can simultaneously support signal transmission operations of two sets of universal serial bus (USB) 2.0 specifications. 如請求項1所述之連接介面,其中用以支援該兩組USB 2.0規格中任一組通用序列匯流排之4支金屬對接結構,可搭配其他5支金屬對接結構,以形成可支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。The connection interface as described in claim 1, wherein the four metal docking structures used to support either of the two USB 2.0 specifications can be combined with the other five metal docking structures to form a nine-metal docking structure that can support signal transmission operations of a single USB 3.0 specification. 如請求項1所述之連接介面,其中於該些金屬對接結構中,至少具有可支援一積體匯流排電路(I²C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。The connection interface as described in claim 1, wherein the metal docking structures include at least two metal docking structures that can support signal transmission operations of an integrated circuit (I²C) specification, or at least four metal docking structures that can support signal transmission operations of a general purpose input and output (GPIO) specification, or at least two metal docking structures that can provide a fixed 3.3 volt power signal transmission operation, or at least four metal docking structures that can provide a fast power charging signal transmission operation, or at least four metal docking structures that can provide a grounding function. 如請求項3所述之連接介面,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。The connection interface as described in claim 3, wherein the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least any one of 5 volts, 9 volts, 15 volts, 19 volts, 24 volts, 40 volts or 48 volts. 如請求項1所述之連接介面,其中該連接介面可與一限位對接結構進行結合,以限定任兩連接介面僅能進行單向對接而無法進行雙向對接。As described in claim 1, the connection interface can be combined with a limit docking structure to limit any two connection interfaces to only one-way docking and not two-way docking. 如請求項5所述之連接介面,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。A connection interface as described in claim 5, wherein the position-limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure. 如請求項5所述之連接介面,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。The connection interface as described in claim 5, wherein the limiting docking structure includes at least one of a limiting groove and a limiting column. 如請求項1所述之連接介面,其中該連接介面用以設置於由一主機與至少一擴充單元所共同組成之一模組化周邊裝置中,以提供該主機與該至少一擴充單元之間進行模組化連接。The connection interface as described in claim 1, wherein the connection interface is used to be set in a modular peripheral device composed of a host and at least one expansion unit to provide a modular connection between the host and the at least one expansion unit. 如請求項8所述之連接介面,其中該模組化周邊裝置至少包括:一Wi-Fi模組、至少一記憶儲存單元與一無線充電電路中之至少一者、一第一USB介面裝置、一第二USB介面裝置以及一電源電路。The connection interface as described in claim 8, wherein the modular peripheral device includes at least: a Wi-Fi module, at least one of at least one memory storage unit and a wireless charging circuit, a first USB interface device, a second USB interface device and a power circuit. 如請求項9所述之連接介面,其中該第一USB介面裝置電連接於支援該兩組USB2.0規格中任一組通用序列匯流排之4支金屬對接結構,以支援USB2.0規格之信號傳輸運作,及/或該任一組通用序列匯流排之4支金屬對接結構可再搭配其他5支金屬對接結構,以支援單一組通用序列匯流排(USB)3.0規格之信號傳輸運作。A connection interface as described in claim 9, wherein the first USB interface device is electrically connected to four metal docking structures supporting either of the two USB 2.0 specifications to support signal transmission operations of the USB 2.0 specifications, and/or the four metal docking structures of either of the USB 2.0 specifications can be further combined with five other metal docking structures to support signal transmission operations of a single USB 3.0 specification. 如請求項10所述之連接介面,其中該第一USB介面裝置具有一USB2.0/USB3.0共用連接埠,抑或同時具有一USB2.0連接埠以及一USB3.0連接埠。The connection interface as described in claim 10, wherein the first USB interface device has a USB2.0/USB3.0 shared connection port, or has both a USB2.0 connection port and a USB3.0 connection port. 如請求項9所述之連接介面,其中該第二USB介面裝置電接該兩組USB2.0規格中另一組通用序列匯流排之4支金屬對接結構,以支援USB2.0規格之信號傳輸運作。The connection interface as described in claim 9, wherein the second USB interface device is electrically connected to the four metal docking structures of the other universal serial bus in the two sets of USB2.0 specifications to support the signal transmission operation of the USB2.0 specification. 如請求項12所述之連接介面,其中該第二USB介面裝置具有一USB2.0連接埠。The connection interface as described in claim 12, wherein the second USB interface device has a USB 2.0 connection port. 如請求項9所述之連接介面,其中該電源電路係電連接於提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、及/或電連接於提供一電源快充信號傳輸運作之4支金屬對接結構。A connection interface as described in claim 9, wherein the power circuit is electrically connected to two metal docking structures that provide a fixed 3.3 volt power signal transmission operation, and/or electrically connected to four metal docking structures that provide a power fast charging signal transmission operation. 一種相容於Type C通用序列匯流排之硬體規格的連接介面,包括:一連接介面之硬體結構,相容於一Type C通用序列匯流排之硬體規格;其中,該連接介面包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者;以及24支金屬對接結構,分布於該連接介面中,且該些金屬對接結構僅能進行單向對接而未提供雙向對接;其中,於該些金屬對接結構中,至少具有可支援一通用序列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構、用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構,以及該4支金屬對接結構可搭配其他5支金屬對接結構,以形成可支援一通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。A connection interface compatible with the hardware specification of a Type C universal serial bus, comprising: a hardware structure of a connection interface, compatible with the hardware specification of a Type C universal serial bus; wherein the connection interface includes any one of a male connection interface and a female connection interface compatible with the Type C universal serial bus; and 24 metal docking structures distributed in the connection interface, and the metal docking structures are only capable of unidirectional docking and do not provide bidirectional docking; wherein, among the metal docking structures, there are at least four metal docking structures that can support signal transmission operations of a universal serial bus (USB) 2.0 specification, and are used to support another USB The present invention also provides another four metal docking structures for signal transmission operations of the 2.0 specification, and the four metal docking structures can be combined with other five metal docking structures to form a nine-metal docking structure that can support signal transmission operations of a Universal Serial Bus (USB) 3.0 specification. 如請求項15所述之連接介面,其中於該些金屬對接結構中,至少具有可支援一積體匯流排電路(I²C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。The connection interface as described in claim 15, wherein among the metal docking structures, there are at least two metal docking structures that can support signal transmission operations of an integrated circuit (I²C) specification, or at least four metal docking structures that can support signal transmission operations of a general purpose input and output (GPIO) specification, or at least two metal docking structures that can provide a fixed 3.3 volt power signal transmission operation, or at least four metal docking structures that can provide a fast power charging signal transmission operation, or at least four metal docking structures that can provide a grounding function. 如請求項16所述之連接介面,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。The connection interface as described in claim 16, wherein the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least any one of 5 volts, 9 volts, 15 volts, 19 volts, 24 volts, 40 volts or 48 volts. 如請求項15所述之連接介面,其中該連接介面可與一限位對接結構進行結合,以限定任兩連接介面僅能進行單向對接而無法進行雙向對接。As described in claim 15, the connection interface can be combined with a limit docking structure to limit any two connection interfaces to only one-way docking and not two-way docking. 如請求項18所述之連接介面,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。A connection interface as described in claim 18, wherein the limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure. 如請求項18所述之連接介面,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。A connection interface as described in claim 18, wherein the limiting docking structure includes at least one of a limiting groove and a limiting column. 如請求項15所述之連接介面,其中該連接介面用以設置於由一主機與至少一擴充單元所共同組成之一模組化周邊裝置中,以提供該主機與該至少一擴充單元之間進行模組化連接。A connection interface as described in claim 15, wherein the connection interface is used to be set in a modular peripheral device composed of a host and at least one expansion unit to provide a modular connection between the host and the at least one expansion unit. 一種相容於Type C通用序列匯流排之硬體規格的連接介面,應用於一至少具有一第一裝置與一第二裝置之一系統中,該連接介面至少包括:具有24支金屬對接結構之一第一連接介面之硬體結構,設置於該第一裝置中;以及具有另一24支金屬對接結構之一第二連接介面之硬體結構,設置於該第二裝置中,且該第二連接介面之硬體結構用以與該第一連接介面之硬體結構進行單向對接;其中,該第一連接介面之硬體結構或該第二連接介面之硬體結構皆相容於一Type C通用序列匯流排之硬體規格,且於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,皆可於同一時間支援兩組通用序列匯流排(USB)2.0規格之信號傳輸運作。A connection interface compatible with the hardware specification of the Type C universal serial bus is applied to a system having at least a first device and a second device, the connection interface comprising at least: a hardware structure of a first connection interface having 24 metal docking structures, disposed in the first device; and a hardware structure of a second connection interface having another 24 metal docking structures, disposed in the second device, and the hardware structure of the second connection interface is used to perform unidirectional docking with the hardware structure of the first connection interface; wherein the hardware structure of the first connection interface or the hardware structure of the second connection interface are both compatible with a Type C universal serial bus. C Universal Serial Bus hardware specifications, and in the 24 metal docking structures and in any of the other 24 metal docking structures, two sets of Universal Serial Bus (USB) 2.0 specification signal transmission operations can be supported at the same time. 如請求項22所述之連接介面,其中該第一連接介面之硬體結構或該第二連接介面之硬體結構皆包括可相容於該Type C通用序列匯流排之一公頭連接介面與一母座連接介面中之任一者。The connection interface as described in claim 22, wherein the hardware structure of the first connection interface or the hardware structure of the second connection interface includes either a male connection interface or a female connection interface compatible with the Type C universal serial bus. 如請求項22所述之連接介面,其中於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,至少具有可支援一通用序列匯流排(USB)2.0規格之信號傳輸運作之4支金屬對接結構、用以支援另一USB 2.0規格之信號傳輸運作之另一4支金屬對接結構,以及該4支金屬對接結構可搭配其他5支金屬對接結構,以形成可支援一通用序列匯流排(USB)3.0規格之信號傳輸運作之9支金屬對接結構。The connection interface as described in claim 22, wherein among the 24 metal docking structures and any one of the other 24 metal docking structures, there are at least 4 metal docking structures that can support signal transmission operations of a Universal Serial Bus (USB) 2.0 specification, another 4 metal docking structures for supporting signal transmission operations of another USB 2.0 specification, and the 4 metal docking structures can be combined with other 5 metal docking structures to form 9 metal docking structures that can support signal transmission operations of a Universal Serial Bus (USB) 3.0 specification. 如請求項22所述之連接介面,其中於該24支金屬對接結構中以及於該另一24支金屬對接結構中之任一者,至少具有可支援一積體匯流排電路(I²C)規格之信號傳輸運作之兩支金屬對接結構、抑或至少具有可支援一通用型之輸入輸出(GPIO)規格之信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一固定3.3伏特之電源信號傳輸運作之兩支金屬對接結構、抑或至少具有可提供一電源快充信號傳輸運作之4支金屬對接結構、抑或至少具有可提供一接地功能之4支金屬對接結構。The connection interface as described in claim 22, wherein among the 24 metal docking structures and any one of the other 24 metal docking structures, there are at least two metal docking structures that can support a signal transmission operation of an integrated circuit (I²C) specification, or at least four metal docking structures that can support a signal transmission operation of a general purpose input and output (GPIO) specification, or at least two metal docking structures that can provide a fixed 3.3 volt power signal transmission operation, or at least four metal docking structures that can provide a fast power charging signal transmission operation, or at least four metal docking structures that can provide a grounding function. 如請求項25所述之連接介面,其中該電源快充信號傳輸運作,係指至少可為一5伏特、9伏特、15伏特、19伏特、24伏特、40伏特或48伏特中之任一者之電源信號傳輸運作。The connection interface as described in claim 25, wherein the power fast charging signal transmission operation refers to a power signal transmission operation that can be at least any one of 5 volts, 9 volts, 15 volts, 19 volts, 24 volts, 40 volts or 48 volts. 如請求項22所述之連接介面,其中該第一連接介面與該第二連接介面中之任一者皆可與一限位對接結構進行結合,以限定該第一連接介面與該第二連接介面僅能進行單向對接而無法進行雙向對接。As described in claim 22, the connection interface, either the first connection interface or the second connection interface, can be combined with a position-limiting docking structure to limit the first connection interface and the second connection interface to only one-way docking and not two-way docking. 如請求項27所述之連接介面,其中該限位對接結構至少包括一凸部對接結構或一凹槽對接結構中之任一者。A connection interface as described in claim 27, wherein the limiting docking structure includes at least one of a protrusion docking structure and a groove docking structure. 如請求項27所述之連接介面,其中該限位對接結構至少包括一限位槽或一限位柱中之任一者。A connection interface as described in claim 27, wherein the limiting docking structure includes at least one of a limiting groove and a limiting column. 如請求項22所述之連接介面,其中該第一裝置可為一主機,該第二裝置可為至少一擴充單元,且該系統可為由該主機與該至少一擴充單元之間進行模組化連接而所組成之一模組化周邊裝置。The connection interface as described in claim 22, wherein the first device may be a host, the second device may be at least one expansion unit, and the system may be a modular peripheral device composed of a modular connection between the host and the at least one expansion unit.
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