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TWM671849U - Laser cutting equipment - Google Patents

Laser cutting equipment Download PDF

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Publication number
TWM671849U
TWM671849U TW114202571U TW114202571U TWM671849U TW M671849 U TWM671849 U TW M671849U TW 114202571 U TW114202571 U TW 114202571U TW 114202571 U TW114202571 U TW 114202571U TW M671849 U TWM671849 U TW M671849U
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TW
Taiwan
Prior art keywords
protective cover
laser cutting
working area
laser
unit
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TW114202571U
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Chinese (zh)
Inventor
羅嘉宇
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米德奈股份有限公司
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Priority to TW114202571U priority Critical patent/TWM671849U/en
Publication of TWM671849U publication Critical patent/TWM671849U/en

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Abstract

本新型雷射切割設備,包含一承載台、一防護罩單元,及一雷射切割單元,其該雷射切割單元與該防護罩單元彼此為獨立元件。該承載台具有至少一個作業區域。該防護罩單元包括一防護罩,該防護罩位於該作業區域的上方,且對應位於該作業區域的整個範圍,並界定出一防護空間。該雷射切割單元設置於該防護罩單元與該承載台之間,並包括一雷射源,該雷射源可移動地位於該作業區域且位於該防護空間內。在進行切割製程時,由於該防護罩無須跟著該雷射源移動,因此能減低製程中的能量耗損。The novel laser cutting equipment includes a carrier, a protective cover unit, and a laser cutting unit, wherein the laser cutting unit and the protective cover unit are independent components. The carrier has at least one working area. The protective cover unit includes a protective cover, which is located above the working area and corresponds to the entire range of the working area, and defines a protective space. The laser cutting unit is arranged between the protective cover unit and the carrier, and includes a laser source, which is movably located in the working area and in the protective space. When performing the cutting process, since the protective cover does not need to move with the laser source, the energy loss in the process can be reduced.

Description

雷射切割設備Laser cutting equipment

本新型涉及一種元件加工設備,特別是指一雷射切割設備。 The new invention relates to a component processing device, in particular a laser cutting device.

雷射切割技術為加工製造業常見的操作手段之一。習知用以切割大型加工件的雷射切割設備通常配置有一防護罩,用以防止操作人員在製程過程中受到來自於雷射光源的輻射傷害。該防護罩通常設置於雷射光源上方或周圍以對外阻隔該雷射光源,例如,該防護罩與該雷射光源共同設置於一支撐結構以於切割製程中同步位移。 Laser cutting technology is one of the common operating methods in the processing and manufacturing industry. It is known that laser cutting equipment used to cut large workpieces is usually equipped with a protective cover to prevent operators from being harmed by radiation from the laser light source during the process. The protective cover is usually set above or around the laser light source to block the laser light source from the outside. For example, the protective cover and the laser light source are jointly set on a supporting structure to move synchronously during the cutting process.

前述的結構設計雖可有效防止該雷射光源對操作人員造成傷害,然而,用以切割大型加工件的雷射裝置需要配置具有高功率的雷射光源,造成該雷射裝置本身體積十分龐大。因此,當該雷射裝置在移動時,往往需消耗許多能量,而設置於該雷射裝置的該防護罩則進一步增加了能量損耗,使製程成本難以降低。 Although the aforementioned structural design can effectively prevent the laser light source from causing harm to the operator, the laser device used to cut large workpieces needs to be equipped with a high-power laser light source, which makes the laser device itself very large. Therefore, when the laser device is moving, it often consumes a lot of energy, and the protective cover installed on the laser device further increases the energy loss, making it difficult to reduce the process cost.

因此,本新型的目的即在提供一種雷射切割設備,適用於切割大型加工件,用以降低切割製程的能量損耗。 Therefore, the purpose of this invention is to provide a laser cutting device suitable for cutting large workpieces to reduce the energy loss of the cutting process.

本新型雷射切割設備,包含一承載台、一防護罩單元、一雷射切割單元。 This new type of laser cutting equipment includes a carrier, a protective cover unit, and a laser cutting unit.

該承載台具有至少一個作業區域。 The carrier has at least one working area.

該防護罩單元包括一防護罩,該防護罩位於該作業區域的上方,且對應位於該作業區域的整個範圍,並界定出一防護空間。 The protective cover unit includes a protective cover, which is located above the working area and corresponds to the entire range of the working area and defines a protective space.

該雷射切割單元設置於該防護罩單元與該承載台之間,並包括一雷射源,該雷射源可移動地位於該作業區域且位於該防護空間內。 The laser cutting unit is disposed between the protective cover unit and the carrier, and includes a laser source that can be movably positioned in the working area and within the protective space.

其中,該防護罩單元與該雷射切割單元為彼此獨立。 The protective cover unit and the laser cutting unit are independent of each other.

本新型的功效在於:該雷射切割單元與該防護罩單元彼此為獨立元件,因此在進行切割製程時,該防護罩無須跟著該雷射源移動,僅需移動該雷射源即可,而能減低製程中的能量耗損,且基於該防護罩所界定的該防護空間對應位於整個該作業區域的範圍,因此仍能提供足夠的防護力。 The effect of the new invention is that the laser cutting unit and the protective cover unit are independent components, so when the cutting process is carried out, the protective cover does not need to move with the laser source, but only needs to move the laser source, which can reduce the energy loss in the process, and the protective space defined by the protective cover corresponds to the range of the entire working area, so it can still provide sufficient protection.

10:承載台 10: Carrier platform

11:作業區域 11: Work area

20:防護罩單元 20: Protective cover unit

21:移動件 21: Moving parts

22:防護罩 22: Protective shield

221:防護空間 221: Protective Space

23:開口 23: Open mouth

24:防護門 24: Protective door

30:雷射切割單元 30: Laser cutting unit

311:支撐部 311: Supporting part

312:連接部 312: Connection part

313:移動部 313:Mobile Department

314:位置調整部 314: Position adjustment department

32:雷射源 32: Laser source

L:縱向方向 L: Longitudinal direction

T:橫向方向 T: Horizontal direction

圖1和圖2為一示意圖,說明本新型雷射焊接設備的一實施例。 Figures 1 and 2 are schematic diagrams illustrating an embodiment of the novel laser welding equipment.

有關於本新型的技術內容與功效,在配合圖式及以下實施例的詳細說明將可清楚呈現。要說明的是,本新型圖式僅用以表示元件間的位置相對關係,與各元件的實際尺寸並不相關。 The technical content and effects of the present invention will be clearly presented in the detailed description of the accompanying drawings and the following embodiments. It should be noted that the drawings of the present invention are only used to indicate the relative position relationship between components and are not related to the actual size of each component.

參閱圖1和圖2,本新型雷射切割設備的一實施例,包含一承載台10、一防護罩單元20,及一雷射切割單元30。其中,該防護罩單元20與該雷射切割單元30彼此相互獨立。 Referring to Figures 1 and 2, an embodiment of the novel laser cutting device includes a carrier 10, a protective cover unit 20, and a laser cutting unit 30. The protective cover unit 20 and the laser cutting unit 30 are independent of each other.

該承載台10具有複數個沿一縱向方向L排列的作業區域11,供用以使該雷射切割單元30對一待切割的加工件(圖未示)進行雷射切割。其中,該承載台10為一地軌式裝置。 The support platform 10 has a plurality of working areas 11 arranged along a longitudinal direction L, for the laser cutting unit 30 to perform laser cutting on a workpiece to be cut (not shown). The support platform 10 is a ground rail device.

該防護罩單元20包括一鄰近於該承載台10設置的移動件21,及一設置於該移動件21的防護罩22。 The protective cover unit 20 includes a moving part 21 disposed adjacent to the carrier 10, and a protective cover 22 disposed on the moving part 21.

該防護罩22移動地對應位於其中一作業區域11的上方,並界定出一防護空間221。該移動件21用以控制該防護罩22位移,使該防護罩22可移入或移出對應於該其中一作業區域11的範圍,且可沿該縱向方向L移動至其中另一作業區域11。 The protective cover 22 is movably located above one of the working areas 11 and defines a protective space 221. The moving member 21 is used to control the displacement of the protective cover 22 so that the protective cover 22 can be moved into or out of the range corresponding to one of the working areas 11 and can be moved along the longitudinal direction L to another working area 11.

在本實施例中,該移動件21包括一組間隔設置於該承載台10相對兩側且沿該縱向方向L延伸的軌道,有助於使該防護罩22沿著該軌道移動;該防護罩22的一側周壁形成有兩個沿該縱向方向L間隔的開口23,且具有兩個分別鄰近於該兩個開口23設置的防護門24。該兩個防護門24為自動捲門,分別用以開啟或關閉所對應的該兩個開口23。當該防護罩22沿該縱向方向L移動時,該兩個開口23會開啟,使該作業區域11以及設置於該承載台10的加工件可經由該兩個開口23通過;當執行該雷射切割製程時,該防護罩22會固定於該其中一作業區域11的範圍,此時該兩個開口23會經由該等防護門24關閉,使該防護空間221呈現封閉狀態。 In this embodiment, the moving member 21 includes a set of rails spaced apart on opposite sides of the carrier 10 and extending along the longitudinal direction L, which helps the protective cover 22 to move along the rails; a side peripheral wall of the protective cover 22 is formed with two openings 23 spaced apart along the longitudinal direction L, and has two protective doors 24 respectively disposed adjacent to the two openings 23. The two protective doors 24 are automatic rolling doors, which are respectively used to open or close the corresponding two openings 23. When the protective cover 22 moves along the longitudinal direction L, the two openings 23 will open, so that the working area 11 and the workpiece placed on the support table 10 can pass through the two openings 23; when the laser cutting process is performed, the protective cover 22 will be fixed within the range of one of the working areas 11, and at this time, the two openings 23 will be closed through the protective doors 24, so that the protective space 221 is in a closed state.

該雷射切割單元30設置於該防護罩單元20與該承載台10之間,並包括一移動支撐結構,及一設置於該移動支撐結構的雷射源32,該雷射源32經由該移動支撐結構帶動從而可移動地位於該作業區域11且位於該防護空間221內。 The laser cutting unit 30 is disposed between the protective cover unit 20 and the support platform 10, and includes a movable support structure and a laser source 32 disposed on the movable support structure. The laser source 32 is driven by the movable support structure so as to be movable to the working area 11 and located in the protective space 221.

具體地說,在本實施例中,該移動支撐結構如圖2所示,具有二分別直立設置於該作業區域11相對兩側的支撐部311、一連接該等支撐部311的連接部312、一設置於該連接部312的位置調整部314,以及一設置於該支撐部311的移動部313。其中,該雷射源32設置於該連接部312並與該位置調整部314相連接,該等支撐部311與該連接部312共同形成一龍門架(grantry)結構,並作為該雷射切割單元30主要的支撐性結構。該移動部313具有一組間隔設置於該承載台10相對兩側且沿該縱向方向L延伸的滑軌,用以帶動該龍門架結構以及該雷射源32沿該縱向方向L移動,該位置調整部314則用以帶動該雷射源32在位於該作業區域11的範圍內較小距離地(即移動範圍小於該作業區域11的範圍)沿一橫向方向T、一垂直方向和該縱向方向L的至少其中一者移動。 Specifically, in this embodiment, the movable support structure is shown in FIG. 2 and comprises two support parts 311 respectively disposed upright at opposite sides of the working area 11, a connecting part 312 connected to the support parts 311, a position adjustment part 314 disposed on the connecting part 312, and a movable part 313 disposed on the support part 311. The laser source 32 is disposed on the connecting part 312 and connected to the position adjustment part 314. The support parts 311 and the connecting part 312 together form a gantry structure and serve as the main supporting structure of the laser cutting unit 30. The moving part 313 has a set of slide rails spaced apart on opposite sides of the support platform 10 and extending along the longitudinal direction L, for driving the gantry structure and the laser source 32 to move along the longitudinal direction L, and the position adjustment part 314 is used to drive the laser source 32 to move within the working area 11 at a relatively small distance (i.e., the moving range is smaller than the working area 11) along at least one of a transverse direction T, a vertical direction and the longitudinal direction L.

其中,該移動部313的滑軌設置於該承載台10與該移動件21的軌道之間。其中,該橫向方向T正交於該縱向方向L,且與該連接部312的延伸方向為同向;該垂直方向為一直立於該作業區域11的方向。 The slide rail of the moving part 313 is disposed between the support platform 10 and the rail of the moving member 21. The transverse direction T is orthogonal to the longitudinal direction L and is in the same direction as the extension direction of the connecting part 312; the vertical direction is a direction that is always perpendicular to the working area 11.

要說明的是,該雷射切割單元30之各元件構件(例如該支撐部311、連接部312與該位置調整部314等)的結構設計依實際需求可有不同變化,例如,該移動支撐結構也可以僅設置單一個支撐部311且設置於該作業區域11的單一側邊,而未配置該連接部312,只要該雷射切割單元30與該防護罩單元20彼此為獨立元件即可,並不以前述實施例與圖式為限。 It should be noted that the structural design of each component member of the laser cutting unit 30 (such as the support portion 311, the connecting portion 312 and the position adjustment portion 314, etc.) can be changed according to actual needs. For example, the mobile support structure can also be provided with only a single support portion 311 and set on a single side of the working area 11 without the connecting portion 312. As long as the laser cutting unit 30 and the protective cover unit 20 are independent components, it is not limited to the aforementioned embodiments and drawings.

使用時,由於該加工件會於雷射切割的過程中產生粉塵,使部分雷射光路徑受干擾而發生漫射,或者,該雷射源32會在執行三維式雷射切割製程時發出多種不同入射角度的雷射光,本實施例之該防護罩22所界定形成的該防護空間221涵蓋了整個作業區域11的範圍,從而有效地對該雷射源32所發出輻射 能量以及雷射光進行防護,避免操作人員受到傷害,且基於該雷射切割單元30與該防護罩單元20為兩個彼此獨立的元件,因此該防護罩22在製程中無須隨著該雷射源32移動,而能有效地降低製程中所耗費的能量,同時提供足夠的防護力。 During use, the workpiece will generate dust during the laser cutting process, causing part of the laser light path to be disturbed and diffused, or the laser source 32 will emit laser light of various incident angles when performing the three-dimensional laser cutting process. The protective space 221 defined by the protective cover 22 of this embodiment covers the entire range of the working area 11, thereby effectively protecting the radiation energy and laser light emitted by the laser source 32 to prevent the operator from being injured. In addition, since the laser cutting unit 30 and the protective cover unit 20 are two independent components, the protective cover 22 does not need to move with the laser source 32 during the process, and can effectively reduce the energy consumed in the process while providing sufficient protection.

在一些實施例中,該雷射切割設備還包含一控制單元,分別與該防護罩單元20及該雷射切割單元30訊號連接,用以發出一指令訊號。該雷射切割單元30接收該指令訊號後,該移動支撐結構可據以帶動該雷射源32沿一預設製程路徑移動,以對放置於該作業區域11的該加工件進行雷射切割,形成一預設的切割圖案;該防護罩單元20接收該指令訊號後,可據以使該移動件21沿該縱向方向L移動至對應位於指定的其中一作業區域11的範圍,從而使該雷射源32在該其中一作業區域11的範圍內進行切割製程時可位於該防護空間221內。 In some embodiments, the laser cutting device further includes a control unit, which is signal-connected to the protective cover unit 20 and the laser cutting unit 30 respectively, for issuing a command signal. After the laser cutting unit 30 receives the command signal, the mobile support structure can drive the laser source 32 to move along a preset process path to perform laser cutting on the workpiece placed in the working area 11 to form a preset cutting pattern; after the protective cover unit 20 receives the command signal, the mobile member 21 can be moved along the longitudinal direction L to a range corresponding to one of the designated working areas 11, so that the laser source 32 can be located in the protective space 221 when performing the cutting process within the range of one of the working areas 11.

在另一些實施例中,該承載台10也可僅具有單一個作業區域11,該防護罩單元20則可依需求而將該防護罩22固設於對應位於該作業區域11的範圍,而毋須配置該移動件21。實施時,該雷射源32可移動地位於該防護空間221,省去耗費移動該防護罩單元20的能量。 In other embodiments, the carrier 10 may have only a single working area 11, and the protective cover unit 20 may fix the protective cover 22 in a range corresponding to the working area 11 as required, without configuring the moving part 21. During implementation, the laser source 32 may be movably positioned in the protective space 221, saving the energy of moving the protective cover unit 20.

綜上所述,本新型雷射切割設備透過該防護罩單元20與該雷射切割單元30彼此為獨立元件的結構設計,因此在進行切割製程時,該防護罩22對應設置於該作業區域11的範圍進行防護而毋須移動,除了能提供有效地防護作用,且僅需移動該雷射源32即可,因此可減低製程中的能量耗損,且相較於完全開放式的雷射切割機台更為安全,故確實能達到本新型的目的。 In summary, the novel laser cutting equipment adopts the structural design that the protective cover unit 20 and the laser cutting unit 30 are independent components. Therefore, when the cutting process is performed, the protective cover 22 is set corresponding to the range of the working area 11 for protection without moving. In addition to providing effective protection, only the laser source 32 needs to be moved, thereby reducing energy loss in the process. Compared with a completely open laser cutting machine, it is safer, so the purpose of the novel device can be achieved.

10:承載台 10: Carrier platform

11:作業區域 11: Work area

20:防護罩單元 20: Protective cover unit

21:移動件 21: Moving parts

22:防護罩 22: Protective shield

221:防護空間 221: Protective Space

23:開口 23: Open mouth

30:雷射切割單元 30: Laser cutting unit

311:支撐部 311: Supporting part

312:連接部 312: Connection part

313:移動部 313:Mobile Department

314:位置調整部 314: Position adjustment department

32:雷射源 32: Laser source

L:縱向方向 L: Longitudinal direction

T:橫向方向 T: Horizontal direction

Claims (4)

一種雷射切割設備,包含: 一承載台,具有至少一個作業區域; 一防護罩單元,包括一防護罩,該防護罩位於該作業區域的上方,且對應位於該作業區域的整個範圍,並界定出一防護空間;及 一雷射切割單元,設置於該防護罩單元與該承載台之間,並包括一雷射源,該雷射源可移動地位於該作業區域且位於該防護空間內, 其中,該防護罩單元與該雷射切割單元為彼此獨立。 A laser cutting device comprises: a carrier having at least one working area; a protective cover unit comprising a protective cover, the protective cover being located above the working area and corresponding to the entire range of the working area and defining a protective space; and a laser cutting unit being arranged between the protective cover unit and the carrier, and comprising a laser source, the laser source being movably located in the working area and in the protective space, wherein the protective cover unit and the laser cutting unit are independent of each other. 如請求項1所述的雷射切割設備,其中,該承載台具有複數個沿一縱向方向排列的作業區域,該防護罩可移動地對應位於其中一作業區域的整個範圍。The laser cutting equipment as described in claim 1, wherein the support table has a plurality of working areas arranged along a longitudinal direction, and the protective cover can be movably corresponding to the entire range of one of the working areas. 如請求項2所述的雷射切割設備,其中,該防護罩單元還包括一移動件,該防護罩設置於該移動件,該移動件可沿該縱向方向移動,用以使該防護罩移動至對應位於其中另一作業區域的範圍。The laser cutting equipment as described in claim 2, wherein the protective cover unit further includes a moving part, the protective cover is arranged on the moving part, and the moving part can move along the longitudinal direction to move the protective cover to a range corresponding to another working area therein. 如請求項1所述的雷射切割設備,其中,該雷射切割單元還包括一移動支撐結構,該雷射源固設於該移動支撐結構,而可經由該移動支撐結構帶動以在對應於該作業區域的範圍內移動。The laser cutting device as described in claim 1, wherein the laser cutting unit further includes a movable support structure, the laser source is fixed to the movable support structure, and can be driven by the movable support structure to move within a range corresponding to the working area.
TW114202571U 2025-03-14 2025-03-14 Laser cutting equipment TWM671849U (en)

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