TWM671849U - Laser cutting equipment - Google Patents
Laser cutting equipment Download PDFInfo
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- TWM671849U TWM671849U TW114202571U TW114202571U TWM671849U TW M671849 U TWM671849 U TW M671849U TW 114202571 U TW114202571 U TW 114202571U TW 114202571 U TW114202571 U TW 114202571U TW M671849 U TWM671849 U TW M671849U
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Abstract
本新型雷射切割設備,包含一承載台、一防護罩單元,及一雷射切割單元,其該雷射切割單元與該防護罩單元彼此為獨立元件。該承載台具有至少一個作業區域。該防護罩單元包括一防護罩,該防護罩位於該作業區域的上方,且對應位於該作業區域的整個範圍,並界定出一防護空間。該雷射切割單元設置於該防護罩單元與該承載台之間,並包括一雷射源,該雷射源可移動地位於該作業區域且位於該防護空間內。在進行切割製程時,由於該防護罩無須跟著該雷射源移動,因此能減低製程中的能量耗損。The novel laser cutting equipment includes a carrier, a protective cover unit, and a laser cutting unit, wherein the laser cutting unit and the protective cover unit are independent components. The carrier has at least one working area. The protective cover unit includes a protective cover, which is located above the working area and corresponds to the entire range of the working area, and defines a protective space. The laser cutting unit is arranged between the protective cover unit and the carrier, and includes a laser source, which is movably located in the working area and in the protective space. When performing the cutting process, since the protective cover does not need to move with the laser source, the energy loss in the process can be reduced.
Description
本新型涉及一種元件加工設備,特別是指一雷射切割設備。 The new invention relates to a component processing device, in particular a laser cutting device.
雷射切割技術為加工製造業常見的操作手段之一。習知用以切割大型加工件的雷射切割設備通常配置有一防護罩,用以防止操作人員在製程過程中受到來自於雷射光源的輻射傷害。該防護罩通常設置於雷射光源上方或周圍以對外阻隔該雷射光源,例如,該防護罩與該雷射光源共同設置於一支撐結構以於切割製程中同步位移。 Laser cutting technology is one of the common operating methods in the processing and manufacturing industry. It is known that laser cutting equipment used to cut large workpieces is usually equipped with a protective cover to prevent operators from being harmed by radiation from the laser light source during the process. The protective cover is usually set above or around the laser light source to block the laser light source from the outside. For example, the protective cover and the laser light source are jointly set on a supporting structure to move synchronously during the cutting process.
前述的結構設計雖可有效防止該雷射光源對操作人員造成傷害,然而,用以切割大型加工件的雷射裝置需要配置具有高功率的雷射光源,造成該雷射裝置本身體積十分龐大。因此,當該雷射裝置在移動時,往往需消耗許多能量,而設置於該雷射裝置的該防護罩則進一步增加了能量損耗,使製程成本難以降低。 Although the aforementioned structural design can effectively prevent the laser light source from causing harm to the operator, the laser device used to cut large workpieces needs to be equipped with a high-power laser light source, which makes the laser device itself very large. Therefore, when the laser device is moving, it often consumes a lot of energy, and the protective cover installed on the laser device further increases the energy loss, making it difficult to reduce the process cost.
因此,本新型的目的即在提供一種雷射切割設備,適用於切割大型加工件,用以降低切割製程的能量損耗。 Therefore, the purpose of this invention is to provide a laser cutting device suitable for cutting large workpieces to reduce the energy loss of the cutting process.
本新型雷射切割設備,包含一承載台、一防護罩單元、一雷射切割單元。 This new type of laser cutting equipment includes a carrier, a protective cover unit, and a laser cutting unit.
該承載台具有至少一個作業區域。 The carrier has at least one working area.
該防護罩單元包括一防護罩,該防護罩位於該作業區域的上方,且對應位於該作業區域的整個範圍,並界定出一防護空間。 The protective cover unit includes a protective cover, which is located above the working area and corresponds to the entire range of the working area and defines a protective space.
該雷射切割單元設置於該防護罩單元與該承載台之間,並包括一雷射源,該雷射源可移動地位於該作業區域且位於該防護空間內。 The laser cutting unit is disposed between the protective cover unit and the carrier, and includes a laser source that can be movably positioned in the working area and within the protective space.
其中,該防護罩單元與該雷射切割單元為彼此獨立。 The protective cover unit and the laser cutting unit are independent of each other.
本新型的功效在於:該雷射切割單元與該防護罩單元彼此為獨立元件,因此在進行切割製程時,該防護罩無須跟著該雷射源移動,僅需移動該雷射源即可,而能減低製程中的能量耗損,且基於該防護罩所界定的該防護空間對應位於整個該作業區域的範圍,因此仍能提供足夠的防護力。 The effect of the new invention is that the laser cutting unit and the protective cover unit are independent components, so when the cutting process is carried out, the protective cover does not need to move with the laser source, but only needs to move the laser source, which can reduce the energy loss in the process, and the protective space defined by the protective cover corresponds to the range of the entire working area, so it can still provide sufficient protection.
10:承載台 10: Carrier platform
11:作業區域 11: Work area
20:防護罩單元 20: Protective cover unit
21:移動件 21: Moving parts
22:防護罩 22: Protective shield
221:防護空間 221: Protective Space
23:開口 23: Open mouth
24:防護門 24: Protective door
30:雷射切割單元 30: Laser cutting unit
311:支撐部 311: Supporting part
312:連接部 312: Connection part
313:移動部 313:Mobile Department
314:位置調整部 314: Position adjustment department
32:雷射源 32: Laser source
L:縱向方向 L: Longitudinal direction
T:橫向方向 T: Horizontal direction
圖1和圖2為一示意圖,說明本新型雷射焊接設備的一實施例。 Figures 1 and 2 are schematic diagrams illustrating an embodiment of the novel laser welding equipment.
有關於本新型的技術內容與功效,在配合圖式及以下實施例的詳細說明將可清楚呈現。要說明的是,本新型圖式僅用以表示元件間的位置相對關係,與各元件的實際尺寸並不相關。 The technical content and effects of the present invention will be clearly presented in the detailed description of the accompanying drawings and the following embodiments. It should be noted that the drawings of the present invention are only used to indicate the relative position relationship between components and are not related to the actual size of each component.
參閱圖1和圖2,本新型雷射切割設備的一實施例,包含一承載台10、一防護罩單元20,及一雷射切割單元30。其中,該防護罩單元20與該雷射切割單元30彼此相互獨立。
Referring to Figures 1 and 2, an embodiment of the novel laser cutting device includes a
該承載台10具有複數個沿一縱向方向L排列的作業區域11,供用以使該雷射切割單元30對一待切割的加工件(圖未示)進行雷射切割。其中,該承載台10為一地軌式裝置。
The
該防護罩單元20包括一鄰近於該承載台10設置的移動件21,及一設置於該移動件21的防護罩22。
The
該防護罩22移動地對應位於其中一作業區域11的上方,並界定出一防護空間221。該移動件21用以控制該防護罩22位移,使該防護罩22可移入或移出對應於該其中一作業區域11的範圍,且可沿該縱向方向L移動至其中另一作業區域11。
The
在本實施例中,該移動件21包括一組間隔設置於該承載台10相對兩側且沿該縱向方向L延伸的軌道,有助於使該防護罩22沿著該軌道移動;該防護罩22的一側周壁形成有兩個沿該縱向方向L間隔的開口23,且具有兩個分別鄰近於該兩個開口23設置的防護門24。該兩個防護門24為自動捲門,分別用以開啟或關閉所對應的該兩個開口23。當該防護罩22沿該縱向方向L移動時,該兩個開口23會開啟,使該作業區域11以及設置於該承載台10的加工件可經由該兩個開口23通過;當執行該雷射切割製程時,該防護罩22會固定於該其中一作業區域11的範圍,此時該兩個開口23會經由該等防護門24關閉,使該防護空間221呈現封閉狀態。
In this embodiment, the moving
該雷射切割單元30設置於該防護罩單元20與該承載台10之間,並包括一移動支撐結構,及一設置於該移動支撐結構的雷射源32,該雷射源32經由該移動支撐結構帶動從而可移動地位於該作業區域11且位於該防護空間221內。
The
具體地說,在本實施例中,該移動支撐結構如圖2所示,具有二分別直立設置於該作業區域11相對兩側的支撐部311、一連接該等支撐部311的連接部312、一設置於該連接部312的位置調整部314,以及一設置於該支撐部311的移動部313。其中,該雷射源32設置於該連接部312並與該位置調整部314相連接,該等支撐部311與該連接部312共同形成一龍門架(grantry)結構,並作為該雷射切割單元30主要的支撐性結構。該移動部313具有一組間隔設置於該承載台10相對兩側且沿該縱向方向L延伸的滑軌,用以帶動該龍門架結構以及該雷射源32沿該縱向方向L移動,該位置調整部314則用以帶動該雷射源32在位於該作業區域11的範圍內較小距離地(即移動範圍小於該作業區域11的範圍)沿一橫向方向T、一垂直方向和該縱向方向L的至少其中一者移動。
Specifically, in this embodiment, the movable support structure is shown in FIG. 2 and comprises two
其中,該移動部313的滑軌設置於該承載台10與該移動件21的軌道之間。其中,該橫向方向T正交於該縱向方向L,且與該連接部312的延伸方向為同向;該垂直方向為一直立於該作業區域11的方向。
The slide rail of the
要說明的是,該雷射切割單元30之各元件構件(例如該支撐部311、連接部312與該位置調整部314等)的結構設計依實際需求可有不同變化,例如,該移動支撐結構也可以僅設置單一個支撐部311且設置於該作業區域11的單一側邊,而未配置該連接部312,只要該雷射切割單元30與該防護罩單元20彼此為獨立元件即可,並不以前述實施例與圖式為限。
It should be noted that the structural design of each component member of the laser cutting unit 30 (such as the
使用時,由於該加工件會於雷射切割的過程中產生粉塵,使部分雷射光路徑受干擾而發生漫射,或者,該雷射源32會在執行三維式雷射切割製程時發出多種不同入射角度的雷射光,本實施例之該防護罩22所界定形成的該防護空間221涵蓋了整個作業區域11的範圍,從而有效地對該雷射源32所發出輻射
能量以及雷射光進行防護,避免操作人員受到傷害,且基於該雷射切割單元30與該防護罩單元20為兩個彼此獨立的元件,因此該防護罩22在製程中無須隨著該雷射源32移動,而能有效地降低製程中所耗費的能量,同時提供足夠的防護力。
During use, the workpiece will generate dust during the laser cutting process, causing part of the laser light path to be disturbed and diffused, or the
在一些實施例中,該雷射切割設備還包含一控制單元,分別與該防護罩單元20及該雷射切割單元30訊號連接,用以發出一指令訊號。該雷射切割單元30接收該指令訊號後,該移動支撐結構可據以帶動該雷射源32沿一預設製程路徑移動,以對放置於該作業區域11的該加工件進行雷射切割,形成一預設的切割圖案;該防護罩單元20接收該指令訊號後,可據以使該移動件21沿該縱向方向L移動至對應位於指定的其中一作業區域11的範圍,從而使該雷射源32在該其中一作業區域11的範圍內進行切割製程時可位於該防護空間221內。
In some embodiments, the laser cutting device further includes a control unit, which is signal-connected to the
在另一些實施例中,該承載台10也可僅具有單一個作業區域11,該防護罩單元20則可依需求而將該防護罩22固設於對應位於該作業區域11的範圍,而毋須配置該移動件21。實施時,該雷射源32可移動地位於該防護空間221,省去耗費移動該防護罩單元20的能量。
In other embodiments, the
綜上所述,本新型雷射切割設備透過該防護罩單元20與該雷射切割單元30彼此為獨立元件的結構設計,因此在進行切割製程時,該防護罩22對應設置於該作業區域11的範圍進行防護而毋須移動,除了能提供有效地防護作用,且僅需移動該雷射源32即可,因此可減低製程中的能量耗損,且相較於完全開放式的雷射切割機台更為安全,故確實能達到本新型的目的。
In summary, the novel laser cutting equipment adopts the structural design that the
10:承載台 10: Carrier platform
11:作業區域 11: Work area
20:防護罩單元 20: Protective cover unit
21:移動件 21: Moving parts
22:防護罩 22: Protective shield
221:防護空間 221: Protective Space
23:開口 23: Open mouth
30:雷射切割單元 30: Laser cutting unit
311:支撐部 311: Supporting part
312:連接部 312: Connection part
313:移動部 313:Mobile Department
314:位置調整部 314: Position adjustment department
32:雷射源 32: Laser source
L:縱向方向 L: Longitudinal direction
T:橫向方向 T: Horizontal direction
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW114202571U TWM671849U (en) | 2025-03-14 | 2025-03-14 | Laser cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW114202571U TWM671849U (en) | 2025-03-14 | 2025-03-14 | Laser cutting equipment |
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| Publication Number | Publication Date |
|---|---|
| TWM671849U true TWM671849U (en) | 2025-06-21 |
Family
ID=97226067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW114202571U TWM671849U (en) | 2025-03-14 | 2025-03-14 | Laser cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM671849U (en) |
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