TWM671629U - Heat dissipation device - Google Patents

Abstract

The invention discloses a heat diffusion device, comprising a porous carrier and a metal skin layer coated on the porous carrier. The porous carrier is composed of small-sized particles, medium-sized particles and large-sized particles, wherein the small-sized particles, the medium-sized particles and the large-sized particles are independently silicon carbide, diamond, diamond-like stone and/or graphene particles, and the particle size ratio of the small-sized particles, the medium-sized particles and the large-sized particles is 1:2-2.5:3-20. The metal skin layer is formed of a high thermal conductivity metal material, and the high thermal conductivity metal material is filled in the pores of the porous carrier.

Description

Heat dissipation device

This invention relates to a porous carrier, in particular to a porous carrier suitable for carrying high thermal conductivity metal materials and a heat diffusion device using the same.

As electronic products continue to innovate, in addition to basic functions, in order to meet the needs of high integration, high transmission, high speed and high efficiency, electronic products also have higher requirements for heat dissipation performance. The currently commonly used heat dissipation solutions, such as installing heat dissipation fans or general metal heat sinks, are no longer sufficient to deal with the heat dissipation problems of servers and high-power products.

Silicon carbide has excellent properties such as high thermal conductivity, resistance to cold and hot shocks, acid and alkali resistance, and lightness. Heat sinks based on silicon carbide have become one of the key components in the development of thermal management assembly technology. However, the performance of this type of heat sink also depends on the microstructure of silicon carbide after molding, such as pore size, porosity, pore distribution, pore connectivity, etc. However, the existing methods for manufacturing this type of heat sink generally have some room for improvement in process stability and finished product yield. For example, in the ceramic molding step, it is difficult to control the microstructure of the ceramic, resulting in poor process stability. For another example, in the infiltration step, the molten metal containing metal is not easy to penetrate into the ceramic pores, resulting in a low finished product yield.

The technical problem to be solved by this invention is to provide a porous carrier with high porosity, high rigidity, high thermal stability and low thermal expansion coefficient to address the shortcomings of the existing technology. It is suitable for carrying high thermal conductivity metal materials such as aluminum, copper, silver or their alloys to meet the heat dissipation requirements of practical applications. On this basis, this invention also provides a heat diffusion device.

In order to solve the above technical problems, one of the technical solutions adopted by this invention is to provide a porous carrier suitable for carrying a high thermal conductivity metal material. The porous carrier is composed of small-sized particles, medium-sized particles and large-sized particles, wherein the small-sized particles, the medium-sized particles and the large-sized particles are each independently silicon carbide, diamond, diamond-like stone and/or graphene particles, and the particle size ratio of the small-sized particles, the medium-sized particles and the large-sized particles is 1:2-2.5:3-20.

In an embodiment of the present invention, the porosity of the porous carrier is 20% to 70%.

In an embodiment of the present invention, the particle size of the small particle size is in the range of 0.1 μm to 5 μm, the particle size of the medium particle size is in the range of 2 μm to 10 μm, and the particle size of the large particle size is in the range of 10 μm to 100 μm.

In the embodiment of the present invention, based on the total weight of the porous carrier, the weight ratio of the small-size particles, the medium-size particles and the large-size particles is 1:3:4.

In the embodiment of the present invention, among the small-size particles, the medium-size particles and the large-size particles, the proportion of the silicon carbide particles is greater than or equal to 99%.

In the embodiment of the present invention, among the small-size particles, the medium-size particles and the large-size particles, the proportion of the silicon carbide particles is less than 30%.

In the embodiment of the present invention, among the small-size particles, the medium-size particles and the large-size particles, the proportion of the silicon carbide particles is less than 1%.

In order to solve the above technical problems, another technical solution adopted by this invention is to provide a heat diffusion device, which includes a porous carrier with the above technical characteristics and a metal skin layer. The metal skin layer is coated outside the porous carrier, and the metal skin layer is formed by a high thermal conductivity metal material. In addition, the high thermal conductivity metal material is filled in the pores of the porous carrier.

In an embodiment of the present invention, the thickness of the metal skin layer is greater than 5 μm.

In the embodiment of the present invention, the porous carrier has an upper surface and a lower surface opposite to each other, and the metal skin layer and the heat diffusion device satisfy the following relationship: 2A/T≦50%; A represents the covering thickness of the metal skin layer on the upper surface or the lower surface; T represents the total thickness of the heat diffusion device.

In the embodiment of the present invention, the high thermal conductivity metal material is copper, silver, aluminum or their alloys.

In an embodiment of the present invention, the heat diffusion device has a thermal conductivity greater than 180W/m˙K.

In general, the thermal diffusion device and porous carrier provided by this invention can be realized by including the technical features of "porous carrier is composed of small-sized particles, medium-sized particles and large-sized particles (the particle size of small-sized particles: the particle size of medium-sized particles: the particle size of large-sized particles = 1:2-2.5:3-20)" and "small-sized particles, medium-sized particles The technical solution of combining small-diameter particles and large-diameter particles independently as silicon carbide, diamond, diamond-like stone and/or graphene particles is adopted to fully fill the pores of the porous carrier with high thermal conductivity metal materials, and exhibit good thermal conductivity under the bridging effect generated by the mutual accumulation of ceramic material or hard carbon material particles, thereby meeting the high-power heat dissipation requirements.

To further understand the features and technical content of this work, please refer to the following detailed description and diagrams of this work. However, the diagrams provided are only for reference and description and are not used to limit this work.

Z: Heat diffusion device

1:Porous carrier

101: Upper surface

102: Lower surface

11: Small particle size particles

12: Medium-sized particles

13: Large particle size particles

2: Metal surface layer

3: Dip mold

31: Watering the mouth

M: High thermal conductivity metal material

S100, S102, S104: Manufacturing method steps

Figure 1 is a schematic diagram of the structure of the porous carrier of this invention.

Figure 2 is an enlarged schematic diagram of part II of Figure 1.

Figure 3 is a schematic diagram of the process of mounting a high thermal conductivity metal material on the porous carrier of this invention.

Figure 4 is a schematic diagram of the structure of the heat diffusion device of this invention.

Figure 5 is a flow chart of the manufacturing method of the heat diffusion device of this invention.

The following is a specific implementation example to illustrate the implementation method of the "heat diffusion device and porous carrier thereof" disclosed in this invention. The technical personnel in this field can understand the advantages and effects of this invention from the content disclosed in this manual. This invention can be implemented or applied through other different specific implementation examples. The details in this manual can also be modified and changed based on different viewpoints and applications without deviating from the concept of this invention. In addition, the attached figures of this invention are only for simple schematic illustration and are not depicted according to actual size. Please note in advance. The following implementation method will further explain the relevant technical content of this invention in detail, but the disclosed content is not used to limit the scope of protection of this invention.

It should be understood that although the terms "first", "second", "third" and so on may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the related listed items depending on the actual situation.

Unless otherwise defined, the terms used in this article have the same meaning as those generally understood by those skilled in the art. The materials involved in each embodiment are commercially available or prepared according to existing technologies unless otherwise specified. The methods or operations involved in each embodiment are conventional methods or operations in this field unless otherwise specified.

[First embodiment]

Please refer to FIG. 1, which shows the structure of the porous carrier 1 according to the first embodiment of the present invention. As shown in FIG. 1, the porous carrier 1 of the present invention is composed of small-sized particles 11, medium-sized particles 12 and large-sized particles 13, wherein the small-sized particles 11, medium-sized particles 12 and large-sized particles 13 can each be a ceramic material particle, a hard carbon material particle or a combination of ceramic material particles and hard carbon material particles. Therefore, the porous carrier 1 of the present invention can have the characteristics of high porosity, high rigidity, high thermal stability and low thermal expansion coefficient, and is suitable for carrying high thermal conductivity metal materials to meet the heat dissipation requirements of practical applications. Specifically, the high thermal conductivity metal material can be loaded on the surface of the porous carrier 1 and implanted into the porous carrier 1, thereby reducing the contact thermal resistance and diffusion thermal resistance.

Ceramic materials suitable for this invention include but are not limited to: silicon carbide, silicon dioxide, aluminum oxide, aluminum nitride, gallium nitride and cubic boron nitride. Hard carbon materials suitable for this invention include but are not limited to: diamond, diamond-like stone and graphene. High thermal conductivity metal materials suitable for this invention include but are not limited to: aluminum, copper, gold, silver, magnesium, titanium, nickel, and alloys of the aforementioned metals.

In this embodiment, the small-sized particles 11, the medium-sized particles 12 and the large-sized particles 13 are each independently silicon carbide, diamond, diamond-like stone and/or graphene particles, and the particle size ratio of the small-sized particles 11, the medium-sized particles 12 and the large-sized particles 13 is 1:2-2.5:3-20. It should be noted that the particle sizes of the small-sized particles 11, the medium-sized particles 12 and the large-sized particles 13 will vary with the thickness of the porous carrier 1. In addition, the small-size particles 11, the medium-size particles 12 and the large-size particles 13 can be combined with each other by sintering to form a porous carrier 1; the porous carrier 1 can be formed into a block or a sheet, but the invention is not limited thereto. Preferably, based on the total weight of the porous carrier 1, the weight ratio of the small-size particles 11, the medium-size particles 12 and the large-size particles 13 is 1:3:4.

In practical application, the particle size of the small-size particles 11 may be in the range of 0.1 μm to 5 μm, the particle size of the medium-size particles 12 may be in the range of 2 μm to 10 μm, and the particle size of the large-size particles 13 may be in the range of 10 μm to 100 μm. The porosity of the porous carrier 1 may be 20% to 70%, that is, the pore volume in the porous carrier 1 accounts for 20% to 70% of its total volume. However, the above is only a feasible implementation method and is not intended to limit the present invention.

In some embodiments, the porous carrier 1 of the present invention adopts a formula of silicon carbide, that is, among the small-size particles 11, the medium-size particles 12 and the large-size particles 13, the proportion of silicon carbide particles is greater than or equal to 99%. Therefore, the thermal conductivity coefficient of the porous carrier 1 can be improved.

In some embodiments, the porous carrier 1 of the present invention adopts a formula of diamond-doped silicon carbide, that is, the proportion of silicon carbide particles in the small-size particles 11, the medium-size particles 12 and the large-size particles 13 is less than 30%. Therefore, the formability of the porous carrier 1 can be improved.

In some embodiments, the porous carrier 1 of the present invention adopts a high-purity graphene formula, that is, the proportion of silicon carbide particles in the small-size particles 11, the medium-size particles 12 and the large-size particles 13 is less than 1%. Therefore, the thermal conductivity coefficient of the porous carrier 1 can also be improved.

Please refer to Figures 2 and 3. Figure 2 shows the method used in the present invention to load the high thermal conductivity metal material M onto the porous carrier 1, and Figure 3 shows the heat diffusion device Z formed by the above method. As shown in Figures 2 and 3, the present invention also provides a heat diffusion device Z, which includes a porous carrier 1 having the above technical characteristics and a metal skin layer 2 coated outside the porous carrier 1.

In the embodiment of the present invention, the metal skin layer 2 is formed by a high thermal conductivity metal material M, and an example of the high thermal conductivity metal material M is described above; and in the process of forming the metal skin layer 2, the high thermal conductivity metal material M will penetrate into the pores of the porous carrier 1. It is worth noting that the high thermal conductivity metal material M dispersed in the pores can show a good thermal conductivity effect under the bridging effect generated by the mutual accumulation of ceramic material or hard carbon material particles.

In actual application, the heat diffusion device Z of the invention can have a thermal conductivity greater than 180W/m˙K, wherein the thickness of the metal skin layer 2 can be greater than 5μm, preferably 25μm to 100μm. However, the above is only a feasible implementation method and is not intended to limit the invention.

As shown in FIG4 , the porous carrier 1 has an upper surface 101 and a lower surface 102 opposite to each other, and the metal skin layer 2 and the heat diffusion device Z satisfy the following relationship: 2A/T≦50%; A represents the covering thickness of the metal skin layer 2 on the upper surface 101 or the lower surface 102; T represents the total thickness of the heat diffusion device Z.

[Second embodiment]

Referring to FIG. 4 , the second embodiment of the present invention provides a manufacturing method that can be used to manufacture the heat diffusion device Z as described in the first embodiment. The manufacturing method mainly includes: step S100, providing a powder composition, which includes small-size particles, medium-size particles and large-size particles; step S102, using the powder composition to form a porous carrier; and step S104, mounting a high thermal conductivity metal material on the porous carrier.

In the following, the various steps of the manufacturing method of this invention will be described in detail in conjunction with Figures 1 to 3.

In step S100, the selected small-size particles 11, medium-size particles 12, and large-size particles 13 may be mixed with a conformal binder (such as polyvinyl alcohol) to form a powder composition. The particle size of the medium-size particles 12 is in the range of 2 to 2.5 times the particle size of the small-size particles 11, and the particle size of the large-size particles 13 is in the range of 3 to 5 times the particle size of the small-size particles 11. In addition, the small-size particles 11, the medium-size particles 12, and the large-size particles 13 can each be a ceramic material particle, a hard carbon material particle, or a combination of ceramic material particles and hard carbon material particles, preferably silicon carbide, diamond, diamond-like stone, graphene particles, or any combination thereof. The amount of the conformal binder used can be 5wt% to 20wt% relative to 100wt% of the powder composition.

In step S102, the powder composition obtained in step S100 can be firstly made into a blank with a certain shape through a pressure molding process, and then the blank is sintered at a high temperature so that the small-size particles 11, the medium-size particles 12 and the large-size particles 13 are combined with each other to form a porous carrier 1. The sintering of the blank can be carried out under normal pressure (atmosphere), vacuum or special atmosphere, and the sintering temperature can be in the range of 800°C to 1500°C.

In step S104, the porous carrier 1 obtained in step S102 can be placed in an impregnation mold 3, and then a molten metal containing a high thermal conductivity metal material M is injected into the impregnation mold 3 through the sprue 31 above the porous carrier 1, and the high thermal conductivity metal material M is loaded on the surface of the porous carrier 1 under heating and pressure conditions to form a metal skin layer 2, and at the same time infiltrates into the pores of the porous carrier 1. It should be noted that the heating temperature can vary with the high thermal conductivity metal material M; for example, the heating temperature can be set within the range of 600°C to 1300°C.

It is worth noting that, unlike the infiltration process of the prior art, which infiltrates the molten metal from a larger surface (such as the front of the block) into the interior of the sintered embryo, the porosity of the porous carrier 1 formed by step S100 and step S102 is high enough to infiltrate the molten metal in a standing state, that is, the molten metal can infiltrate from a smaller surface (such as the side end face of the block) into the interior of the porous carrier 1. Therefore, not only can a metal skin layer of the required thickness (such as a thickness greater than 5μm) be formed, but also a more uniform molten metal infiltration effect can be achieved.

In practical applications, the porous carrier 1 may be subjected to mechanical processing, such as cutting, grinding, drilling, etc., before step S104, so that the porous carrier 1 has a desired shape or structure. In addition, the porous carrier 1 may also be subjected to heat treatment before step S104 to completely remove the conformal binder.

The relevant technical details mentioned in the first embodiment are still valid in this embodiment. In order to reduce repetition, they will not be repeated here. Correspondingly, the relevant technical details mentioned in this embodiment can also be applied in the first embodiment.

[Beneficial effects of the embodiment]

The thermal diffusion device and porous carrier provided by this invention can be realized by including the technical features of "the porous carrier is composed of small-sized particles, medium-sized particles and large-sized particles (the particle size of small-sized particles: the particle size of medium-sized particles: the particle size of large-sized particles = 1:2-2.5:3-20)" and "the small-sized particles, medium-sized particles The technical solution of combining "silicon carbide, diamond, diamond-like stone and/or graphene particles" with large-size particles independently allows the high thermal conductivity metal material to be fully filled in the pores of the porous carrier, and exhibits a good thermal conductivity effect under the bridging effect generated by the mutual accumulation of ceramic material or hard carbon material particles, thereby meeting the high-power heat dissipation requirements.

Furthermore, unlike the infiltration process of the prior art, which infiltrates the molten metal from a larger surface (such as the front of the block) into the interior of the sintered embryo, the porous carrier provided by this invention has a high enough porosity that the molten metal can be infiltrated in a standing state, that is, the molten metal can infiltrate from a smaller surface (such as the side end face of the block) into the interior of the porous carrier. Therefore, not only can a metal skin layer of the desired thickness (such as a thickness greater than 5μm) be formed, but a more uniform molten metal infiltration effect can also be achieved.

The above disclosed contents are only the preferred feasible embodiments of this creation, and do not limit the scope of patent application of this creation. Therefore, all equivalent technical changes made by using the description and diagram contents of this creation are included in the scope of patent application of this creation.

Z: Heat diffusion device

1:Porous carrier

101: Upper surface

102: Lower surface

2: Metal surface layer

M: High thermal conductivity metal material

Claims (11)

A heat diffusion device, comprising: a porous carrier, composed of small-size particles, medium-size particles and large-size particles, wherein the small-size particles, the medium-size particles and the large-size particles are each independently silicon carbide, diamond, diamond-like stone and/or graphene particles, and the particle size ratio of the small-size particles, the medium-size particles and the large-size particles is 1:2-2.5:3-20; and a metal skin layer, which is coated on the outside of the porous carrier, wherein the metal skin layer is formed of a high thermal conductivity metal material, and the high thermal conductivity metal material is filled in the pores of the porous carrier. A heat diffusion device as described in claim 1, wherein the porosity of the porous carrier is 20% to 70%. A heat diffusion device as described in claim 1, wherein the particle size of the small particle size particles is in the range of 0.1 μm to 5 μm, the particle size of the medium particle size particles is in the range of 2 μm to 10 μm, and the particle size of the large particle size particles is in the range of 10 μm to 100 μm. A heat diffusion device as described in claim 1, wherein, based on the total weight of the porous carrier, the weight ratio of the small-size particles, the medium-size particles and the large-size particles is 1:3:4. A heat diffusion device as described in claim 1, wherein among the small-size particles, the medium-size particles and the large-size particles, the proportion of the silicon carbide particles is greater than or equal to 99%. A heat diffusion device as described in claim 1, wherein the proportion of the silicon carbide particles in the small particle size particles, the medium particle size particles and the large particle size particles is less than 30%. A heat diffusion device as described in claim 1, wherein the proportion of the silicon carbide particles in the small particle size particles, the medium particle size particles and the large particle size particles is less than 1%. A heat diffusion device as described in claim 1, wherein the thickness of the metal skin layer is greater than 5 μm. A heat diffusion device as described in claim 8, wherein the porous carrier has an upper surface and a lower surface relative to each other, and the metal skin layer and the heat diffusion device satisfy the following relationship: 2A/T ≦ 50%; A represents the covering thickness of the metal skin layer on the upper surface or the lower surface; T represents the total thickness of the heat diffusion device. A heat diffusion device as described in claim 1, wherein the high thermal conductivity metal material is copper, silver, aluminum or an alloy thereof. The heat diffusion device as described in claim 1 has a thermal conductivity greater than 180 W/m•K.

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