TWM670575U - Package structure - Google Patents

Abstract

This invention proposes a packaging structure, including: a substrate; a conductive wire, the conductive wire is arranged below the substrate; a coating layer, the upper part of the conductive wire is coated by the coating layer, and the lower part of the conductive wire protrudes from the coating layer; a solder ball, the solder ball wraps the conductive wire protruding from the coating layer. In this way, by providing the protruding conductive wire, the contact area between the solder ball and the conductive wire is increased, the generation of stress is reduced, the adhesion and bonding strength between the solder ball and the conductive wire are increased, and the stability of the packaging structure is guaranteed.

Description

Package structure

This work is about the field of semiconductor packaging technology, specifically about a packaging structure.

In order to meet the design requirements for reducing product space, the product's electrical pin design has evolved from the original existing ball grid array package and copper pillar to a vertical wire structure, which is mainly used in protection structures or I/O connection structures.

See FIG. 1, which shows the existing vertical wire structure manufacturing process: Step 1, see (a), placing electronic components 02 on substrate 01 and forming a seed layer 03; Step 2, see (b), forming conductive wires 04 on seed layer 03; Step 3, see (c), using a coating layer 05 to encapsulate the structure below substrate 01; Step 4, see (d), grinding Part of the coating layer 05 is removed until the upper surface of the electronic component 02 and the upper surface of the conductive wire 04 are exposed; step 5, see (e), metal connecting balls 06 are formed on the upper surface of the electronic component 02 and the upper surface of the conductive wire 04; step 6, see (f), cutting to form a single vertical conductive wire structure; step 7, see (g), observe whether the final vertical conductive wire structure meets the requirements.

See Figure 2, which shows a vertical wire structure made by the above-mentioned manufacturing process, which uses vertical wires with a width of 30 to 50 microns as the input/output (I/O) connection channel structure. Without special design, these wires will generate stress on the contact surface when they are impacted by external forces. After the drop test, the connection point P (as shown by the circle in Figure 2) is prone to fracture, which raises concerns about the bonding strength.

This invention proposes a packaging structure, including: a substrate; a conductive wire, the conductive wire is arranged below the substrate; a coating layer, the upper part of the conductive wire is coated by the coating layer, and the lower part of the conductive wire protrudes from the coating layer; a solder ball, the solder ball wraps the conductive wire protruding from the coating layer.

As a possible implementation, the conductive line is vertically arranged below the substrate.

As a possible implementation, the conductive line is a curve.

As a possible implementation, the conductive wire protruding from the cladding layer includes a protruding top surface and a protruding side surface.

As a possible implementation, at least two of the conductive lines are not parallel.

As a possible implementation, the heights of the conductive wires are not uniform.

As a possible implementation, the top surface of the coating layer is an irregular shape.

As a possible implementation, the height difference between the highest point and the lowest point of the top surface of the coating layer is no more than 30μm.

As a possible implementation, the conductive wire protruding from the coating layer is of irregular shape.

As a possible implementation, the coating layer includes a plurality of filler particles.

As a possible implementation, the filling particles on the top surface of the coating layer have no cut surface.

As a possible implementation, the filling particles on the side of the coating layer have cut surfaces.

As a possible implementation, the solder ball is disposed below the encapsulation layer.

As a possible implementation, the height difference of the conductive line is no more than 30μm.

As a possible implementation, the diameter of the filler particles is not less than 5 μm and not more than 20 μm.

As a possible implementation, it further includes: an electronic component, wherein the electronic component is disposed below the substrate.

As a possible implementation, it further includes: a circuit board, wherein the circuit board is disposed below the conductive wire.

As a possible implementation, it further includes: a seed layer, wherein the seed layer is disposed between the substrate and the conductive wire.

As a possible implementation, the material of the filling particles is one or more of silicon oxide, aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, zinc oxide, and silicon carbide.

In order to improve the bonding strength of the packaging structure, this invention proposes a packaging structure, including: a substrate; a conductive wire, the conductive wire is vertically arranged below the substrate; a coating layer, the upper part of the conductive wire is coated by the coating layer, and the lower part of the conductive wire protrudes from the coating layer; a solder ball, the solder ball wraps the conductive wire protruding from the coating layer. In this way, by setting the protruding conductive wire, the contact area between the solder ball and the conductive wire is increased, the generation of stress is reduced, the adhesion and bonding strength of the solder ball and the conductive wire are increased, and the stability of the packaging structure is guaranteed.

01:Substrate

02: Electronic components

03:Seed layer

04: Conductive thread

05: Coating layer

06:Metal connecting ball

100:Packaging structure

101:Substrate

102: Electronic components

103: Seed layer

104: Conductive thread

1041: protruding top surface

1042: Protruding side

105: Coating layer

106: Solder ball

107: Circuit board

108: Tape

P: Connection point

By reading the detailed description of the non-limiting embodiments with reference to the following figures, other features, purposes and advantages of the present invention will become more apparent: FIG. 1 is a flow chart of the manufacture of a conventional packaging structure; FIG. 2 is an enlarged view of the physical structure of the conventional packaging structure; FIG. 3 is a schematic diagram of the structure of a packaging structure according to an embodiment of the present invention; FIG. 4 is a schematic diagram of the structure of a solder ball according to an embodiment of the present invention; FIG. 5 is a flow chart of the manufacture of a packaging structure according to an embodiment of the present invention; FIG. 6 is a schematic diagram of the structure of a conductive wire according to an embodiment of the present invention; FIG. 7 is a schematic diagram of the structure of a coating layer according to an embodiment of the present invention; FIG. 8 is a schematic diagram of the structure of a conductive wire according to an embodiment of the present invention; FIG. 9 is a schematic diagram of a partial structure of a plurality of packaging structures according to an embodiment of the present invention; FIG. 10 is a partial structure of a packaging structure according to an embodiment of the present invention and its side view; FIG. 11 is a comparison diagram of the effects of a packaging structure according to an embodiment of the present invention.

The following is a combination of diagrams and examples to illustrate the specific implementation of this creation. Through the contents recorded in this manual, people with ordinary knowledge in this field can easily understand the technical problems solved by this creation and the technical effects produced. It can be understood that the specific examples described here are only used to explain the relevant creation, rather than to limit the creation. In addition, for the convenience of description, only the parts related to the relevant creation are shown in the diagram.

It should be readily understood that the meanings of "on", "over" and "above" in this work should be interpreted in the broadest manner, such that "on" means not only "directly on something", but also "on something" including intermediate components or layers existing between the two.

In addition, for ease of description, spatially relative terms such as "below", "under", "lower", "above", "upper", etc. may be used herein to describe the relationship of one element or component to another element or component shown in the drawings. In addition to the orientation described in the drawings, spatially relative terms are also intended to cover different orientations of the device in use or operation. The device can be oriented in other ways (rotated 90° or in other orientations), and the spatially relative descriptors used in this article can be interpreted accordingly.

As used herein, the term "layer" refers to a portion of a material including an area having a certain thickness. A layer may extend over the entire underlying or upper structure, or may have an extent less than the extent of the underlying or upper structure. In addition, a layer may be an area of a homogeneous or inhomogeneous continuous structure, whose thickness is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and/or along a conical surface. A substrate may be a layer, may include one or more layers therein, and/or may have one or more layers thereon, above and/or below. A layer may include multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers and may have the same or different materials.

The term "substrate" as used herein refers to the material on which subsequent layers of material are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a wide variety of semiconductor materials such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of non-conductive materials such as glass, plastic, or sapphire wafers, etc. Further optionally, the substrate may have semiconductor devices or circuits formed therein.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings of the specification are only used to match the contents described in the specification so as to facilitate understanding and reading by people with ordinary knowledge in the field. They are not used to limit the restrictive conditions for the implementation of this creation, and therefore have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by this creation without affecting the effects and purposes that can be achieved by this creation. At the same time, the terms such as "on", "first", "second" and "one" used in this manual are only for the convenience of description and are not used to limit the scope of implementation of this creation. Changes or adjustments in their relative relationships, without substantial changes in the technical content, should also be regarded as the scope of implementation of this creation.

It should also be noted that the longitudinal section corresponding to the embodiment of the present invention can be the section corresponding to the front view, the transverse section can be the section corresponding to the right view, and the horizontal section can be the section corresponding to the top view.

In addition, the embodiments and features of the present invention can be combined with each other without conflict. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

See FIG. 3, which is a schematic diagram of a package structure 100 according to an embodiment of the present invention. The package structure 100 includes: a substrate 101; a conductive wire 104, which is disposed below the substrate 101; a coating layer 105, wherein the upper part of the conductive wire 104 is coated by the coating layer 105, and the lower part of the conductive wire 104 protrudes from the coating layer 105; a solder ball 106, which wraps the conductive wire 104 protruding from the coating layer 105. It should be noted that the solder ball 106 is disposed below the coating layer 105.

In this way, the solder ball 106 can achieve full contact with the conductive wire 104 protruding from the cladding layer 105, thereby increasing the contact area between the solder ball 106 and the conductive wire 104, reducing the generation of stress, and enhancing the adhesion and bonding strength between the solder ball 106 and the conductive wire 104, thereby ensuring the stability of the package structure 100.

As a possible implementation, the conductive wire 104 can be vertically arranged below the substrate 101, and can be a vertical wire, which can minimize space and reduce power consumption by vertically connecting the substrate 101 and other components. Since the conductive wire 104 has a small diameter, it may appear as a curve during the wiring process, that is, if there are multiple conductive wires 104, some of them can be straight lines and some can be curved lines.

Similarly, due to the size and process of the conductive wire 104, at least two conductive wires 104 may not be parallel during the bonding process, and the height of the conductive wires 104 may be inconsistent. It should be noted that the height difference of the conductive wires 104 is no more than 30μm.

In addition, the conductive wire 104 protruding from the cladding layer 105 may include a protruding top surface 1041 and a protruding side surface 1042.

As a possible implementation, it further includes: an electronic component 102, which is disposed below the substrate 101 and can be a chip or component that realizes various functions.

As a possible implementation, it further includes: a circuit board 107, which is arranged below the conductive wire 104, and the substrate 101 is electrically connected to the circuit board 107 through the conductive wire 104. Optionally, the electronic component 102 can also be electrically connected to the circuit board 107 and the substrate 101.

As a possible implementation, it further includes: a seed layer 103, which is disposed between the substrate 101 and the conductive wire 104. In addition, there may also be a seed layer 103 between the solder ball 106 and the circuit board 107, between the electronic component 102 and the circuit board 107, and between the substrate 101.

As a possible implementation, the coating layer 105 may include a plurality of filling particles, the material of the filling particles is one or more of silicon oxide, aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, zinc oxide, and silicon carbide, and the diameter thereof is not less than 5 μm and not more than 20 μm.

As a possible implementation, referring to FIG. 4 , a solder ball 106 can simultaneously cover two conductive wires 104 protruding from the covering layer 105.

See Figure 5 below to introduce the manufacturing steps of a packaging structure 100 of an embodiment of the present invention: Step 1, see (a), forming an electronic component 102 and a seed layer 103 on a substrate 101; Step 2, see (b), forming a conductive wire 104 above the seed layer 103; It should be noted that the height of the conductive wire 104 may be inconsistent (see Figure 6), but the height difference is no more than 30μm.

Step 3, see (c), apply tape 108 on the conductive wire 104 and the electronic component 102; it should be noted that the tape 108 is used to cover part of the conductive wire 104, so that the formation of the coating layer 105 avoids the part of the conductive wire 104 covered by the tape 108. The tape 108 can be a heat-resistant tape, a sticky mold, etc., or other insulating materials that can achieve the above functions, which is not limited here.

Step 4, see (d), forming a coating layer 105 between the tape 108 and the substrate 101.

Step 5, see (e), remove the tape 108 to expose the conductive wire 104 wrapped by the tape 108; it should be noted that when removing the tape 108, the material wrapped by the tape 108 may appear irregularly shaped, including the top surface of the coating layer 105 (see Figure 7) and the conductive wire 104 protruding from the coating layer 105 (see Figure 8). However, the height difference between the highest point and the lowest point of the top surface of the coating layer 105 is no more than 30μm.

Step 6, see (f), forms solder balls 106 above the electronic components 102 and the conductive lines 104.

Step 7, see (g), cutting to form a single structure; it should be noted that in the actual manufacturing process, the package structure 100 may be multiple and perform the above steps 1 to 6 at the same time, for example, see steps (c) and (d) shown in Figure 9. On this basis, it is necessary to perform a cutting operation in step 7 to form a single structure as shown in (g) in Figure 5.

In this case, since the coating layer 105 includes a plurality of filling particles, if cut, the cut surface may show the cut surface of the filling particles (see FIG. 10 ). Therefore, for the package structure 100, the filling particles on the side of the coating layer 105 have a cut surface. Since the top surface of the coating layer 105 is formed by removing the tape 108, this process will not destroy the integrity of the filling particles, that is, the filling particles on the top surface of the coating layer 105 have no cut surface.

Step 8, see (h), observe whether the structure formed in step 7 meets the requirements.

Step 9, see (i), flip the structure formed in step 7 and form it on the circuit board 107.

Step 10, see (j), forms a complete package structure 100.

In summary, see FIG11. The left side of FIG11 is a package structure of the prior art, and the right side is a package structure 100 of the present invention. As can be seen from the figure, the contact area between the conductive wire 104 and the solder ball 106 is larger, thereby improving the stability and reliability of the package structure 100, and being able to effectively protect the conductive wire 104 from external impact and pressure.

As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with numerical values, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, the thickness of a film or layer is "substantially uniform" may refer to an average thickness of the film or layer that is less than or equal to ±10% standard deviation, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane (e.g., within 40 μm, within 30 μm, within 20 μm, within 10 μm, or within 1 μm along the same plane). Two components may be considered to be "substantially aligned" if, for example, they overlap or overlap within 200μm, 150μm, 100μm, 50μm, 40μm, 30μm, 20μm, 10μm, or 1μm. Two surfaces or components may be considered to be "substantially perpendicular" if the angle between them is, for example, 90°±10° (e.g., ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°). When used in conjunction with an event or situation, the terms "substantially", "substantial", "approximately", and "about" may refer to situations where the event or situation occurs exactly as well as situations where the event or situation occurs very approximately.

100:Packaging structure

101:Substrate

102: Electronic components

103: Seed layer

104: Conductive thread

105: Coating layer

106: Solder ball

107: Circuit board

1041: protruding top surface

1042: protruding side

Claims (10)

A packaging structure, comprising: a substrate; a conductive wire, the conductive wire being arranged below the substrate; a coating layer, the upper part of the conductive wire being coated by the coating layer, and the lower part of the conductive wire protruding from the coating layer; a solder ball, the solder ball wrapping the conductive wire protruding from the coating layer. A packaging structure as described in claim 1, wherein the conductive line is vertically arranged below the substrate. A packaging structure as described in claim 1, wherein the conductive wire is a curve. A packaging structure as described in claim 1, wherein the conductive line protruding from the covering layer includes a protruding top surface and a protruding side surface. A packaging structure as described in claim 1, wherein at least two of the conductive lines are not parallel. A packaging structure as described in claim 1, wherein the top surface of the coating layer is an irregular shape. A packaging structure as described in claim 6, wherein the height difference between the highest point and the lowest point of the top surface of the coating layer is no more than 30 μm. A packaging structure as described in claim 1, wherein the coating layer includes a plurality of filling particles. A packaging structure as described in claim 8, wherein the filling particles on the top surface of the coating layer have no cut surface. A packaging structure as described in claim 8, wherein the filling particles on the side of the coating layer have a cut surface.